mfl67468023_42ls3450-da.awc-awh-awm

8/14/2019 MFL67468023_42LS3450-DA.AWC-AWH-AWM

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LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP91A

MODEL : 32LH20R 32LH20R-LA/TA

North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com

Internal Use Only


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LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes

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CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION .................................................................9

TROUBLE SHOOTING............................................................................14

BLOCK DIAGRAM...................................................................................17

EXPLODED VIEW .................................................................................. 18

SVC. SHEET ...............................................................................................


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- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent

Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the

servicing of a receiver whose chassis is not isolated from the AC

power line. Use a transformer of adequate power rating as this

protects the technician from accidents resulting in personal injury

from electrical shocks.

It will also protect the receiver and it's components from being

damaged by accidental shorts of the circuitry that may be

inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,

replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,

over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., to

be sure the set is safe to operate without damage of electrical

shock.

Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect an

electrical jumper across the two AC plug prongs. Place the AC

switch in the on position, connect one lead of ohm-meter to the AC

plug prongs tied together and touch other ohm-meter lead in turn to

each exposed metallic parts such as antenna terminals, phone

jacks, etc.

If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 1M and 5.2M.

When the exposed metal has no return path to the chassis thereading must be infinite.

An other abnormality exists that must be corrected before the

receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor

between a known good earth ground (Water Pipe, Conduit, etc.)

and the exposed metallic parts.

Measure the AC voltage across the resistor using AC voltmeter

with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage

measurements for each exposed metallic part. Any voltage

measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA.

In case any measurement is out of the limits specified, there is

possibility of shock hazard and the set must be checked and

repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument's

exposed

METALLIC PARTS

Good Earth Ground

such as WATER PIPE,

CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Ground

for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

IMPORTANT SAFETY NOTICE

0.15uF


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- 4 -

CAUTION: Before servicing receivers covered by this service

manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.

Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power

source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in anexplosion hazard.

2. Test high voltage only by measuring it with an appropriate high

voltage meter or other voltage measuring device (DVM,

FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specified otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the

contacts with a pipe cleaner, cotton-tipped stick or comparable

non-abrasive applicator; 10% (by volume) Acetone and 90% (by

volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks are

correctly installed.

7. Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive

lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily

by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some field-effect transistors and

semiconductor "chip" components. The following techniques

should be used to help reduce the incidence of component

damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic

charge on your body by touching a known earth ground.

Alternatively, obtain and wear a commercially available

discharging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or

exposure of the assembly.3. Use only a grounded-tip soldering iron to solder or unsolder ES

devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classified as "anti-static" can generate

electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective

package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads

electrically shorted together by conductive foam, aluminum foil

or comparable conductive material).

7. Immediately before removing the protective material from the

leads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will be

installed.

CAUTION: Be sure no power is applied to the chassis or circuit,

and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion such as

the brushing together of your clothes fabric or the lifting of your

foot from a carpeted floor can generate static electricity

sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within the

range or 500F to 600F.

2. Use an appropriate gauge of RMA resin-core solder composed

of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500F to 600F)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature

(500F to 600F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there

only unti l the solder flows onto and around both the

component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS


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- 5 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through

which the IC leads are inserted and then bent flat against the

circuit foil. When holes are the slotted type, the following technique

should be used to remove and replace the IC. When working with

boards using the familiar round hole, use the standard technique

as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder

melts.

2. Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the

IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and

solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as

possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with

long nose pliers to insure metal to metal contact then solder

each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit

board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as

possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit

board.

3. Observing diode polarity, wrap each lead of the new diodearound the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if

necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board toprevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit

board will weaken the adhesive that bonds the foil to the circuit

board causing the foil to separate from or "lift-off" the board. The

following guidelines and procedures should be followed whenever

this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the

following procedure to install a jumper wire on the copper pattern

side of the circuit board. (Use this technique only on IC

connections).

1. Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the good

copper pattern. Solder the overlapped area and clip off any

excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern

at connections other than IC Pins. This technique involves the

installation of a jumper wire on the component side of the circuit

board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly

connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead

of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.


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- 6 -

SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.

4. Electrical specification4.1. General Specification

1. Application rangeThis spec sheet is applied to LCD TV used LP91A chassis.

2. SpecificationEach part is tested as below without special appointment.

1) Temperature : 255C (779F), CST : 405C

2) Relative Humidity : 6510%3) Power Voltage : Standard input voltage(100~240V@50/60Hz)

* Standard Voltage of each products is marked by models.4) Specification and performance of each parts are followed

each drawing and specification by part number inaccordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method1) Performance: LGE TV test method followed

2) Demanded other specification- Safety: CE, IEC specification- EMC : CE, IEC

No Item Specification Measurement Remark

1 Screen Size 32 wide Color Display Module Resolution : 1366*768

2 Aspect Ratio 16:9

3 LCD Module 32 TFT WXGA LCD

4 Operating Environment Temp.: 0 ~ 40 deg

Humidity : 0 ~ 85 %

5 Storage Environment Temp.: -20 ~ 60 deg

Humidity : 0~ 85 %

6 Input Voltage AC100-240V~, 50/60Hz

150 W 32 HD

7 LDC Module HD 760 x 450 x 48 Unit : mm

(Maker : LGD) 0.17025 x 0.51075

12 EEFL

Coating 3H


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- 7 - LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes

No. Item Min. Typ. Max. Unit Maker Remark

1. Luminance 400 500 cd/m2

(W/O PC mode)

2. VIew angle (R/L, U/D) 178 / 178 degree LGD

3. Color Coordinates White Wx Typ 0.279 Typ LGD 32(HD)

Wy -0.03 0.292 +0.03

RED Xr 0.636

Yr 0.335

Green Xg 0.291

Yg 0.613

Blue Xb 0.146

Yb 0.061

4. Contrast ratio 700:1 1000:1

5. Luminance Variation 1.3

5. Chroma& Brightness (Optical)5.1. LCD Module

the Color Coordinates check condition- 50cm from the surface, Full White Pattern- Picture mode Vivid

6. Component Video Input (Y, PB, PR)

NoSpecification

RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)

2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)

3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz

4 720* 480 31.47 59.94 27.000 SDTV 480P

5 720* 480 31.50 60.00 27.027 SDTV 480P

6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz

7 1280* 720 44.96 59.94 74.176 HDTV 720P

8 1280* 720 45.00 60.00 74.250 HDTV 720P

9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz

10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

11 1920* 1080 33.72 59.94 74.176 HDTV 1080I

12 1920* 1080 33.75 60.00 74.25 HDTV 1080I

13 1920* 1080 56.25 50 148.5 HDTV 1080P

14 1920* 1080 67.432 59.94 148.350 HDTV 1080P

15 1920* 1080 67.5 60.00 148.5 HDTV 1080P


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NoSpecification Proposed


1 640* 350 31.468 70.09 25.17 EGA

2 720* 400 31.469 70.09 28.32 DOS

3 640* 480 31.469 59.94 25.17 VESA( VGA)

4 800* 600 37.879 60.317 40 VESA( SVGA)

5 1024* 768 48.363 60.004 65 VESA( XGA)

6 1280* 768 47.776 59.87 79.5 VESA( WXGA)

7 1360* 768 47.72 59.799 84.75 VESA( WXGA)

8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model

9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model

7. RGB7.1. Analog PC, RGB- DTV NOT SUPPORT

8. HDMI Input8.1. PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1 640 x 480 31.469 59.94 25.17 VESA( VGA)

2 800 x 600 37.879 60.317 40.00 VESA( SVGA)

3 1024 x 768 48.363 60.004 65.00 VESA( XGA)

4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)

5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)

6 1366 x 768 47.7 60.00 84.62 WXGA

7 1280 x 1024 63.595 60.00 108.875 SXGA

8 1920 x 1080 66.647 59.988 138.625 WUXGA

8.2. DTV Mode

NoSpecification


1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out

2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.

3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4 720 x 480 31.47 59.94 27 SDTV 480P

5 720 x 480 31.5 60.00 27.027 SDTV 480P

6 720 x 576 31.25 50.00 27 SDTV 576P

7 1280 x 720 44.96 59.94 74.176 HDTV 720P

8 1280 x 720 45 60.00 74.25 HDTV 720P

9 1280 x 720 37.5 50.00 74.25 HDTV 720P

10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I

11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I

12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I

13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P

14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P

15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P

16 1920 x 1080 27 24.00 74.25 HDTV 1080P17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P


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ADJUSTMENT INSTRUCTION

1. Application RangeThis specification sheet is applied to all of the LCD TV,LP91A/B/C/D chassis.

2. Specification1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolationtransformer will help protect test instrument.

2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of

25 5 C of temperature and 6510% of relative humidity ifthere is no specific designation.

4) The input voltage of the receiver must keep 100~220V,

50/60Hz.5) Before adjustment, execute Heat-Run for 5 minutes at RF

no signal.

3. Adjustment items3.1. PCB assembly adjustment items

(1) Download the MSTAR main software(IC800, Mstar ISP Utility)1) Using D/L Jig

2) Using USB Memory Stick.(2) Input Tool-Option/Area option.(3) Download the EDID

- EDID datas are automatically download when adjustingthe Tool Option2

(4) ADC Calibration RGB / Component

(4) Check SW Version.

3.2. SET assembly adjustment items(1) Input Area option

(2) Adjustment of White Balance : Auto & Manual(3) Input Tool-Option/Area option(4) Intelligent Sensor Inspection Guide

(5) Preset CH information(6) Factoring Option Data input

4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1. Using D/L Jig

(1) Preliminary steps1) Connect the download jig to D-sub(RGB) jack

(2) Download steps

1) Execute ISP Tool program, the main window(Mstar ISPutility Vx.x.x) will be opened

2) Click the Connect button and confirm Dialog Box

3) Click the Config. button and Change speed I2C Speed

setting : 350Khz~400Khz

4) Read and write bin file.

Click (1)Read tab, and then load downloadfile(XXXX.bin) by clicking Read.

- LH20/ LH30

1Fil

1Filexxx.binile x x x b in


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5) Click (2)Auto tab and set as below6) Click (3)Run.7) After downloading, you can see the (4)Pass message.

4.1.2. Using the Memory Stick* USB download : Service Mode1) Insert the USB memory stick to the ISB port.

2) Automatically detect the SW Version.-> S/W download process is executed automatically.

3) Show the message Copy the file from the Memory

4) After Finished the Download, Automatically DC Off -> On

5) Check The update SW Version.

4.2. Input tool option.Adjust tool option refer to the BOM.- Tool Option Input : PCBA Check Process

- Area Option Input : Set Assembly Process

After Input Tool Option and AC off

Before PCBA check, you have to change the Tool option andhave to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)

(1) Profile : Must be changed the option value because beingdifferent with some setting value depend onmodule maker, inch and market

(2) Equipment : adjustment remote control.

(3). Adjustment method- The input methods are same as other chassis.(Use IN-

START Key on the Adjust Remocon.)

(If not changed the option, the input menu can differ themodel spec.)

Refer to Job Expression of each main chassis assy(EBTxxxxxxxx) for Option valueCaution : Dont Press IN-STOP key after completing the

function inspection.

4.3. EDID D/L methodRecommend that dont connect HDMI and RGB(D-SUB) cable

when downloading the EDID.If not possible, recommend that connect the MSPG equipment.

There are two methods of downloading the edid data

4.3.1. 1st MethodEDID datas are automatically downloaded when adjusting the

Tool Option2.

Automatically downloaded when pushing the enter key afteradjusting the tool option2.

It takes about 2seconds.

4.3.2. 2nd Method

* Caution :Must be checked that the tool option is right or not.If tool option is wrong, hdmi edid data could not be

downloaded well.1) Press the ADJ key

2) Move to the EDID D/L and Press the right direction key(G)

3) Press the right direction key(G) at Start.4) After about a few seconds, appear OK, then compele.

4.3.3. RS-232C command Method(1) Command : AE 00 10

* CautionDont connect HDMI and RGB(D-SUB) cable whendownloading the EDID.

If the cables are connected, Downloading of edid could befailed.


Filexxx bin


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4.3.4. EDID data(1) Analog(RGB): 128bytes>

(2) HDMI 1 : 256Bytes

(3) HDMI 2 : 256Bytes

4.4. ADC Calibration4.4.1. ADC Calibration - Component (Using External pattern)

(1) Required Equipments

- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process1) Change the Input to Component1 or 2 mode.2) Input the Component 480i@60Hz 100% Color Bar

YPbPr signal into Component1 or 2.

(MSPG-925F Model: 209 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.

4) Enter Password number. Password is 0 0 0 0.

5) Select 0. ADC calibration : Component by using D/E

(CH +/-) and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear

4.4.2. ADC Calibration - RGB (Using External pattern)(1) Required Equipments

- Remote controller for adjustment

- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process1) Change the Input to RGB mode..2) Input the PC 1024x768@60Hz Horizontal Color Bar

signal into RGB.(MSPG-925F Model: 60 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is 0 0 0 0.

5) Select 0. ADC calibration : RGB by using D/E(CH +/-)

and press ENTER(A).

6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear


OK

OK


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* CASE

First adjust the coordinate far away from the target value(x, y).

1. x, y > target

i) Decrease the R, G.

2. x, y < target

i) First decrease the B gain,

ii) Decrease the one of the others.3. x > target, y < target

i) First decrease B, so make y a little more than the target.

ii) Adjust x value by decreasing the R

4. x < target, y > target

i) First decrease B, so make x a little more than the target.

ii) Adjust x value by decreasing the G

(4) Standard color coordinate and temperature when using the

CA100+ or CA210 equipment

To check the Coordinates of White Balance, you have to

measure at the below conditions.

Picture Mode : User 1

Dynamic Contrast : Off

Dynamic Colour : Off

(If you miss the upper condition, the coordinates of W/B

can be lower than the spec.)


CoordinateMode

x yTemp uv

Cool 0.2760.002 0.2830.002 11,000K 0.000

Medium 0.2850.002 0.2930.002 9,300K 0.000

Warm 0.3130.002 0.3290.002 6,500K 0.003


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- 14 -

TROUBLESHOOTING

No power

(LED indicator off)

Check 24V, 12V, 5,2V

of Power B/D

Check short of Main B/D

or Change Power B/D

Pass

Check Output of

IC1001, IC1003, IC1007

Check P307 Connector

Change LEDAssy

: [A] PROCESS

Fail

Fail

Pass

Pass

Check LEDAssy

Change IC1002,, Q1003

Pass

Check short of IC1001,IC1003, IC1007

Fail

Re-soldering or Change defect

part of IC1001, IC1003, IC1007

Fail

No Raster [B]: Process

Check LED status

On Display UnitRepeat A PROCESS

Pass

Fail

Check Output of IC802 Change IC802Fail

Change Inverter Connector

Or InverterFail

Pass

Fail

Pass

Change ModuleFail

Check LVDS Cable

Pass

Check Panel Link Cable

Or Module

Change Panel Link Cable

Or Module

Check Inverter Connector

Or Inverter

Pass


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- 15 -

No Raster on PC Signal

Check Input source Cableand Jack

Pass

Re-soldering or

Change the defect part

Pass

Check the Input/Output

Of IC100 Fail

Re-soldering or

Change the defect part,

Check RGB EDID Data

Repeat [A], & [B] Process

Pass


Of J104 Fail

Pass


Of IC800 Fail

Re-soldering or


Pass

No Raster on COMMPONENT Signal

Check Input source

Cable And Jack

Pass

Re-soldering or


Pass

Check the Input/OutputOf IC800 Fail

Re-soldering or



Check The Input/Output

Of JK101 Fail

Pass

No Raster on HDMI Signal

Check Input source

Cable And Jack

Pass


Of JK301, JK302, JK303 Fail

Re-soldering or


Pass

Pass


Of IC300, IC301, JK302 Fail

Re-soldering orChange the defect part

Check HDMI EDID Data

Re-download HDCP

Pass

Pass


Of IC800 Fail

Re-soldering or




16/28


- 16 -

No Sound

Check The Input Sourse.


Of IC600.

Re-soldering or

Change the defect part.Fail

Pass

Pass

Check The Speaker. Change Speaker.

Fail

Check The Speaker Wire.

Pass

Change The Source Input.Fail

No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal

Check Input source

Cable And Jack

Pass

Check Input source

Cable And Jack

Pass


Of JK101, JK201

Pass

Re-soldering or


Pass

Fail

Pass



Of IC800 Fail

Re-soldering or


Pass


Of TU500

Pass

Re-soldering or


Pass

Fail


Of IC800 Fail

Re-soldering or




17/28


18/28

- 18 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.Only for training and service purposes

300

200

801

802

803

804

805

806

520

530

540

550

400

900

120

510

500

320

200T

200N

310

LV1

A2

A10

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These

parts are identified by in the Schematic Diagram and EXPLODED VIEW.

It is essential that these special safety parts should be replaced with the same components as

recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE


19/28

TH

E

SYMBOLMARKOFTHISSCHEMETICDIAGRAMINCORPORATES

SP

ECIALFEATURESIMPORTANTFORPROTECTIONFROMX-RADIATION.

FILREANDELECTRICALSHOCKHAZARDS,WHENSERVICINGIFIS

ES

SENTIALTHATONLYMANUFATURESSPECFIEDPARTSBEUSEDFOR

TH

ECRITICALCOMPONENTSINTHE

SYMBOLMARKOFTHESCHEMETIC.

CVBS

_LIN

MUTE

_LINE

AUDIO

_R

SD05

ZD100

100uF

16V

C102

SD05

ZD103

SD05

ZD105

MNT

_ROUT

CVBS

_VIN

SPK

_R+

_HOTEL

RT1C3904-T112

Q100

E

B

C

SPK

_R-_HOTEL

CVBS

_RIN

SD05

ZD104

10uF

16V

C101

MUTE

_LINE

SD05

ZD101

SD05

ZD102

MNT

_LOUT

RT1C3904-T112

Q101

E

B

C

MNT

_VOUT

10uF

16V

C100

30V

NON_H

OTEL

_OPT

D102

30V

NON_H

OTEL

_OPT

D103

30V

D101

30V

ADUC30S03010L

_AMODIODE

D100

30V

D104

30V

D105

COMP2_Y

COMP2_PB

COMP2_PR

COMP2_L

COMP2_R

S_V

IDE

O_D

ET

SIDE

_Y

SIDE

_C

+3.3V

_MULTI_MST

OPT

READY

C104

30V

D106

30V

D107

SD05

ZD106

SD05

ZD107

PSJ014-0

1

JK101

S-V

IDEO

GND

6

1

C-L

UG1

2

C-L

UG2

3

0-S

PRING

4

C-L

UG3

5

C-L

UG4

SHIELD

7

75

R102

0

HOTEL

_OPT

R103

0

HOTEL

_OPT

R105

0

NON

_HOTEL

_OPT

R106

0

HOTEL

_OPT

R101

75

R109

75

R108

75

R107

220K

R104

12K

R118

12K

R117

12K

R119

12K

R120

10K

R113

10K

R115

10K

R116

220K

R100

220K

R111

220K

R112

75

R110

75

R122

S-V

IDEO

75

R121

S-V

IDEO

10K

R123

100pF

READY

C103

10K

R114

PPJ226-01

JK100

9A[GN]1P

_CAN

4A[GN]O-SPRING

_A

3A[GN]CONTACT

_A

9B[BL]1P

_CAN

8B[BL]C-LUG

_A

9C[RD]1P

_CAN

_1

8C[RD]C-LUG

_A

9D[WH]1P

_CAN

8D[WH]C-LUG

_A_

1

9E[RD]1P

_CAN

_2

4E[RD]O-SPRING

_A

_1

3E[RD]CONTACT

_A_1

9F[YL]2P

_CAN

4F[YL]O-SPRING

_A

3F[YL]CONTACT

_A

9G[WH]2P

_CAN

8G[WH]C-LUG

_A_

2

9H[RD]2P

_CAN

4H[RD]O-SPRING

_A

_2

3H[RD]CONTACT

_A_2

5J

[YL]O

-SPRING

_B

6J

[YL]CONTACT

_B

7K

[WH]C

-LUG

_B

5L

[RD]O

-SPRING

_B

6L

[RD]CONTACT

_B

1

9

2008/12/16

INPUT1

MSTARN-EU

EAX56856904

H

6LCDMERCURY P

OPNOISE

MNT_OUT

COMPONENT1

POPNOISE

AV1

COMPONENT1,AV1,MNT_

OUT[JACKPACKTYPED]:

JK100

S-VIDEO(ChinaModel)

IN

PUT1:COMPONENT1,S

-VIDEO

Copyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes

LGE Internal Use Only


20/28

USB

_DN

USB

_DP

TH

E


SP


FILREANDELECTRICALSHOCKHAZARDS

,WHENSERVICINGIFIS

ES


TH



SIDE

_LIN

SIDE

_RIN

5.6

B

ZD203

SIDE

_V

PPJ218

-01

JK201

5C[RD]C

ONTACT

2C[RD]U

_CAN

4C[RD]O

_SPRING

2B[WH]U

_CAN

3B[WH]C

_LUG

2A[YL]U

_CAN

5A[YL]C

ONTACT

4A[YL]O

_SPRING

5.6

B

ZD202

USBDOWNSTREAM

KJA-UB-4-0004

SIDE_U

SBJ

K204 1 2 3 4 5

IR_O

UT

+3

.3V

_MST

TX

D

4.7

K

R204

ST3232CDR

IC200

3

C1-

2

V+

4

C2+

1

C1+

6

V-

5

C2-

7

T2OUT

8

R2IN

9

R2OUT

10

T2IN

11

T1IN

12

R1OUT

13

R1IN

14

T1OUT

15

GND

16

VCC

4.7

K

R205

RX

D

KCN-D

S-1-0

088

JK200

1 2 3 4 5

6 7 8 9 10

+3

.3V

_M

ST

+5VST

_MST

6630TGA004K

KCN-D

S-1-0089

JK202

1

RED

2

GREEN

3

BLUE

4

GND

_1

5

DDC_GND

6

RED

_GND

7

GREEN

_GND

8

BLUE_GND

9

NC

10

SYNC_GND

11

GND

_2

12

DDC

_DATA

13

H_S

YNC

14

V_S

YNC

15

DDC

_CLOCK

16

SHILED

SD05

ZD200

DSUB

_SDA P

C_V

S

SD05

ZD201

ENKMC2837-T112

D211

A AC

C

PC

_B

ENKMC2837-T112

D210

A AC

C

PEJ024-01

JK203

6B

T_T

ERMINAL2

8

SHIELD

_PLATE

7B

B_T

ERMINAL2

5

T_S

PRING

4

R_S

PRING

7A

B_T

ERMINAL1

6A

T_T

ERMINAL1

3

E_S

PRING

DSUB

_SDA

PC

_AUD

_R

PC

_G

DSUB

_SCL

CAT24C02WI-GT3

IC201

3

A2

2

A1

4

VSS

1

A0

5

SDA

6

SCL

7

WP

8

VCC

ENKMC2837-T112

D212

A AC

CDDC

_WP

PC

_HS

PC

_AUD

_L

+5V

_MULTI

DSUB

_SCL

PC

_R

CDS3C30GTH

30VD202

CDS3C30GTH

30VD203

ADUC30S03010L

_AMODIOD

E

30V

D200

ADUC30S03010L

_AMODIOD

E

30V

D201

30V

D206

30V

D205

ADUC30S03010L

_AMODIODE

30V

D204

ADUC30S03010L

_AMODIODE3

0V

D209

30V

D208

READY

30V

D207

READY

USB

_DL

_N

USB

_DL

_P

0

REAR

_USB

R229

0

REAR

_USB

R230

USBDOWNSTREAM

UB01123-4HHS-4F

JK205

REAR

_USB

1 2 3 45

0.1

uF

C203

0.1

uF

C200

0.1

uF

C201

0.1

uF

C202

0.0

1uF

C205

0.1uF

C204

0.1uF

C206

0.1uF

C207

100

R202

100

R203

75

R227

220K

R223

READY

220K

R222

READY

12K

R226

12K

R228

75R21

1

75

R212

75

R213

4.7

K

R214

4.7

K

R215

220K

R231

220K

R232

10K

R233

10K

R234

12K

R235

12K

R236

4.7

K

R220

4.7

KR221

100

R216

100

R217

100

R218

0.1

uF

OCP_READY

C208

MIC2009YM6-TR

OCP_READY

IC202

3

ENABLE

2

GND

4FAULT/

1

VIN

6VOUT

5ILIMIT

10uF

OCP_READY

C209

120OHM

OCP_READY

L200

+5V

_USB

1K

OCP

_READY

R209

4.7

K

OCP_READY

R210

0

Non_OCP

R237

10uF6

.3V

C210

USB

_DL

_N

USB

_DL

_P

68

R207

68

R208

68pF

C213

68pF

C211

4.7

K

R219

READY

0R200

0R201

500

L201

220uF

16V

C212

100uF

16V

C214

KDS226

D213

OCP_READY

A

AC

C

510

OCP_READY

R238

160

OCP_READY

R206

10K

R224

10K

R225

IR_

OUT

2

9

INPUT2

MSTARN-EU

2008/12/16

INPUT2:PC,RS-232C,SIDE

AV,USB

USB

EAX56856904

H

6LCDMERCURY

Itspossibelto27~47ohm

**

1A

Design

SIDEAV

RS

-232C

(CIITEM

)

PCEDID

PC

PC

SOUND

PintoPinwith

EAN43439401

ClosetoSIDE

_USB




21/28

TMD

S3_RX2-

+5V

_HDMI_2

TMD

S3_RXC-

HPD

_MST

_2

TMD

S3_RX0+

TMD

S2_RX2-

CEC

TMD

S2_RXC-

TMD

S2_RXC+

TMD

S1_RXC-

TMD

S2_RX0+

TMD

S3_RX0-

TMD

S3_RX1+

TMD

S3_RXC+

+5V_HDMI_2

HPD

_MST

_1

CEC

TMD

S1_RX2+

TMD

S2_RX1+

+5V

_MULTI

+5V_HDMI_1

TMD

S3_RX2+

TMD

S2_RX0-

TMD

S1_RX1-

TMD

S2_RX1-

TMD

S1_RX2-

+5V

_HDMI_3

TMD

S3_RX1-

+5V

_MULTI

+5V

_HDMI_3

+5V

_MULTI

+5V

_HDMI_1

TMD

S1_RX0-

TMD

S1_RX1+

CEC

TMD

S1_RX0+

TMD

S2_RX2+

TMD

S1_RXC+

HPD

_MST

_3

DDC

_SDA2

DDC

_SCL2

DDC

_SDA1

DDC

_SCL1

DDC

_SDA

3

DDC

_SCL

3

JP304

JP305

JP301

JP30

0

JP302

JP303

2SC3875S

RT1C3904-T

112

Q301

E

B

C2SC3875S

RT1C3904-T

112

Q300 E

B

C

2SC3875S R

T1C3904-T

112

Q302 E

B

C

KJA-ET-0-0032

JK303

14NC

13CEC

5DATA1_SHIELD

20

JACK

_GND

12

CLK-

11CLK

_SHIELD

2DATA2_SHIELD

19HPD

18+5V

_POWER

10CLK+

4DATA1+

1DATA2+

17DDC/CEC

_GND

9DATA0-

8DATA0_SHIELD

3DATA2-

16SDA

7DATA0+

6DATA1-

15SCL

KDS184S

D300

A1

C

A2

KDS184S

D301

A1

C

A2

KDS184S

D302

A1

C

A2

CAT24C02WI-GT3

IC301

3

A2

2

A1

4

VSS

1

A0

5

SDA

6

SCL

7

WP

8

VCC

CAT24

C02WI-GT3

IC302

3

A2

2

A1

4

VSS

1

A0

5

SDA

6

SCL

7

WP

8

VCC

CAT24C02WI-GT3

IC300

3

A2

2

A1

4

VSS

1

A0

5

SDA

6

SCL

7

WP

8

VCC

DDC

_WP

DDC

_WP

DDC

_WP

TH

E


SP



,WHENSERVICINGIFIS

ES


TH



BSS8

3

CEC

_READY

Q30

3

SBD

G

CEC

+3

.3V

_MST

CEC

_C

CDS3C30GTH

30VCEC

_READY

D304

MMBD301LT1G

30V

CEC

_READY

D303

10K

R301

1K

R303

0.0

1uF

C300

10K

R300

1K

R302

100

R329

1KR314

10K

R312

68K

CEC

_READY

R315

0R313

100

R317

100

R318

100

R305

100

R304

0.0

1uF

C301

100

R331

100

R306

100

R307

0.0

1uF

C302

100

R327

10K

R308

10K

R310

10K

R309

10K

R311

10K

R319

10K

R320

QJ41193-CFEE1-7F

JK301

1DATA2+

2DATA2_SHIELD

3DATA2-

4DATA1+

5DATA1_SHIELD

6DATA1-

7DATA0+

8DATA0_SHIELD

9DATA0-

10CLK+

11

12

13

14

15

16

17

18

19 2

0JACK

_GND

21

.

22

QJ41193-CFEE1-7F

JK302

1DATA2+

2DATA2_SHIELD

3DATA2-

4DATA1+

5DATA1_SHIELD

6DATA1-

7DATA0+

8DATA0_SHIELD

9DATA0-

10CLK+

11

12

13

14

15

16

17

18

19 2

0JACK

_GND

21

.

22

56K

CEC

_RE

ADY

R316

HDMI

3

9

MSTARN-EU

2008/12/16

OPTION

SW_HPD:USESWH

PD(Default)

MST_HPD:USEMSTHPD

H

6LCD

MERCURY

EAX56856904




22/28


23/28

MAIN

_SIF

0.0

1uF

C501

M_S

DA

27pF

C500

+5V

_TUNER

TV_M

AIN

M_S

CL

+5V

_TUNER

C504

READY

27pF

C502

10uH

L502

READY

82pF

C507

READY

T

HE


S

PECIALFEATURESIMPORTANTFORPROTECTIONFROMX-RADIATION.

F

ILREANDELECTRICALSHOCKHAZARDS

,WHENSERVICIN

GIFIS

E

SSENTIALTHATONLYMANUFATURESSPECFIEDPARTSBEU

SEDFOR

T

HECRITICALCOMPONENTSINTHE

SYMBOLMARKOFTH

ESCHEMETIC.

10uF

16V

C508

120-o

hm

L500

READY

ISA1

530AC1

Q502

E

B

C

TAFT

-H203F

TU500

-*1

NTSC

_TUNER

14

NC

_5

13

V-O

UT

5

RF

_AGC

12

NC

_4

11

MOPLL

_AS

2

GND

_1

19

NC

_8

18

NC

_7

10

SCL

4

NC

_2

1

NC

_1

17

NC

_6

9

SDA

8

GND

_2

3

+B[5V]

16

SIF

-OUT

7

NC

_3

6

TP[3

.3V

_OPT]

15

A-O

UT

21

SHIELD

20

NC

_9

TAFT-Z

20

3D

TU

500

PAL_TUNER 14

NC

_5

13V-O

UT

5RF

_AGC

12NC

_4

11M

OPLL

_AS

2GND

_1

19NC

_8

18NC

_7

10

SCL

4NC

_2

1NC

_1

17NC

_6

9SDA

8GND

_2

3+B[5V]

16SIF-O

UT

7NC

_3

6TP[3

.3V

_OPT]

15A-O

UT

21 S

HIELD2

0NC

_9

4.7

K

R502

220

R50

6

220

R507

100uF16V

C50

5

100uF16V

C509

100uF16V

C50

6

120-o

hm

L501

47

R504

47

R50

5

0.1uF

50V

C503

0L501-*

1

0Ohm

TUNER

5

9

MSTAR

2008/12/16

H6LCD

MERCURY

EAX56856904

Nearthepin




24/28

0.1

uF

C644

0.1

uF

C637

M_SDA

1000pF

C606

22000pF

C616

22000pF

C623

+1.8

V_

DVDD

1000pF

50V

C651

0.4

7uF

C632

MULTI_PW

_SW

0.1

uF

C605

+1.8

V_D

VDD

0.1

uF

C615

0.1

uF

C629

AMP_MUTE_HOTEL

+3

.3V

_MULTI_MST

0.1

uF

C643

DA-8

580

EAP38319001

L607

2S

1S

1F

2F

0.1

uF

C617

0.1

uF

C602

0.0

1uF

C647

SPK

_R+

M_SCL

0.1

uF

C610

DA-8

580

EAP38319001

L603

2S

1S

1F

2F

22000pF

C611

SPK

_L+

+1.8V

_AVDD

SPK

_L-

0.1

uF

C669

+16V

_NTP

+16V

_NTP

SPK

_R-

100pF

C601

22000pF

C625

+1.8

V_A

VDD

0.0

1uF

C672

0.0

1uF

C648

1000pF

C603

SW

_RESET

0.4

7uF

C673

0.0

1uF

C671

0.1

uF

C626

0.0

1uF

C613

330uF35V

C612

TH

E


SP



,WHENSERVICINGIFIS

ES


TH



SPK

_L-

SPK

_R+

+1.8V

_DVDD

SPK

_R-

SMAW250-04

P600

1 2 3 4

SPK

_L+

+1.8V

_AVDD

+1.8

V

I2S

_MCLK

I2S_SDO

I2S_WS

I2S_SCK

390pF

C619

390pF

C621

390pF

C630

390pF

C634

1uF

C608

1uF

C618

1uF

C624

1uF

C614

0.1

uF

50V

C607

10uF

35V

C642

READY

+12V_AUDIO

MNT

_R

_AMP

+12V_AUDIO

RT1C3904-T

112

Q600

E

B

C

RT1C3904-T

112

Q601

E

B

C

MNT

_L_A

MP

0.0

1uF

C635

MNT

_ROUT

+12V_AUDIO

LM

324D

IC601

3INPUT1+

2INPUT1-

4VCC

1OUT1

6INPUT2-

5INPUT2+

7OUT2

8

OUT

3

9

IN

PUT

3-

10

INPUT

3+

11

GND

12

INPUT4+

13

IN

PUT4-

14

OUT4

6800pF

C628

6800pF

C627

MNT_

LOUT

AUDIO

_R

SPK

_R-_HOTEL

SPK

_R+

_HOTEL

12505WR-09A00

HOTEL

_OPT

P601

1 2 3 4 5 6 7 8 9

10

0.1

uF

HOTEL

_OPT

C636

+16V

_NTP

RT1C3904-T112

HOTEL

_OPT

Q602

E

B

C

AMP

_MUTE

_HOTEL

+3.3V

_MULTI_MST

SW

_RESET

10uF

16V

C600

10uF

16V

C604

10uF16V

C609

3.3

R604

12

R608

12

R611

12

R610

12

R638

4.7

K

R663

4.7

K

R623

3.3

R626

3.3

R625

100

R601

3.3

K

R600

100 R676

100 R677

100 R678

100

R602

100

R603

0 R656HOTEL_OPT

0

R673

12

R658

12

R653

12

R621

12

R654

4.7

K

R628

4.7

K

R667

3.3

R671

3.3

R635

1KR607

10K

NON

_HOTEL

_OPT

R613

12K

HOTEL

_OPT

R613-* 5

.6K

R614

5.6

K

R615

10K

NON

_HOTEL

_OPT

R616

12K

HOTEL

_OPT

R616-*

1K

R609

4.7

K

R606

200

HOTEL

_OPT

R612

10K

HOTEL

_OPT

R617

0

HOTEL

_OPT

R620

0

HOTEL

_OPT

R619

4.7

K

R605

33pF

C631

33pF

C633

0.1

uF

C620

0.1

uF

C622

6.8

K

R618

6.8

K

R622

NTP-3

100L

IC600

1

BST1A

2

VDR1A

3

RESET

4

AD

5

DVSS

_1

6

VSS

_IO

7

CLK

_I

8

VDD

_IO

9

DGND

_PLL

10

AGND

_PLL

11

LFM

12

AVDD

_PLL

13

DVDD

_PLL

14

TEST0

15 DVSS_2

16 DVDD

17 SDATA

18 WCK

19 BCK

20 SDA

21 SCL

22 MONITOR_0

23 MONITOR_1

24 MONITOR_2

25 FAULT

26 VDR2B

27 BST2B

28 PGND2B_1

29

PGND2B

_2

30

OUT2B

_1

31

OUT2B

_2

32

PVDD2B

_1

33

PVDD2B

_2

34

PVDD2A

_1

35

PVDD2A

_2

36

OUT2A

_1

37

OUT2A

_2

38

PGND2A

_1

39

PGND2A

_2

40

BST2A

41

VDR2A

42

NC

43VDR1B

44BST1B

45PGND1B_1

46PGND1B_2

47OUT1B_1

48OUT1B_2

49PVDD1B_1

50PVDD1B_2

51PVDD1A_1

52PVDD1A_2

53OUT1A_1

54OUT1A_2

55PGND1A_1

56PGND1A_2

MLB-201209-0120P-N2

0LCML00003B

120-o

hm

L605

MLB-201209-0120P-N2

0LCML00003B

120-o

hm

L606

33pF

50V

C638

READY

33pF

50V

C639

READY

+3

.3V

_MST

10K

R630

RT1C3904-T112

Q603

E

B

C

10K

R629

MU

LTI_PW

_SW

0R627

READY

0R624

READY

22K

R631

READY

SPK

_L-

H6LCDMERCURY

EAX56856904

AUDIO

MSTARN-EU

2008/12/16

6

9

MainAMP

AMP:GAINX4

ChineseHotelOption




25/28


26/28



+1.8V_DDR

DDR2

_A[0-1

2]

DDR2_BA0

DDR2_BA1

DDR2_MCLK

DDR2_MCLKZ

DDR2_CKE

DDR2_ODT

DDR2_RASZ

DDR2_CASZ

DDR2_WEZ

DDR2_DQS0P

DDR2_DQS1P

DDR2_DQM0

DDR2_DQM1

DDR2_DQS0M

DDR2_DQS1M

+1.8V_DDR

+1.8V_DDR

DDR2

_D[0-1

5]

1000p

F

C905

V_REF

56

R900

56

R901

56

R902 5

6R903

56

R904 5

6R905

0.0

1u

F

C904

0.0

1u

F

50V

C900

0.0

1u

F

C901

0.0

1u

F

C902

0.0

1uF

C903

0.0

1u

F

C906

0.0

1u

F

C907

0.0

1u

F

C908

0.0

1u

F

C909

0.0

1u

F

C910

0.0

1u

F

C911

0.0

1u

F

C912

0.0

1u

F

C913

0.0

1u

F

C914

0.0

1u

F

C915

0.0

1u

F

C916

0.0

1u

F

C917

+1.8V_DDR

150

R906

READY

T

HE


S

PECIALFEATURESIMPORTANTFORPROTECTIONFROMX-RADIA

TION.

F

ILREANDELECTRICALSHOCKHAZARDS

,WHENSERVICINGIF

IS

E

SSENTIALTHATONLYMANUFATURESSPECFIEDPARTSBEUSED

FOR

T

HECRITICALCOMPONENTSINTHE

SYMBOLMARKOFTHESC

HEMETIC.

V_REF

0.1

uF

50V

C918

HYB18TC512160

B2F-2.5

IC900

J2

VREF

J8

CK

H2

VSSQ2

B7

UDQS

N8

A4

P8

A8

L1

NC4

L2

BA0

R8

NC3

K7

RAS

F8

VSSQ3

F3

LDM

P3

A9

M3

A1

N3

A5

K8

CK

R3

NC5

L3

BA1

J7

VSSDL

L7

CAS

F2

VSSQ4

B3

UDM

M2

A10/AP

K2

CKE

R7

NC6

M7

A2

N7

A6

M8

A0

J1

VDDL

K3

WE

E8

LDQS

P7

A11

K9

ODT

A2

NC1

N2

A3

P2

A7

H8

VSSQ1

F7

LDQS

A8

UDQS

R2

A12

L8

CS

E2

NC2

E7

VSSQ5

D8

VSSQ6

D2

VSSQ7

A7

VSSQ8

B8

VSSQ9

B2

VSSQ10

P9

VSS1

N1

VSS2

J3

VSS3

E3

VSS4

A3

VSS5

G9

VDDQ1

G7

VDDQ2

G3

VDDQ3

G1

VDDQ4

E9

VDDQ5

C9

VDDQ6

C7

VDDQ7

C3

VDDQ8

C1

VDDQ9

A9

VDDQ10

R1

VDD1

M9

VDD2

J9

VDD3

E1

VDD4

A1

VDD5

B9

DQ15

B1

DQ14

D9

DQ13

D1

DQ12

D3

DQ11

D7

DQ10

C2

DQ9

C8

DQ8

F9

DQ7

F1

DQ6

H9

DQ5

H1

DQ4

H3

DQ3

H7

DQ2

G2

DQ1

G8

DQ0

10u

F

10V

C919

1KR907

1KR908

DDR2

_A[0]

DDR2

_A[12]

DDR2

_A[11]

DDR2

_A[1]

DDR2

_A[2]

DDR2

_A[3]

DDR2

_A[4]

DDR2

_A[5]

DDR2

_A[6]

DDR2

_A[7]

DDR2

_A[8]

DDR2

_A[9]

DDR2

_A[10]

DDR2

_D[0

-15]

DDR2

_D[0]

DDR2

_D[1]

DDR2

_D[2]

DDR2

_D[3]

DDR2

_D[4]

DDR2

_D[5]

DDR2

_D[6]

DDR2

_D[7]

DDR2

_D[8]

DDR2

_D[9]

DDR2

_D[10]

DDR2

_D[11]

DDR2

_D[12]

DDR2

_D[13]

DDR2

_D[14]

DDR2

_D[15]

DDR2

MSTAR

DDR2

8

9

2

008/12/16

H6LCDMERCURY

EAX56856904

DDR2MEMORY

ClosetoDDR2

IC

ClosetoDDR2IC


27/28


28/28

Feb., 2009

Printed in KoreaP/NO : MFL60021510

mfl67468023_42ls3450-da.awc-awh-awm

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