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    Differentiate the types of Integratedcircuits

    Construct and interpret circuits thatuses integrated circuits

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    Small in size

    Low cost

    y

    limited operating current

    and voltage

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    This involves the processing

    of the Silicon Wafer

    This involves molding the ICinto its ceramic or plasticpackages

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    This involves testing the IC basedon its electrical characteristics

    The last part of the processwhere the IC is already packedand ready for transport or

    delivery.

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    IC Processing

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    Attire in SemiconductorIndustry

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    Bipolar Transistor

    MOS Technology

    Small signal IC

    Power IC

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    Things to take note about

    MOS Technology

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    Plastic (0 to 70) Ceramic (-55 to +125 )

    Through-Hole Device

    Surface Mount Device

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    SIP (Single in-line package)

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    DIP (Dual in-line package)

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    PGA (Pin-grid arrays)

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    Small Outlined IC

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    Flat packs

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    BGA (Ball-grid arrays)

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    IC IDENTIFICATION CODE

    Example:

    -p n

    Letterprefix

    Lettersuffix

    Designator

    Afril C. PascualAfril C. PascualAfril C. PascualAfril C. Pascual

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    IC Function and Features:

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    PIN CONFIGURATION OF IC

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    Example of Internal Circuitry of an IC

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    Electrical Characteristics:

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    - linear type of circuitry

    Digital IC- switched type of circuitry

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