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CPU: central processing unit ()

IC: Integrated circuit()

Memory IC: Memory Integrated circuit

RAM: Random Access Memory

DRAM: Dynamic Random Access Memory

SRAM: Staic Random Access Memory

ROM: Read-only Memory EPROM:Electrical Programmable Read-only Memory

EEPROM: Electrical Erasbale Programmable Read-only MemoryCMOS: Complementary Metal-Oxide-Semiconductor

BIOS: Basic Input Output System

Transistor

LED:

Resistor

Variator Capacitor:

Capacitor array

Diode

Transistor

Transformer ADP

Oscillator 0sc

Crystal

XTAL/OSC: X

Relay

Sensor Bead core

Filter:

Flat Cable

Inductor

Buzzer

Socket

Slot

Fuse

Current

Solder iron

Magnifying glass

Caliper

Driver

Oven

TFT:

Oscilloscope

Connector

PCB:printed circuit board


2/282

PCBA: printed circuit board assembly

PP:

HDD:

FDD:

PSU:power supply unit

SPEC:

Attach:

Case:

Cover

Base

Bazel panel

Bracket

Lable

Guide

Manual

Card

Switch

Hub

Router

Sample

Gap

Sponge

Pallet

Foam

Fiber

Disk

PROG:

Barcode System

System Barcode

M/B:mother board

CD-ROM:

FAN:

Cable

Audio

K/B:Keyboard

Mouse

Riser card Card reader

Screw

Thermal pad

Heat sink

Rubber

Rubber foot

Bag

Washer

Sleeve


3/283

Config

Label hi-pot

Firmware label

Metal cover

Plastic cover

Tape for packing

Bar code

Tray

Collecto

Holder ,L

Connecter

IDE:

SCSI:

Gasket

AGP:

PCI:

LAN:

USB:

Slim

COM:

LPT:

Power cord

I/O:

Speaker

EPE:

Carton

Button

Foot stand QS:Quality system

CS:Coutomer Sevice

QC:Quality control

IQC:Incoming quality control

LQC:Line Quality Control

IPQC:In process quality control

FQC:Final quality control

OQC:Outgoing quality control

QA:Quality assurance

SQA:Source(supplier) Quality Assurance (VQA)

CQACustomer Quality Assurance

PQArocess Quality Assurance

QE:Quality engineer

CE:component engineering

EE:equipment engineering

ME:manufacturing engineering

TE:testing engineering


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PPEroduct Engineer

IE:Industrial engineer

ADM: Administration Department

RMA:

CSDI:

PC:producing control

MC:mater control

GAD: General Affairs Dept

A/D: Accountant /Finance Dept

LAB: Laboratory

DOE:

HR:

PMC:

RD:

W/H:

SI:

PD: Product Department

PA:

(PUR: Purchaing Dept)SMT:Surface mount technology

MFG:Manufacturing

MIS:Management information system

DCC:document control center

QT:Quality target

QP:Quality policy

QI:Quality improvement

CRITICAL DEFECT: CR

MAJOR DEFECT: MA

MINOR DEFECT: MI

MAX:Maximum

MIN:Minimum

DIAiameter

DIMimension

LCL:Lower control limit

UCL:Upper control limit

EMI:

ESD:

EPA :

ECN:

ECO:Engineering change order

ECR:

CPI:Continuous Process Improvement

Compatibility

Marking

DWGrawing

Standardization


5/285

Consensus

Code

ZD:Zero defect

Tolerance

Subject matter

Auditor

BOM:Bill of material

Rework

IDidentification ,,

PILOT RUN: ()

FAI:

FPIRFirst Piece Inspection Report

FAA:

SPC

CP: capability index

CPK: capability index of process )

PMP

MPI:

DASefects Analysis System

PPB

Flux

P/N:

L/NLot Number

Version

Quantity

Valid date

MIL-STDMilitary-Standard

ICT: In Circuit Test ()ATEAutomatic Test Equipment

MO: Manafacture Order

T/U: Touch Up ()

I/N:

P/T:

F/T: Function Test (-)

AS

P/K:

TQM:Total quality control

MDA:manufacturing defect analysis (ICT)RUN-IN:

HI-pot

FMIFrequency Modulation Inspect

DPPM: Defect Part Per Million () 1000PPM

0.1%

Corrective Action: (CAR )

ACC

REJ:

S/SSample size


6/286

SI-SIVSpecial I-Special IV

CONConcession / Waive

ISO:

ISAIndustry Standard Architecture

OBA:

FIFO:

PDCA:

Plan do check action

WIP:

S/O: Sales Order ()

P/O: Purchase Order ()

P/R: Purchase Request ()

AQL:acceptable quality level

LQL;Limiting quality level

QVL:qualified vendor list

AVL (Approved Vendor List)

QCD: Quality cost delivery

MPM:Manufacturing project management

KPI:Key performance indicate

MVT:Manufacturing Verification Test

Q/R/SQuality/Reliability/Service //

STL:ship to line

NTF:No trouble found

CIP:capacity improvement plan

MRB:material review board

MRB:Material reject bill

JIT:just in time

5S:seiri seiton seiso seiketsu shitsuke

SOP:standard operation process

SIP:Specification inspection process

TOP: Test Operation Process ()

WI: working instruction

SMD:surface mounting device

FAR:failure aualysis report

CAR:Corrective action report

BPR (Business Process Reengineering)

ISAR (Initial Sample Approval Request)-JIT (Just In Time)

QCC (Quality Control Circle)

Engineering Department ()TQEM: Total Quality Environment Management

()

PD: Production Department ()

LOG: Logistics ()

Shipping: ()

AOQAverage Output Quality


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AOQLAverage Output Quality Level

FMEAfailure model effectiveness analysis

CRB: Change Review Board ()

CSACustomer Simulate Analysis

SQMSSupplier Quality Management System

QIT: Quality Improvement Team

QIPQuality Improvement Plan

CIPContinual Improvement Plan

M.Q.F.S: Material Quality Feedback Sheet ()

SCAR: Supplier Corrective Action Report ()

8D Sheet: 8 Disciplines sheet ( 8D )

PDCAPDCA (Plan-Do-Check-Action) )

MPQ: Material Packing Quantity ()

DSCN: Delivery Schedule Change Notice ()

QAPS: Quality Assurance Process Sheet ()

DRP (Distribution Resource Planning)

DSS (Decision Support System)

EC

(Electronic Commerce)EDI (Electronic Data Interchange)

EIS (Excutive Information System)

(Enterprise Resource Planning)

FMS (Flexible Manufacture System)

KM (Knowledge Management)

4L (Lot-for-Lot)

LTC (Least Total Cost)

LUC (Least Unit Cost)

MES (Manufacturing Execution System)

MPS (Master Production Schedule)MRP (Material Requirement Planning)

MRP (Manufacturing Resource Planning)

OEM (Original Equipment Manufacture)

ODM (Original Design & Manufacture)

OLAP (On-Line Analytical Processing)

OLTP (On-Line Transaction Processing)

OPT (Optimized Production Technology)

PDCA PDCA (Plan-Do-Check-Action)

PDM (Product Data Management))

RCCP (Rough Cut Capacity Planning)SCM (Supply Chain Management)

SFC (Shop Floor Control)

TOC (Theory of Constraints)

TQC (Total Quality Control)

FYI/R:for your information/reference

ASAP:

S/T:Standard time

TPM:total production maintenance

ESD Wrist strap


8/288

IT:information technology

CEOChief Executive Officer

COOChief Operaring Officer

SWOTStrength,Weakness,Opportunity,Threat

Competence

Communication

Cooperation

Vibration Testing

IDPIndividual Development Plan

MRPMaterial Requirement Planning

MAT'SMaterial

LRRLot Rejeet Rate

ATINAttention

3CComputer ,Communication , Consumer electronic

5W1HWhen , Where , Who , What , Why , Ho5M: Man , Machine , Material , Method , Measurement

,,,,4MIE: Man,Material,Machine,Method,Environment

,,,,()

7M1I: Manpower , Machine , Material , Method, Market , Management , Money , Information

,

1 Accuracy

2 Action

3 Activity

4 Analysis Covariance

5 Analysis of Variance

6 Approved

7 Attribute

8 Average

9 Balance sheet

10 Binomial

11 Brainstorming Techniques

12 Cause and Effect Matrix ()

13 CL:Center Line

14 Check Sheets

15 Complaint

16 Conformity

17 Control

18 Control chart ()

19 Correction

20 Correlation Methods

21 CPI: continuouse Process Improvement

22 Cross Tabulation Tables

23 CS: Customer Sevice

24 DSA: Defects Analysis System


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25 Data Description:

26 DCC: Document Control Center

27 Decision

28 Defects per unit

29 Description

30 Device

31 Do

32 DOE: Design of Experiments

33 Element

34 Engineering recbnology

35 Environmental

36 Equipment

37 Estimated accumulative frequency

38 E Equipment Variation

39 External Failure ,

40 FA: Failure Analysis

41 Fact control

42 Fatigue

43 FMEA: Failure Mode and Effect Analysis

44 FP First-Pass Yield

45 FQA: Final Quality Assurance

46 FQC: Final Quality control

47 Gauge system

48 Grade

49 Histogram

50 Improvement

51 Initial review

52 Inspection 53 Internal Failure

54 IPQC: In Process Quality Control

55 IQC: Incomming Quality Control

56 IS International Organization for Standardization

57 LCL: Lower Control limit

58 LQC: Line Quality Control

59 LSL: Lower Size Limit

60 Machine

61 Manage

62 Materials 63 Measurement

64 Median

65 MSA: Measurement System Analysis

66 Occurrence

67 Operation Instruction

68 Organization

69 Parto

70 PPMarts per Million

71 Plan


10/2810

72 Policy

73 Population

74 PQA: Process Quality Assurance

75 Practice ()

76 Prevention

77 Probability

78 Probability density function

79 Procedure

80 Process

81 Process capability analysis

82 Process control and Process capability

83 Product

84 Production

85 Projects

86 QA: Quality Assurance

87 QC: Quality Control

88 QE: Quality Engineering

89 QFD: Quality Function Desgin

(

)90 Quality

91 Quality manual

92 Quality policy ()

93 Random experiment

94 Random numbers

95 R:Range

96 Reject

97 Repair

98 Repeatusility

99 Reproducibility 100 Requirement

101 Responsibilities

102 Review

103 Reword

104 Rolled yield

105 RPN: Risk Priority Number

106 Sample ,

107 Sample space

108 Sampling with replacement

109 Sampling without replacement 110 Scatter diagram

111 Scrap

112 Simple random sampling

113 Size

114 SL: Size Line

115 Stratified random sampling

116 SOP: Standard Operation Procedure

117 SPC: Statistical Process Control

118 Specification


11/2811

119 SQA: Source(Supplier) Quality Assurance

120 Stage sampling

121 Standard Deviation

122 Sum of squares

123 Taguchi-method ()

124 Theory

125 TQC: Total Quality Control

126 TQM: Total Quality Management

127 Traceablity

128 Training

129 UCL: Upper Control Limit

130 USL: Upper Size Limit

131 Validation

132 Variable

133 Verification

134 Version

135 VOC: Voice of Customer

136 VOE: Voice of Engineer

137 Inventory stock report:

138 Sales order report :

QC quality control

FQC final quality control

IPQC in process quality control

OQC output quality control

IQC incoming quality control

TQC total quality control POC passage quality control

QA quality assurance

OQA output quality assurance

QE quality engineering

FAI first article inspection

FAA first article assurance

CP capability index CPK capability process index

SSQA standardized supplier quality audit

FMEA failure model effectiveness analysis

FQC

AQL Acceptable Quality Level

S/S Sample size

ACC Accept

REE Reject


12/2812

CR Critical

MAJ Major

MIN Minor

Q/R/S Quality/Reliability/Service //

P/N Part Number

L/N Lot Number

AOD Accept On Deviation

UAI Use As It

FPIR First Piece Inspection Report

PPM Percent Per Million

SPC Statistical Process Control

SQC Statistical Quality Control

GRR Gauge Reproductiveness & Repeatability

DIM Dimension

DIA Diameter

N Number

QIT Quality Improvement Team

ZD Zero Defect

QI Quality Improvement

QP Quality Policy

TQM Total Quality Management

RMA Return Material Audit

7QCTools 7 Quality Control Tools

ECN Engineering Change Notice ()

ECO Engineering Change Order ()

PCN Process Change Notice

PMP Product Management Plan

SIP Standard Inspection Procedure

SOP Standard Operation Procedure

IS Inspection Specification

BOM Bill Of Material PS Package Specification

SPEC Specification

DWG Drawing

ES Engineering Standard

CGOO China General PCE

IWS International Workman Standard


13/2813

ISO International Standard Organization

GS General Specification

PMC Production & Material Control

PCC Product control center

PPC Production Plan Control

MC Material Control DC Document Center

QE Quality Engineering ()

QA Quality Assurance ()

QC Quality Control ()

PD Product Department

LAB Laboratory

IE Industrial Engineering

R&D Research & Design

PCs Pieces (,)

PRS Pairs ()

CTN Carton

PAL Pallet/skid

PO Purchasing Order

MO Manufacture Order

D/C Date Code

ID/C Identification Code ()

SWR Special Work Request

L/N Lot Number

P/N Part Number

OEM Original Equipment Manufacture

PC Personal Computer

CPU Central Processing Unit

A.S.A.P As Soon As Possible

E-MAIL Electrical-Mail

N/A Not Applicable

QTY Quantity

I/O input/output /NG Not Good ,

C=0 Critical=0

APP Approve ,,

CHK Check

ASS'Y Assembly ,

T/P True Position 5WIH When, Where, Who, What, Why, How to

6M Man, Machine, Material, Method, Measurement, Message

4MTH Man, Material, Money, Method, Time, How ,,,,()


14/2814

SQA Strategy Quality Assurance

DQA Design Quality Assurance

MQA Manufacture Quality Assurance

SSQA Sales and service Quality Assurance

LRR Lot Reject Rate

SPS Switching power supply

DT Desk Top ()

MT Mini-Tower ()DVD Digital Video DiskVCD Video Compact Disk

LCD Liquid Crystal DisplayCAD Computer Aided Design

CAM Computer Aided Manufacturing

CAE Computer Aided Engineering

PCB Printed Circuit Board

CAR Correction Action Report

NG Not Good

WDR Weekly Delivery Requirement

PPM Percent Per Million TPM Total Production Maintenance

MRP Material Requirement Planning

OS Operation System

TBA To Be Assured ,D/C Drawing Change

P/P Plans & Procedure

EMI Electrical-Music Industry

Electrical Magnetic Interference

RFI Read Frequency Input

MMC Maximum Material ConditionMMS Maximum Material Size

LMC Least Material Condition

LMS Least Material Size

LED lighting-emitting diode QBR Quarter Business RecordCIP Continuous improvement process

FGI Forecasted Goal Inventory

CNC Computerized numeral controllerB2C Business to customer

B2B Business to business

AVL Approved vendor listPOP Procedure of packaging

EOL End of life

VDCS Vender defect correcting sheet

PDCS Process defect correcting sheetGRN Goods receiving note

A/R Accounting receivable

A/P Accounting payable


15/2815

president

operator

position

general manager

special assistant

deputy manager |'depjuti| =vice manager deputy supervisor =vice supervisor

group leader

line leader

supervisor

responsible department Human Resources Department

Head count production department

planning department

QC Section

stamping factory

painting factory

molding factory

administration/general affairs dept./

production unit

meeting minutes

distribution department

subject

conclusion

decision items

pre-fixed finishing date

Color management

Visual management

production capacity

first count

first check

second count

second check

quantity of physical inventory second count

physical inventory

physical count quantity

difference quantity

spare parts physical inventory list

cause analysis

waste materials


16/2816

description

specification

model

work order

revision

remark

Registration

registration card

to control

application form for purchase

consume, consumption

to notify

to fill in

to collect, to gather

statistics

cosmetic inspection standard

computer case ()

personal computer enclosure

front plate

rear plate

chassis |'?si|

bezel panel

Hood

base pan

bezel

riser card

flat cable

TOP driver cage bottom driver cage

resin film

raw materials

materials

steel plate

roll/coil material

spare parts =buffer

plastic parts

sheet metal parts/stamping parts

material check list finished product

semi-finished product

good product/accepted goods/ accepted parts/good parts

defective product/non-good parts

disposed goods

warehouse/hub

packing material

basket

plastic basket


17/2817

flow chart

production tempo

lots of production

manufacture procedure

to revise, modify

to switch over to, switchto, switching over

engineering bottleneck, project difficulty

glove(s)

glove(s) with exposed fingers

Band-Aid

Industrial alcohol

broom

mop

vacuum cleaner

rag

garbage container

garbage can

garbage bag

liaison

rags

lamp holder

to mop the floor

to clean a table

air pipe

delivery deadline

die worker

production, to produce

equipment resistance

beacon

coolant

crusher

club car

plate

power button

reset button

forklift

Workshop traveler trailer =long vehicle

Hydraulic trolley

hydraulic hand jack

casing = containerization

Velocity

patent

coordinate

supply and demand

career card


18/2818

barricade

carton box

to pull and stretch

work cell/work shop

sub-line

bottleneck

plain die

pierce die

forming die

progressive die

stage die

compound die

shearing die

riveting die

feature die male die

female die

cavity

core

die change

to fix a die

to repair a die

punch set

punch pad

punch holder stripper pad

up stripper

upper plate

lower plate

die pad

die holder

die set

bottom block

bottom plate ()

upper supporting blank

upper padding plate blank

top plate

top block

stripping plate ()

outer stripper

inner stripper

lower stripper

Punch


19/2819

insert ()

deburring punch

groove punch

stamped punch

round punch

special shape punch

bending block

roller

baffle plate

located block

supporting block for location

air cushion plate

air-cushion eject-rod

trimming punch

stiffening rib punch = stinger

ribbon punch

reel-stretch punch

guide plate

sliding block

sliding dowel block

die locker

pressure plate =plate pinch

thickness gauge

cutting die, blanking die

die block

folded block

sliding block

location pin lifting pin

die plate, front board

padding block

stepping bar

panel board

to load a die

to unload a die

active plate

lower sliding plate

upper holder block upper mid plate

spring box

spring-box eject-rod

spring-box eject-plate

bushing block

cover plate

guide pad

pilot

trim


20/2820

pierce

pocket for the punch head

slug hole

radius

shim/wedge/heel/pad/spacer/gasket

torch-flame cut

set screw

form block

round pierce punch =die button

shape punch =die insert

stock located block

metal plate

miller

grinder

tolerance

score =groove

sliding block

Lathe

active plate

baffle plate

cover plate

groove punch

air-cushion eject-rod

spring-box eject-plate

capability

parameter

factor

driller set up die

height of die setting up

analog-mode device

inner guiding post

inner hexagon screw

dowel pin

coil spring

lifter pin

eq-height sleeves =spool

pin lifter guide pin

guide pin

wire spring

outer guiding post

stop screw

located pin

outer bush

press specification

die height


21/2821

flow mark

welding mark

post screw insert

self tapping screw

stripper plate

piston

handle mold

flash mold

positive mold

split mold

die lifter

top stop

bottom stop

one stroke

to continue, cont.

to grip(material)

location lump, locating piece, location block

reset

to file burr

embedded lump |in'bed| mp| ?|l

stamping-missing

to tight a bolt

to loosen a bolt

punched hole

to cut edge =side cut =side scrap

to bending

to pull, to stretch

engraving, to engrave stamping

to stake

designing, to design

design modification

gauge(or jig)

pedal

stopper

flow board

torque

spline =the multiple keys quenching

tempering

annealing

carbonization

alloy

tungsten high speed steel

moly high speed steel

forming (,)

draw hole


22/2822

bending

emboss

dome

semi-shearing

stamp mark

deburr or coin

punch riveting

side stretch

reel stretch

groove

stamp letter ()

tick-mark nearside

tick-mark farside

punch, press

punching machine hydraulic machine

jack

decoiler

manufacture management

stamping, press

feeder

rack, shelf, stack

taker

to reverse material

to load material to unload material

to return material/stock to

scraped |'skr?pid|

scrape ..v. ;

robot

production line

packaging tool

packaging

well type

insulated runner

hot runner

runner plat

valve gate

band heater

spindle


23/2823

spear head

slag well

cold slag

air vent

welding line

eject pin

knock pin

return pin

sleeve

stripper plate

insert core

runner stripper plate

guide pin

eject rod (bar)

subzero

three plate

runner system

stress crack

orientation

sprue gate

nozzle

sprue lock pin ()

slag well

side gate

edge gate

tab gate

film gate

flash gate slit gate

fan gate

dish gate

diaphragm gate

ring gate

submarine gate

tunnel gate

pin gate

runner less

sprue less long nozzle

spur ;

waste

board

sliding rack

to impose lines

to compress, compressing

character die

to feed, feeding


24/2824

material change, stock change

feature change

prepare for, make preparations for

rotating speed, revolution

abnormal handling

Assembly line

Layout

Conveyer

Rivet machine

Rivet gun

Screw driver

Electric screw driver

Hydraulic machine

Pneumatic screw driver

automation to stake, staking, riveting

add lubricant oil

argon welding

cylinder

robot

conveying belt

transmission rack

to draw holes

bolt

nut screw

identification tag

screwdriver plug

automatic screwdriver

to move, to carry, to handle

be put in storage

packing

staker = riveting machine

fit together

fasten ()

fixture ()

pallet/skid

barcode

barcode scanner

fuse together

fuse machine/heat stake

processing, to process

delivery, to deliver


25/2825

to return delivery to. to send delivery back to return of goods

easily damaged parts

standard parts

to lubricate

spring

spare tools location/buffer

spare molds location

tox machine

phosphate

viscosity

alkalidipping

main manifold

organic solvent

demagnetization ;

high-speed transmission heat dissipation

rack

volatile

degrease

rinse

alkaline etch

desmot

D.I. rinse

Chromate

Anodize seal

scraped products

disposed products

dismantle the die

auxiliary function

heater band

thermocouple

derusting machine

degate

dryer

induction

induction light

response =reaction =interaction

ram

edge finder

concave

convex

cold slug


26/2826

blush

gouge ;

satin texture

witness line

grit

granule =pellet =grain

sand blasting

grit maker

cushion

fillet ;

roller pin formality

cam driver

shank

crank shaft

qualified products, up-to-grade products defective products, not up-to-grade products

defective product box

poor processing

poor incoming part

exposed metal/bare metal

excessive defect

critical defect

major defect

minor defect

not up to standard cosmetic defect

lack of painting

slipped screw head/slippery slipped thread

missing part

wrong part

oxidation

defective threading

poor staking

deficient purchase

deficient manufacturing procedure

cosmetic inspection

inner parts inspection

blister

angular offset

dent

scratch

deformation

filings


27/2827

defective label

abrasion

Breaking. (be)broken,(be)cracked

short

nick

speck

shine

splay

gas mark

delaminating

speckle

mildewed =moldy = mouldy

deformation

burr ()

Flash ()

poor staking

excessive gap

grease/oil stains

inclusion

shrinking/shrinkage

mixed color

fold of packaging belt

painting make-up

discoloration

water spots

impurity

Mismatch

failure, trouble deformation

rust

peel

Shrink

Contamination

water spots

Gap

label error

Missing label

rejection criteria Suspected rejects

abrasion

Texture surface

Streak

stains

Blotch

discoloration

Inclusion

slug mark


28/28

dirt grime

blush

sink

Hickey

labels and logos

Configuration labels

corrugated container

Delaminating

splattering

Gouge

puckering

stratification

histogram

plato diagram

check sheet

charateristic diagram scatter diagram

control diagram

OTHERS

ABSPVC()

T

5S ,

SPC 1. 2. 3. 4. 5.

6. 7.

QC KJ PDPC PERT

QE FMEA QFD SIX SIGMA

5W1H

!!!

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