Form #: CSI-D-686 Document 005

Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • sales@micross.com • www.micross.com

March 29, 2016 • Rev is ion 2.6

MYX4DDR264M16HW

Features

• Tin-lead ball metalurgy

• VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V

• JEDEC-standard 1.8V I/O (SSTL_18-compatible)

• Differential data strobe (DQS, DQS#) option

• 4n-bit prefetch architecture

• Duplicate output strobe (RDQS) option for x8

• DLL to align DQ and DQS transitions with CK

• 8 internal banks for concurrent operation

• Programmable CAS latency (CL)

• Posted CAS additive latency (AL)

• WRITE latency = READ latency - 1 tCK

• Selectable burst lengths (BL): 4 or 8

• Adjustable data-output drive strength

• 64ms, 8192-cycle refresh

• On-die termination (ODT)

• Supports JEDEC clock jitter specification

• 8D response time

Options Code

• Configuration

64M x 16 (8M x 16 x 8 banks) 64M16

• Package: FBGA (Sn63 Pb37) BG

84-ball FBGA (8mm x 12.5mm) HR Die Rev :H

84-ball FBGA (8mm x 12.5mm) NF Die Rev :M

• Timing - cycle time

2.5ns @ CL = 5 (DDR2-800) -25E

• Self refresh

Standard None Low-power L

• Operating temperature

Industrial (-40°C ≤ TC ≤ +95°C; IT -40°C ≤ TA ≤ +85°C;)

Military (-55°C ≤ TC ≤ +125°C) XT

• Part Marking: Label (L), Dot (D)

Table 1: Key Timing Parameters

Speed GradeData Rate (MT/s)

tRC (ns)CL=3 CL=4 CL=5 CL=6 CL=7

-25E 400 533 800 800 n/a 55

1Gb - 64M x 16 DDR2 SDRAMAdvanced information. Subject to change without notice.

Micron Part No. MT47H64M16HR, Die Rev:H (NOTE: for IT Temp)Micron Part No. MT47H64M16NF, Die Rev:M (NOTE: for XT Temp)

mailto:sales%40micross.com?subject=http://www.micross.com/?utm_source=Micross%20PDF&utm_medium=Flyer_MYX4DDR264M16HW&utm_campaign=Micross.comhttp://www.micross.com/?utm_source=Micross%20PDF&utm_medium=Flyer_MYX4DDR264M16HW&utm_campaign=Micross.com

Form #: CSI-D-686 Document 005

Micross US (Americas) • 407.298.7100Micross UK (EMEA & ROW) • +44 (0) 1603 788967

sales@micross.comwww.micross.com

MYX4DDR264M16HW • 1Gb - 64M x 16 DDR2 SDRAMAdvanced information. Subject to change without notice.

March 29, 2016 • Rev is ion 2.6

Figure 1: 84-Ball FBGA - x16 Ball Assignments (Top View)Figure 7: 84-Ball FBGA – x16 Ball Assignments (Top View)

V DDQ

DQ15

V DDQ

DQ13

V DDQ

DQ7

V DDQ

DQ5

V DD

ODT

V DD

V SS

UDQS#/NU

V SSQ

DQ8

V SSQ

LDQS#/NU

V SSQ

DQ0

V SSQ

CK

CK#

CS#

A0

A4

A8

RFU

V SSQ

UDQS

V DDQ

DQ10

V SSQ

LDQS

V DDQ

DQ2

V SSDL

RAS#

CAS#

A2

A6

A11

RFU

V SS

UDM

V DDQ

DQ11

V SS

LDM

V DDQ

DQ3

V SS

WE#

BA1

A1

A5

A9

RFU

NC

V SSQ

DQ9

V SSQ

NC

V SSQ

DQ1

V SSQ

V REF

CKE

BA0

A10

A3

A7

A12

V DD

DQ14

V DDQ

DQ12

V DD

DQ6

V DDQ

DQ4

V DDL

BA2

V SS

V DD

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

1 2 3 4 6 7 8 95

1Gb: x4, x8, x16 DDR2 SDRAMBall Assignments and Descriptions

PDF: 09005aef821ae8bf1GbDDR2.pdf – Rev. X 10/11 EN 16 Micron Technology, Inc. reserves the right to change products or speci�cations without notice. 2007 Micron Technology, Inc. All rights reserved.

mailto:sales%40micross.com?subject=http://www.micross.com/?utm_source=Micross%20PDF&utm_medium=Flyer_MYX4DDR264M16HW&utm_campaign=Micross.comhttp://www.micross.com/?utm_source=Micross%20PDF&utm_medium=Flyer_MYX4DDR264M16HW&utm_campaign=Micross.com

Form #: CSI-D-686 Document 005

Micross US (Americas) • 407.298.7100Micross UK (EMEA & ROW) • +44 (0) 1603 788967

sales@micross.comwww.micross.com

MYX4DDR264M16HW • 1Gb - 64M x 16 DDR2 SDRAMAdvanced information. Subject to change without notice.

March 29, 2016 • Rev is ion 2.6

Figure 2: Package Dimensions 84-Ball FBGA Package (8mm x 12.5mm) – x16; “HR” Die Rev:H

Packaging

Package Dimensions

Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16

1.8 CTRNonconductive

overmold

0.155

Seating plane

0.12 A

123789

Ball A1 ID Ball A1 ID

A

0.25 MIN

1.1 ±0.1

6.4 CTR

8 ±0.1

0.8 TYP

11.2 CTR

12.5 ±0.1

84X Ø0.45Dimensions applyto solder ballspost-reflow onØ0.35 SMD ball pads.

0.8 TYP

ABCDEFGHJKLMNPR

Exposed gold plated pad1.0 MAX X 0.7 nominal.

Notes: 1. All dimensions are in millimeters.2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,

36%Pb, 2% Ag).

1Gb: x4, x8, x16 DDR2 SDRAMPackaging

PDF: 09005aef821ae8bf1GbDDR2.pdf – Rev. X 10/11 EN 19

Micron Technology, Inc. reserves the right to change products or specifications without notice.� 2007 Micron Technology, Inc. All rights reserved.

Packaging

Package Dimensions

Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16

1.8 CTRNonconductive

overmold

0.155

Seating plane

0.12 A

123789

Ball A1 ID Ball A1 ID

A

0.25 MIN

1.1 ±0.1

6.4 CTR

8 ±0.1

0.8 TYP

11.2 CTR

12.5 ±0.1

84X Ø0.45Dimensions applyto solder ballspost-reflow onØ0.35 SMD ball pads.

0.8 TYP

ABCDEFGHJKLMNPR

Exposed gold plated pad1.0 MAX X 0.7 nominal.

Notes: 1. All dimensions are in millimeters.2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,

36%Pb, 2% Ag).

1Gb: x4, x8, x16 DDR2 SDRAMPackaging

PDF: 09005aef821ae8bf1GbDDR2.pdf – Rev. X 10/11 EN 19

Micron Technology, Inc. reserves the right to change products or specifications without notice.� 2007 Micron Technology, Inc. All rights reserved.

Notes: 1. All dimensions are in millimeters. 2. Solder ball material: Sn63/Pb37

Figure 3: Package Dimensions 84-Ball FBGA Package (8mm x 12.5mm) – x16; “NF” Die Rev:M

Packaging

Package Dimensions

Figure 7: 84-Ball FBGA Package (8mm x 12.5mm) – x16; "NF" Die Rev :M

1.8 CTRNonconductive

overmold

0.155

Seating plane

0.12 A

123789

Ball A1 ID(covered by SR)

Ball A1 ID

A

0.28 MIN

1.1 ±0.1

6.4 CTR

8 ±0.1

0.8 TYP

11.2 CTR

12.5 ±0.1

84X Ø0.47Dimensions applyto solder ballspost-reflow onØ0.42 SMD ball pads.

0.8 TYP

ABCDEFGHJKLMNPR

Notes: 1. All dimensions are in millimeters.2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).

1Gb: x8, x16 Automotive DDR2 SDRAMPackaging

PDF: 09005aef85a711f41gb_ddr2_ait-aat_u88b.pdf – Rev. B 10/14 EN 17

Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2014 Micron Technology, Inc. All rights reserved.

Packaging

Package Dimensions

Figure 7: 84-Ball FBGA Package (8mm x 12.5mm) – x16; "NF" Die Rev :M

1.8 CTRNonconductive

overmold

0.155

Seating plane

0.12 A

123789

Ball A1 ID(covered by SR)

Ball A1 ID

A

0.28 MIN

1.1 ±0.1

6.4 CTR

8 ±0.1

0.8 TYP

11.2 CTR

12.5 ±0.1

84X Ø0.47Dimensions applyto solder ballspost-reflow onØ0.42 SMD ball pads.

0.8 TYP

ABCDEFGHJKLMNPR

Notes: 1. All dimensions are in millimeters.2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).

1Gb: x8, x16 Automotive DDR2 SDRAMPackaging

PDF: 09005aef85a711f41gb_ddr2_ait-aat_u88b.pdf – Rev. B 10/14 EN 17

Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2014 Micron Technology, Inc. All rights reserved.

mailto:sales%40micross.com?subject=http://www.micross.com/?utm_source=Micross%20PDF&utm_medium=Flyer_MYX4DDR264M16HW&utm_campaign=Micross.comhttp://www.micross.com/?utm_source=Micross%20PDF&utm_medium=Flyer_MYX4DDR264M16HW&utm_campaign=Micross.com