microtechniek drukken van polymere rfid tags 20100218

April 12, 2023

Drukken van polymere RFID tags

Gerwin Gelinck

RFID meer dan hype

18 february 2010, Eindhoven

Presentation

overview

Gerwin Gelinck - RF ID, meer dan Hype?

Holst Centre – a short introductionRF ID is dead, long live RF sensors

Smart Blister

Enabling technologies

Printing of thin Si chips

Printed transistors

© Holst Centre


4

Partner in research

• Independent, with reputed parents Founded by IMEC (1300 fte, Belgium) and TNO

(4500 fte, the Netherlands) Established in 2005

• Critical mass Staff of 150 researchers; 25 nationalities 60 resident researchers from industry and

universities

• Global network Industrial and academic partners

• Supported by Dutch government Measured by its international excellence, long-

term vision and impact on Dutch economy

© Holst Centre


5

At the hotspot of human-focused innovation

• High-Tech Campus, initiated by Philips

• >90 companies, 7000 researchers

• Shared labs (www.miplaza.com); >8000 m² cleanrooms

• Open Innovation research centres (e.g. Holst Centre)

Materials Analysis

Electronic measurement

Thin Filmclean room

OLED Device Processing

Reliability lab

Photonics cleanroom

ElectronicPrototyping

EquipmentEngineering

Life Sciences

EMC lab

Holst CentreR2R lab

Holst Centre Offices

© Holst Centre


7

Industrial partners from across the value chain

Presentation

overview


Holst Centre

From RF ID to RF sensorsSmart Blister

Enabling technologies


Printed transistors

© Holst Centre


9

RF ID – hype or reality?

IBM CEO Sam Palmisano (Nov 6, 2008 speech highlighting ‘Big Blue’s vision of a ‘Smart Planet’)

• “There will likely be 4 billion mobile phone subscribers by the end of this year … and 30 billion RF ID tags produced globally within two years.”

• “Sensors are being embedded across entire ecosystemd – supplychains, healthcare, network, cities … even natural systems like rivers.”

• “Very soon there will be 2 billion people on the internet. But in an instrumented world, systems and objects can now “speak” to one another, too. Think about the prospect of a trillion connected and intelligent things – cars, appliances, cameras, roadways, pipelines … even pharmaceuticals and livestock.”

IDTechEx Market Analyses (2008)• Item-level tag volume in 2015: 163 billion units, $5.3billion, 101% CAGR

Note this implies average sale price of 3ct/tag• RTLS (real time location systems) in 2017:$2.71billion; now ‘increasing sharply’

“Some of the largest companies in the world are now active in RTLS, … These companies include Mitsubishi, Cisco, IBM, Motorola and Microsoft.”

IDC report (2005)• “As RFID evolves and incorporates such implementations as sensors …, the number

of devices in circulation breaks into the trillions.”

© Holst Centre


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Smart packaging

• incorporating electronic functionalities on thin flexible foils enhancing Safety, Quality & Authenticity of the packed product

Low power wireless sensors

Flexible foilsSmart

packagingProgram

© Holst Centre


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Market opportunities: Smart packaging applications

Food• Inefficient supply chains: $40 billion

is lost each year • Product freshness and expiration: $48

billion in food is thrown away annually.

• Meat and poultry recalled: 300 million pounds in the U.S. past fifteen years.

Pharma• 10% of the drugs on the world wide market

is counterfeit• Need for rapid and cost-effective recalls• Therapy non-compliance results in:

125.000 Deaths per year in USA caused by non-compliance (Smith, 1989)

Yearly cost USA: 300Bln US$ (Medco Health Systems, 2005)

(30 Billion packages global shipments 2007)

Presentation

overview


Holst Centre

From RF ID to RF sensors

Smart BlisterEnabling technologies


Printed transistors

© Holst Centre


13

Smart blister

• Embedding electronic monitoring and sensing functionality in blister lid foil/film Electronic registration push-out of pills by breaking tracks

behind each blister• Key component in a larger system

Auto detection and communication via active RFID function. Data is read from blister via wireless NFC Link (13.56 MHz)

• Platform for extended features

Blister

Blister

Pharmacist collects and reads blister in exchange for new blister.

NFC

© Holst Centre


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Smart blister – key component in a larger system

OtCM™ OtCM™ “Comfort- “Comfort-

to-Know”to-Know”Real Time Compliance Data measuring unit dose

Real Time Compliance Data measuring unit dose

Influencing patient behavior Influencing patient behavior

Feedback loops(sms, call, Internet)Feedback loops(sms, call, Internet)

Secured & Convenient data transferSecured & Convenient data transfer

Measuring Real Time Diagnostic OutcomeMeasuring Real Time Diagnostic Outcome

Analysis of Compliance data and Diagnostic outcomes

Analysis of Compliance data and Diagnostic outcomes

© Holst Centre


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125.000 Deaths per year in USA caused by non-compliance (Smith, 1989)

Yearly cost USA: 300Bln US$ (Medco Health Systems, 2005)

• Direct healthcare cost: 77Bln US$ (Cutting Edge Information, 2004)(wasted medication, re-test, re-hospitalization)• Indirect cost: 193Bln US$(loss in productivity)

A growing problem• Growing population• Aging western population• Rising GDP in developing countries will increase health problems(e.g. diabetes, cholesterol)

Monitoring patient therapy compliance

Therapy non-compliance. If a patient doesn’t comply to the doctor’s or pharmacist instructions concerning medication usage: e.g. continuation, dosage or interval, we speak of: “Mal- or Non-Compliance”

© Holst Centre


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Challenges of smart blister

Printed conducting linesPrinted conducting lines

electronic circuitry on electronic circuitry on fr4 or flex foil materialfr4 or flex foil material BatteryBattery

Printed Printed AntennaAntenna

Heat bonding processHeat bonding process

Printed tracksPrinted tracks

IC RFID/ NFCIC RFID/ NFC

BatteryBattery

AntennaAntenna

Features:• Assembled • “3D”-system• High cost• Added to existing package, not compatible with R2R

The Holst approach

e.g. StoraEnso Pharma DDSi

Holst Centre System in Foil

Near Future:• Fully integrated • 2D-System in Foil• Low cost, mass fabrication• Roll to Roll compatible

© Holst Centre


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By monitoring patient therapy compliance

• Forgetting will become a distant memory your mobile phone will receive an e-mail alert in a matter of

seconds.• Healthcare costs are better spent

Doctors can use this information to recommend lifestyle changes and treatments.

Pharmaceutical companies will also be able to engineer new, more effective medications that are targeted for each of us as individual patients.

© Holst Centre


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Roadmap of smart packaging

• Smart blister. Developed jointly with DSM

• Future developments under consideration. From pharmaceuticals to nutraceuticals Perishable food monitoring Intelligent shopping

• Technically all this requires Advanced sensors Power autonomy Integration technologies on flexible foils Market acceptance and cost-benefit sharing

Presentation

overview


Holst Centre

From RF ID to RF sensors

Smart Blister

Enabling technologiesPrinting of thin Si chips

Printed transistors

© Holst Centre


20

Conventional Silicon Conventional LCD High quality printing• $40 000/m2 $200/m2 $0.25/m2

• X-Si a-Si/poly-Si Inks• Wafer glass plates R2R• 32 nm 3m >20m

Comparison of technology

© Holst Centre


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Foil characterization/handling

1.70

1.72

1.74

1.76

1.780° (MD)

15°30°

45°

60°

75°

90° (TD)

105°

120°

135°

150°165°

180°195°

210°

225°

240°

255°

270°

285°

300°

315°

330°345°

35 cm

1.70

1.72

1.74

1.76

1.780° (MD)

15°30°

45°

60°

75°

90° (TD)

105°

120°

135°

150°165°

180°195°

210°

225°

240°

255°

270°

285°

300°

315°

330°345°

50 cm

1.70

1.72

1.74

1.76

1.780° (MD)

15°30°

45°

60°

75°

90° (TD)

105°

120°

135°150°

165°180°

195°210°

225°

240°

255°

270°

285°

300°

315°330°

345°

12 cm 35 cm 50 cm

MD 16.1TD 17.4

MD 15.4TD 17.1

MD 18.1TD 18.8

Reported by DuPont Teijin CTE is 18ppm/°C

Index of refractionPEN foil

Transversal

Mach

ine

Edge of web Centre

Coefficient of thermal expansion

MD

TD

1 m

© Holst Centre


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R2R pick ‘n’ place process• mass chip placement of ultrathin chips• smart blister case

Goal:• chip: 1 x 1 mm, 15 µm thickness, 20 IO’s• process: R2R place/bond 10-50 chips/second

Principle:• combination of self-assembly of chips

to place, then do backside contactingthrough foil

“Printing” of (ultrathin) Si dies

© Holst Centre


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Printing of RD IDMaterials, processes, electronics

Printed circuitry is a multidisciplinary field and requires collaboration

© Holst Centre


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• Advantages of printing process Simple process and non-vacuum Less expensive equipment Size expandable High productivity

• are well-placed when applications demand Large area Mechanical flexibility Low cost/area … only moderate performance of

~ 1 cm2/Vs

• Two main application drivers Large area flexible displays Low-cost electronic tags

Printed transistorsLargest reported carrier mobility of organic FETs over time

Year1986 1990 1994 1998 2002 2006

Lar

ges

t re

prt

ed c

arri

er m

ob

ility

(cm

2 /Vs)

10-5

10-4

10-3

10-2

10-1

100

101

solution-processedpolymersvacuum-depositedsmall-moleculessolution-processedsmall-moleculessingle-crystals

© Holst Centre


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Circuit demonstrators

Better materials and downscaling of technology leads to record-fast circuits Data rate compatible with Electronic Product Code Plastic rectifiers working at 867 MHz

ISSCC’080.8 kbit/s

Plastic transponder

ISSCC’091.5 kbit/s

Plastic transponder50 kbit/s

Plastic transponder

14

12

10

8

6

4

2

0

Vou

t [V

]

120100806040200

Time [ms]

Data rate 752 b/sVDD 14 V

© Holst Centre


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• 128 bit organic RFID at 13.56 MHz, >1300 organic transistors integrated, operating at 50 kHz

• Based on pMOS

Status

© Holst Centre


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New semiconductors

• Organic semiconductors Printable n-types Mobility of ~1 cm2/Vs achieved

• Metal oxide semiconductors Amorphous, Low temperature, transparent High mobility achieved (> 10 cm2/Vs)

5

4

3

2

1

0

Vdc

[V]

102

103

104

105

106

107

Freq [Hz]

L=3 pentacene (µ = 0.15 cm2/Vs) L=5 a-GIZO (µ > 10 cm2/Vs)

10

8

6

4

2

0

Vou

t [V

]

422421420419418time [s] x 10

-6

5-stage oscillatorL=5µm, diode-logic

f=870kHz @ VDD=20V f=1.2MHz @ VDD=25V

Ring oscillators @ MHz frequency High-efficiency MHz rectification

© Holst Centre


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Multi-year technical roadmap

• Step-by-step performance improvement New materials

• Step-by-step process simplification Carrier-less foil processes From batch processes to linear processes, eventually roll-to-roll

Cost

dow

n

Performance

=0.5 cm2/Vs =5 cm2/Vs

Litho + foil-on-carrier

Litho + carrier-less foil

Printed + carrier-less foil

Roll-to-roll

© Holst Centre


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Unique infrastructure

2008: R2R coating/print lineR2R vacuum deposition line being specified now

2009: R2R lamination line2009: maskless lithography tool2010: R2R multilayer imprint line

Inkjet printers1x multi single nozzle printer (MicroFab)1 nozzle at the time, the nozzle can easily be exchangednozzle diameters ranging from 30 to 100µm

2 LEP and 2 PEDOT printersSpectra SX3 and Galaxy printheads (Fujifilm)nominal drop volume ranging from 30 to 80 plmax DoD frequency 5 kHz128 (SX3) and 256 (Galaxy) nozzles

1x 4 printhead setupGalaxy or SX3 printheadsspecs according to the LEP and PEDOT printer, except there are 4 printheads in a row, so possibly 4 different inks

© Holst Centre


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Linear deposition of pentacene from gas phase

• Linear showerhead deposits continuous layer on moving substrate• High quality (mobility) at high deposition speed

Flupke Series: Saturation mobility vs Deposition speed

00.20.4

0.60.8

11.2

1.41.6

0 100 200 300 400 500 600 700 800 900 1000 1100 1200

Sd (µm²/s)

µsat

(cm

²/V

s)

30nm film at 1m/min

30nm film at 2m/min

500 µm²/s is roughly equivalent to 50 Å/s on a 4’’ substrate and 1m/min web speed

1000 µm²/s is roughly equivalent to 100 Å/s on a 4’’ substrate and 2m/min web speed

© Holst Centre


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Patterning of OSC• Ink jet printing

Decrease material consumption High throughput compatible process Ink optimization on viscosity, surface wetting

10 fA

1 pA

100 pA

10 nA

1 µA

100 µA

I DS [A

]

-10 -5 0 5 10

VG [V]

ISD , VSD = -1 V ISD , VSD = -10 V

= 1.1 cm2/Vs

50 um

50 um

© Holst Centre


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Multi-year technical roadmap

32

2005First HF rectifier

2006Integrated HF

rectifier

200764 bit HF

tag@

acceptedEM field

2008128 bit transponder

and UHF rectifier

200925 kbit/s

andAnti-collision

2010Bi-directional

communication

2011UHF tag

+ IntegratedPlastic NVM

2012-2015EPC-like

tag

2009First OLEDbackplane

2010Integration to

display with OLED

2011Outdoor-readable

OLEDdisplay with

oxide

2012-2015AM sensor arrays

(e.g. medical,Smart bandage,…)

© Holst Centre


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Summary

• Perceived value of remote identification (RF ID) is low, remote sensing is the way forward.

• At Holst Centre, we work with our industrial partners on wireless sensors on foil, communicating with your

mobile phone. First application: smart blister Enabling technologies

Embedding thinned Si on plastic foil Direct printing of thin film transistor circuits. First application

of printed transistors will be flexible displays.

Visit us at

www.holstcentre.com

microtechniek drukken van polymere rfid tags 20100218

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