References: IPC-A-610G

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Vertical fill of barrel

Vertical fill criteria is based on the number of componet leads, and if the assembly is connected to a thermal plane.

Less than 14 leads: 75% fill required Less than 14 leads – with thermal plane: 50% fill required 14 leads or more: 50% fill required Ref: 7.3.5.1

Wetting of component sidelead & barrel = 180°A properly wetted solder fillet must circle at least 180° (or 50%) of the way around the lead and barrel. Ref: 7.3.5.2

Wetting of solder sidelead, land & barrel = 270°A properly wetted fillet must extend at least 270° (or 75%) of the way around the lead, land and barrel on the solder source side of the board. Ref: 7.3.5.4, 7.3.5.5

Wetting of component side land = 0%A properly wetted solder joint on the solder destination or component side land is not required.

Ref: 7.3.5.3

Minimum Through Hole Solder Joint Requirements • Class 2 CU

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Minimum Through Hole Solder Joint Requirements • Class 2

Shown below are the minimum acceptable conditions for a Class 2 Plated-Through Hole Solder Joint. All of the illustrations show the same solder connection from three different views: top, barrel (cutaway), and bottom.

Any Class 2 solder connection failing to meet these minimum requirements should be considered a defect.