MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

Download MIPI DevCon 2016: Specifications Roadmap - The Wires for Wireless

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<ul><li><p>MIPI Alliance Specifications Roadmap: </p><p>The Wires for Wireless </p><p>Rick Wietfeldt, Ph.D. </p><p>Qualcomm Technologies, Inc. </p><p>Chairman, Technical Steering Group, MIPI Alliance Inc. </p></li><li><p>Agenda </p><p> Introduc)onMIPIandtheMobileGs2003-2016+RoadmaptoTomorrowMoremobile;IOT,autoConclusion</p><p>2 </p></li><li><p>MIPI Alliance 2003-2016 </p><p>3 </p><p>Sophia-An?polis</p><p>Amsterdam</p><p>Dallas</p><p>ParisLondon</p><p>SanFrancisco</p><p>Osaka</p><p>Helsinki</p><p>Montreal</p><p>Seoul</p><p>Phoenix</p><p>Brussels</p><p>HongKongMiami</p><p>LasVegas</p><p>Prague</p><p>Lisbon</p><p>SanDiego</p><p>Athens</p><p>Frankfurt</p><p>Chicago</p><p>Vancouver</p><p>Berlin</p><p>Bangkok</p><p>Warsaw</p><p>Toronto</p><p>Budapest</p><p>Shanghai</p><p>Hawaii</p><p>Copenhagen</p><p>Barcelona</p><p>Taipei</p><p>SeaSle</p><p>NewOrleans</p><p>2013mee)ngsandMIPIAlliance</p><p>forma)on</p></li><li><p>MIPI Technical Steering Group (TSG) The TSG serves as the steward and guiding influence for </p><p>specification work within the MIPI Alliance. </p><p> TSG defines and maintains the MIPI Technology Roadmap, tracking future work for each specification, and introducing new interfaces/technology into the Roadmap. </p><p> TSG now works with newly formed Marketing Steering Group (MSG), driving coordination across all WGs; and both report to the Board of Directors. </p><p>4 </p></li><li><p>Mobile Terminal Evolution and MIPI Formation </p><p>5 </p><p>2020</p><p>5G++</p><p>4G(all-IP&amp;morebands)</p><p>3G(mobilebroadband)</p><p>2G(digital&amp;data)</p><p>1G(analog)</p><p>10G</p><p>10M</p><p>1M</p><p>10k App</p><p>roximatewire</p><p>lessspe</p><p>edsinbps</p><p>1G</p><p>100M</p><p>100k</p><p>First2G(GPRS,1xRTT)Phone</p><p>MIPIAllianceForms</p><p>FirstCameraPhone</p><p>201520102005200019951990</p></li><li><p>MIPI Interface Evolution with the Mobile Gs </p><p>6 </p><p>1 2 3 4</p></li><li><p>MIPI and Mobile G evolution vectors </p><p>7 </p><p>I.Wireless</p><p>TechnologyEvolu?on</p><p>II.User</p><p>ExperienceEvolu?on</p><p>MIPISpecGroups:IPC:InterProcessCommunica?ons;C&amp;D:Control&amp;Data;MM:Mul?media;D&amp;T:Debug&amp;Trace[1]OtherindustrystandardIPCinterfacesinclude:USBHSIC,USB3,PCIe[2]ThepredecessorofUFSise.MMCthatcon?nuesselec?veindustryuse</p><p>Common</p></li><li><p>8 </p></li><li><p>9 </p><p>MIPISpecifica-onsFramework</p><p>Mul?media</p><p>Chip-to-Chip(M-PHY)InterProcess</p><p>Communica?ons</p><p>Debug&amp;</p><p>Trace</p><p>Control&amp;</p><p>Data</p></li><li><p>10 </p><p>MIPI Spec Framework and Key Specs </p><p> CSI (camera) DSI (display) SLIMbus/ </p><p>SoundWire (audio) UniPro (UFS) </p><p> RFFE I3C VGI (Virtual GPIO) </p><p>10 Chip-to-chip IPC UniPro (UniPort-M) </p><p> LLI </p><p>UpdatedSpecBrandNewSpec(2016)</p><p>Mul?media</p><p>Chip-to-Chip(M-PHY)InterProcess</p><p>Communica?ons</p><p>Debug&amp;</p><p>Trace</p><p>Control&amp;</p><p>Data</p><p> GbD IP Sockets NIDnT HTI SyS-T (software) </p></li><li><p>11 </p><p>MIPI Specifications: Protocol Layering (1) </p><p>Mul$media Chip-to-Chip</p></li><li><p>12 </p><p>MIPI Specifications: Protocol Layering (2) </p><p>Control&amp;Data</p></li><li><p>13 </p><p>MIPI Interface Development Pillars </p></li><li><p>Product Developer Choices </p><p>14 </p><p>PHY</p><p>AP-Centric</p><p>Networked(UniPort-M)</p><p>D-PHY</p><p>M-PHY</p><p>C-PHY</p></li><li><p>15 </p><p> ManyMIPIInterfacesareusedtodayinAutomo?veincludingMul?media,Storage,Sensor,andWirelessconnec?vity(WWAN,WLAN,GNSS,BT,NFC)</p><p> MIPIInterfacesmaybefedtoaBridgedevicefortransportonlongerdistances</p></li><li><p>MIPI Roadmap to Tomorrow Continued focus on mobile terminal interfaces to 5G </p><p> I: Wireless Technology; II. Multimedia </p><p> Increased focus on leveraging MIPI Interfaces for use in mobile-influenced Markets IOT, Automotive, Industrial </p><p> Examples: Extended Lengths for longer reach applications </p><p> PHY, RFFE, I3C Lower RFFE latency for (Pre)5G wireless Lower speed Modem interface (VGI) I3C for touch and control applications </p><p>16 </p></li><li><p>Conclusion Footprint MIPI is now in every smartphone, and </p><p>soon in every phone (i.e. including featurephone ! smartphone) </p><p> Expanding Rapidly expanding into mobile-influenced markets as mobile SOC manufacturers and OEMs leverage (reuse) their interface IP assets New terminals: Wearables, VR, Drones, Connected Vehicles </p><p> Optimizing With assistance from new industry members and developers, evolving specs to address specific requirements of the mobile-influenced markets </p><p>17 </p></li><li><p>DevCon Topics General MIPIinAutomo?ve MIPIBeyondMobileindustrialComputer-on-Module</p><p>Low-speedInterfaces DevelopersGuidetoMIPII3CImplementa?on I3CHighDataRateModes MIPIMobileTouch Verifica?onofMIPISoundWire MobilesystemGPIOminimiza?onusingVirtualGPIOInterface</p><p>High-speedInterfaces ImpactofHigherDataRateRequirementsonMIPICSI&amp;DSI CSI-2forVisionandSensorFusion CSI-2CameraAggrega?oninFPGAs D-PHYTestandMeasurement C-PHYfromTheorytoPrac?calImplementa?on MIPIDebugSpecsHelptoDevelopSystemSohware</p><p>Manyothers</p><p>18 </p></li><li><p>Thank You </p></li></ul>