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Mobile Component Forum 2004July 21-23, 2004 / Tokyo Big Sight

Co-held with EXPO COMM WIRELESS JAPAN

“Fundamental mobile component for Ubiquitous society” This event focus on exchange of technology about the electric component of mobile product.

Organized by E.J. Krause & Associates, Inc. & RIC Telecom, Co., Ltd.Cooperated by KOGYO CHOSAKAI PUBLISHING CO., LTD.

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Outline

■Exhibition name: Mobile Component Forum 2004. （ Co-held with EXPO COMM WIRELESS JAPAN 2004. ）■Organized by E.J. Krause & Associates, Inc. / RIC Telecom Co., Ltd.■Supported by KOGYO CHOSAKAI Publishing Co., Ltd.■Date ： July 21 to 23, 2004■Venue: Tokyo Big Sight – Tokyo International Exhibition Center-■Attendee: 6,000 from Mobile equipment technology field. ■The number of exhibitors: 40 companies and 600sqm expected ■The event consists of exhibition, Symposium and commercial presentation.

Mobile Component Forum 2004

EXPO COMM WIRELESS JAPANApplication layer

Network layer

Component layer

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What is Mobile Component Forum?

3.5G/4G mobile phone, High-speed wireless communication, Mobile TV to receive Grand digital wave, Telematice and car navigation on board and many other mobile products are fundamental for Ubiquitous society and the usage of the mobile products have been expanding throughout the mobility society. The event “Mobile Component Forum 2004” just only focus on components for mobile products. The event is place where advanced mobile component technologies and engineers of mobile set maker exchange technical information for further business development. This technical exchanging is surely effective matchmaking.Because Communication between them can make possible to catch set makers needs and propose solutions to set makers.Companies who want to have develop business on Japan’s mobile component market should be at Mobile Component Forum 2004.

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Noisy Stage

Model Performance

Big Sound

“Can’t talk business…anymore !”said by engineers & exhibitors

Why is Mobile Component Forum born?

What is the problem for Japan’s existing exhibition ?

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What is the problem for Japan’s existing exhibition ?

From visitor survey of EXPO COMM WIRELESS JAPAN 2003

Q. What kind of function will you want at event?

Q. Improvement you expect for events？　 First :　More rest space　 Second :　 Should be more quiet : 　 fifth :　Want to talk with educated staff　　

Miss the business chance!

Business negotiation in quite environment 509

Good decorated booth 430

Conversation with top or key-man stuff 66

Communication with visitors 168

Others 88

Total1,26

1・・

6“Opportunity for Pre-sales Activity”

Real Trade Exchangein Quiet Environment

Matchmaking with hearing and proposal.

“hearing” “communicating” “proposal”

So Mobile Component Forum is planned

Less Sound

No Model performance

STRUCTURES for trade meeting through the event.1, Package demonstration salon for targeted visitor’s communication.

2, Speaking chance at the symposium.

The most important on limited market is not visual performance but deep communication.

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Strategy of the Mobile Component Forum

6000 targeted visitor come together!

Business cardscollection

first sales stage

Second salesFinal sales

Close a deal＝

Unilateral solution proposal ended. Now it is time to built up relationship through communication with potential customers.

This is function of normal event

This is style ofMobile Component Forum

plus

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Attendee Target

++ Mobile Carrier: R&D leader++ Mobile set maker : Circuit design, R&D, Electronics packing technology, SE, Programmer++ Wireless System/Terminal Manufacturer: R&D and Engineering leader++ Electronics Manufacturer: R&D leader++ Car & Car electronics company : R&D leader, Management++ Broadcast : R&D leader, Management

Engineers of Circuit design, R&D, Electronics packing technology, SE, Programmer for mobile products

Over6,000 engineers come and communicate -expected-

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Exhibit Category

<<Parts>> IC tag, Tip, Connector, Switch, Terminal, Speaker, Microphone, heat countermeasure, CCD, Noise countermeasure, Memory IC, Memory stick, circuit, electrode, antenna, condenser, quartz, vibration, others

Exchange technical information with engineers of mobile equipment maker.

<<Board & material>> Printed wiring board, Flexible circuit, Integral substrates, Bonding material, Solder, Flat panel, touch panel, plastic, rubber, cable, Magnet disc, Ceramic material, key-board, Magnet, Insulation material, others<<Display>> Liquid crystal display, Organic EL display, PDP、 and other display instruments <<Power>> Fuel Cell, Secondary cell, Power supply equipment, Battery charger and others<<Measurement>> Sensor, Analyzer, Tester and others

<<Related material>> Electric packaging technology, Plating equipment, edging equipment and others

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Demonstration salon and Speaking chance detail

Following is included in fee.** space** wall** carpet** meeting table and chair** demonstration table** registration counter** company sign board

Company can have demonstration and technical discussion with visitors with drinking.

Speaking Chance at symposium

**Company can present and explain about technology details.**One slot is 60 min. long. **Audience require pre-registration.**Audience data is given to speaking company. **Room capacity is about 100seats.

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Exhibit fee

Platina Sponsor : \5,000,0000-**Demonstration Salon 54sqm (decoration, meeting set incl.) **Speaking chance -Key-note speech:50min. long and one slot of Symposium:60 min. long **Company Logo posted on the forum Web **Printing promotion Material 　　　　

Gold Sponsor : \4,500,000-**Demonstration Salon 36sqm (decoration, meeting set incl.)**Speaking chance : two slots of symposium -60 min. long per a slot

**Company Logo appeared on Web **Printing Promotion Material　　

Silver Sponsor : \2,000,000-**Demonstration Salon 18sqm (decoration, meeting set incl.) 　**Speaking chance : one slot of symposium -60min. Long. **Printing Promotion Material 　　　　Bronze Sponsor : \1,200,000-**Demonstration Salon 18sqm (decoration, meeting set incl.) **Printing Promotion Material

　　　　

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Wireless Japan is the only one trade event focused on mobile & wireless network in Japan

The number of attendee : 36,851 people

Wireless Japan 2003 Profile

Who visited?: Engineers of Circuit designer, R&D, Electronic packing technology in Mobile Telecom carrier, Mobile set maker, Automotive, Electronics maker and other field. >>>>10,424 engineers 10,424 engineers came to the show and communicated with

exhibitors

Mobile Component Forum visitor target

Co-held with Mobile Component Forum 2004

Who were exhibitors? : NTT DoCoMo, KDDI, Vodafone, NEC, Panasonic, SANYO, KYOCERA, TOSHIBA, Wi-Fi alliance, Intel, RENESAS Technology and other 170 exhibitors

about WIRELESS JAPAN 2004