Modu-lab Low Cost Tools for High Tech

Learning

DIFFUSION FURNACE

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DEVICE CHARACTERIZE

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PHOTLITHOGRAPHY

HOTWALL C.V.D.

PLASMA

Modu-Lab lab layout: This page shows one example of a training lab layout. The approximate scaling is for a room of 7 meters X 15 meters ( ~20 ft. X 45 ft).

The gray areas approximate the user areas and delineate free space for operation and maintenance of the systems.

The blue is the actual module outline. The modules come in two lengths with only 1 width. The width is 77 cm (30in.) and the lengths are 153 cm(60 in) and 183 cm (72 in.).

Modules with circles require exhaust. A large circle designates approx 8.5 m3/min(300CFM). The small circle designates a flow of 1.4 m3/min.(50CFM) Both flows are with a static pressure of .3 mm H2O(1/8”wg).

SAFETY EYE

WASH

OXIDATION FURNACE

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METROLOGY

DEVICE CHARACTERIZE

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HOTWALL C.V.D.

OXIDATION FURNACE

DIFFUSION FURNACE

DIFFUSION FURNACE

The layout above shows a full complement of modules. A basic complement that will allow fabrication of transistors, diodes, capacitors and resistors does not utilize the Hotwall or Plasma systems. The fume hood and eye wash are not supplied by EMS. The fume hood is not required, but is highly recommended. The object below are for cutting and pasting into your own layout drawing.

In order to rotate the objects correctly, you may have to ungroup the object and manipulate accordingly.

SMALL FUME HOOD

Modu-lab Low Cost Tools for High Tech

Learning

WE

T E

TC

HMETROLOGY

DEVICE CHARACTERIZE

WE

T PR

OC

ES

S

PVD

PHOTLITHOGRAPHY

HOTWALL C.V.D.

PLASMA

DIFFUSION FURNACEOXIDATION FURNACE

SAFETY EYE

WASH

SMALL FUME HOOD

Modu-lab Low Cost Tools for High Tech

Learning

Layout and Installation Notes:1) The lab should have eyewash and/or safety shower2) A fume hood with a sink has proven to be a nice advantage to the lab.3) A small DI water system is also recommended - the alternative is to provide rinse water in jugs. Distilled water works pretty good.4) Always keep in mind the required free space around the modules.5) The use access designation is the dimension from which usage of the module is accessed. eg - the WPM is used from the width side. 6) Maintaining the water supply tanks in the WPM and WEM requires access to both ends in order to remove and replace the rinse water supply.7) The furnaces are loaded and unloaded from the end; but gas and temp control are accessed on the right hand side when facing the front end.8) The wet processors are easily field retrofitted for connection to house water and drains.9) When constructing a layout, it may be advantageous to place exhausted modules in the same vicinity to minimize duct work.

Equipment Description Electrical Exhaust Fluids Used Foot Print (WxLxH)

Wet Etch Module (WEM) Stainless steel insert, 2 hot plates, 2 teflon tanks w/ covers, external rinse tank, single wafer spin dryer 110 Vac, 5A

4" duct 400 CFM 1/8wg static pressure

Baker Clean, Aluminum Etch, Water 60" X 30" X 50"

Wet Process Module (WPM)

Used for develop and strip of positive photoresist.- includes 2 reagent tanks, 2 rinse tanks and single wafer spin dryer 110 Vac, 5A

4" duct 400 CFM 1/8wg static pressure

Developer, BOE, Pirahna, Water 60" X 30" X 50"

Photolithography Module (PLM)Includes video aligner, programmable spinner, bakeplate, and table 110 Vac, 10A 2" duct 50 CFM

Photoresist, Acetone 72" X 30" X 60"

Oxidation Furnace Module (OFM)

1000°C -includes furnace, quartzware, 2 channel rotameter gas system, bubbler, gas connections and table

220 VAC or 208 3phv 40A 30A 2" duct 50 CFM N2, O2, Water 72" X 30" X 72"

P Type Diffusion Furnace Module1300°C includes Quartz, 2 channel rotameter gas system, and table

220 VAC or 208 3phv 50A 40A 2" duct 50 CFM

N2, O2, Solid Sorce Boron 72" X 30" X 72"

N Type Diffusion Furnace Module1300°C includes Quartz, 2 channel rotameter gas system, and table

220 VAC or 208 3phv 50A 40A 2" duct 50 CFM

N2, O2, Solid Sorce Phosphours 72" X 30" X 72"

CVD (Chemical Vapor Deposition)includes Hotwall CVD TEOS System w/PLC control, table

220 VAC or 208 3phv 40A 30A 2 - 2" duct 50 CFM

N2, TEOS, Compressed Air 72" X 30" X 72"

PVD (Physical Vapor Deposition)includes 150A Filament/Boat Deposition System w/interlocked electro-pneumatic valves and table 110 Vac, 15A 2" duct 50 CFM

N2, Compressed Air 60" X 30" X 64"

PDV Ultra (Physical Vapor Deposition)

includes Sputter Deposition System w/1” S-gun, rate monitor, substrate rotation,mass flow pressure control, interlocked electro-pneumatic valves and table 110 Vac, 15 A 2" duct 50 CFM

N2, Compressed Air, UHP Argon 60" X 30" X 72"

Device Characterization Module (DCM)

Probe Station w/3 probes, Computer with Labview I/O Card, GPIB card, Keithley 2400 sourcemeter and Table 110 Vac, 5A NA NA 60" X 30" X 64"

Metrology Module 1includes: Spectrophotometer, Four Point Probe,CV plotter, Computer and table 110 Vac, 10A NA NA 72" X 30" X 72"

Metrology Module 2 includes Stylus Profilometer, PhotoSpectrometer, Four Point Probe, Conduction Guage, Computer and table 110 Vac, 10A NA NA 60" X 30" X 52"

Process Supply Kit (approx. range) Kit is price ranged depending on desired supplies

System Installation Package

includes set-up, detailed instruction, 1 cassette (25) of 4" wafers, 1 qt. of positive resist, 1 gal of TMAH develop, 1 gal of BOE and 1 gal. of aluminum etch. 1 100 micron FET- Resistor-Capacitor mask set. Functional devices will be fabricated on custom