mosfet coolmos™ c7 - tme · 2 650v coolmos™ c7 power transistor ipa65r045c7 final data sheet...
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MOSFETMetalOxideSemiconductorFieldEffectTransistor
CoolMOS™C7650VCoolMOS™C7PowerTransistorIPA65R045C7
DataSheetRev.2.0Final
PowerManagement&Multimarket
2
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
TO-220FP
DrainPin 2
GatePin 1
SourcePin 3
1DescriptionCoolMOS™isarevolutionarytechnologyforhighvoltagepowerMOSFETs,designedaccordingtothesuperjunction(SJ)principleandpioneeredbyInfineonTechnologies.
CoolMOS™C7seriescombinestheexperienceoftheleadingSJMOSFETsupplierwithhighclassinnovation.TheproductportfolioprovidesallbenefitsoffastswitchingsuperjunctionMOSFETsofferingbetterefficiency,reducedgatecharge,easyimplementationandoutstandingreliability.
Features•IncreasedMOSFETdv/dtruggedness•BetterefficiencyduetobestinclassFOMRDS(on)*EossandRDS(on)*Qg•BestinclassRDS(on)/package•Easytouse/drive•Pb-freeplating,halogenfreemoldcompound•QualifiedforindustrialgradeapplicationsaccordingtoJEDEC(J-STD20andJESD22)
Benefits•Enablinghighersystemefficiency•Enablinghigherfrequency/increasedpowerdensitysolutions•Systemcost/sizesavingsduetoreducedcoolingrequirements•Highersystemreliabilityduetoloweroperatingtemperatures
ApplicationsPFCstagesandhardswitchingPWMstagesfore.g.Computing,Server,Telecom,UPSandSolar.
Pleasenote:ForMOSFETparallelingtheuseofferritebeadsonthegateorseparatetotempolesisgenerallyrecommended.
Table1KeyPerformanceParametersParameter Value UnitVDS @ Tj,max 700 V
RDS(on),max 45 mΩ
Qg.typ 93 nC
ID,pulse 212 A
Eoss@400V 11.7 µJ
Body diode di/dt 60 A/µs
Type/OrderingCode Package Marking RelatedLinksIPA65R045C7 PG-TO 220 FullPAK 65C7045 see Appendix A
3
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
TableofContentsDescription . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
2MaximumratingsatTj=25°C,unlessotherwisespecified
Table2MaximumratingsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Continuous drain current 1) ID --
--
1811 A TC=25°C
TC=100°C
Pulsed drain current 2) ID,pulse - - 212 A TC=25°C
Avalanche energy, single pulse EAS - - 249 mJ ID=12A; VDD=50V; see table 10
Avalanche energy, repetitive EAR - - 1.25 mJ ID=12A; VDD=50V; see table 10
Avalanche current, single pulse IAS - - 12.0 A -
MOSFET dv/dt ruggedness dv/dt - - 100 V/ns VDS=0...400V
Gate source voltage (static) VGS -20 - 20 V static;
Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz)
Power dissipation Ptot - - 35 W TC=25°C
Storage temperature Tstg -55 - 150 °C -
Operating junction temperature Tj -55 - 150 °C -
Mounting torque - - - 50 Ncm M2.5 screws
Continuous diode forward current IS - - 18 A TC=25°C
Diode pulse current2) IS,pulse - - 212 A TC=25°C
Reverse diode dv/dt 3) dv/dt - - 1.5 V/ns VDS=0...400V,ISD<=IS,Tj=25°C see table 8
Maximum diode commutation speed dif/dt - - 60 A/µs VDS=0...400V,ISD<=IS,Tj=25°C see table 8
Insulation withstand voltage VISO - - 2500 V Vrms,TC=25°C,t=1min
1) Limited by Tj max. 2) Pulse width tp limited by Tj,max3)IdenticallowsideandhighsideswitchwithidenticalRG
5
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
3Thermalcharacteristics
Table3ThermalcharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Thermal resistance, junction - case RthJC - - 3.6 °C/W -
Thermal resistance, junction - ambient RthJA - - 80 °C/W leaded
Thermal resistance, junction - ambientfor SMD version RthJA - - - °C/W n.a.
Soldering temperature, wavesolderingonly allowed at leads Tsold - - 260 °C 1.6mm (0.063 in.) from case for
10s
6
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
4ElectricalcharacteristicsatTj=25°C,unlessotherwisespecified
Table4StaticcharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Drain-source breakdown voltage V(BR)DSS 650 - - V VGS=0V,ID=1mA
Gate threshold voltage V(GS)th 3 3.5 4 V VDS=VGS,ID=1.25mA
Zero gate voltage drain current IDSS --
-20
2- µA VDS=650,VGS=0V,Tj=25°C
VDS=650,VGS=0V,Tj=150°C
Gate-source leakage current IGSS - - 100 nA VGS=20V,VDS=0V
Drain-source on-state resistance RDS(on)--
0.0400.096
0.045- Ω VGS=10V,ID=24.9A,Tj=25°C
VGS=10V,ID=24.9A,Tj=150°C
Gate resistance RG - 0.85 - Ω f=1MHz,opendrain
Table5DynamiccharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Input capacitance Ciss - 4340 - pF VGS=0V,VDS=400V,f=250kHz
Output capacitance Coss - 70 - pF VGS=0V,VDS=400V,f=250kHz
Effective output capacitance, energyrelated 1) Co(er) - 146 - pF VGS=0V,VDS=0...400V
Effective output capacitance, time related2)
Co(tr) - 1630 - pF ID=constant,VGS=0V,VDS=0...400V
Turn-on delay time td(on) - 20 - ns VDD=400V,VGS=13V,ID=24.9A,RG=3.3Ω;seetable9
Rise time tr - 14 - ns VDD=400V,VGS=13V,ID=24.9A,RG=3.3Ω;seetable9
Turn-off delay time td(off) - 82 - ns VDD=400V,VGS=13V,ID=24.9A,RG=3.3Ω;seetable9
Fall time tf - 7 - ns VDD=400V,VGS=13V,ID=24.9A,RG=3.3Ω;seetable9
Table6GatechargecharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Gate to source charge Qgs - 23 - nC VDD=400V,ID=24.9A,VGS=0to10V
Gate to drain charge Qgd - 30 - nC VDD=400V,ID=24.9A,VGS=0to10V
Gate charge total Qg - 93 - nC VDD=400V,ID=24.9A,VGS=0to10V
Gate plateau voltage Vplateau - 5.4 - V VDD=400V,ID=24.9A,VGS=0to10V
1)Co(er)isafixedcapacitancethatgivesthesamestoredenergyasCosswhileVDSisrisingfrom0to400V2)Co(tr)isafixedcapacitancethatgivesthesamechargingtimeasCosswhileVDSisrisingfrom0to400V
7
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
Table7ReversediodecharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Diode forward voltage VSD - 0.9 - V VGS=0V,IF=24.9A,Tj=25°C
Reverse recovery time trr - 725 - ns VR=400V,IF=18A,diF/dt=60A/µs;see table 8
Reverse recovery charge Qrr - 13 - µC VR=400V,IF=18A,diF/dt=60A/µs;see table 8
Peak reverse recovery current Irrm - 36 - A VR=400V,IF=18A,diF/dt=60A/µs;see table 8
8
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
5Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation
TC[°C]
Ptot[W
]
0 25 50 75 100 125 1500
5
10
15
20
25
30
35
40
Ptot=f(TC)
Diagram2:Safeoperatingarea
VDS[V]
ID[A
]
100 101 102 10310-4
10-3
10-2
10-1
100
101
102
103
1 µs10 µs100 µs1 ms
10 ms
DC
ID=f(VDS);TC=25°C;D=0;parameter:tp
Diagram3:Safeoperatingarea
VDS[V]
ID[A
]
100 101 102 10310-5
10-4
10-3
10-2
10-1
100
101
102
103
1 µs10 µs100 µs1 ms
10 ms
DC
ID=f(VDS);TC=80°C;D=0;parameter:tp
Diagram4:Max.transientthermalimpedance
tp[s]
ZthJC[K
/W]
10-5 10-4 10-3 10-2 10-1 10010-2
10-1
100
101
0.5
0.2
0.1
0.05
0.02
0.01
single pulse
ZthJC=f(tP);parameter:D=tp/T
9
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
Diagram5:Typ.outputcharacteristics
VDS[V]
ID[A
]
0 5 10 15 200
50
100
150
200
250
20 V10 V
8 V
7 V
6 V
5.5 V
5 V
4.5 V
ID=f(VDS);Tj=25°C;parameter:VGS
Diagram6:Typ.outputcharacteristics
VDS[V]
ID[A
]
0 5 10 15 200
20
40
60
80
100
120
14020 V
10 V8 V
7 V
6 V
5.5 V
5 V
4.5 V
ID=f(VDS);Tj=125°C;parameter:VGS
Diagram7:Typ.drain-sourceon-stateresistance
ID[A]
RDS(on
) [Ω]
0 20 40 60 80 100 120 1400.07
0.08
0.09
0.10
0.11
0.12
0.13
0.14
0.15
0.16
0.17
20 V
5.5 V 6 V 6.5 V 7 V
10 V
RDS(on)=f(ID);Tj=125°C;parameter:VGS
Diagram8:Drain-sourceon-stateresistance
Tj[°C]
RDS(on
) [Ω]
-50 -25 0 25 50 75 100 125 1500.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
0.11
0.12
typ
98%
RDS(on)=f(Tj);ID=24.9A;VGS=10V
10
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
Diagram9:Typ.transfercharacteristics
VGS[V]
ID[A
]
0 2 4 6 8 10 120
50
100
150
200
250
150 °C
25 °C
ID=f(VGS);VDS=20V;parameter:Tj
Diagram10:Typ.gatecharge
Qgate[nC]
VGS [V]
0 20 40 60 80 100 1200
2
4
6
8
10
12
400 V120 V
VGS=f(Qgate);ID=24.9Apulsed;parameter:VDD
Diagram11:Forwardcharacteristicsofreversediode
VSD[V]
IF [A]
0.0 0.5 1.0 1.510-1
100
101
102
125 °C25 °C
IF=f(VSD);parameter:Tj
Diagram12:Avalancheenergy
Tj[°C]
EAS [mJ]
25 50 75 100 125 1500
25
50
75
100
125
150
175
200
225
250
EAS=f(Tj);ID=12A;VDD=50V
11
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
Diagram13:Drain-sourcebreakdownvoltage
Tj[°C]
VBR(DSS
) [V]
-60 -20 20 60 100 140 180580
600
620
640
660
680
700
720
740
760
VBR(DSS)=f(Tj);ID=1mA
Diagram14:Typ.capacitances
VDS[V]
C[p
F]
0 100 200 300 400 500100
101
102
103
104
105
Ciss
Coss
Crss
C=f(VDS);VGS=0V;f=250kHz
Diagram15:Typ.Cossstoredenergy
VDS[V]
Eoss[µ
J]
0 100 200 300 400 5000
2
4
6
8
10
12
14
16
Eoss=f(VDS)
12
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
6TestCircuits
Table8DiodecharacteristicsTest circuit for diode characteristics Diode recovery waveform
t
V ,I
Irrm
IF
VDS
10 %Irrm
trrtF tS
QF QS
dIF / dt
dIrr / dt
VDS(peak)
Qrr = QF +QS
trr =tF +tS
VDS
IF
VDS
IF
Rg1
Rg 2
Rg1 = Rg 2
Table9SwitchingtimesSwitching times test circuit for inductive load Switching times waveform
VDS
VGS
td(on) td(off)tr
ton
tf
toff
10%
90%
VDS
VGS
Table10UnclampedinductiveloadUnclamped inductive load test circuit Unclamped inductive waveform
VDS
VD
V(BR)DS
IDVDS
VDSID
13
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
7PackageOutlines
Figure1OutlinePG-TO220FullPAK,dimensionsinmm/inches
14
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
8AppendixA
Table11RelatedLinks
• IFXCoolMOSTMC7Webpage:www.infineon.com
• IFXCoolMOSTMC7applicationnote:www.infineon.com
• IFXCoolMOSTMC7simulationmodel:www.infineon.com
• IFXDesigntools:www.infineon.com
15
650VCoolMOS™C7PowerTransistor
IPA65R045C7
Rev.2.0,2013-10-18Final Data Sheet
RevisionHistoryIPA65R045C7
Revision:2013-10-18,Rev.2.0
Previous Revision
Revision Date Subjects (major changes since last revision)
2.0 2013-10-18 Release of final version
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Edition2011-08-01PublishedbyInfineonTechnologiesAG81726München,Germany©2011InfineonTechnologiesAGAllRightsReserved.
LegalDisclaimerTheinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.Withrespecttoanyexamplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthedevice,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation,warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty.
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WarningsDuetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,pleasecontactthenearestInfineonTechnologiesOffice.TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/orautomotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifafailureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationandaerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsareintendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itisreasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered.