mpcs presentation 2017
TRANSCRIPT
Providing Interconnection Solutions Through Innovative Products
Changing The Way You Buy Circuit Boards Midwest Printed Circuit Services, Inc.
Providing Interconnection Solutions Through Innovative Products
Who Are We?
A Value Add Printed Circuit Board SupplierEstablished in 1984American Owned and OperatedEntirely Manufactured in the USA2 Locations Located in Round Lake Beach, IL (47,000 SqFt)
A “Trusted” Source of SupplyDedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
What do we do?
Manufacture both Prototype and Full Volume High Reliability PCB’s Offer Manufacturing Solutions for all PCB Product LinesProvide Experienced Engineering and Unparalleled Customer Support from First Contact Through DeliveryDedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Why do we do it?
We value our relationships above all elseWe take great pride in being a trusted and valued American supplier to numerous companies in your industry We care about making your buying process easy
Dedicated to Total Customer Satisfaction!
Other3%
Transportation7%
Power Supply10%
Military / Aerospace
27%Telecom 8%
Medical20%
Industrial Controls
25%
Providing Interconnection Solutions Through Innovative Products
Who do we serve?
Automotive
Defense Medical Aerospace Industrial
Consumer Telecom Computer
Providing Interconnection Solutions Through Innovative Products
How do we do it?
We dedicate ourselves to making the PCB buying and receiving process an easy and seamless transactionWe offer total customer support from First Contact through DeliveryOur management team averages over 31 years of manufacturing experience with an average employee tenure of 11 yearsDedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
What can we offer you?
Single sided to high layer count multi-layers, including Flex, Rigid-Flex, and Heat Sinks/Metal CoresBoth low and high volume lots at competitive pricesStandard lead times of 3 weeksQuick Turn/Prototypes as fast as 2 daysTailored Pricing options to fit your needsDedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Value Add Services
Printed bar-coding and multiple serialization options utilizing our Inkjet Legend PrinterFront end engineering analysis & DFM with new ordersReal time job tracking utilizing our M2M Enterprise Management SystemRaw material stocking programsKanban Dedicated to Total Customer Satisfaction!
New Orbotech Sprint 120 Inkjet Legend Printer
Providing Interconnection Solutions Through Innovative Products
Thermal Management Solutions
Heat sinksMetal coresMetal BackedThermagon Construction: (10x thermally conductive substrates & pre-pregs)Exotic Material MultilayerMixed Dielectric MultilayerVarious Bonding CapabilitiesBlind & Buried Vias
Dedicated to Total Customer Satisfaction!
In House Milling Dept.*Finishing done at NADCAP approved suppliers.
Providing Interconnection Solutions Through Innovative Products
Capabilities
Via in PadLPI and Dry Film SoldermaskNASA – Meets or Exceeds Outgassing Requirements Fully Automated CAMCarbon InkPeelable Solder MaskRaised Profile Plating Deep Ni/Au, Immersion Gold (ENiG), Silver, OSP Solder Stencils
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Technologies
Blind and Buried ViasSequential Lamination and Controlled Depth Drill/Plating CapabilityControlled Impedance (+/- 10% Standard)Copper Weights up to 4 OuncesHigh Speed Epoxy / Teflon HybridsDedicated to Total Customer Satisfaction!
Blind Thermal Via plated to internal copper core
Buried Via through internal copper core
Providing Interconnection Solutions Through Innovative Products
Technology Roadmap Current
FutureMinimum Drill SizeBlind/Buried Via 0.006” 0.006”Through Via 0.010” 0.008”
Line Width / Space(Half Oz Copper)Inner Layers 0.003”/0.003” 0.002”/0.002”Outer Layers 0.004”/0.004” 0.003”/0.003”
Laser Vias – Stacked 2 each 4 each
Laser Vias – Filled Yes YesAspect Ratio 0.5:1 0.75:1
Metal Core Filling 100% In House 100% In House
Metal Core Machining 100% In House 100% In House
Impedance ControlStandard 10% 10%Advanced 8% 7.5%
Testing Capability 250V In House 250V In HousePitch 0.004” 0.004”High Pot Up to 5KV Up to 5KV
Providing Interconnection Solutions Through Innovative Products
Cross Sections
Coupons Conform to IPC-2221
Thermal Stress IPC-TM-650, 2.6.8 Added to all Panels
Exceeds IPC 6012 for Space & Military Avionics
Inspected to• MIL-PRF-31032• MIL-PRF-55110• MIL-PRF-50884• IPC-6012 • IPC-6013
9 Ounce Surface Copper
3 Ounce all Layers
Providing Interconnection Solutions Through Innovative Products
Common Materials
FR4 – 370HR/185HR, VT-47, ITEQ 180AFlexible and Rigid/FlexHybrids*Getek*FR408*Rogers*BT Epoxy*Polyimide*Teflon/Duroid/PTFEAnd more
*These materials are not commonly stocked but stocking programs are available
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Thermal Materials
ThermagonAisimalibar CobrithermITEQ IT-859TAVentec VT-44 Series
These materials are not commonly stocked but stocking programs are available
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Commitment to Quality
ISO 9001 Obtained 1998
MIL-PRF-31032/1 and 2 GF and GI MaterialsMIL-PRF-31032/3 and 4MIL-PRF-55110 GF and GI MaterialsMIL-PRF-50884IPC-6012 Class 3 and 3A (Space and Military Avionics)IPC-6013 Class 3 (Flex & Rigid Flex)Approved for Manned Space Flight
UL Listed ITAR Registered AS9100D (in process)NADCAP 7119 (in process)Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
RoHS Compliance
Finishes ENiG Lead Free Solder Silver OSP
Materials HR370 HR185 VT-47 ITEQ 180A
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Recent Capital Improvements
1. Orbotech Paragon 8000 LDI2. Orbotech Sprint 120 Ink Jet Legend
Printer3. Camtek Phoenix HDI AOI4. TMP 4 Opening Vac Lam Press (hot
and cold)5. Multiline OPE 9000 4 Camera
Automatic Post Etch Punch6. Polar CIT S880s Controlled Impedance
Test System7. Two Portable Clean rooms with HEPA
Filters8. Perkin Elmer PinAAcle 500 AA Unit9. Glenbrook TRX-113VAV X-Ray System10.Chemcut 547 Xli 30’ Ammonia Etcher
Continuous Improvement Plan:
To Further Enhance our Capabilities
Continue Improving Quality
Improve Efficiencies
Ensure on-time delivery
Exceed the demands of the ever changing industry
Providing Interconnection Solutions Through Innovative Products
Notable Customers
Providing Interconnection Solutions Through Innovative Products
Organizational ChartPresident & CEO
Joseph Fehsenfeld
Wet ProcessingManager
Larry Mikel
Human Resource / Purchasing
Linda Hutton
Process Engineering
Manager
Dave Sennett
Production Manager
Chuck Hutton
Customer Support Manager
Robert Denbo
Facilities Manager
Don Lackey
Quality Assurance Manager
Kathy Phelan
Director of West Coast Sales
Dave Pearson
Director of East Coast Sales
Pete Codella
Customer Support
Carol Main
Business Development
Matt Fehsenfeld
Providing Interconnection Solutions Through Innovative Products
Contact Us
Main Office: 1741 Circuit DriveRound Lake Beach, IL 60073Phone: (847) 740-4120 Fax: (847) 740-4187
www.midwestpcb.com
Bob Denbo – Customer Support [email protected] Pearson – Dir. of West Coast [email protected] Codella – Dir. of East Coast [email protected] Phelan – Quality Assurance [email protected] Main – Customer [email protected] Hutton – Production [email protected] Sennett – Process Engineering [email protected] Mikel – Wet Processing [email protected] Fehsenfeld – Business [email protected]
Joe Fehsenfeld – President & [email protected]