nessi – the “new sampling sensor initiative” - an enabling technology a cpac sponsored open...
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NeSSI – The “New Sampling Sensor Initiative” - An Enabling Technology
• A CPAC Sponsored Open Initiative
• Prepared by: – Rob Dubois – Dow Chemical– Peter van Vuuren – ExxonMobil Chemical– Jim Tatera – Tatera & Associates, Inc.
• ISA AD2002 April 16, 2002
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Presentation Outline
• Introduction, Drivers & History
• NeSSI Generation I and II comparison
• Elements of a NeSSI Generation II System
• What will a Generation II prototype look like?
• Status Update and New Developments
• NeSSI Roadmap & Summary
• How do I get involved with NeSSI?
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NeSSI Initiative
• An ad hoc global industry initiative, formed in June, 2000 to drive permanent change in Process Analysis.– NeSSI mail-out has now grown to 250+ subscribers
– Composed of End Users, Manufacturing Companies, Integrators
• Sponsored by the Center for Process Analytical Chemistry (CPAC) - legal umbrella
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• Originated from various CPAC focus sessions • IFPAC 2000 plenary paper presented NeSSI vision• Focus Groups and Workshops
– Pittcon 2000; ISA Expo 2000; IFPAC 2001, Pittcon 2001, CPACT Edinburgh, ISA Analytical Division, ISA 2001, IFPAC 2002
• Tutorials:– ISA2001 Houston, INTERMAC 2001 Tokyo, Pittcon2002
A Brief History of
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NeSSI Objectives
• Facilitate the acceptance/implementation of...– modular, miniature & smart process analytical
technology• Promote the concept of...
– at the pipe/field-mounted (“byline”) analytical systems
• Lay the groundwork for...– open connectivity communication architecture
• Provide a technology bridge to the process for...– “sensor/lab-on-a-chip” microanalytical devices
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The drivers for change...
• Reduce Cost to Build– Design and Engineering
– Manufacturing and Installation
• Reduce Cost of Ownership– Design Standardization
– Simpler, less expensive maintenance
• Enhance Reliability– Validate sample, data, communication
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Project Segmentation
Gen III
Gen II
Gen I Mechanical (mostly)
Electrical/Smart (Diagnostic)
MicroAnalytical & Wireless
Value
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Gen I - Standardize on a miniature, modular system
• Concept “Borrowed” from the semiconductor industry
• LEGO® like design• ISA Standard
– rugged
Courtesy of CIRCOR
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Elastomer Seals are desired in HP Industries
Courtesy of the Swagelok Co
Manufacturers…
• Parker-Hannifin
• Autoflow
• CIRCOR
• Kinetics
• Swagelok
• Fujikin
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What is ISA SP76?
Copyright 2001 ISA. All rights reserved.
Reproduced and distributed with permission of ISA.
Note: Draft provided for promotion
only.
Refer to ISA SP76.
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A Future Analytical SystemA Future Analytical System...Will Look More Like Us!
• Single Processor - Overall Control– Sensor Analytical Manager (SAM)
• System will be Multifunctional– Emphasis on all sensors
• System will be Adaptable– Predictive maintenance; self-healing
• Capable of Multivariate Analysis– Use many sensors for analysis
Courtesy of Ken Creasy, Honeywell. IFPAC 2001
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Gen. I versus Gen. IIFeatureSignalProtection MethodsClassificationSensorsIntelligenceControl PhilosophyRegulating Comp.Passive Comp.ActuatorsHeatingWiring
Generation I4-20 mAPurgeDiv 2Non-substrateLimitedCentralizedSelf-containedMechanicalStand-aloneExternalConduit/Cable
Generation IISerial BusISDiv 1SubstrateSmartDistributed (SAM)PID control loopsElectro-mechanicalSubstrate MountSubstrate integratedIS Wiring
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Generation II Dimensions- 7 Elements
• 1. Heated Substrate• 2. Physical t-Sensors• 3. Combi Valves
• 4. SAM • 5. PC with HMI
• 6. IS Multi-drop bus• 7. Enclosure
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1. Heated, Programmable Substrate
AC PowerAC Power
Conduction Heating- cartridge heater(s)
- over-temperature cut-off
Furn. by
substrate mfg.
Heating Fluids
(alternative)
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2a. Physical Sensors for System Diagnostics
• Doing analytical is not good enough!• Miniature Flow, Pressure, Temperature
– Gas and/or liquid service– Rugged construction– Intrinsically Safe (IEC Ex ia)– Div/Zone 1 Gp A-D; T4 (135 C)
A/D
COM
FLOW:
P, coriollis,
thermal, other?
Substrate
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2b. Conceptual Sensor for NeSSI
Process Cavity- no unswept voids
- low volume
BARRIER- Process Seal- Electrical Isolation- Thermal
Insulation Skirt- engineered
A/D
Comm.
Sensor
Base - pressure rated
µP
Mem
ory
Body- encapsulated
“Top Hat” Comm. Chip
A
Port- standard size/pin
- daisy chain
1.50”
Digital “Smart” Sensor- engineering units
- memory
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3a. Electrical Actuators on the Substrate - COMBO
• Miniature substrate mount– Gas and/or liquid service
– Wide P & T service
– Intrinsically Safe (IEC Ex ia)
– Div/Zone 1 Gp A-D; T4 (135 C)
COMBO Valve /w integral solenoid
SV
Comm.
Act.
AIR
On/Off and Proportional
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3b. Conceptual “Combo” Valve A
Actuator
Instrument Air
Valve
Vent
Vent
Comm.
D/A
Solenoid
Conventional pneumatic valve
“TopHat” Comm. Chip
3-way “pilot” solenoid valve - Intrinsically Safe
Actuator- NO or NC
Engineered InsulationSkirt
Port- standard size/pin
- daisy chain
Digital On-Board
Thermal Barrier
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4a. Introducing SAM “I do 5 jobs!”
Gateway to an Ethernet LAN
- OPC perhaps
Host to a
Sensor/Actuator Bus
Field Interface
- Graphical
- Wireless
- e.g. Bluetooth™, 802.11
Software Applets for
Sample System
Repetitive Tasks
(Industry Common)
“Open” Development Space for Custom Software
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4b. Standalone “SAM” - Wired Sensor/Actuator Bus
SensorAnalyticalManager
(SAM)
Analyzer System Ethernet LAN
PLegend: Pressure Sensor Temp Sensor Valve/Actuator Analytical SensorVA
T
PC or Analyzer Controller
VTP
A
?
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4c. Embedded SAM - Wired Sensor/Actuator Bus
Analyzer System Ethernet LAN
PLegend: Pressure Sensor Temp Sensor Valve/Actuator Analytical SensorVA
T
VTP
A
?Analyzer Controller
w/ Embedded SAM Functionality
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4d. SAM “Pick-list” for Common Sampling Tasks
Zero & span validation Pressure regulation Temperature monitoringStream switching Maintenance diagnostics
• Interoperability– talk to all analytical systems
SAM
Enabling Technology
for microAnalytical
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5. PC/PDA Graphical HMI (Human Machine Interface)
F Vv T P
FVvA
HMIPersonal digital
assistant
PC
Hello?
Vv=automatic valve; P=pressure sensor; F=Flow Sensor; A=Analytical Sensor;T=Temp. Sensor
HMI
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6. Serial Multi-drop Bus - “Au Revoir 4-20 mA?”
• CANbus– DeviceNet, SDS, etc.– Intrinsically Safe
• Engineering units on board sensors
• Reduces wiring load– multi-drop
• Eliminates I/O• Rugged, low cost
VTP
A
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7. Enclosure “X-team” Haz. Review Process
AC Power
Div/Zone 1GP. A-D, T4
Enclosure- NEMA 4/IP56 Rated- all climate operation- no purges- no X-proof tubs- low cost of operation
Sensor Bus
Intrinsically Safe (IEC Ex ia)- no gas “sniff” tests req..- allows hot disconnects- plug & play
Heaters- Substrate & Enclosure- IEC Ex d- programmable temp.
AC Power
Designed for Global Use
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Gen III Wireless SignalAnalyzer System Ethernet LAN
VTP
A
• Eg Bluetooth , 802.11• Plug and Play!• Power Supplied by...
– X-proof or IS miniature power bus
SensorAnalyticalManager
(SAM)
P.S.
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Generation IIIPlug & Play Analytical
F Vv T
A
SAM
Fiber Optic
ATOne sensor
per component“lab on a chip”
One Sensor and Multiple Analytes
A
Ethernet
Transducer Bus
Enabling Technologyfor Analytical
- GC-on-a-chip
- micro MS
- chem. sensors
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Keys to speedy development
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Don’t (re)invent…leverage existing standards
• Make use of existing connectivity and communication...
• Ethernet
• OPC
• CANbus
• wireless e.g. Bluetooth™
• WEB servers/Internet
Personal Digital Assistant (PDA)
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Communicate…globally!
• International– Europe, Japan, Canada,
USA
• Consortia– CPAC, CPACT
• Conferences– ISA, Pittcon, IFPAC,
etc.
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Design & certify to global requirements...
• NEC, UL, FM (USA)• CEC, CSA (Canada)• CENELEC (Europe)• ATEX Directive
(Europe)• CE Mark• JAPAN, ASIA…
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Around the Loop: The New Sampling/Sensor Initiative
CONTROL MAGAZINE
Great publicity...
“It's estimated that 70-80%
of analyzer outages can
be traced to the sample system”Terrence McMahon
August 01, 2001
Also ISA InTech Magazine; Chem. & Eng. News
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How difficult are these substrates to work with ?
The following section (compliments of John Cumbus of ExxonMobil) should give you an idea.
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Expected Advantages
• Minimum Engineering /Drafting Effort
• Simplicity of Construction
• Ease of Maintenance
• Leverage Technicians for Higher Priority Activity
• Higher Service Factors
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SupplyFilter
Bypass FlowController
SampleSupply
SampleBypass
SupplyPressure
ToAnalyzer
CalibrationSupply Stream
Valve(config-1)
GuardFilter
StreamValve
(config-2)
FromAnalyzerAnalyzer
Return
F
SupplyShut-Off
NC
NO
NC
NC
NC
Atmos.Vent
Calib.Shut-Off
FE
PI
F
Analyzer FlowController
FE
PE
PressureTransmitter
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Engineering Package
• Provided by Configurator
• Pressure Indicator left for Technicians
• Eight Single Stream and One Dual Stream
• Three Analog Outputs, Two Inputs
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Modular Sample System (minus MFMs)
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Modular System Connections Inside Enclosure
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New System in an Old Box
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Assembly Test of Smaller System (76 Pieces)
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Assembly Test Configuration
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Assembly Drawings Provided
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Completed Assembly
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Example of Mechanic’s Previous Work
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The “Mechanic”, Age 9
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Comparison of “Old” and “New” Sample Systems
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New Developments
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NeSSI Analyzers - here today
Courtesy of Panametrics & Swagelok Courtesy of Rosemount Analytical
Courtesy of Rosemount AnalyticalCourtesy of Panametrics & Swagelok
Oxygen
H2O
pH
Conductivity
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Courtesy of Porter Instruments and the Swagelok Co.
MFC’s here today
– Porter Inst. (Div. 2)
– Others…Gen Purpose• Unit Instruments
• Brooks
Undergoing
Certification
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Just announced...
Courtesy of Applied Analytics
MIR ATR
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Enabling technology for...
– Miniature physical sensors
– Flow– Temperature– Pressure
– Miniature chemical sensors
• “lab-on-a-chip”
– Component Mfgs.• Calibrators, pumps &• dryers, etc.
Courtesy of Mass-Sensors Inc.
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Petrochemical installs...
Coutesy of a
gulf coast
petrochemical facility
Courtesy of an east coast petrochemical facility
and Parker-Hannifin
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What’s New - Generation II Specification
• Draft version now compete
• Global Review Teams in Progress – X-team (hazardous areas)– C-team (connectivity issues)– A-team (simple applets)
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White Paper in Progress
• Driven by Honeywell Automation
• Will adapt final NeSSI Gen II spec as criteria for build
• Expand End Users, Manufacturers– Looking for involvement!!
• 10-20 Gen II prototypes will be built
• DoE being approached for funding in June
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Time (years)
03 04
NeSSI Roadmap
02
Mechanical Components e.g. filters, valves, etc.
Mechanical FieldInstallations
SP76 Substrate Available
NeSSI/CPAC Vision & Roadmap
2000
Design /Prototype - Gen II Smart/Heating/SAM
Smart Field Installations
MechanicalGen. I
Smart/”Electrified”Gen. II
Analytical & WirelessGen. III
01 0605
Rev. 1, Dec. 2001
Analytics/Sensors (e.g. laser based)/Wireless
Simple Analyzers (H2O, O2, pH, UV/VIS, etc.)
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References & involvement...
...a few references you may want tolook over. The NeSSI portion of the CPAC web site at
www.cpac.washington.edu The ISA Draft Standard - ISA Draft 76.00.02 , “Modular
Component Interfaces for Surface-Mount FluidDistribution Components--Part 2: Elastomeric Seals”
"The New Sampling/Sensor Initiative", Terence K.McMahon, Control, August/2001, Vol XIV, No. 8, page158
"Molding the Future of Process Analytical Sampling",Ellen Fussell, InTech, August/2001, page 32
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Acknowledgements I
• Dow– Danny Quevillon
– Reg Hartwig
– Walt Henslee
– Bac Vu (SP76)
– John Leach II
– Craig Snook
• ExxonMobil Chemical– Dan Podkulski (SP76)
– Jeff Gunnell
– John Cumbus
– Rajko Puzic
• CPAC– Mel Koch
– Dave Veltkamp
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Acknowledgements II
– Doug Mitchell - Panametrics
– John Wawrowski, Rick Ales, Dave Simko - Swagelok
– Yoav Barshad - Applied Analytics
– Nick van Bruggen - Porter
– Gary Frank, Raj Adani - Kinetics
– CD Feng - Rosemount Analytical
– Bob Nickels, Ulrich Bonne, Ken Creasy - Honeywell
– Chris Towle/Don Long - MTL
– Steve Doe - Parker
– X-Team
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A parting thought...
"When men got structural steel, they did not use
it to build steel copies of wooden bridges."
Ayn Rand. Atlas Shrugged. 1957.
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MicroAnalytical
• Do you have any questions regarding the the standard footprint and/or the relevance of your technology to this concept and/or its suitability beyond plant applications (lab, pilot plant, etc)?
• Do you understand the Process Safety issues and requirements (e.g. I.S. Ex ia)? Would your like to discuss any of them?
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Sensor/Actuator Bus
SensorAnalyticalManager
(SAM)
Analyzer System Ethernet LAN
Analyzer Controller
VTP
A
Sensor Requirements:
Simple Sensor Host Communications Configurable Sensor AttributesSmall Footprint of SensorEngineering UnitsInexpensive but reliable
Host Requirements:
Controls all Sensor/Actuator Functions Support Common SS tasks (Applets)Gateway to Analyzer LAN/Imbedded
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Sensor/Actuator Bus
SensorAnalyticalManager
(SAM)
Analyzer System Ethernet LAN
Analyzer Controller
VTP
A
CAN-bus:
Simple Sensor Host Communications Configurable Sensor AttributesMeasurement and DiagnosticsSmall Footprint of SensorEngineering UnitsInexpensive but reliable (proventechnology)Attributes Flashable (DeviceNet/SDS..)
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Sensor/Actuator Bus
SensorAnalyticalManager
(SAM)
Analyzer System Ethernet LAN
Analyzer Controller
VTP
A
Workgroup Question/Feedback:
Is CAN the right answer?
Is IS the right answer?
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Embedded or Standalone SAMEthernet LAN
Analyzer or PC Controller
VTP
A
CANbus
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Q1. Who Should Manage the Applets?
• Foundation like organization?
• Applet creator?
• Analyzer Vendors?
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Q2. SAM Concept
• Would you agree that SAM would be useful device for interfacing and interacting with both the Sensor bus and the larger world of the Ethernet – What do you (or don’t you) like….?– What would you like improved or added?