NEWSNEWSInternal Review

November 20Presentation covering most of the relevant L4 WBS activities:

rf shielding, substrate,Vacuum vessel, Position control system, Cooling system, Pixel support frame

3 hours of presentationDiscussion with the ReviewersQuestion: individual comments from reviewer, written reportCharge to the reviewers

ESLIESLI48 glassy carbon tubes delivered1.5mm OD (23), 1.2mm OD (25)Four of each being sent to Iowa and WSUProperties: see attached spreadsheetTests planned: impact test of joints, strength test

of the tubes, solution to manifold, irradiation test, corrosion test

Wall thickness found to be non-uniform

ESLI Carbon Tubes (FNAL)

ESLI Carbon Tubes (MSB2-Sep01) 23 1.5-mm OD 25 1.2-mm OD

Calculated Linear Mass

1.5mm Tube 1.2mm TubeOD in 0.059 0.047 = m 1.50E-03 1.19E-03ID in 0.051 0.039 = m 1.30E-03 9.91E-04

L m 1.00E+02 1.00E+02Volume m3 4.46E-05 3.49E-05

Carbon density kg/m3 1.63E+03 1.63E+03Mass kg 7.27E-02 5.68E-02

Linear Mass kg/m 7.27E-04 5.68E-04 = mg/m 726.8 568.2

Measured Linear Mass

1.5-mm Tubes A B C D E AVERAGEmass g 0.1568 0.1554 0.1565 0.1547 0.1565

Length mm 215.6 213.7 214.8 213.2 215.6Linear mass mg/m 727.3 727.2 728.6 725.6 725.9 726.9

1.3-mm TubesLength mm 0.1343 0.134 0.132 0.133 0.1328

Linear mass mg/m 236.1 235 234.4 235.3 234.8Linear mass mg/m 568.8 570.2 563.1 565.2 565.6 566.6

RF shieldingRF shielding

Alex will report on the FEAWe met with Weiren Chou (BD) to discuss the

shielding. Chou will do calculation on the beam effects: impedance, heating, and image current return

Also discussed with Cary and Mark on prototyping; would like to fabricate a short section

(welding, stamping, EDM, laser cut etc)

Be substrate ( for CM )Be substrate ( for CM )

More movies taken with small bumpConclusion: not much differenceProposed to adopt Charles’ idea; make it solid Be at the

notchHad a meeting with Mike H., Mike R., Jim Fast on the

alignment holes – lead to some changes in the precision of the holes, ideas on assembly etc

We should try out the procedure; Zeiss 850 available to us; will use it for the thermal displacement test but also for the assembly practice

Be substrate Be substrate

FEA FEA

Recall that bump bond is the weakest link according to FEA

We can improve the strength by putting in underfill around the corners

Our test using ATLAS 2x8 module with 5 FPIX1 chips bonded is still OK after a few thermal cycles

FEA (cont)FEA (cont)

Big stress on the epoxy layer because if CTE mismatch between Si and Be

Factor of 3 larger than strength of any known epoxy

Separate the epoxy layer into