nittobo new glass fabric for pcb - ibm · ne-glass low dk low df ppccb market and nittobob market...
TRANSCRIPT
Nittobo New Glass fabric for PCB
Nitto Boseki Co., Ltd.Glass Fiber Division
Technical Dept. Nov. 2011
The contents of this document are based on the results of experiments, investigations and analyses conducted by Nitto Boseki Ltd. (Nittobo). Nittobo does not intend to guaranteed the value.Nittobo reserves the right to change these typical values as a natural process of refining our test equipment and techniques.
11-2011Confidential
IC Substrate
BGA
CSP
High Speed
Switching system
High speed server
Our original processOur original process
SS processSS process , , NHR processNHR processConfidential
TT--glassglassLow CTE
NENE--glasglasssLow DkLow DfHigh Quality and Reliability
ETCC ABSEngine Controller PCB
PCB Market and Nittobo’s TargetPPCCB Market and NittoboB Market and Nittobo’’s Targets Target
Contents
1-1. Why Low CTE?1-2. Glass Fiber Composition1-3. Properties of glass fiber
Confidential
1.1. TT--glassglass fabricsfabrics
Mother board
Silicon chip
Substrate
1-1. Why Low CTE ?
Confidential
Demanded for lower CTE substrate materialsDemanded for lower CTE substrate materials
3~4 ppm/℃
9~11 ppm/℃
CTE :
PCB receives the heat stress by thermal expansion.
T-glass fabric respond
Heat stress
Mother board
Silicon chip
Substrate
Connected reliability decrease
1-2. Glass Fiber Composition
Nittobo is integrated Glass Fiber Manufacturer. (Yarn & Fabric)Nittobo can develop a different component Glass Fiber.
E-glass T-glass
SiO2 52-56 64-66Al2O3 12-16 24-26B2O3 5-10 -CaO
20-25-
MgO 9-11R2O 0-0.8 -
This is technical data, not guaranteed value.
Confidential
1-3. Properties of glass fiber
This is technical data, not guaranteed value.
Confidential
>1000844℃The Point softening
2.85.6ppm/℃Thermal Expansion
774763J/kg・KSpecific Heat
10151015Ω・cmVolume Resistance
0.00430.0035(1GHz)Dissipation factor
5.46.8(1GHz)Dielectric Constant
8675GPaTensile Modulus
4.83.2GPaTensile Strength
2.52.6g/cm3Density
T-glassE-glassUnitProperty
>1000844℃The Point softening
2.85.6ppm/℃Thermal Expansion
774763J/kg・KSpecific Heat
10151015Ω・cmVolume Resistance
0.00430.0035(1GHz)Dissipation factor
5.46.8(1GHz)Dielectric Constant
8675GPaTensile Modulus
4.83.2GPaTensile Strength
2.52.6g/cm3Density
T-glassE-glassUnitProperty
IC Substrate
BGA
CSP
High Speed
Switching system
High speed server
Confidential
High Quality and Reliability
ETCC ABSEngine Controller PWB
SS processSS process , , NHR processNHR process
TT--glassglassLow CTE
NENE--glassglassLow DkLow Df
PCB Market and Nittobo’s TargetPPCCB Market and NittoboB Market and Nittobo’’s Targets Target
Contents
2-1. Why Low Dk and Df ?2-2. Glass Fiber Composition2-3. Properties of glass fiber
Confidential
2. 2. NENE--glassglass fabricsfabrics
The high speed signal has been used for an electronic device.
Transmission speed (V)
V = C / √(Dk)
(C : Velocity of light)
Transmission loss (a)
a = f ×√(Dk) × Df
(f : Frequency)
Confidential
2-1. Why Low Dk and Df ?
Demanded for lower Demanded for lower DkDk and and DfDf materialsmaterialsNE-glass fabric respond
2-2. Glass Fiber Composition
Nittobo is integrated Glass Fiber Manufacturer. (Yarn & Fabric)Nittobo can develop a different component Glass Fiber.
E-glass NE-glass
SiO2 52-56 50-56
Al2O3 12-16 10-18
B2O3 5-10 18-25
CaO20-25 5-12
MgO
R2O 0-0.8 0-1
This is technical data, not guaranteed value.
Confidential
2-3. Properties of glass fiber
Confidential
-844℃The Point softening
3.35.6ppm/℃Thermal Expansion
862863J/kg・KSpecific Heat
10151015Ω・cmVolume Resistance
0.00150.0035(1GHz)Dissipation factor
4.86.8(1GHz)Dielectric constant
6475GPaTensile Modulus
3.13.2GPaTensile Strength
2.32.6g/cm3Density
NE-glassE-glassUnitProperty
This is technical data, not guaranteed value.
-844℃The Point softening
3.35.6ppm/℃Thermal Expansion
862863J/kg・KSpecific Heat
10151015Ω・cmVolume Resistance
0.00150.0035(1GHz)Dissipation factor
4.86.8(1GHz)Dielectric constant
6475GPaTensile Modulus
3.13.2GPaTensile Strength
2.32.6g/cm3Density
NE-glassE-glassUnitProperty
IC Substrate
BGA
CSP
High Speed
Switching system
High speed server
Confidential
High Quality and Reliability
ETCC ABSEngine Controller PWB
SS processSS process , , NHR processNHR process
TT--glassglassLow CTE
NENE--glassglassLow DkLow Df
PCB Market and Nittobo’s TargetPPCCB Market and NittoboB Market and Nittobo’’s Targets Target
Contents
3-1. What’s SS process?3-2. Characteristic impedance 3-3. Summary
Confidential
3. SS process3. SS process
The technical key of SS process :- Spread out and Flatten fiber technique- Uniform distribution of filaments
SS processSS process
Weft
Warp
Strand
Filament
Confidential
Conventional fabric (Cross section) :
① Surface smoothness
② Dimensional stability
③ Laser drill-ability
Advantage of the fabric with SS process :
④ Characteristic impedance④ Characteristic impedance
tW
εr
bb
εrConfidential
3-2. Characteristic impedance (Z0)
<Microstripline>
5.98×b
εrZ0
60ln
0.8 ×W + t=
Conventional process
SS process
Dk distribution is uneven
Dk distribution is even
Thickness of the board varies widely
Thickness of the board varies small
3-3. Summary
Confidential
Excellent characteristic impedanceExcellent characteristic impedance
IC Substrate
BGA
CSP
High Speed
Switching system
High speed server
Confidential
High Quality and Reliability
ETCC ABSEngine Controller PWB
SS processSS process NHR processNHR process
TT--glassglassLow CTE
NENE--glassglassLow DkLow Df
PCB Market and Nittobo’s TargetPPCCB Market and NittoboB Market and Nittobo’’s Targets Target
, ,
Contents
4-1. Resin impregnation measurement4-2. Influence by the viscosity of the resin4-3. Summary
Confidential
4. NHR process4. NHR process
Conventionalprocess
NHR process
Before measuring After 10 seconds
※Ending impregnation
4-1. Resin impregnation measurement
Confidential
Fabric type : 1027Resin : FR-4
Conventionalprocess
NHR process
Impregnation characteristics Impregnation characteristics for several fabric types :for several fabric types :
0.0
1.0
2.0
3.0
4.0
5.0
6.0
1017 1027 1037 1035 1078 2116
End
poin
t (m
in)
Fabric type
Conventional process
NHR process
Resin : FR-4 (100cps)
Confidential
Reference.
※End point = The fabric became transparent
4-2. Influence by the viscosity of the resin
0.0
5.0
10.0
15.0
20.0
25.0
30.0
100 200 300 500
End
poi
nt (
min
)
Viscosity of resin (cps)
Conventional process
NHR process
Confidential
Reference.
Fabric type : 1027
Resin : FR-4
4-3. Summary
・・ SuitableSuitable for special resinfor special resin
・・ Suitable for high insulation reliabilitySuitable for high insulation reliability
Confidential
- Large improvement resin impregnation characteristicsfor several fabric type.
- Excellent impregnation characteristics in the resin of the high viscosity.
T-glass Fabric ProductsTT--glass Fabric Productsglass Fabric Products
Confidential
-
20
40
60
80
100
120
0 20 40 60 80 100
Thickness (μm)
Base
wei
ght (
g/m
2 )
T1017
T1027
(T1029)T1024
T1037(T1039)
T1030
T1035T1067
T1080
T1280
T2118
T2116
T1078
The product with parentheses shows unregistration in IPC spec.
-
20
40
60
80
100
120
0 20 40 60 80 100Thickness (μm)
Bas
e w
eigh
t (g/
m 2 )
Confidential
※NE1017NE1027
NE1037
NE1067NE1080
(NE2013)
NE2116
NE106
NE1078
NE1035
※Development.
The product with parentheses shows unregistration in IPC spec.
NE-glass Fabric ProductsNENE--glass Fabric Productsglass Fabric Products