october 7 -10, 2007 radisson fort mcdowell resort ... · product requirements drive the need for...

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Presentations\Tradeshow & Conference Presentations\AIMCAL Fall Technical Conf - Oct 2007\Mark Strnad - Designing CR to Accommodate R2R Process Equip Final.ppt

Designing a Cleanroom to Accommodate Roll-to-Roll Processing Equipment

Presented by:

Mark StrnadVice President Operations and Engineering

October 7-10, 2007Radisson Fort McDowell ResortScottsdale, Arizona USA

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AGI Abbie Gregg, Inc. | Designing a Cleanroom to Accommodate Roll to Roll Processing Equipment Slide 2 of 65


Overview

• Cleanroom design continues to advance as technology changes. Product requirements drive the need for cleaner air, gases, liquids, and power. Concurrently, the use of roll-to-roll equipment is becoming more attractive. However, roll-to-roll equipment presents another set of challenges due to special size and material handling needs. This presentation will discuss how to design a cleanroom that will operate with both sophisticated products and roll-to-roll equipment.

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The Challenge – Start with roll-to-roll technology

Photo Courtesy of Hanita Coatings

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Add in this tool size

Photo Courtesy of Energy Conversion Devices

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And put it in a clean environment

Photo Courtesy of the Flexible Display Center at ASU

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Key Terms

We will start by defining and illustrating a few key terms as used in this presentation.

• Geometries– Minimum dimension that needs to be produced to create a given

technology. Typically, this is listed in microns. A human hair is about 100 microns in diameter. A red blood cell is about 5 microns across.

• Cleanliness– How clean the environment needs to be to produce the product.

This is often listed as Cleanroom Class.

• Form Factor– Size of the substrate or starting material used in manufacturing.

This is defined in millimeters or inches.

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Geometries- What is small?

• Why do we need a Cleanroom?

• Current products are very small

Typical Silicon Wafer -8 inch or 200 mm

Individual features are < 0.1 micron

Microprocessor Die 1 cm by 1 cm

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Geometries continue to get smaller

Source: The Nanoelectronic ChallengePeter Kucher, Fraunhofer CNT

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Nanotechnology 2003

0.09 µ CD90nm

Nm = Nanometers

4 µ CD 2.5 µ CD 1.5 µ CD

NMOS 1980 HMOS 1985 CMOS DLM 2 µ 1989 CMOS QLM 0.35µ 1995

0.35 µ CD4000nm 2500nm 1500nm 350nm

Bacteria Skin FlakeCigarette Smoke

0.2 - 0.4 µ ? 2 µ ? 8 µ ?

Amines200 – 400nm 2000nm 8000nm

~ 50 nm

Geometries- Killer defect size

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Geometries, defects, and yield

Defects (Down) Yield (Up)

LOW Defect Density HIGH Yield=

=HIGH Defect Density LOW Yield

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Fed STD209 E

Equivalent

ISO Classification number (N)

Maximum concentration limits (particles/m3 of air) for particles equal to and larger than the considered sizes shown below

0.1 µm100nm

0.2 µm 0.3 µm300nm

0.5 µm 1 µm1000 nm

5 µm

N/A ISO Class 1 10 2

N/A ISO Class 2 100 24 10 4

1 ISO Class 3 1,000 237 102 35 8

10 ISO Class 4 10,000 2,370 1,020 352 83

100 ISO Class 5 100,000 23,700 10,200 3,520 832 29

1,000 ISO Class 6 1,000,000 237,000 102,000 35,200 8,320 293

10,000 ISO Class 7 352,000 83,200 2,930

100,000 ISO Class 8 3,520,000 832,000 29,300

ISO Class 9 35,200,000 8,320,000 293,000

NOTE: Uncertainties related to the measurement process require that concentration data with no more than three significant figures be used in determining the classification level.

Cleanliness - ISO Clean Class

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This table lists the air changes per hour necessary to achieve the cleanliness level desired. The information provided below is based on data tested by the Institute of Environmental Sciences and Technology (IEST).

Reference IEST-RP-CC012.1 – Institute of Environmental Sciences and Technology

ClassAirflow Type

Average AirflowVelocity

(Over the Entire Area)

Air ChangesPer Hour

Class 100,000ISO 8

N M .005-.041 m/sec (1-8 ft/min) 5-48

Class 10,000ISO 7

N M .051-.076 m/sec (10-15 ft/min) 60-90

Class 1,000ISO 6

N M .127-.203 m/sec (25-40 ft/min) 150-240

Class 100ISO 5

U N M .203-.406 m/sec (40-80 ft/min) 240-480

Class 10ISO 4

U .254-.457 m/sec (50-90 ft/min) 300-540

Class 1ISO 3

U .305-.457 m/sec (60-90 ft/min) 360-540

ISO 2, 1 U.305-.508 m/sec (60-100 ft/min)

360-600

1 When airflow type is listed, it represents the more common airflow characteristics for cleanrooms of that class: U = unidirectional N = nonunidirectional M= mixed.2 Average airflow velocity is the way that airflow in standard dimension cleanrooms (that is, those that typically have a ceiling height of 10 feet or 3 meters) usually is specified. This term is commonly used to refer to unidirectional airflow.3 Air changes per hour is the way that nonunidirectional and mixed airflow in nonstandard, high bay, or unusually configured cleanrooms usually is specified.

Cleanliness - Air Changes per hour

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$/Sq Ft

Class 0.5 micron particles per

cu ft (Fed 209D)

$2,250 1 1

$1,800 10 10

$1,425 100 100

$900 1,000 1,000

$700 10,000 10,000

$75 Support

(Facilities)

N/A

Cleanliness- Why is it important?

Typical Cleanroom Cost Assumptions

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Wafer Form Factor Evolution

Wafer Form Factor

0

2

4

6

8

10

12

14

1964

1968

1972

1976

1980

1984

1988

1992

1996

2000

2004

2008

Year

Wa

fer

Dia

me

ter

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Panel Form Factor Evolution

Panel Form Factor

0

1

2

3

4

5

6

7

8

9

19

88

19

90

19

92

19

94

19

96

19

98

20

00

20

02

20

04

20

06

Year

Gla

ss G

en

era

tio

n

2200 x 2500

1870 x 2200

1500 x 1800

1100 x 1300

730 x 920

550 x 650

370 x 470

300 x 400

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Panel Form Factor EvolutionGen 8 2200 x 2500 mm

Gen 7 1870 x 2200 mm

Gen 6 1500 x 1800 mm

Gen 2 370 x 470 mm

Gen 5 1100 x 1300 mm

Gen 4 730 x 920 mm

Gen 3 550 x 650 mm

Gen 1

300 x 400 mm

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Panel Form Factor Driver – Revenue

• Gen 7 (1870 x 2200 mm) can produce – Eight 40” Diagonal LCD TVs

– or

– Six 46” Diagonal LCD TVs

• Gen 8 (2200 x 2500 mm) can produce– Eight 46” Diagonal LCD TVs

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FPD Technology 2005 Sales 2007 Sales CAGR

a-Si TFT LCD $54.4 B $70.1 B 13%

PM LCD $6.0 B $4.5 B -14%

PDP (Plasma) $5.8 B $8.9 B 24%

LTPS TFT LCD $5.5 B $6.8 B 11%

OLED $0.5 B $1.8 B 86%

Other Tech. $2.0 B 2.0 B 0%

All FPD $74.3 B $94.1 B 13%

Size of Display Market

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• Clothing and Wearable Displays• Foldable Displays• E Book• Electronic paper

FPD Future: Flexible Displays

Images courtesy of Seiko / E Ink, Fujitsu, and Philips.

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• Start with small form factor• Grow to a larger form factor• Need to automate/mass produce

• Roll-to-Roll Manufacturing

Flexible Displays

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Designing the Cleanroom

• Tools or Equipment

• Utilities

• Building Cross Section

• Cleanroom Concepts

• Air Management

• Chemicals

• Other Design Considerations

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Tool Needs

• Quantity

• Utility requirements

• Cleanliness level

• Size– Footprint

– Layout

– Move-in path

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Tool Quantities

• Quantity determined via capacity model

Process Tool

Total

Required

Tools

Total

Required

Whole

Tools

Equipment

Utilization*

Laminate Mask Pattern 1.2722 2 55.6%

Laminate, Remove 1.2722 2 55.6%

Laser Repair 2.4080 3 70.2%

Laser, Pulsed Excimer 1.2722 2 55.6%

PECVD Deposit 8.3042 9 78.1%

PECVD, Microwave 2.4853 3 70.1%

PECVD, Microwave Inert 2.4853 3 70.1%

Reactive Ion Etch 5.2881 6 74.6%

Receive from evaporator 1.2722 2 55.6%

Roll Coat 8.8598 9 86.0%

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Photos Courtesy of Shibaura

Tool Footprint

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Photos Courtesy

of Entegris

Tool Footprint

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Tool Layout – What is Wrong with this Picture?

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Tool Layout - Incorrect

• Should not be in Front of Column

• No Support Space

• No Access to Rear of Tool

• No Room To Make Utility Connections

• Should Be Bulk-headed

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Tool Layout - Correct

• Table Utilizes Space in Front of Column

• Plenty of Maintenance Space

• Accessibility to Rear of the Tool

• Plenty of Room for Utility Connections

• Tool is Bulk-headed for Easy Access

• Allows space for material handling

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Tool Layout Options - Bulkheading

View of the clean bay side.

Machine interface is on the clean side, with the tool bulkheaded into

the chase.

View of the chase side.

Back of tools sit in the “dirty” environment.

Maintenance can be done in lower protocols.

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Tool Layout Options – No Bulkheading

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Tool Spacing for Material Movement

Photo Courtesy of Multilayer Coating Technologies

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Tool Spacing for Material Movement

• Typical wafer tools have an area space factor of 1.3. A typical tool has a footprint of 100 square feet. This means the tool and the area necessary to access it require 130 square feet. These tools can be placed very close together and the aisle between them can be 6 feet or less wide. This allows more than adequate room for operator and product movement.

• Continuous web processing equipment has an area space factor of 1.75. This equipment is much larger. A typical tool is 784 square feet. The access area required around the tool is also much larger. The maneuvering of the lift carts causes aisles to be 15 feet wide and 11 feet of space between tools. This means the tool and the area necessary to access it require 1,372 square feet. This space requirement can be reduced with future improvements in the lift carts.

Web Process Tools

Typical Wafer Tools

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Tool Move In

• Utilize Existing Space

– Use the service corridor as a move-in path via chases

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Utilities - Planning and Analysis

• Many individual spreadsheets and/or “home-grown” software applications exist throughout the industry.

• Each application has its own assumptions, analysis methodology, cost and process data, and “frame of reference.”

• Separate databases or spreadsheets used for different projects often contain contradictory information, resulting in confusion.

• Information is not validated by observing process tools in use.

• Accuracy of vendor data is not verifiable by Architects/Engineers who sometimes do this type of planning.

• It requires process and operations expertise to get an accurate database and “by-project” analysis.

• Data is not easily diversified for varying utility usage in phased projects.

• A detailed utility matrix is required to solve these problems.

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Utility Matrix

• What is required for a project:– Database system which quantifies, totals, and summarizes the utility

requirements for the user’s equipment.– Various utility parameters that are tabulated and quantified include:

• Liquids• Exhausts• Electrical• Process and house gases• Process supplies (other chemicals)

• Total fab requirements (by area or by fab)– Process gases, liquids, and supplies– Electrical requirements– Exhaust demand– Drain needs

• Heat load to the room– Needed for accurate HVAC sizing– Accounts for exhaust and process cooling water reductions in load.

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Facility Research

• Capacity of Systems (all upstream components) – per base build specifications

• Location – verified per base build specifications

• Termination

• Expandability

• Flexibility

• Accessibility / Mounting etc.

• Purity Verified - per base build specifications

• Quality Verified - per base build specifications

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Facility Research

• Use Flow Meters to check the flow rates of gases or liquids in the facility.

• Use the Pressure Gauge to check the pressure of the gases or liquids that are in the facility

• Use calibrated quality instruments to check particle counts and chemical analysis of incoming gases and liquids, available volumes of exhaust, static pressure, etc.

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Facility Research

• Typical view of facility area before tool hookup

• Very Narrow Chase

• Wall Mount Piping

• Shows stubs for hookup connections

• Piping Stage of Construction

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Building Cross Section

Cross Sections.

• Single Floor – Less Expensive– Slab on Grade

– Mixed with partial subfab

• Raised Floor/Subfabs- Most expensive– Is either option absolutely necessary?

• Can support areas be located elsewhere?

• Can process equipment support pieces be located in chases?

– Very Costly

– May require additional vibration isolation for sensitive equipment and process

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Slab on grade (Low Sidewall) Return

• Least expensive option because it doesn’t require a raised floor

• Least flexible because space must be left in the wall for air flow

• Higher pressure drop across smaller wall openings requires more fan energy

Chase BayBayCleanroom

Isolated Foundation

Exhaust Scrubber

Pressurized Plenum

Piped Services RecirculatingAir Handlers

Wet wastes


Isolated Foundation

Exhaust ScrubberExhaust Scrubber

Pressurized Plenum

Pressurized Plenum

Pressurized Plenum

Piped Services RecirculatingAir Handlers

Wet wastes

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Raised Floor Return

• Require a raised access floor, with tool pedestals for vibration sensitive tools

• Very flexible because air passes below the tools, better laminarity of air flow

• Lower pressure drop across all floor area, better vertical laminar flow

• Space below floor can be used for drains and to distribute power and some gases

Chase BayBay

Cleanroom

Isolated Foundation

Exhaust Scrubber

Pressurized Plenum

Piped ServicesRecirculatingAir Handlers

Wet wastes

Chase BayBay

Cleanroom

Isolated Foundation


Pressurized Plenum

Pressurized Plenum

Pressurized Plenum

Piped ServicesRecirculatingAir Handlers

Wet wastes

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Subfab Return

Exhaust Systems

Piped ServicesPiped Services


Sub-Fab

Interstice

20

’20

’20

’20

’

Isolated Foundation


Pressurized Plenum

Pressurized Plenum

Pressurized Plenum

Heavy StructureTarget 250 to 125 µin/s

RecirculatingAir Handlers

Wet wastesWet wastesSupport tools, gas cabs, etc.

• Air passes through the fab and down into the subfab

• Space in the subfab can be used for support equipment such as pumps and gas cabinets

• Highest cost but conserves cleanroom space

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Bay / Chase Cleanroom Concept

• Most common cleanroom layout

• Provides for maximum flexibility with least area under filter

• Allows for services and maintenance for the “back” side, or the chase

• Can bulkhead tools in the chase so that only machine interface is in the clean zone

Service

Tour Aisle

Clean Protocols

Clean Aisle

Ba

y

Chase

Tool Move In

People & Materials

Protocol Options

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Bay / Chase Air Return Options

Bay / Chase with low sidewall return

Bay / Chase with floor return

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Ballroom Cleanroom Concept

• Layout used primarily for Class 1,000 or 10,000

• Can be used with mini-environments for some processes

• People, product, and equipment share the clean zone

• Can be very flexible for tools requiring few utilities such as CDA, N2 and power

Service

Chase

Ballroom

Ch

as

e

Clean Protocols

Tool Move In

People & Materials

Protocol Options

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Ballroom Cleanroom Concept

Ballroom Layout

Class 1,000 with mini-environments

Ballroom Cleanroom

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Air Management StrategiesDucted System

• Flexible locations for filters

• Air handling equipment is located outside the clean zone

• Usually lowest operating cost of system options

• Requires most interstitial height, increases building height

Chase (Return)

HEPA Filter

Recirc

Free Air Return

Bay (Clean Aisle)

Make -up

Return Air

Minimum bend radius

Fan Deck or Support Structure

Chase (Return)

HEPA Filter

Recirc

Free Air Return

Bay (Clean Aisle)

Make -up Air

Return Air

Minimum bend radius

Fan Deck or Support Structure

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Air Management StrategiesFan Filter Units

• Flexible locations for filters, not related to wall locations

• Can have lower first cost

• Fan and filter maintenance is done inside the cleanroom

• Can fit in reduced access ceiling space

• Can be individually controlled and monitored

• If one unit malfunctions, the clean space can still operate

• Each unit can be replaced individually

• Difficulty identifying fans or filters that are out of services

• Fan noise can be a significant problem

Fan / Filter Boxes

Fan / Filter Unit

OpenPlenum

Free Air Return

Bay (Clean Aisle)

Chase (Return)

Make-up Air

Fan / Filter Boxes

Fan / Filter Unit

OpenPlenum

Free Air Return

Bay (Clean Aisle)

Chase (Return)

Make-up Air

(Conditioned)

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Air Management StrategiesPressurized Plenum

• Flexible locations for filters

• Equipment maintenance is outside the cleanroom

• Fairly low operating cost, comparable to ducted filter option

• Provides local sensible cooling to return air

• Less height required than ducted supply

• Can combine ducted and open return for more local air separation

• Walls are limited to locations of plenum boxes, (can supplement with FFUs)

• Must measure exact size for fit – field modifications costly.

Pressurized Plenum

Free Air Return

Bay (Clean Aisle)

Make-up Air

HEPA Filter

Recirc

Plenum Box

Return Air

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Automated Wet Process Manual Wet Process

Chemicals at Point-of-Use

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CMP chemical distribution Wafer Fab

Labeled double containmentchem distribution lines- subfab

Chemical Distribution Systems

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Process Nitrogen (Process Gases): “Electronic Grade”

Subject GAS Content Method of Analysis

Nitrogen 99.999 %

O2 1 ppm Portable O2

CO2 <0.5 ppm

CO <0.5 ppm

H2 <1 ppm

H2O 1 ppm Shaw or equivalent

THC <0.5 ppm Flame Ionization GCA. GCA of Residue in activated charcoal filter that was on the line for 1 hour at approximately 1 LPM flow rate.

ACCEPTABLE NUMBER OF PARTICLES/CFM

Particle size [um] Allowable Quantity

0.1 – 0.3 <05

0.3 – 0.5 <03

0.5 – 1.0 <00

> 1.0 <00

Note: “VSLI” Grade is usually half of these levels.

Other Design Considerations - Gases

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House Nitrogen “Carrier Grade”

Subject GAS Content Method of Analysis

Nitrogen 99.999 %

O2 2 ppm Portable O2

CO2 < 1 ppm

CO < 2 ppm

H2 < 2 ppm

H2O 1 ppm Shaw or equivalent

THC (C1-C5) < 1 ppm Flame Ionization GCA

THC <0.5 ppm GCA of Residue in activated charcoal filter that was on the line for 1 hour at approximately 1 LPM flow rate.

ACCEPTABLE NUMBER OF PARTICLES/CFM

Particle size [um] Allowable Quantity

0.1 – 0.3 <10

0.3 – 0.5 <07

0.5 – 1.0 <04

> 1.0 <01

Other Design Considerations - Gases

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DI Water (Liquids in contact with materials)Particle and Contaminant Specs

Deionized Water: Typical quality at point of use to process equipment in a class 100 cleanroom.

Resistivity 18.0 Meg Ohms

TOC less than 50 ppb (Total Organic Carbon)

Residue less than 50 ppb

Bacteria less than 10 per 100ml after 72 hours

Soluble Silica less than 10 ppb

Particles less than 20 per liter at 0.5 micron or less

Sodium less than 0.2 ppb

Potassium less than 0.3 ppb

Chloride less than 0.2 ppb

Bromide less than 0.1 ppb

Nitrate less than 0.1 ppb

Sulfate less than 0.3 ppb

Copper less than 2.0 micrograms per liter

•5 ft/second recirculation flow rate prevents bacteria growth in water.

Other Design Considerations – DI Water

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Cleanliness of Pipe

• Carrier of process gases and fluids– 316 electropolished stainless steel, 316 L electropolished, 304

Stainless or Type L copper – gases.

– PVDF (teflon), polypropylene, or PVC – DI water/chemicals

• Filtration and purification, sterilization – all add cost

• How clean is the plumbing of your process equipment?– Wet hoods

– Wet processors

– Gas manifolds

– These are nearest to the point-of-use

Other Design Considerations - Piping

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• In addition to particle counts, other Room Conditions are also critical

– ESD control

– Temperature

– Humidity

• Cleanliness at the substrate surface during process is critical and may not depend on room abatement.

– Clean process tools/equipment

– Minienvironments- localized fan powered HEPAs, with or without temperature/RH control and robotics.

Other Design Considerations- Environment

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Other Design Considerations - Facility Conditions

• Building– Site plan, available square footage

– Available Square Footage for each intended use

– Area available for support, air handling and utilities

– Available height for cleanroom envelope

• Vibration Issues– Sources such as HVAC equipment, traffic, trains, implanter wheels

– Areas with critical vibration requirements – metrology, lithography, and SEM

– Techniques for abatement

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Other Design Considerations - Facility Conditions

• Electromagnetic Interference and ESD– Sources such as Overhead or underground power lines,

transformers, Light rail systems, bus and truck traffic, heavy doors

– Tools and areas with critical EMI requirements- SEM

– Electrostatic discharge- can attract particles

– Abatement techniques

• “House” Utilities: Clean Dry Air, Nitrogen, DI water– Quality of these also determines process environment

– Particle count/size

– Contaminates

– Dew point of Air

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Other Design Considerations - People Issues

• Number of people working in each area

• Gowning

• Viewing

• Communication

• Supervision

• Maintenance Access

• Security

• Lighting

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Other Design Considerations - Material Handling, Storage of Supplies, Equipment Needs

• Product – within the tool, intrabay, interbay, stockers, MGV, AGV, monorail options

• WIP philosophy-experiment storage

• Standard Mechanical interfaces (SMIF)

• Production Supplies- Maintenance supplies/parts

• Garments and gowning protocol

• Record keeping methods– Notebooks and Pens, Computers

– Documentation- electronic or paper formats

– WIP tracking System – location of terminals

• Tools and toolboxes

• Equipment Staging

• Wipe down areas

• Pump rebuild areas

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Summary

Major steps for designing a cleanroom include determining-

• The product you will make

• The geometries required

• The form factor you will use

• The cleanliness levels needed

• The tool set to support your demand

• The utilities needs (utility matrix)

• The building cross section

• Air management strategy

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Summary

• Clean Class

– Class 10; 100; 1,000; 10,000; 100,000

– Most Costly Decision

• Impacts

– Air Changes and Treatment

– Quantity Filters

– Quality of Filters (ULPA vs. HEPA)

– Types of Construction Materials

– Cost of Ownership

– Understanding the Process and Geometries will help in selecting the appropriate clean class

– Providing the right combination of clean class by area can satisfy user needs and reduce costs.

Photo BayClass 100

Thin FilmsClass 1,000

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Remember to keep the Utility Matrix a Living Document

• The utility matrix you’ve created must continue to be a living document throughout the life of your factory

– Otherwise, you’ve created a utilities snapshot that was outdated almost as soon as you last saved the file on your hard drive

• The benefits of continuing to review and update your utility matrix: You’ve created a database that future process and equipment engineers can use to more accurately design utilities for future fabs

– You can evaluate opportunities for future cost savings based on utility usage (real time data loaded directly into utility matrix database)

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ACKNOWLEDGEMENTS

The author would like to thank the following:

• AIMCAL for the opportunity to make this presentation

• The staff at AGI for their assistance in assembling this document

• You, the audience, for your attention

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Thank You!

Designing a Cleanroom to Accommodate Roll- to-Roll Processing Equipment

Presented by:

Mark StrnadVice President Operations and Engineering

October 7-10, 2007Radisson Fort McDowell ResortScottsdale, Arizona USA

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october 7 -10, 2007 radisson fort mcdowell resort ... · product requirements drive the need for...

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