on the facilities for (ac-) lgad design and fabrication
TRANSCRIPT
on the facilities for (AC-)LGAD design and fabrication
Gabriele Giacomini– September 3rd, 2020
US-Japan meeting
TCAD numerical simulations
Mip @ different X
Current pulses for different X
Qualitatively assessment of LGAD/ACLGAD properties
Other Facilities• PECVD Oxide
& Si3N4, using class1000 clean room in another lab @ BNL
• DI water tank in the basement
• dehumidifier, Pressure Air System on the roof
• External service for ion-implantation
CMP
Laser dicing
Dry etching
Laser Dicing
• Laser Dicing Machine can cut single silicon detector out from the wafer, it can cut any shapes and holes (although not needed for LGAD)
Finish Processed Wafer
Laser Dicing MachineSingle Diced Detector
Packaging & assemblyDiced detector is wire-bonded to the read-out electronics on the PCB
Single Diced Detector
Packaged PIN-Maia Detector
Bench Tests• Electrical tests at the probe-station
select good detectors to be mounted• I-V C-V up to 200V with Keithley
4200SCS
Or…
• We use HP4145B connected to Keithley 2410 to do I-HV And HP4284A connected to Keithley 2410 to do C-HV up to 1000V