Optimal MemoryOptimal Memoryfor Ultrafor Ultra--Thin NBThin NBfor Ultrafor Ultra--Thin NBThin NB

JuJu YeonYeon JungJung

Mobile Forum Taiwan_Seoul 2012

PC Shipment growth is expected to be 7% (`10~15 CAGR)• Laptops will lead, with Ultra Thin NB comprising up to 40% of laptops

PCPC Shipment ForecastShipment Forecast

342342 Desktop

362347

413447

481

(SEC, IDC)

140

342342 Desktop

(’12 YoY -2%↓)

Notebook

(’12 YoY 8%↑)

209

137

227

135

`10 `12`11 `13 `14

(-2%↓)

(3%↑)

Ultra Thin NB

(portion: 9%)20

`15

272312

351

70

108

149

(26%)

(35%)

(43%)

PC GB/SysPC GB/SysPC GB/Sys will grow by 4.4GB in 2012

• Weak consumer demand will have a negative impact on PC contents growth

• PC memory consumption growth will be relatively lower than the past

66%

34%33%

52%

27% 23% 16%27%

21%21%

44%44%

*Source: Samsung

`11 `12 `13 `14`09 `10`05 `06

3.13.1

2.42.4

0.60.6 0.80.8

`07 `08

1.91.91.31.3

3.84.1

3.6

4.54.4

4.3

Desktop

(’12 YoY 12%↑)

Notebook

(’12 YoY 18%↑)

Ultra Thin NB

(21%↑)

(24%↑)

4.0

Client Industry TrendClient Industry Trend

TabletTablet Ultra Thin Notebook Ultra Thin Notebook

Notebook industry trend

Large Screen Large Screen Thin/Zero Client Thin/Zero Client

Desktop industry trend

SmartphoneSmartphone

NotebookNotebook

Ultra Thin Notebook Ultra Thin Notebook

Thinner, Lighter, Longer battery life, Instant on

Client Platform Trend Client Platform Trend Desktop/Notebook platform trend

CPUCPU

Gfx NB MC

CPUCPU

Gfx PCH

CPUCPUGPU MCMC

Conventional Integrated MC Integrated Graphic

PCH

Thin/Zero Thin/Zero ClientClient

Thin/Zero client

CPUCPUGPU MC

One Chip

PCHPCH

Cloud Computing

DesktopDesktop

NotebookNotebook

Notebook Notebook �� Ultra thin Notebook with lower power consumptionUltra thin Notebook with lower power consumption

Thickness

Battery

40-50mm20-30mm

<10mm13-17mm

Storage HDD SSD Stick SSD

MemoryOn boardModule

3 hr5-6 hr

8-9 hr >13 hr

On board

• Shared, Interactive

• Always Connected

• Instant on

PC Era

• Personal, Passive

• Intermittent Connectivity

• Always Plugged-In

• On/Off plug-in

• Limited mobility

Mobile Era Desktop ���� Notebook ���� Ultra Thin NB Smartphone/Tablet���� Mobile Computing

Performance Performance Watt/BandwidthWatt/Bandwidth

Industry Paradigm Shift to MobileIndustry Paradigm Shift to MobileMemory optimization gives differentiated user experiences

Performance Low power

More DensitySmall/Thin

form-factor

Mobile appl.

Increase Display size

Higher resolution

For Fancy & Slim design

Always Connected

Instant On

Multi-tasking

Ultra Thin NB

Connected

Devices

Ultra Thin NB VisionUltra Thin NB VisionThe Explosion of Connected Devices in the Mobile-Era

• The continuous synchronization of content among connected devices is creating

better end-user experiences

Always On, Always Connected

Lowest Standby Power

“Lower STBY” Must Be Required

For Always Connected

Devices (S.P, Tablet, PC)

Tablet

Ultra Thin NB

Smart TV

Smart Phone

CloudLPDDR3

Lowest Standby Power

“AOAC” Must Be Required

For Personal Computing

In Cloud environment

x64

x64

SODIMM

x64

x64

Solder Down DRAM

Conventional Notebook (‘11)Conventional Notebook (‘11)Conventional Notebook (‘11)Conventional Notebook (‘11)

Device Attributes for Device Attributes for Ultra Thin NBUltra Thin NBUltra Thin NB requires different values for components

• New values more concerned than cost itself for low power, thin & light

Ultra Thin NB Ultra Thin NB Ultra Thin NB Ultra Thin NB (‘13)(‘13)(‘13)(‘13)

CPU

CPU

Cheap & CommodityCheap & CommodityCheap & CommodityCheap & Commodity

High Reliability, Low Power, Small, High Reliability, Low Power, Small, High Reliability, Low Power, Small, High Reliability, Low Power, Small, Thin & Light, Customized Thin & Light, Customized Thin & Light, Customized Thin & Light, Customized

Accessibility Longer Battery LifeThin & Light

HDDThick BatteryFan

Thin - Wide Battery

SSDThin Fan

The The Ultra ThUltra Thin NB Experiencein NB ExperienceProviding the Ultra Thin NB experience requires a new paradigm

– Low Power + Thin & Light

> 25mm

< 18mm

3 days stand-by

On-boardOn-board

SSDSSD

Thin

&

Light

Longer

Battery LPDDR3DDR3 x16

Low

Id

le P

ow

er

Ultra Thin

3 days stand-by

>13 days stand-by

> 30sec wake up time from S4

< 7sec

Battery

Life

Responsive

-ness

HDD SSD

Pe

rfo

rma

nce

LPDDR3DDR3 x16

Low

Id

le P

ow

er

5mW

5K

72K

HDD SSD

Ultra Thin

Ultra Thin

LPDDR3 will be the right memory solution for Ultra Thin NB

Samsung DRAM Solution for Samsung DRAM Solution for Ultra Thin NB Ultra Thin NB

DDR3 DDR3

DDR3 LPDDR3 x16/32 LPDDR3 x16/32

DDR3 DDR3 DDR3

Performance

Ultra Thin NB

Basic

2012 2013 2014

LPDDR3 x32 LPDDR3 x16 DDR3L

Speed 1600Mbps = 1600Mbps ~

DDR3/4

PerformanceSpeed 1600Mbps = 1600Mbps ~

B/W 12.8GB/s = 12.8GB/s ~

Power

Consumption

Standby 9.6mW ���� 86.4mW

Operating 1131mW ���� 1148mW

Power

efficiency88.3mW/GBps ���� 89.6mW/GBps

PKG Type Mono/POP/eMCP Mono/DDP Mono/DDP

� Condition for Power Consumption :

• Current : Using typical value with Room Temperature

• Power (Estimated) : 1. Standby : 2-ch 4GB 4chip (x16 2CS DDP based) (IDD6 100%) @ LPDDR3 x32 / 2-ch 4GB 8chip (IDD6 100%) @ LPDDR3 x16, DDR3L

2. Operating : 2-ch 4GB , Utilization 60% , Read 70%/ Write 30%

•

Product Config. Density ’11 ’12 ‘13

2GB

Samsung Ultra Thin NB Samsung Ultra Thin NB Memory Memory Solution Solution with with DDR3LDDR3L

Configuration for various capacity

4Gb x16 … 4Gb x16

4Gb Comp. 1CH x644ea

2Gb x8 … 2Gb x8

2Gb Comp. 1CH x648ea

2Gb Comp. 2CH x648ea

Support high capacity & low power solution with DDR3L 4Gb x16

DDR3L x64

4GB

8GB

4Gb x8 … 4Gb x8

4Gb Comp. 1CH x648ea

4Gb x16 … 4Gb x16

4Gb Comp. 2CH x648ea

8ea

2Gb x16 … 2Gb x16

4Gb x8 … 4Gb x8

4Gb Comp. 2CH x6416ea

LPDDR3 LPDDR3

4Gb x16 … 4Gb x16

4Gb Comp. 2CH 2Rank x6416ea

Samsung Memory Solution with LPDDR3Samsung Memory Solution with LPDDR3Memory Configuration Summary

• LPDDR3 x32 is the best solution for 4-chip configuration in 2/4/8GB

• LPDDR3 x16 is the best solution for 8-chip configuration in 4/8GB

Conf. Index 2GB 4GB 8GB Note

4

Chip

1 Rank

Operation

Ch 2 2 2

Rank/Ch 1 2 2

x64 x32

x32

x64 x32

x32

x16

x16

x16

x16

x64

x64

x64

Rank/Ch 1 2 2

Op.Die*/(Rank/Ch) 2 2 4

PKG Mono DDP QDP

8

Chip

1 Rank

Operation

Ch 1 2 2

Rank/Ch 1 1 2

Op.Die/(Rank/Ch) 4 4 4

PKG Mono Mono DDP

x64

x16x16

x16x16

x16x16

x16x16

x64

x16x16

x16x16

x16x16

x16x16

x64

x16x16

x16x16

x16x16

x16

*Op.Die :Operating Die

x64

x64

LPDDR3 x16 ProposalLPDDR3 x16 Proposal

Justification of LPDDR3 x16 for Ultra Thin NB• Very low power x16 solution dedicated to Ultra Thin NB & compatible with LPDDR3

Standby Power Cost Performance Granularity Product Lineup

LPDDR3x16

Low standby Power , enough to meet AOAC requirement

Cheaper than LPDDR3 x32 :Smaller Chipsize by x16 org.

Same performance as DDR3L

Higher depth over x32 -> More memory for notebook

Simplify product lineup

LPDDR3 x32

LPDDR3 x16

DDR3L

Win8 AOAC

requirement

Up to 1600LP3 x32

DDR3L *

DDR3L

LPDDR3 x16

x2

x64 base

DDR3L * : DDR3L with low IDD6

DRAM Solution for Each ApplicationDRAM Solution for Each ApplicationLPDDR3 x16 is focusing on Ultra Thin NB application

• Tablet market will be supported from the end of ‘13 with 2xnm Technology

LPDDR3 4Gb x32

LPDDR3 8Gb x32 DDP

1CH, 32-bit,

PoPLPDDR3 x32 MCP

2CH, 64-bit,

PoP & Mono

LPDDR3 x16 /32

PoP & Mono.

DDR3L

Smart

Phone

Tablet

[Configuration] [Majority Solution]

LPDDR3 4Gb x16

LPDDR3 8Gb x16 DDP

DDR3L 4Gb x16

DDR3L SODIMM

PoP & MonoDDR3L

2CH, 64-bit,

Mono &

SODIMM

LPDDR3 x16/32

DDR3L x16

2CH, 64-bit,

Mono &

SODIMM

DDR3L x16

DDR3L SODIMM

Ultra

Thin

Note-

PC

’10 ’11 ’12 ‘13 ‘14 ‘15

Interface

VDD/VDDQ

LPDDR2 1.2V/1.2VLPDDR2 1.2V/1.2V LPDDR3 1.2V/1.2VLPDDR3 1.2V/1.2V LPDDR4LPDDR4

Bring up right technology at right on time• LP2-800 (‘10) ���� LP3-1600(‘12) ���� LP4-3200(‘14)

Mobile DRAM Technology TrendMobile DRAM Technology Trend

WIO and WIO2WIO and WIO2VDD/VDDQ

Speed

Density

PKG

2Gb2Gb 4Gb4Gb 8Gb8Gb

Up to 4 die stacks : 1.0 mm ���� 0.9mm and belowUp to 4 die stacks : 1.0 mm ���� 0.9mm and below

6.4GB/s6.4GB/s 8.5GB/s8.5GB/s 12.8GB/s 12.8GB/s 25.6GB/s+25.6GB/s+

WIO and WIO2WIO and WIO2

1XMDDR(1.8V)

LP2(1.2V)

Operating power reduction continued while standby remained same

• Operating power (Watt/BW) reduction with CAGR -28%

• Standby power (Watt/Gb) to be maintained at best

Operating power

(Watt/Bandwidth)

Mobile DRAM Power TrendMobile DRAM Power Trend

‘10 ‘15

Standby power

(Watt/Gb )

0.5X

CAGR -28%LP2(1.2V)

LP3(1.2V)

Wide IO

‘11 ‘12 ‘13 ‘14

Thank YouThank YouThank YouThank You