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© 2016 Inventec Corp. K888G3 series servers target at GPU accelerated and high performance computing markets with 24 DIMM capacity (up to 1.5TB with 64GB DIMMs) and expandability up to 4 GPGPU cards, optimized for great density and expandability in 2U enclosure. The series are designed for high performance computing, applicable in fields such as life sciences, engineering analysis, molecular dynamics, medical diagnosis, electronic design automation, financial analysis, fluid mechanics, geological sciences, graphic processing, among other applications that demand greater floating-point operation capability. The series present, High Performance: Compared with previous Romley platform, dual Intel ® E5-2600v3 series processor solutions are based on Intel ® 22nm process technology and yield up to 33% improved performance, with power enhancement, virtualization enhancement, security enhancement and DDR4 support. The latest v4 platform is further enhanced by Intel ® 14nm process technology in 50% smaller package, highlighting up to even 47% faster, 27% average generational performance gain across key industry-standard workloads and applications, moving steps forward to better virtualization efficiency, smarter resource orchestration and more enhanced protection of systems and data. Great Density and Expandability: Adopting Intel ® C612 chipset, supporting dual CPU of E5-2600v3/v4 family and up to 1.5TB of DDR4 memory. K888G3 series host 4x PCIe x16 lanes, enabling expansion of up to four GPGPU cards. Flexible Network Configuration: By offering a variety of network choices through OCP NIC (Network Interface Controller) mezzanine card options, ranging from 1G Ethernet to 10G Ethernet (optical or Base-T), the high speed performance and IO flexibility are realized, catering to suitable demands of different application procedures. Density Performance K888G3 HPC/GPU- optimized Server 4x PCIe x16 lanes deliver great expandability

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Page 1: optimized Server - Inventecebg.inventec.com/productData/K888G3/download/2016DS_EN_K888G… · enhanced protection of systems and data. ... (optical or Base-T), ... Positioning GPU

© 2016 Inventec Corp.

K888G3 series servers target at GPU accelerated and high performance computing markets with 24 DIMM capacity (up to 1.5TB with 64GB DIMMs) and expandability up to 4 GPGPU cards, optimized for great density and expandability in 2U enclosure. The series are designed for high performance computing, applicable in fields such as life sciences, engineering analysis, molecular dynamics, medical diagnosis, electronic design automation, financial analysis, fluid mechanics, geological sciences, graphic processing, among other applications that demand greater floating-point operation capability. The series present, H i g h P e r f o r m a n c e :   Compared wi th prev ious Romley platform, dual Intel® E5-2600v3 series processor solutions are based on Intel® 22nm process technology and yield up to 33% improved performance, with power enhancement, virtualization enhancement, security enhancement and DDR4 support. The latest v4 platform is further enhanced by Intel® 14nm process technology in 50% smaller package, highlighting up to even 47% faster, 27% average generational performance gain across key industry-standard workloads and applications, moving steps forward to better virtualization efficiency, smarter resource orchestration and more enhanced protection of systems and data.

Great Density and Expandability: Adopting Intel® C612 chipset, supporting dual CPU of E5-2600v3/v4 family and up to 1.5TB of DDR4 memory. K888G3 series host 4x PCIe x16 lanes, enabling expansion of up to four GPGPU cards. Flexible Network Configuration: By offering a variety of network choices through OCP NIC (Network Interface Controller) mezzanine card options, ranging from 1G Ethernet to 10G Ethernet (optical or Base-T), the high speed performance and IO flexibility are realized, catering to suitable demands of different application procedures.

Density

Performance

K888G3 HPC/GPU-optimized Server

4x PCIe x16 lanes deliver great expandability

Page 2: optimized Server - Inventecebg.inventec.com/productData/K888G3/download/2016DS_EN_K888G… · enhanced protection of systems and data. ... (optical or Base-T), ... Positioning GPU

© 2016 Inventec Corp.© 2016 Inventec Corp.

Model Name K888G3 K888G3CPositioning GPU Accelerated Computing High Performance ComputingForm Factor 2U1N rack mountProcessor Dual Socket

Intel® Xeon® Processor E5-2600 v3/v4 Family Memory Slot 24x DDR4 DIMM slotChipset Intel® C612Storage Controller

Onboard: Intel® C612: 2x SATA 6Gb/s port; SATA RAID 0,1,5,10

PCH SATA: 10 x SATA 6Gb/s port; Intel® RST RAID 0/1/10/5 (AHCI mode); supporting SATADOM

ASM1061 SATA:4 x SATA 6Gb/s port; Intel® RST RAID 0,1,5,10

Inventec storage mezz card options:

Option1: SAS3-3008-8i (12Gb/s)Option2: SAS3-3216-16i (12Gb/s)Option3: SAS3-3224-24i (12Gb/s)

Network Controller

Onboard: Dedicated 10/100/1000 management port Inventec network OCP mezz card options:

Option1: NIC-I350-1GDC Option2: NIC-I599-10GD

Option3: NIC-I540-10GDCExpansion Slot 1x PCIe Gen3 x8 storage mezz slot

1x PCIe Gen3 x8 network OCP mezz slot

Interposer board slots:4x PCIe Gen3 x16 (for GPU card)

1x PCIe Gen3 x8 storage mezz slot 1x PCIe Gen3 x8 network OCP mezz slot

Standard PCIe slots:4x PCIe Gen3 x16

Disk Drive Bay Front primary bays: Option1: 24x 2.5" SAS3-12Gb/s hot-plug drive Option2: 12x 3.5" SAS3-12Gb/s hot-plug drive

Rear OS SSD bays:2x 2.5" 7mm SATA-6Gb/s hot-plug solid state drive

Front primary bays: Option1: 24x 2.5" SAS3-12Gb/s hot-plug drive Option2: 12x 3.5" SAS3-12Gb/s hot-plug drive

System Management

IPMI 2.0 compliant

TPM 1.2Power Supply 1600W (220V) Platinum

1+1 redundancy 800W (220V) Platinum

1+1 redundancy

K888G3 supports up to 4 GPGPU cards

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers. Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party.

Inventec logos are trademarks or registered trademarks of Inventec Corporation.Intel, the Intel logo, Xeon, the Xeon inside, Intel Atom and Intel Atom Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.All trademarks and logos are the properties of their representative holders.

ABOUT INVENTECInventec Enterprise Business Group (EBG) was established in 1988 and has been focusing on the design and manufacturing of server systems. Inventec EBG is the key server system supplier of the global branding clients.

Copyright ©2016 Inventec Corp. All rights reserved. 170209

Inventec Corporation (TAO)No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, TaiwanTel: 886-3-390-0000Fax: 886-3-376-2370Email: [email protected]