overview - dbhitek.com hitek company profile... · tof : spad (adas) global shutter development...
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Overview
Established 1997
Revenue US$600M(2017)
Number of Employees 1,940(2017)
Business Areas System IC
Technology 90nm~0.35um
Capacity 116,000wfs/month(200mm)
History
Facilities
Fab1(Bucheon) Fab2(Sangwoo)
Bucheon
Sangwoo
55 60 64 67
45 52
52 52
2015 2016 2017 2018(P)
Fab1 Fab2
Capacity
(Unit: Kwfs/month)
Global Networks
2010s, Appearance of new technology and applications
with the wave of 4th industrial revolution
2016, The first statement about 4th industrial revolution
in Davos Forum
1970s, 3rd industrial revolution (Knowledge and information)
1990s, PC commercialization
Late 2000s, Smartphone commercialization
[IoT]
[AI]
[Big Data]
[Smart Factory]
[AR/ VR]
[Wearable] [3D printing]
[Drone]
[Robot]
[Smart Car]
[FinTech] [Music]
[Smartphone]
[Game] [Education]
[Movie]
[internet]
[Finance]
Knowledge and information society
with smartphone
Business Strategy Industry Environment
Hyper-connected and super intelligent
society in 4th industrial revolution
429
461 461 476
489
2017 2018 2019 2020 2021
61
66
71
78
84
2017 2018 2019 2020 2021
(Unit: $B)
(Source: IHS ‘18.1Q)
(Unit: $B)
Business Strategy Industry Environment
Technology
System Process
Experience • Various Technology Platform
• Competitive Power &
Sensor Technology
• Technology Innovation
• Full PDK Support
• Competitive Cycle Time
• Superior Quality Control System
• 20years of Foundry Experience
• Partnership with Customers
• Track Record of Success
• Improvement Processes
• Customer Relationship
Management Processes
Foundry Value Proposition
Key Process Portfolio
eFlash
High Voltage CMOS
Applications
AUDIO
TABLET
AUTOMOTIVE
WEARABLE SMARTPHONE DATA SERVER
DRONE
AR/ VR
TV
SECURITY AI SPEAKER
NOTEBOOK
IoT
Analog/ Power
Mobile Security Medical Industrial
PMIC Motor Driver IC Wireless Charger DC-DC Converter
eFlash Mixed-Signal
TSC MCU
UHD LDI OLED TDDI
Audio Codec High Precision ADC Fingerprint Sensor WLAN CMOS PA Microdisplay
CIS High Voltage
CMOS
LV (≤40V)
MV (≤45V)
HV (≤100V)
UHV (Non-Epi)
Development Planning
AN180(Non-Epi)
BD180LV(Gen2) BD180LVA(Gen3)
AN180LC BD180LV(Fab2)
BD180LVA(Fab2)
BD130LV(Gen1)
BD180LV(Gen4)
BD130LV(Gen2)
BD180MV
BD350
BD180X BD180XH BD130XH
UHV700 UHV700(Gen2)
BD180XH(Gen2)
BD180SOI
Technology Roadmap
0.18um
- Stitching
0.13/
0.11um
- Stitching
90nm
IL18SH X-ray, Line sensor
IL13SI
IL13SJ IL13SK
IL09SA
ToF : PPD (Mobile)
ToF : SPAD (ADAS)
Global Shutter
Development Planning
Technology Roadmap
0.18um
0.11um
0.11um
RF Front End
90nm
0.13um
eFlash
MS180
HP180 Low noise
MS18BC Low noise
MS18BD Low cost, Low noise
TS11SB Low noise
RF11SB Low noise
TS11SC Low noise/ULL
RF11SC(HRS)
MS18BE Low cost, Low noise
RF11SD & SE(HRS) RS13SA(SOI) RS13SA(SOI)
TS09SA Low noise
SE13SA TE13SB
Development Planning
Technology Roadmap
TV
IT
Mobile
LD350 LD160 LD150 LD130
LD180 LD160
LD110 LD110
LD160 LD110
SJ MOSFET(Gen2) 600V/650V/700V
SJ MOSFET(Gen3) 600V/650V
IGBT 1200V Automotive
Microphone(Gen4) Microphone(Gen1) Microphone(Gen2) Microphone(Gen3)
Micro Heater
Development Planning
Technology Roadmap
Partner Companies
Design Infra Application Specific IP
Reference Design Flow
Design Environment
YourFabTM Service
ShuttleChipTM Service
0.11um
0.11um
0.13um
0.15 ~ 0.18um
Tape-out start date
* The shuttle schedule might be changed or canceled if the minimum number of paid seat has not been filled. * Schedule for some ShuttleChip may change due to un-foreseen circumstances, so please contact your account manager for updated schedule. * DB check will be cleared within 7 days before tape-out.
Certifications