overview of oral presentation sessions · 2017. 8. 4. · outstanding student abroad in 2007,...
TRANSCRIPT
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OVERVIEW OF ORAL PRESENTATION SESSIONS
Friday, August 18, 2017
Parallel Sessions
Room A Room B Room C Room D Room E Room F Room G
Oral Session 1
(Session A-1)
Oral Session 2
(Session B-1)
Oral Session 3
(Session B-5)
Oral Session 4
(Session D-1)
Oral Session 5
(Session F-1)
Oral Session 6
(Session G-1)
Oral Session 7
(Session H-1)
Chair Jintang Shang Rong Sun Qian Wang Hua Lu Paul Wang Lei Liu CH. Chew
08:30 – 09:55 Keynote 01:
Yuan Lu
Keynote 02:
Changqing Liu
Keynote 03:
Zhi-Quan Liu
Keynote 04:
Chenxi Wang
Keynote 05:
Chunyan Yin
Keynote 06:
Asushi Okuno
Keynote 07:
Boping Wu
43,72,98 11,16,102 146,153,156 116,273,225 113,123,203 18,266,169 44, 299,70
09:55 – 10:50 Poster Session 1 & Coffee Break
Oral Session 8
(Session A-2)
Oral Session 9
(Session B-2)
Oral Session 10
(Session B-6)
Oral Session 11
(Session B-9 &F-5)
Oral Session 12
(Session F-2)
Oral Session 13
(Session G-2& H-3 & E-1)
Oral Session 14
(Session H-2)
Chair Yunhui Mei Changqing Liu Zhi-Quan Liu Liangliang Li Chunyan Yin Fei Xiao Boping Wu
10:50 – 12:10 293, 107,134,154
Keynote 08:
Rong Sun 159,168,177,187 280, 322,348,149 127,142,224,320 94,199,88,360
Keynote 9:
CH. Chew
20,45,103 75,65,209
12:10 – 13:30 Lunch: Sunlight Restaurant in VIP Building & Banquet Hall in Catering Building
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OVERVIEW OF ORAL PRESENTATION SESSIONS (Cont.)
Friday, August 18, 2017
Parallel Sessions
Room A Room B Room C Room D Room E Room F Room G
Oral Session 15
(Session A-3& D-2)
Oral Session 16
(Session B-3)
Oral Session 17
(Session B-7)
Oral Session 18
(Session I-1)
Oral Session 19
(Session F-3)
Oral Session 20
(Session C-1)
Oral Session 21
(Session C-3)
Chair Hu He Daoguo Yang Dongyan Ding Ran He Hongjun Ji Hongtao Chen Chunjin Hang
13:30 – 14:50 250,326,128,230 47,51,87,104 167,189,222,265 288,180,234,89 232,301,335,364 186,155,253,260 86,172,302,201
14:50 – 15:50 Poster Session 2 & Coffee Break
Oral Session 22
(Session D-3)
Oral Session 23
(Session B-4)
Oral Session 24
(Session B-8)
Oral Session 25
(Session I-2)
Oral Session 26
(Session F-4)
Oral Session 27
(Session C-2)
Oral Session 28
(Session C-4)
Chair Yuan Lu Wei Liu Rong An Wenhua Yang Fengwen Mu Yujie Li Chenxi Wang
15:50 – 17:10 SP1, 66,192,278 92,93,99,140 197,231,276,282 330,233,297,151 275,258,100,179 81,109,213,96 90,36,175,256
17:30 – 20:30 Dinner: Sunlight Restaurant on 1st floor of the VIP Building
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Introduction of Invited Session Keynotes Speakers
Dr. Yuan Lu, Institute of Microelectronics, Chinese Academy of Sciences,
China
Yuan Lu: Technical Director, National Center for Advanced Packaging (NCAP-CHINA);
Professor, Institute of Microelectronics, Chinese Academy of Sciences. Dr. Lu is a National
Distinguished Expert (“The Thousand Talents Plan”). Dr. Lu got his PhD from Wayne State
University (US) in 2006. Dr. Lu has been with Institute of Microelectronics, Chinese Academy
of Sciences and working on 3D microelectronics packaging since 2012. He joined
NCAP-CHINA in 2013. Before getting back to China, Dr. Lu had worked for various US
semiconductor companies (Freescale Semiconductor (now NXP), FlipChip International,
Lucent Technologies, Digital Semiconductor, AVX, General Motors, etc) for more than 20
years. In recent 5 years, Dr. Lu has been working on 3D semiconductor device integration, MEMS/IC integration,
ultra-fine pitch IC interconnect, and high speed OE/IC integration, etc. He has applied more than 50 patents.
Prof. Changqing Liu, Loughborough University, UK
Changqing Liu received his BEng from Nanjing University of Science and Technology in
1985, and his MSc from the Institute of Metals Research of Chinese Academy of Sciences in
1988. After five years appointment as an assistant professor at the Institute of Metals Research,
he secured an Overseas Research Scholarship (ORS-CVCP) and moved to UK in 1993 reading
his PhD at Hull University. From 1997 he was employed as postdoctoral research fellow at
Birmingham University (UK) for three years. Since 2000 he joined the Wolfson School of
Mechanical, Electrical and Manufacturing Engineering at Loughborough University (UK) as
research fellow, where he became Professor of Electronics Manufacture from January 2011,
following his appointment as Lecturer in 2005, Senior Lecturer in 2007. His current research focuses on advanced
materials and innovative manufacturing to enable 3D multi-material heterogeneous embodiment, integration and
miniaturisation of future generation multifunctional devices. He has published over 242 academic papers, and
currently a Fellow of Higher Education Academy, UK, and a Senior IEEE member. He has been active in the field of
electronics integration and manufacturing as a regular participant and contributor as well as technical committee
member to the IEEE CPMT conferences (e.g. ECTC, ESTC, EPTC, EMPC), and previously served as Chair of the
Interconnections Committee of ECTC (USA) and Chair of Packaging Materials & Processes Committee of ICEPT
(China).
Prof. Zhi-Quan Liu, Institute of Metal Research (IMR), China
Professor Zhi-Quan Liu is the Group Leader of Microelectronic Interconnect Materials at
Institute of Metal Research (IMR), Chinese Academy of Sciences (CAS). After received a
doctor’s degree in April 2000, He worked in Japan (NIMS) for more than 6 years and then
joined in IMR as a Hundred Talent Scholar of CAS since 2017. His research expertise spans
across property related microstructure characterization and phase transformation, focusing on
microstructure and reliability of interconnect materials under thermal, mechanical and
electrical fields. He has been authored and co-authored more than 100 international
peer-reviewed journal papers, which were published in Nature, Science, Physical Review Letters, Acta Materialia,
Nanotechnology, etc.
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Dr. Chenxi Wang, Harbin Institute of Technology, China
Dr. Chenxi Wang received the B.E. and M.E. degrees in materials science and engineering
from Harbin Institute of Technology, China, in 2002 and 2004 respectively and the Ph.D
degree in precision engineering, The University of Tokyo in 2009. From 2009 to 2011, he
received postdoctoral fellowship awarded by Japan Society for the Promotion of Science
(JSPS) at The University of Tokyo. From 2011 to 2014, he worked as a Senior Researcher at
the Department of Applied Chemistry, The University of Tokyo. He is currently working as an
Associate Professor at the School of materials science and engineering, Harbin Institute of
Technology from 2014. His research involved microsystem integration and packaging,
low-temperature wafer bonding, high-precision alignment, micro/nanofabrication, micro/nanofluidic devices. He has
co-authored more than 60 papers in international journals and conferences, and holds 2 Japan patents and 8 China
patents (pending). He received many awards, including the Best Paper Awards of international conferences on
electronic packaging technology (ICEPT) in 2003, 2007, 2010 and 2011, Chinese Government Award for
Outstanding Student Abroad in 2007, IEEE-CPMT travel award for ECTC 2009, Young award of IEEE CPMT
Symposium Japan 2010, and the 2010 Dean Award of School of Engineering, The University of Tokyo, Best
Presentation Award of 2nd Advanced Welding & Joining Technology Conference in 2011. He is a member of IEEE
and Electrochemical society (ECS).
Dr. Chunyan Yin, University of Greenwich, UK
Chunyan Yin received her Bachelor and Master Degrees in material engineering from Harbin
Institute of Technology, China in 1999 and 2001, and her PhD degree in computational science
and engineering from University of Greenwich, UK in 2006. She joined University of
Greenwich as a PhD research student in 2002, and worked as a research fellow since 2007 and
a lecturer since 2013. Prior to this, she worked at City University of Hong Kong as a research
assistant. Dr Yin's main research interests are in thermo-mechanical modelling,
physics-of-failure analysis, prognostic and reliability assessment. She has authored or
co-authored over 50 publications in these areas.
Dr. Atsushi Okuno, Green Planets CO.,LTD, Japan
Atsushi Okuno obtained master degrees in Kansai University with Plastic materials such as
epoxy resin in Osaka,Japan on 1969. Assistant professor in Kansai University. He joined
SANYU REC CO.,LTD in 1959. He developed electronic insulating materials, such as
semiconductor, transformation, LED, and capacitor. He is senior member of IEEE in 1995. He
received the best paper at ISEPT with IC Packaging. He has been R&D Center Executive
director in Fudan University. He received the best paper at ISPET with LED Packaging in
2003. He is Vice President in Japan LED Lighting association in 2004. He has been to CEO of
SANYU REC CO.,LTD in 2007. He has been R&D Center Executive Director in Tongji
University in 2009. Now, He is CEO of Green Planets CO.,LTD. His current research includes LED, Semiconductor,
insulating materials. He is vice president of Japan and China Friendship Association from 2015.
Dr. Boping Wu, HuaWei Central Research Institute, China
Boping Wu (S’04-M’10-SMIEEE’15) received the B.Eng. (Dean's Honor) from the City
University of Hong Kong in 2005, and the M.S. and Ph.D. from the University of Washington,
Seattle, in 2007 and 2010, respectively.
Presently, he is a Principal Researcher at HuaWei Central Research Institute. Prior to that,
he is a System Architect at Intel Corporation, working on various SoC core products and different high speed interfaces. He has extensive industry experiences of technology
development including 2004 at Philips (now NXP) and 2007 at IBM T.J. Watson Center. In
2008-09, he was a Lecturer at the University of Washington, teaching Microwave Engineering
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and Computation Electromagnetics. He has published 16 research articles in refereed journals, presented over 40
technical papers at international conferences, and awarded 4 US patents. His research interests include signal
integrity, power delivery, 3D packaging, heterogeneous integration, microelectronics modeling, simulation and
characterization.
Dr. Rong Sun, Shenzhen Institutes of Advanced Technology, Chinese
Academy of Sciences, China
Dr. Rong Sun joined Shenzhen Institutes of Advanced Technology,Chinese Academy of
Sciences (SIAT, CAS), in 2006. Due to her outstanding performance and contribution, she was
appointed as deputy director of Shenzhen Institute of Advanced Integration Technology, one of
the branch institutes of SIAT. She also acts as the executive director of Center for Advanced
Materials, which is part of National Engineering Laboratory for Packaging Technology of
High-Density Integrated Circuit. As a renowned researcher in electronic materials area, her
current research interest focuses on advanced electronic packaging materials, embedded
electronic components, controllable nano-particles, phase-change materials, energy storage
materials, etc. Dr. Sun has been involved in more than 40 national or provincial major research programs as principle
investigator or core member, which include 02 Special National Grand Science-Technology Project of China,
Natural Science Foundation of China, Technology Development Project granted by the Department of Science and
Technology of Guangdong province, Major Project for Basic Research and Industry Development granted by
Shenzhen City, etc. Up to now, Dr. Sun has published one scientific monograph and more than 120 articles in the
international academic journals, with 50 patents applied for. As a reward for her profound work, Dr. Sun is
authorized for special government allowance granted by the State Council of China, and also elected as member of
Shenzhen Double-hundred Plan, which is an exceptional honor for those who have great contribution to Shenzhen
development.
Chee-Hiong Chew, ON Semiconductor, Malaysia
Chee-Hiong Chew received Bachelor of Engineering degree with 1st Class Honors from
University of Technology, Malaysia and best final year engineering student award from IEM
in 1989. He received MBA from Herriot Watts University in 1998. Currently, he is Senior
Director of Package Development for ON Semiconductor Malaysia, Vietnam, China and small
team in Munich.
He started his career as a development engineer with Motorola Semiconductor Sector. He is
pioneer to establish the packaging design group in Motorola Seremban in 1995. In 1997, He
was awarded Motorola Privileged Scientific and Technology Society Engineering Award for
his leadership and Motorola Six Sigma Black Belt award. To date, he owns 15 patents.He started few new innovative
platforms for ON Semiconductor like panel platform PIM, Wafer Level Micro Packaging and LLGA technology.
In early 2002, he has been working closely with Professor Seeta to startup CPMT chapter in Malaysia. He is
CPMT Chair for Malaysia Chapter for the year 2005 and 2006. He startup 1st IEMT conference in Malaysia with
industry colleagues and support from CPMT Santa Clara in 2006. He continues serve as key committee/ advisor for
EMAP, IMPACT and IEMT conferences. He also participates in strategic discussion to growth Malaysia R&D
organized by Ministry of Science and Technology Malaysia and university collaboration programs.
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ORAL SESSIONS Note: Only the affiliation information of the first author is provided due to the space constraints.
Session 1: Advanced Packaging
Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room A Chair Jintang Shang
Keynote-01 8:30-8:55 Advanced Memory Fabrication Technology Based on 3D FOWLP
Yuan Lu Institute of Microelectronics, Chinese Academy of Sciences, China
043 8:55-9:15
A Study on a Simplified Liquid Cooling System
with a Pump Serving as Cold Plate Falong Liu, Bin Duan, Xingjian Yu, Ruikang Wu and Xiaobing Luo Huazhong University of Science and Technology , China
072 9:15-9:35 Package & Board Level Reliability Study of
0.35mm Fine Pitch Wafer Level Package
Peng Sun, Jun Liu, Cheng Xu and Liqiang Cao
The National Center for Advanced Packaging, China
098 9:35-09:55 Formation mechanism and reliability of Cu6Sn5
textures formed in-between liquid Sn and
(111)/(001) Cu single crystals
Shun Yao, Zhihao Zhang, Huijun Cao, Xuelin Wang
and Shihua Yang
Xiamen University, China
Session2: Packaging Materials & Processes
Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room B Chair Rong Sun
Keynote-02 8:30-8:55 Electronics manufacture for harsh, severe and extreme environments: materials, processes and interfacial behaviour
Changqing Liu Loughborough University, UK
011 8:55-9:15
Pb-free silver pastes with SnO-B2O3 glass frits for
crystalline silicon solar cells
Jiachu Jiang, Changli Li, Yue He, Jinquan Wei and
Liangliang Li
Tsinghua University, China
016 9:15-9:35
Effect of Thermal Cycling on Tensile Behaviour of
SAC305 Solder
Xu Long, Yao Yao, Yanpei Wu, Weijuan Xia and
Lianfeng Ren
Northwestern Polytechnical University, China
102 9:35-09:55
Metallization of diamond/Al composite surface
with Ni-P coating
Qi-Yuan Shi, Di Wu, Ding-rui Ni, Dong Wang, and
Zhi-Quan Liu
Institute of Metal Research, Chinese Academy of
Sciences, China
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Session 3: Packaging Materials & Processes Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room C Chair Qian Wang
Keynote-03 8:30-8:55 Electrodeposition of nanotwinned copper film as under bump metallization
Zhi-Quan Liu Institute of Metal Research, Chinese Academy of Sciences, China
146 8:55-9:15 Microstructure and Intermetallic Compounds in Sn-3Ag-3Bi-3In solder joints on Cu Matrix Peng Li, Jing Han, Yan Wang, Fu Guo, Limin Ma and Yishu Wang Beijing University of Technology, China
153 9:15-9:35 Fabrication and Thermal Conduction Mechanism of Epoxy/Modified SiCNP Polymer Composites Yun Huang, Xiaoliang Zeng, Rong Sun, Jian-Bin Xu and Ching-Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
156 9:35-09:55 The evaluation of mechanical properties of Sn58BiXTi solder by tensile test Shiqi Zhou, Xiangdong Liu, Omid Mokhtari and Hiroshi Nishikawa Osaka University, Japan
Session 4: Interconnect technologies Date Friday, August 13, 2017 Time 8:30 AM~09:55 AM Venue Room D Chair Hua Lu
Keynote-04 8:30-8:55 Room-Temperature Wafer Direct Bonding Using a One-Step Fluorinated Plasma Surface Activation
Chenxi Wang
Harbin Institute of Technology, China
116 8:55-9:15 Research of Via about Signal integrity Facing Complete Transmission Path Genxin Huang, Chunyue Huang, Lishuai Han, Rui Yin, Tianming Li, Ying Liang and Liangkun Lu Guilin University of Electronic Technology, China
273 9:15-9:35 Rapid Formation of Intermetallic Joints with Sn/Metal Composite Alloys by Ultrasonic-assisted Soldering for High-temperature Chip Attachment Shu Ma, Hongjun Ji and Junbo Zhou Harbin Institute of Technology (Shenzhen), China
225 9:35-09:55 Simulation of the temperature field for bonding IGBT chip and DBC substrate using Al/Ni self-propagating foil Yuyan Xiang, Fengshun Wu, Zheng Zhou, Liping Mo and Hui Liu Huazhong University of Science and Technology, China
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Session 5: Quality & Reliability Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room E Chair Paul Wang
Keynote-05 8:30-8:55 Modelling the Impact of Conformal Coating Penetration on QFN Reliability
Chunyan Yin Greenwich University, UK
113 8:55-9:15 Microstructures and properties of Bi-11Ag solder doped with small amounts of Sn D. Li and Limeng Yin Chongqing University of Science and Technology, China
123 9:15-9:35 The Effect of Voids at the Cu3Sn/Cu Interface on the Failure Behavior of the Cu/Sn63Pb37 Solder Joints under High-speed Shear Loading Qi Lin, Li Hailong and Wang Chunqing Beijing Institute of Space Mechanics & Electricity, China
203 9:35-09:55 Study on the Factors which Affecting the Conductive Anodic Filament Reliability for Packing Substrate Chaohui Hu China Electronic Product Reliability and Environmental Testing Research Institute, China
Session 6: Solid State Lighting Packaging Integration Date Friday, August 13, 2017 Time 8:30 AM~09:55 AM Venue Room F Chair Lei Liu
Keynote-06 8:30-8:55 Unique Packaging Technology of High Bright Blue LED, UV LED and Micro LED Using VPES (Vacuum Printing Systems)
Asushi Okuno Green Planets Co. Ltd., Japan
018 8:55-9:15 White light-emitting diodes with enhanced luminous efficiency and high color rendering using separated quantum dots@silica/phosphor structure Bin Xie, Yanhua Cheng, Xingjian Yu, Weicheng Shu, Xiaobing Luo, Junjie Hao and Kai Wang Huazhong University of Science and Technology, China
266 9:15-9:35 Effect of Chips Surface Morphology on Optical Performance of Remote and Conformal Phosphor-converted Light-emitting Diodes Jiasheng Li, Caiman Yan, Dong Yuan, Zongtao Li, Binhai Yu and Yong Tang South China University of Technology, China
169 9:35-09:55 The degradation behaviors of white LEDs under highly accelerated stress testing (HAST) Bing Yan, Dongdong Teng, Lilin Liu and Gang Wang Sun Vat-sen University,China
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Session 7: High-speed & High-frequency and Microwave and Power Electronics Packaging Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room G Chairs CH. Chew
Keynote-07 8:30-8:55 5G Millimeter Wave and EMC Technology Development of Advanced Packaging
Boping Wu HuaWei Central Research Institute, China
044 8:55-9:15 Antenna-on-Package on Low-Cost Organic Substrate for 60 GHz Wireless Communication Applications Chen Chao Wang ASE Group, China
299 9:15-9:35 Effect of Cryogenic Treatment on Mechanical Properties and Microstructure of Solder Joint Li Xiao and Yao Yao Northwestern Polytechnical University, China
070 9:35-09:55 Simulations on the Effective Thermal Dissipation of the Microchannel Heat Sink with Different Pin Fins Zhiyu Jin, Yunna Sun, Jiangbo Luo and Guifu Ding Shanghai Jiao Tong University, China
Session 8: Advanced Packaging Date Friday, August 18, 2017 Time 8:30 AM~10:00 AM Venue Room A Chairs Yunhui Mei
293 10:50-11:10 The Preparation of SiO2@BN/epoxy composites with high thermal conductivity and excellent thermo-mechanical property Yuan Gao, Pengli Zhu, Gang Li, Rong Sun and Chingping Wong Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences
107 11:10-11:30 Compact and high density integrated design with
high isolation for S-band up-conversion system
Zhaorong Li and Liming Lv
Institute of Electronic Engineering , China
Academy of Engineering Physics, China
134 11:30-11:50 Study of Wafer Warpage Evolution by Cooling to Extremely Low Temperatures Gong Cheng, Wei Gai, Gaowei Xu and Le Luo Shanghai Institute of Microsystem and Information Tehnology, Chinese Academy of Sciences , China
154 11:50-12:10 Effect of Annealling Processon Microstructure of Cu-TSV Zeliang Li, Limin Ma, Xuewei Zhao, Yishu Wang and Fu Guo The College of Materials Science and Engineering, Beijing University of Technology,China
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Session 9: Packaging Materials & Processes Date Friday, August 18, 2017 Time 10:50 AM~12:15 AM Venue Room B Chairs Changqing Liu
Keynote-08 10:50-11:15 Advanced Electronic Packaging Materials –Research
and Application
Rong Sun
Shenzhen Institutes of Advanced Technology, Chinese
Academy of Sciences, China
020 11:15-11:35 The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu Xi Niu and Kwang-Lung Lin Department of Automobile Engineering, Chongqing Vocational College of Public Transportation, China
045 11:35-11:55 Micromechanical modeling of the cyclic behavior of Sn-0.7Cu solder based on micromechanical polycrystalline approach Lu Liu and Yao Yao Northwestern Polytechnical University, China
103 11:55-12:15 Investigation on the melting and tensile properties of Bi-containing SAC105 lead-free solder alloys Zhi-Quan Liu Institute of Metal Research, Chinese Academy of Sciences, China
Session 10: Packaging Materials & Processes Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room C Chairs Zhi-Quan Liu
159 10:50-11:10 Study of the growth behavior of prism-type Cu6Sn5 in the liquid solder Shuo Zhang, Jing Han, Limin Ma, Yishu Wang and Fu Guo The College of Materials Science and Engineering, Beijing University of Technology, China
168 11:10-11:30 A rate-dependent constitutive model considering effects of temperature cycles for lead-free solders Kaimin Wang, Bingjie Chen and Yao Yao Northwestern Polytechnical University , China
177 11:30-11:50 The effect of conductive filler on the properties of electrically conductive adhesives(ECAs) Jian Hao, Dapeng Wang, Saipeng Li, Xinyue He, Jian Zhou and Feng Xue School of Materials Science and Engineering, Southeast University, China
187 11:50-12:10 Hermeticity Test of Low-Melting Point Sealing Glass and Analysis of Encapsulation Failure Rui Tian, Yi Li, Luqiao Yin and Jianhua Zhang Shanghai University, China
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Session 11: Packaging materials & Processes
Quality & Reliability Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room D Chairs Liangliang Li
280 10:50-11:10 Electro-deposition of Co-Ni sulfide nanosheet arrays on nickel foam and investigation of the pseudocapacitive performance Chao Wang, Yanbin Shen, Zijie Song, Xiaodong Zhu, Shuhui Yu, Rong Sun and Ching-Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
322 11:10-11:30 The investigation of interface effect on the properties of nanosilica-based underfill Tianhao Lu, Peng Zheng, Yuanrong Cheng, Zhuo Li and Pengli Zhu Fudan University,China
348 11:30-11:50 Size effect of Sn3.0Ag0.5Cu solder joint on intermetallic layer growth Shaobin Wang and Yao Yao School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, China
149 11:50-12:10 Inhomogeneous Evolution of Microscopic Structure and Crystal Orientation in Sn3Ag0.5Cu under Tensile Stress Yuhan Qian, Jing Han, Limin Ma, Yishu Wang and Fu Guo The College of Materials Science and Engineering, Beijing University of Technology, China
Session 12: Quality & Reliability Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room E Chairs Chunyan Yin
127 10:50-11:10 Finite-Element Calculations of Elastic Fields within Flip-chip Solder Bumps and Cu-Pillar Bumps under the Influences of Thermal Stresses and Joule Heating Peng Zhou, Baojie Zhao, Yubao Zhen, Shuo Liu, Yuehua Hu and Jiayu Li Harbin Institiute of Technology, China
142 11:10-11:30 Finite element analysis of micro - scale CSP solder joint in 3D packaging under random vibratio Li-Shuai Han, Chun-Yue Huang, Rui Yin, Gen-Xin Huang, Ying Liang, Tian-Ming Li and Wei He GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY , China
224 11:30-11:50 Reliability Analysis of Smartwatch Using Xiaomi Mi Band 2 as a Case Yuk Ngang Zita Yip, Zhu Ze and Yan Cheong Chan City University of Hong Kong, China
320 11:50-12:10 Failure analysis of wire bonding EOS with FEM Xin Tao, Yuanhong Zeng, Jun Wang and Xiaojing Wu Fudan University, China
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Session 13: Advanced Manufacturing Technologies and Packaging Equipment Solid State Lighting Packaging & Integration High-speed & High-frequency Microwave and Power Electronics Packaging Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room F Chairs Fei Xiao
094 10:50-11:10 A Rapid PID Control Method for High-speed Macro-micro Composite Positioning Stage Yutao Tan, Jian Gao, Langyu Zhang, Yongjun Jiang, Hui Tang and Yunbo He Guangdong University of Technology, China
199 11:10-11:30 Recognition and classification of ultrasonic aluminum wire joint based on image morphology and C-SVM Wang Rui, Long Zhili and Zhou Xing Harbin Institute of Technology Shenzhen Graduate School, China
088 11:30-11:50 Effect of the substrate temperature on the phosphor sedimentation of phosphor-converted LEDs Weicheng Shu, Xingjian Yu, Run Hu, Qi Chen, Yupu Ma and Xiaobing Luo Huazhong University of Science and Technology, China
360 11:50-12:10 Rapid Fabrication of Joints Using Low Temperature Sintered Silver Nanoparticles Fan Yang, Mingyu Li and Shihua Yang Harbin Institute of Technology Shenzhen Graduate School
Session 14: Emerging Technologies Date Friday, August 18, 2017 Time 10:50 AM~12:15 AM Venue Room G Chairs Boping Wu
Keynote-9 10:50-11:15 Innovation in Power Integrated Modules CH. Chew Package Development for ON Semiconductor, Malaysia
075 11:15-11:35 Design and Analysis of Minichannels Heat Sinks with Indented Fins under Impingement Flow Condition Yang Sui, Hengyun Zhang, Peichao Li and Tingyu Lin Shanghai Univ. of Engineering Sci., China
065 11:35-11:55 Design and Simulation of a 2.4GHz bandpass filter on silicon substrate Ge Sima, Wenhua Hu, Jian Xu and Peng Sun The National Center for Advanced Packaging, China
209 11:55-12:15 Electro-thermal Modelling of Multichip Power Modules for High Power Converter Application Mohammad Shahjalal, Hua Lu and Chris Bailey University of Greenwich, UK
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Session 15: Advanced Packaging & Interconnect technologies Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room A Chairs Hu He
250 13:30-13:50 A low cost method to synthesize silver nanoparticles for the screen printing conductive inks Wang Zhuang, Zhao Tao and Liang Xianwen Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
326 13:50-14:10 Integrated Process for High Aspect Ratio Through Glass Vias Kai Xue, Feng Jiang, Heng Wu, Xue Fei Ming and Xiu Feng Zhou Gmax, USA
128 14:10-14:30 Flexibale connection for Reflow Free Super Fine Pitch SMT Components Xiaosong Ma, Yongfa Cheng and Feiyang Liu Guilin University of Electronic Technology, China
230 14:30-14:50 Analysis of Wideband Multilayer LTCC Vertical Via Transition for Millimeter-wave System-in-package Zhipeng Li, Ping Wang, Rong Zeng and Wei Zhong Institute of Electronic Engineering, China Academy of Engineering Physics, China
Session 16: Packaging Materials & Processes Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room B Chairs Daoguo Yang
47 13:30-13:50 Impact of Substrate Surface Condition and Epoxy Mixture Properties on the Overflow/Incomplete Flow Xun Lou, Li Yang, Rui Zhu, Huan Wu, Lei Chen, Wenfeng Zhang, Chong Jia, Hwai Peng Yeoh and Junhong Xu Center for Joining and Electronic Packaging,School of Materials Science and Engineering, State Key Laboratory of Materials Processing and Die&Mould Technology Huazhong University of Science and Technology, China
51 13:50-14:10 Silver Nanoparticle deposited Boron Nitride Nanosheet/Nanofrbrillated Cellulose Composites with Enhanced Thermal Conductivity Jiajia Sun, Xiaoliang Zeng, Rong Sun, Jian-Bin Xu and Ching-Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
87 14:10-14:30 Silica Doped Quantum Dots Film with Enhanced Light Conversion Efficiency for White Light Emitting Diodes Yanhua Cheng, Bin Xie, Yupu Ma, Weicheng Shu and Xiaobing Luo Huazhong University of Science and Technology, China
104 14:30-14:50 Effect of reflux time and aging treatment on the interfacial reaction of SnAgCuSbBiNi/Cu solder joint Zhi-Quan Liu Institute of Metal Research, Chinese Academy of Sciences, China
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Session 17: Packaging Materials & Processes Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room C Chairs Dongyan Ding
167 13:30-13:50
Study of EM and TM of Sn0.3Ag0.7Cu solder joints
under high current stress and thermal gradient Zhijie Sun, Limin Ma, Yishu Wang, Fu Guo, Jing Han and Yong Zuo The College of Materials Science and Engineering, Beijing University of Technology, China
189 13:50-14:10 Highly Sensitive Flexible Pressure Sensor Based on Microstructured PDMS For Wearable Electronics Application Yuan Zhang, Yougen Hu, Tao Zhao, Pengli Zhu, Rong Sun and Chingping Wong Shenzhen Institutes of Advanced Technology, China
222 14:10-14:30 Effects of POSS on the interfacial reactions between Sn-3.5Ag solders and Cu substrates during soldering Xue Wang, Jing Han, Fu Guo, Limin Ma and Yishu WangInstitute of Microelectronics of Chinese Academy of Sciences, Beijing, China
265 14:30-14:50 Research on SnSbNi solder joints between light emitting diode chip and heat sink Wei Liu and Man Zhang PKUSZ, China
Session 18: Emerging Technologies Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room D Chairs Ran He
288 13:30-13:50 All-printed Paper Based Supercapacitors Lu Shi, Yang Wang, Wenhui Lai, Zhi Jiang, Ronghe Wang and Cheng Yang Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, China
180 13:50-14:10 Microstructure and properties of AlCrFeNi intermetallic based alloy Mingxing Ren and Guotian Wang Harbin Institute of Technology, China
234 14:10-14:30 Fabrication and optical properties of CuInS2 quantum dots Zhe Wang, Jie Wang, Zhihao He, Te Wang, Ronggang Liu, Jinfeng Ma, Peng Zhang and Yujie Li Harbin Institute of Technology at Weihai, China
89 14:30-14:50
Design of a hydro-dynamically levitated centrifugal micro-pump for the active liquid cooling system Ruikang Wu, Bin Duan, Falong Liu, Han Wu, Yanhua Cheng and Xiaobing Luo Huazhong University of Science and Technology, China
15
Session 19: Quality & Reliability Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room E Chairs Hongjun Ji
232 13:30-13:50 Mechanical property of Cu-Sn-Ni intermetallics in the full intermetallic micro-joints formed with transient liquid phase soldering Liping Mo, Zheng Zhou, Fengshun Wu, Shiyuan Liu and Changqing Liu Huazhong University of Science and Technology, China
301 13:50-14:10 DDR4 Dual-Contact Interconnect Methodology, Component, and Board Level Reliability Paul Wang and David He Mitac International Inc.Taiwan, China
335 14:10-14:30 Thermal effect on material properties of sintered porous silver during high temperature ageing Chanyang Choe, Seungjun Noh, Chuantong Chen, Toshiyuki Ishina, Shijo Nagao and Katsuaki Suganuma Institute of Scientific and Industrial Research, Osaka University, Japan
364 14:30-14:50 Void propensity in solder joints on a single copper pad with a grain size spectrum tuned by strain annealing Chongyang Cai, Rong An, Chunqing Wang and Yanhong Tian Harbin Institute of Technology, China
Session 20: Packaging Design and Modeling Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room F Chairs Hongtao Chen
186 13:30-13:50 Investigation of Design and Material Optimization on High bandwidth Package on Package Ian Hu, Wei-Hong Lai and Ming-Han Wang Key Laboratory of MEMS of Ministry of Education, Advanced Semiconductor Engineering,Taiwan, China
155 13:50-14:10 Channel Concatenated Coding Transmission Scheme for TSV Array Transmission Xiaoyang Duan, Zhensong Li, Tianfang Chen, Min Miao and Yuexia Zhang Beijing Information Science and Technology University, Information Microsystem Institute, China
253 14:10-14:30 Electromigration simulation of flip chip CSP LED Rui Ma, Fei Qin, Jiajie Fan, Xuejun Fan and Cheng Qian Beijing University of Technology, China
260 14:30-14:50 System Level Mechanical Shock Reliability of BGA Packages: Experimental and Numerical Analysis Jianghai Gu, Weidong Xie, Cherif Guirguis, Mudasir Ahmad and Yaoyu Pang Cisco system, USA
16
Session 21: Packaging Design and Modeling Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room G Chairs Chunjin Hang
86 13:30-13:50 A comparative study of phosphor scattering model for phosphor-converted light-emitting diodes Yupu Ma, Yanhua Cheng, Weicheng Shu, Falong Liu, Run Hu and Xiaobing Luo Huazhong University of Science and Technology, China
172 13:50-14:10 Fully-Coupled Electromigration Simulation of Sweat Structure Yiming Jiang, Hailong Li, Yunhui Mei and Xin Li Tianjin University, China
302 14:10-14:30 Void risk prediction for molded underfill technology on flip chip packages Cheng Xu, Jun Liu, Jian Xu, Peng Sun, Chih-Chung Hsu and Chao-Tsai Huang National Center for Advanced Packaging Co.,Ltd., China
201 14:30-14:50 Fine Tuning Development Software for High Precision and Multi-Axis Motion Control System Zhiping Zeng, Yunbo He, Yongshan Hu, Xin Chen, Jian Gao, Zhijun Yang, Yun Chen, Kai Zhang, Hui Tang and Xun Chen Guangdong University of Technology, China
Session 22: Interconnect technologies Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room A Chairs Yuan Lu
SP1 15:50-16:10 High Density, Ultra-thin/Small Packaging Tetsukazu Sugiya Disco Corporation, Japan
66 16:10-16:30 Etching Process Development for 3D Wafer Level Via Last TSV Package Yulong Ren, Geng Fei, Peng Sun, Yanan Sun and Ge Sima National Center for Advanced Packaging (NCAP China), China
192 16:30-16:50 Cu/Adhesive Hybrid Bonding Through a Cu-first
Bonding Approach by Using H-containing HCOOH
Vapor Surface Treatment
Ran He, Masahisa Fujino, Masatake Akaike, Taiji
Sakai, Seiki Sakuyama and Tadatomo Suga
The University of Tokyo, Japan
278 16:50-17:10 Low Temperature Sintering of Nanosilver Paste for
Super-Large-Area Substrate Bonding
Han-Ning Jiang, Xin Li and Yun-Hui Mei
Tianjin University, China
17
Session 23: Packaging Materials & Processes Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room B Chairs Wei Liu
92 15:50-16:10
Hierarchically Interconnected Epoxy/BN-SCMC
Polymer Composites with Enhanced Thermal
Conductivity
Jiantao Hu, Xiaoliang Zeng, Rong Sun, Jian-Bin Xu
and Ching-Ping Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, China
93 16:10-16:30
Effects of aging temperature on fatigue life of
Sn-3.0Ag-0.5Cu solder joints
Jundong Wang and Yao Yao
Northwestern Polytechnical University, China
99 16:30-16:50 Polyurethane-Based flexible conductive adhesives Ma Hongru, Yan Shaocun, Li Zhe, Tian Xun, Ma Lei and Ma Yanqing Shihezi university, China
140 16:50-17:10 Solvent effect on pressureless and
low-temperature sintering of Ag paste for
die-attachment in high-power devices
Hao Zhang, Chuantong Chen, Jingting Jiu and
Katsuaki Suganuma
Osaka University, Japan
Session 24: Packaging Materials & Processes Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room C Chairs Rong An
197 15:50-16:10 A Facile Route to Prepare Metal Nanostructure Applied in SERS Active Substrate Qionglin Ouyang, Gang Li and Pengli Zhu Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
231 16:10-16:30 Study on Slip Behavior of lead-free Solder Joints under Uniaxial Stress Gaqiang Dong and Limin Ma Beijing University of Technology, China
276 16:30-16:50 Improved permittivity and breakdown strength of PVDF composites filled with TiO2-SrTiO3 hybrids Xiaodong Zhu, Suibin Luo, Shanjun Ding, Chao Wang, Zijie Song, Shuhui Yu, Rong Sun and Ching-Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
282 16:50-17:10 Corrosion process study of Zn-30Sn
high-temperature lead-free solder
Zhenghong Wang, Gong Zhang, Chuantong Chen
and Katsuaki Suganuma
Tsinghua University, China
18
Session 25: Emerging Technologies Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room D Chairs Wenhua Yang
330 15:50-16:10 Conductivity of Silver and Copper Film Printed by Particle-free Reactive Inks Hongbo Xu, Xingming Tang, Hailin Sun, Hongyun Zhao and Mingyu Li Harbin Institute of Technology, China
233 16:10-16:30
Easy-disassembly bonding of PDMS used for
leak-tight encapsulation of microfluidic devices
Jie Wang, Shijie Wang, Peng Zhang and Yujie Li
Harbin Institute of Technology at Weihai, China
297 16:30-16:50
CNT-Graphene Heterostructures: First-Principle
Study of Electrical and Thermal Conductions
Wei Yan, Guoyuan Li, Bin Li, Changjian Zhou,
Ren-Yu Tian, Xiao-Bao Yang and Cary Y Yang
South China University of Technology, China
151 16:50-17:10 Study on the Influence of LED PN Junction Area on
Modulation Bandwidth in Visible Light
Communication
Lilin Liu, Zheng Zhou and Gang Wang
Sun Yat-sen University, China
Session 26: Quality & Reliability Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room E Chairs Fengwen Mu
275 15:50-16:10 The Mechanism Study of Low-Temperature Brittle Fracture of Bulk Sn-Based Solder Qi An, Chunqing Wang, Hong Wang and Xiangxi Zhao Harbin Institute of Technology, China
258 16:10-16:30
On-line monitoring flip LED chip performance
degradation and failure analysis
Lin Zhou
Research Institute Of Tsinghua University In
Shenzhen, China
100 16:30-16:50 COB 3wheel Reliability Simulation Method
Development
Jianfei Long, Haomin Bao, Yonghua Zhou and
Jonghyun Chae
Samsung Semiconductor (China) R&D CO.,LTD ,
China
179 16:50-17:10 The stress strain analysis under the reverse load
of the embedded baseplate micro-scale grid array
welder
Rui Yin, Chun-Yue Huang, Gen-Xin Huang, Li-Shuai
Han, Jian-Pei Wang, Ying Liang and Tian-Ming Li
School of Electro-Mechanical Engineering, Guilin
University of Electronic Technology, China
19
Session 27: Packaging Design and Modeling Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room F Chairs Yujie Li
81 15:50-16:10 Solderablity Degradation of Electrodeposited Tin Finishes Jing Wang, Guang Chen, Henry Forbes, Katerina Christopoulos, and Changqing Liu Loughbouough University, UK
109 16:10-16:30 Fatigue life assessment of electronic components under vibration using displacement as a response metric Vinay Kumar, Prashant Tripathi and Wayne Sozansky DELPHI Electronics & Safety, USA
213 16:30-16:50 The influence of heat transfer boundary
conditions on the fusion zone size of Sn solder
under localized and rapid heat source
Zheng Zhou, Anna Zhang, Hui Liu, Liping Mo and Fengshun Wu Huazhong University of Science & Technology, China
96 16:50-17:10 Thermal-Stress Co-Simulation of a Ka-band
Millimeter-wave T/R System in Package
Gang Xu, Wei Zhong and Rong Zen
Institute of Electonic Engineering, Academy of Engineering Physics, Mianyang, China
Session 28: Packaging Design and Modeling Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room G Chairs Chenxi Wang
90 15:50-16:10 Structural design of LED packaging in terms of lumen reliability by a statistical method Qi Chen, Bofeng Shang, Weicheng Shu, Yanhua Cheng and Xiaobing Luo Huazhong University of Science and Technology, China
36 16:10-16:30
Modeling and fabrication of the Redistribution
Layer on the 2.5D Si interposer Yunna Sun, Zhiyu Jin, Jiangbo Luo, Jian Li, Yating Sun, Yan Wang and Guifu Ding Shanghai Jiao Tong University, China
175 16:30-16:50 On reproducing the copper extrusion of through-silicon-via from the atomic scale Jinxin Liu, Zhiheng Huang, Paul Conway, Frank Altmann, Matthias Petzold and Falk Naumann Sun Yat-sen University, China
256 16:50-17:10 A Hybrid Genetic Algorithm for Automatic
Layout Design of Power Module
Baisen Hao, Yunhui Mei and Puqi Ning
Tianjin University, China
20