page advertiser - opensystems...

http://issuu.com/action/page?page=3








https://twitter.com/sff_mag

http://www.smallformfactors.com

GROUP EDITORIAL DIRECTOR John McHale [email protected]

ASSISTANT MANAGING EDITOR Lisa Daigle [email protected]

ASSOCIATE EDITOR Mariana Iriarte [email protected]

E-CAST MANAGER Joy Gilmore [email protected]

CREATIVE DIRECTOR Steph Sweet [email protected]

SENIOR WEB DEVELOPER Konrad Witte [email protected]

WEB DEVELOPER Paul Nelson [email protected]

DIGITAL MEDIA MANAGER Rachel Wallace [email protected]

CONTRIBUTING DESIGNER Joann Toth [email protected]

SALES

SALES MANAGER Tom Varcie [email protected] (586) 415-6500

STRATEGIC ACCOUNT MANAGER Rebecca Barker [email protected] (281) 724-8021

STRATEGIC ACCOUNT MANAGER Bill Barron [email protected] (516) 376-9838

STRATEGIC ACCOUNT MANAGER Eric Henry [email protected] (541) 760-5361

STRATEGIC ACCOUNT MANAGER Kathleen Wackowski [email protected] (978) 888-7367

SOUTHERN CALIFORNIA REGIONAL SALES MANAGER Len Pettek [email protected] (805) 231-9582

SOUTHWEST REGIONAL SALES MANAGER Barbara Quinlan [email protected] (480) 236-8818

NORTHERN CALIFORNIA REGIONAL SALES MANAGER Twyla Sulesky [email protected] (408) 779-0005

ASIA-PACIFIC SALES ACCOUNT MANAGER Elvi Lee [email protected]

EUROPE SALES ACCOUNT MANAGER James Rhoades-Brown [email protected]

PUBLISHER Patrick Hopper [email protected]

PRESIDENT Rosemary Kristoff [email protected]

EXECUTIVE VICE PRESIDENT John McHale [email protected]

EXECUTIVE VICE PRESIDENT Rich Nass [email protected]

CHIEF TECHNICAL OFFICER Wayne Kristoff

VITA EDITORIAL DIRECTOR Jerry Gipper [email protected]

MANAGING EDITOR Jennifer Hesse [email protected]

PICMG EDITORIAL DIRECTOR Joe Pavlat [email protected]

EMBEDDED COMPUTING BRAND DIRECTOR Rich Nass [email protected]

EMBEDDED COMPUTING EDITORIAL DIRECTOR Curt Schwaderer [email protected]

TECHNOLOGY EDITOR Brandon Lewis [email protected]

SENIOR EDITOR Sally Cole [email protected]

TECHNICAL CONTRIBUTOR Rory Dear [email protected]

CREATIVE SERVICES DIRECTOR David Diomede [email protected]

CREATIVE PROJECTS Chris Rassiccia [email protected]

FINANCIAL ASSISTANT Emily Verhoeks [email protected]

SUBSCRIPTION MANAGER [email protected]

CORPORATE OFFICE 16626 E. Avenue of the Fountains, Ste. 201 • Fountain Hills, AZ 85268 • Tel: (480) 967-5581

SALES AND MARKETING OFFICE 30233 Jefferson • St. Clair Shores, MI 48082

REPRINTS

WRIGHT’S MEDIA REPRINT COORDINATOR Wyndell Hamilton [email protected] (281) 419-5725

WWW.OPENSYSTEMSMEDIA.COM

2 Spring 2016 | PC/104 and Small Form Factors Resource Guide www.smallformfactors.com

PAGE ADVERTISER

15 ACCES I/O Products, Inc. – PCI Express MiniCard – mPCIe embedded I/O solutions

11 Association for Unmanned Vehicle Systems International (AUVSI) Xponential – an AUVSI experience

36 Computex – Shaping the future!

13 Elma Electronic – Reliable and field proven. Our industrial platforms do all that – and more

9 Pentair Electronics Protection – Schroff Interscale C

17 Technologic Systems – Superior embedded solutions

ADVERTISER INDEX

EVENTSIMS – International Microwave

Symposium 2016 May 22-27, 2016 San Francisco, CA www.ims2016.org

DAC 2016:

Design Automation Conference June 5-9, 2016

Austin, TX www.dac.com

Sensors Expo June 21-23, 2016

San Jose, CA www.sensorsexpo.com

ECASTSNFC for smarter grid infrastructure

and metering solutions Sponsored by Texas Instruments

http://ecast.opensystemsmedia.com/635

Cybersecurity for the connected car Sponsored by GrammaTech,

LDRA Software, Polarion, and RTI http://ecast.opensystemsmedia.com/637

Space rovers and surgical robots: System architecture lessons

from Mars Sponsored by RTI



mailto:[email protected]




































http://www.ims2016.org

http://www.dac.com

http://www.sensorsexpo.com




Regardless of which military trade show I attend or what mili-tary application is being discussed at a show, the common trend is that everything is getting smaller, whether it’s GPS systems, avionics computers, unmanned aircraft system (UAV) payloads, etc. This trend bodes well for suppliers to the military of small-form-factor standards such as PC/104, COM Express, or SMARC.

The applications that demand these standards are also getting the most important type of attention from the U.S. govern-ment, as the president’s fiscal year (FY) 2017 budget request for the U.S. Department of Defense (DoD) shows. Increased funding for radar, electronic warfare (EW), and communications programs promise growth for defense electronics suppliers.

The total FY 2017 budget request is $582.7 billion, up $2.4 bil-lion from the $580.3 billion enacted in FY 2016. The overall Research, Development, Test, & Evaluation (RDT&E) budget for FY 2017 is $71.765 billion, an increase over the FY 2016 enacted total of $69.968 billion. Funding dropped slightly, however, for the DoD’s Science and Technology program, from $13 billion in FY 2016 to $12.5 billion for FY 2017.

Designers of embedded computing, signal processing, open architectures, and other commercial off-the-shelf (COTS) solutions should find a steady market as the DoD’s missions continue to rely more and more on cyber interventions; command, control, communications, computers, intelligence, surveillance, and reconnaissance (C4ISR); radar; and EW sys-tems to keep an edge both on battlefields and during peace-time. Each application has an insatiable need for bandwidth and processing capability that is only fueled by embedded computing and open architecture designs. Below are key areas within the DoD budget that leverage embedded hard-ware and software.

CybersecurityCyber operations get a $900 million increase in the FY 2017 budget program, with a total of $6.7 billion requested. For more on the DoD’s cyber strategy, visit http://bitly.com/1Usabu0.

EW RDT&ETotal EW funding in the FY 2017 RDT&E budget is $298 mil-lion, more than $100 million more than the FY 2016 enacted total of $184 million. The Navy gets most these funds, with $183 million requested for the service. The Army and Air Force are slated to receive $102.5 million and $12.5 million, respectively. Procurement for the Navy’s AN/SLQ-32 Electronic

Warfare Suite is down slightly from the FY 2016 enacted total of $296 million, to about $275 million.

Radar RDT&E funding for radar programs comes in at about $755 million for FY 2017, down about $5 million from the FY 2016 enacted total of $760 million. Key programs getting FY 2017 RDT&E funding include Air and Missile Defense Radar (AMDR) at $144.3 million, Ground/Air Task Oriented Radar (G/ATOR) at $83.538 million, and Three Dimensional Long-Range Radar (3DELRR) at $49.5 million.

Radar program procurement for the FY 2017 RDT&E request comes in at about $560 million, a slight decrease over the FY 2016 enacted total of $568 million. Counterfire radars for the Army top the radar procurement request at $314 million, an increase of more than $100 million over the FY 2016 enacted total of $198 million.

Other key programsThe M1A2 Abrams battle tank has been modernized with a series of upgrades to improve its capabilities. Total FY 2017 funding – procurement, research, and development – in FY 2017 rises from $509 million in FY 2016 to $559 million.

The F-35 Joint Strike Fighter (JSF) consists of three variants: the F-35A Conventional Take-Off and Landing (CTOL), the F-35B Short Take-Off and Vertical Landing (STOVL), and the F-35C Carrier variant (CV). Total funding – procurement, research, and development – drops from $11.602 billion in FY 2016 to $10.504 billion in FY 2017.

Total funding for the Littoral Combat Ship (LCS) in the FY 2017 budget rises from $1.816 billion in FY 2016 to $1.599 billion.

All these numbers indicate a healthy demand for small form factor, embedded computing technology for military systems. However, uncertainty still reigns. As of this writing, the presi-dential election remains undecided. Hillary Clinton and Donald Trump are the front-runners for the Democrat and Republican primaries, respectively. As democratic presidents are tradition-ally not as pro-defense spending as Republicans and Trump is an unknown, future DoD budget increases remain hard to predict.

If you would like a distraction from the crazy election atmo-sphere, read the budget documents in full at http://comptroller.defense.gov/BudgetMaterials.aspx. By the time you’re done reading, we may have a new president.

DoD budget request funds platforms that leverage small form factors

small MATTERSBy John McHale, Group Editorial Director

www.smallformfactors.com

www.smallformfactors.com PC/104 and Small Form Factors Resource Guide | Spring 2016 3


http://bitly.com/1Usabu0

http://comptroller.defense.gov/budgetmaterials.aspx



Published by:

www.smallformfactors.comwww.pc104online.com ON THE COVER:

The Spring 2016 PC/104 and Small Form Factors Buyer’s Guide features applicable products used in the industrial automation and control, military/aerospace, infotainment/gaming, medical, and transportation industries. Featured on the cover: Products from RTD Embedded Technologies and Curtiss-Wright Defense Solutions.

WHITE PAPERSCOM Express solutions – Overcome the challenges of crafting a customized computer

Acromag http://mil-embedded.com/white-papers/white-express-solutions-overcome-challenges-crafting-customized-computer/

COM-based SBCs: The superior architecture for small-form-factor embedded systems Diamond Systems

http://smallformfactors.mil-embedded.com/white-papers/white-factor-embedded-systems/

PC/104 and Small Form Factorswww.linkedin.com/groups?gid=1854269

2016 OpenSystems Media® © 2016 PC/104 and Small Form FactorsAll registered brands and trademarks used in PC/104 andSmall Form Factors are property of their respective owners.ISSN: Print 1096-9764, ISSN Online 1550-0373

COLUMNSSmall Matters 3DoD budget request funds platforms that leverage small form factorsBy John McHale, Group Editorial Director

PC/104 Consortium 5PC/104 a presence at Embedded World 2016 By Stephen St. Amant, PC/104 Consortium President

Volume 20 • Number 1

FEATURES

SBCs:Focus on the military market

PC/104 and small form factors popular in defense

electronics systemsBy John McHale,

Group Editorial Director

COMs and SOMs:GPGPUs

Cool power sensationBy Charlotte Adams,

Abaco Systems

PROCESSOR ARCHITECTURE:Mobile Processors

Shrinking automotive AI to smaller form factor for

safety, autonomous drivingBy Brandon Lewis, Technology Editor

6

12

14

14

6

@sff_mag

RESOURCE GUIDE PROFILE INDEX 18COMs and SoMs 18Hardware and Peripherals 20 Processing 25SBCs and Boards 26Systems 33

WEB RESOURCESSubscribe to the magazine or E-letter http://opensystemsmedia.com/subscriptionsLive industry news • Submit new products http://submit.opensystemsmedia.com

White papers: Read: http://whitepapers.opensystemsmedia.com Submit: http://submit.opensystemsmedia.com


https://twitter.com/sff_mag


http://www.pc104online.com

http://mil-embedded.com/white-papers/white-express-solutions-overcome-challenges-crafting-customized-computer/

http://smallformfactors.mil-embedded.com/white-papers/white-factor-embedded-systems/

http://www.linkedin.com/groups?gid=1854269

http://opensystemsmedia.com/subscriptions

http://submit.opensystemsmedia.com

http://whitepapers.opensystemsmedia.com

http://submit.opensystemsmedia.com














company’s strengths to bring about hybrid integrated solutions that often involve peripheral and specialty I/O mod-ules from multiple vendors.

One PC/104 manufacturer recently remarked, “We specialize in ‘x’ tech-nology. It’s what we do, and we do it well. I don’t have to be an expert in ‘y.’ Someone else does that. I can buy their PCIe/104 card with its onboard I/O con-nectivity, plug it together with mine, and I have an excellent solution for my cus-tomer. That’s how the ecosystem works.”

Another note: PCI Express Mini Cards. It’s becoming more common for these to bring signal-specific I/O to the PC/104 footprint, or to augment a single board solution. Known by a number of different names that combine the words “mini” and “PCIe” or “PCI Express,” mini PCIe cards are being used as mezzanine solu-tions on carrier cards or as mini-expansion options on single-board computers. For size-constrained applications, mini PCIe gives PC/104 integrators added flexibility with minimal impact on size, weight, and power. Solutions in this area include WiFi, GPS, Camera Link, CAN bus, MIL-STD-1553, mass storage, and more.

Next moves for PC/104Expect to see even more new board-level products and look for continued proliferation of ruggedized enclosures and watertight chassis. The PC/104 architecture is inherently robust, so it comes as no surprise that many full-up PC/104 system configurations are designed for high-shock and -vibration environments where temperatures are at either extreme. From down-hole to outer space, look for PC/104 solutions just about everywhere.

For more information, visit the PC/104 Consortium website at www.pc104.org.

PC/104 had a strong showing at the recent Embedded World 2016 trade show in Nuremberg, Germany. Slick PC/104 demonstrations showed robust graphics pro-cessing, industrial Internet of Things (IoT) gateways, innovative Ethernet switches, ARM/FPGA combinations, and military/industrial control applications. At the board level, PC/104 modules are easily recognized for their general shape, corner mounting holes, and stackable bus connectors, but the trade show floor held more than just board-level PC/104: It was at work inside all sorts of enclosure formats – from cube-like configurations housing a stack of modules, to low-profile flat configurations using PC/104 cards as mezzanines, to ultracompact palm-sized systems.

Tackling today’s application needsUsing the latest processors such as those from Intel, AMD, and Texas Instruments – and ARM processors as well – PC/104 manufacturers and system integrators are addressing a wide range of embedded-computing needs. Because of the versatility of its architecture and the expertise of those building to the standard, PC/104 solu-tions are not limited to a single market segment. PC/104 systems can be found in the latest embedded solutions serving aerospace, defense, communications, transporta-tion, energy, medical, industrial, and research fields:

Hyperspectral imaging using a single-board CPU and Camera Link peripherals Encrypted routers for military and commercial applications Vehicle event data recording for military and commercial applications Avionics communications with features like 20-port+ Ethernet switching,

10G LAN, JITC, and H.264 Railway braking-control systems Portable communication units for tactical long-term evolution (LTE) wireless

networks Security and surveillance for tollbooths, border crossings, and homeland security

using single PC/104 CPUs and frame-grabber peripherals Medical equipment networking and monitoring General-purpose graphics processing unit (GPGPU) applications for military,

industrial, and scientific work Oil well blowout-prevention-control systems Data collection and processing for airborne geological surveying FPGA on PC/104 peripherals to support applications like light detection and

ranging (LIDAR), digital signal processors (DSPs), and radar imaging Unmanned autonomous applications used in security and surveillance, scientific

research, civil defense, and homeland security IoT gateway computing for military and industrial networking

How are they doing it?First, it’s worth noting that embedded manufacturers who build to the PC/104 standard are continually designing in the latest technologies to hit the market. With stackable PCI Express (PCIe/104 and PCI/104-Express), PC/104 meets demanding embedded computing needs while keeping size, weight, and power to a minimum. Second, there’s a lot of collaboration going on in PC/104. Component manufacturers are working with board-level designers and manufacturers bringing the latest technologies to stack-able solutions. Lastly, PC/104 designers are working with each other, leveraging each


PC/104 a presence at Embedded World 2016

PC/104 Consortium

By Stephen St. Amant, PC/104 Consortium President

www.pc104.org


http://www.pc104.org

http://www.pc104.org

perspective. That said, we at Connect Tech are seeing our military customers wanting the rugged and compact fea-tures of the PC/104 of the past combined with the most current technologies.

“Here is where PCIe/104 (The PCI Express version of PC/104) comes into play, offering single-board computers (SBCs) with the latest generation low-power Intel Atom [processors], through to high-performance Intel Core i7 options,” Kasza continues. “Stack this

Thanks to its longevity and modularity, the PC/104 standard continues to be popular with

military system designers, especially, as their size, weight, and power (SWaP) requirements

continue to shrink.

Whether in avionics computers, unmanned systems payloads, ground-control stations, command and control, or intelligence, surveillance, and reconnaissance (ISR) applica-tions, PC/104 technology has found a healthy place in the military industry for nearly three decades.

Now, as reduced size, weight, and power (SWaP) requirements become more preva-lent in military electronics system designs, PC/104’s place in this market is more secure than ever.

“I believe that in the case of PC/104 [military users] are looking to use a proven plat-form that they have seen years of success with,” says Michele Kasza, vice president of sales for Connect Tech in Guelph, Ontario. “These customers may also prefer to stay with a known footprint as it may reduce their design efforts from a mechanical

PC/104 and small form factors popular in defense electronics systemsBy John McHale

SBCs: Focus on the military market

SBCs Focus on the military market

Helicopters such as the U.S. Army’s OH-58D Kiowa Warrior – as well as other space-constrained applications like unmanned systems – benefit from the size, weight, and power (SWaP) characteristics of PC/104 and other embedded computing small-form-factor standards. In this photo, OH-58D Kiowa Warrior helicopters return to Bagram Airfield, Afghanistan to refuel before

completing a security and reconnaissance mission. The pilots are assigned to Company C, 10th Combat Aviation Brigade, Task Force Phoenix. Photo courtesy of U.S. Department of Defense.




Reliability and consistency have ensured continued support for the PC/104 standard in military applications that often have various levels of requirements.

“The requirements of military customers for PC/104 varies from program to program,” says Dr. Paul A.T. Haris, president and CEO of RTD Embedded Technologies, Inc., in State College, Pennsylvania. “But some of the common threads have included a need for rapid prototyping, development, and uptime that the PC/104 architecture provides, given its vast array of product functionalities and numerous manufacturers found on the market.

“Additionally, users have required the need for an inherently rugged architecture at the board level, which also provides modularity for future maintainability and upgradeability,” he continues. “Very few standards over the history of the embedded market have been able to provide these capabilities in such a small form factor. And none can boast the history of this standard and its ability to advance with time while maintaining backward compatibility. This provides military customers with the ability to reduce total lifetime program costs as well as reduce the need for product change-overs. This is why you find many military customers making the PC/104 architecture the architecture of choice for a vast number of military applications in all extremes of environments.”

Military users “are increasingly looking for small-form-factor embedded technologies that reduce the size, weight, and power for their deployed line-replaceable units (LRUs) and reduce or eliminate NRE fees and development schedules,” says Mike Southworth, Product Marketing Executive at Curtiss-Wright Defense Solutions. “At the same time, [they] are seeking increased multicore processor and graphics per-formance, along with I/O scalability from modular open standard PCI Express based architectures like PCIe104 [as well as] COM Express, SMARC, and Mini-PCIe.”

Reduced SWaPEvery defense application today wants five to 10 times more performance in system upgrades, but they want it in the same – if not smaller – footprint of the previous system and with lower power characteristics. This is something PC/104 has been doing for years; it is also a feature of standards such as COM Express and SMARC.

“The PC/104 architecture family of specifications has been serving SWaP requirements even before SWaP was an acronym,” Haris says. “The unique stackable architecture, which also can serve as a true SBC architecture, as well as a mezzanine architecture,

with high-end GPU solutions such as NVIDIA GTX950Ms and high port den-sity Managed Carrier Ethernet Switches or a 10G Ethernet Controllers and sud-denly what was old technology is now leading edge.” Connect Tech offers the Xtreme/GbE 24-Port Managed Carrier Ethernet Switch solution for military small-form-factor requirements. Ports can be accessed via a breakout board/carrier that can mate directly to the XDG024/25 or by mating to a high density high-speed Twinax cable. The XDG025 is designed for standalone applications, with all thermal extraction on one layer and connector/cabling on the opposite layer, whereas the XDG024 is intended to stack directly into a PCIe/104 stack. (See Figure 1.)

Reliability and consistency have ensured continued

support for the PC/104 standard in military applications that

often have various levels of requirements.

Figure 1 | The XDG024 from Connect Tech is intended to stack

directly into a PCIe/104 stack for small-form-factor embedded

computing applications.



with multivendor support and interop-erability. In some cases, the physical footprint of a system is what a customer least wants to change as they may be working within a space that was previ-ously defined around PC/104. From a processor perspective, PC/104 single-board computers are available with lower-power ARM processors as well as x86 options ranging from low-power solutions through to Intel Core i7s.”

“Small-form-factor CPU card standards like PC/104, COM Express, and SMARC offer a physical size that is a fraction of

has been providing the military with embedded, rugged board, and system-level solu-tions for years. With its embedded stackable bus system and onboard I/O connec-tivity, reductions in enclosure size and weight can be either tailored for each appli-cation or realized in standard modular enclosures. With the addition of considering the overall program life cycle cost factor, the PC/104 architecture enables users to quickly upgrade and maintain their systems with backward compatibility and interop-erability of multivendor products, all based on well-defined and controlled standards and specifications.”

Just as no military application is the same with the same embedded computing requirements, no small-form-factor architecture is the right size for every application.

“We live in a world of many small-form-factor options which simply means that one size does not fit all,” Kasza says. “At a small footprint size of 90 mm by 96 mm, PC/104 has a solid ecosystem that allows for easy integration of current technologies


By Brandon Lewis

There were at least 20 PC/104 vendors that I encountered at Embedded World this year, which was held as always in Nuremberg, Germany, and probably several more whose path I didn’t cross. For a technology that’s nearly as old as I am (next year the standard turns 30 and I hit 31), I’d say that makes for a pretty successful week.

Industrial and IoTOne of the markets that helps keep PC/104 production healthy is the Industrial IoT/Industry 4.0. This probably doesn’t come as a surprise because everyone is claiming that they’re IoT in one way or another, often to the point of really, really stretching it. But PC/104 brings real life, true value to the IoT narrative. Given that Industrial IoT will mostly be comprised of small-form-factor edge sensor nodes and gateways, PC/104’s legacy in industrial environments and size, weight, and power (SWaP)-sensitive deployments is a big plus. Furthermore, economies are already in place, driving an industrial-friendly price point.

At least 90 percent of IoT end points and gateways aren’t going to look drastically different from data acquisition (DAQ) and industrial router systems that are in place today – they’re just going to have to convert field bus messages to IP at some point along the way so they can com-municate with back-end cloud/business intelligence systems. From an overall system perspective, they’re not going to look drastically different. So, from a pragmatic deployment standpoint, why reinvent the wheel?

“Before embedded PC/104 and COM modules became more prevalent in military and aerospace applications, these technologies had strong roots in industrial applications, including medical devices, public- transportation vehicles, mining and energy exploration, and ATM and gaming machines, among many others,” says Mike Southworth, product marketing executive at Curtiss-Wright Defense Solutions. “As with military and aerospace applications, industrial customers have adopted these popular technologies for a number of common reasons, including their cost-effectiveness, the large ecosystem of suppliers building modules based on open standards, their compatibility with popular PC operating systems like Linux and Windows, and their ability to be deployed in harsh shock, vibration, and thermal conditions.”

Another point regarding industrial applications is the advantage of PC/104’s standardization and modularity. When combined with

technology turnover rates that can be much more than ten years in industrial markets, the amount of brownfield (legacy) equipment that is currently installed using PC/104-like form factors might be considered an obsolescence challenge. However, PC/104 makes it easy to swap out boards with new process technology and wireless modules.

Market-agnostic“PC/104 is found everywhere and in every market,” says Dr. Paul A.T. Haris, president and CEO of RTD Embedded Technologies, Inc., in State College, Pennsylvania. “The reason for this is that it has always had at its core foundation inherent rugged embedded characteristics even though some applications in many industries were not ready to exploit them or have a need for them. But now that the world has finally evolved to a place where requirements for commercial off-the-shelf (COTS), SWaP, total lifetime cost reductions, and reliability are necessities, the need for PC/104 products is being felt at an ever-increasing pace. New products with new state-of-the-art functionality are being introduced every day. Highly embedded applications are finding their ways into programs that never had a need for them. The need for maximum functionality in a small, cost-effective architecture is now becoming paramount. And we are finding that PC/104 is meeting this need and demand.”

Product newsOne interesting trend at the show was a move toward delivering complete system solutions, with an emphasis on enabling software/ application development for end users by abstracting lower-level facul-ties. This trend was evident in an announcement from ADL Embedded Solutions that the company will be changing its corporate strategy to focus on providing subsystems and full systems that are industry-agnostic, in addition to offering system design services.

Regarding system-on-chip (SoC) trends, Sundance Multiprocessor Technology, Ltd. officials announced that they are integrating Xilinx’s new SDSoC development environment on to their EMC2-Z7030 SBC. This is pretty impressive performance-wise, considering the traditional perception of PC/104 as somewhat vanilla, Intel-based processor boards. Lots of performance punch comes via the Xilinx Zynq FPGA SoC, which can support a ton of processing-intensive applications, including gateway-level analytics processing that couples with the IoT theme.

Group Editorial Director John McHale contributed to this sidebar.

PC/104 popularity in industrial/IoT market seen at Embedded World



traditional 3U or 6U VME/VPX architec-tures,” Southworth says. “This provides an obvious advantage when it comes to packaging for lowest SWaP. In addition, COM Express and SMARC have multiple physical footprint options, including boards roughly the size of a credit card, which allow for further miniaturization targeted at demanding SWaP require-ments. For this space, Curtiss-Wright offers the 39-inch, 1.5-pound rugged mission processor, the Parvus DuraCOR 310, which makes use of integration of a low-power SMARC Computer-on-Module (COM) CPU card with Mini-PCIe I/O card expansion slots,” Southworth says. (Figure 2.)

Other companies – such as Diamond Systems and WinSystems – continue to offer PC/104-based products to meet the demand for reduced SWaP in mili-tary systems.

Diamond Systems has a family of Jupiter PC/104 & PC/104-Plus DC/DC high-efficiency, high-precision power supply modules. Each power supply consists

INTERSCALE C

WWW.PENTAIRPROTECT.COM

Schroff Interscale C cases, leveraging the same proven design as Interscale M cases, feature an interlocking tabbed construction that provides integrated EMC protection and secures with only four screws.

Interscale C cases have integrated heat sinks and are compatible with

Schroff’s Flexible Heat Conductors for industry leading conduction

cooling performance.

Available in standard or custom solutions, with

support from prototype through production.

TOTAL CONDUCTION COOLING SOLUTION

• Compatible with the Flexible Heat Conductor (FHC) for 70% greater thermal dissipation than traditional conduction cooling

• The integrated springs within the FHC allow the aluminum block to expand and contract vertically thereby eliminating the need for a thermal gap pad

• Interscale C, with the FHC, provide consistent performance over the lifetime of the system

• Whitepaper, including thermal test procedures and results, available

CONDUCTION COOLED CASE SOLUTION FOR SMALL FORM FACTOR SOLUTIONS

© 2016 Pentair. H82225 03/16

Standardization Group for Embedded Technologies

Member

Flexible Heat Conductor (FHC) 20mm

same proven design as Interscale M cases, feature an interlocking tabbed construction Schroff’s Flexible Heat Conductors

for industry leading conduction cooling performance.

Interscale C cases have integrated heat sinks and are compatible with

through production.

of a PC/104 form factor module with complete DC-DC voltage regulator circuitry, integrated thermal solution, detachable screw terminal block I/O connections, and PC/104 bus connectors. Its input voltage range of 7 to 34 VDC is compatible with industry-standard 12 V, 24 V, and 28 V inputs.

Engineers at WinSystems leverage the Intel E3800 Atom processor family for their PPM-C407, a fanless low-power PC/104 SBC. The solution is designed for harsh envi-ronments and has soldered RAM for added shock and vibration resistance with an operating temperature range from -40 °C to +85 °C.

Key applicationsDifferent military platforms are taking advantage of small-form-factor embedded computing solutions, with space-constrained applications such as unmanned aircraft system (UAS) legacy avionics applications being typical.

Figure 2 | The Parvus DuraCOR 310 from

Curtiss-Wright Defense Solutions integrates a low-power SMARC Computer-

on-Module (COM) CPU card with Mini-PCIe I/O card expansion slots for

military small-form-factor applications.



http://pentairprotect.com

“Because of their low-SWAP character-istics and affordability, systems based on embedded PC/104 and Computer-on-Module technologies routinely find a home in a multitude of military and civil applications, including MALE and HALE UAS platforms in ISR/combat roles, attack/utility/cargo helicopters, various fixed-wing cargo/fighter/ISR aircraft, and a host of tactical and combat ground vehicles, along with missile defense platforms and shipboard applications,” Southworth says. “As electronics pay-loads on board manned and unmanned platforms look to add new technical capabilities – such as high-speed net-work backbones, ISR sensor/video pro-cessing, and/or avionics databus inter-faces – the smaller system architectures like PC/104 and COM modules have been well received by [our] customers.”

Not just SWaP, but stringent ruggediza-tion and extreme environmental require-ments may also preclude users from choosing PC/104 products.

“With the long history that PC/104 has in the market place, the list of applications is significant, the technology is an ideal fit for any rugged commercial, industrial, or military applications,” Kasza says. “PC/104 is as well-suited to vehicle-based solutions, manned or unmanned, as in industrial environments where unregulated power is a concern as is dirt and dust; also outdoor applications where extreme temperatures, rain, humidity, and salt can be factors. PC/104 is often living in environments where the user may not realize that PC/104 is the architecture driving their application. Crack open a number of small-form-factor, rugged system solutions and you will find PC/104 at its finest; quite often a multivendor stack carefully architected for the ultimate in interoperability.”

“The number of applications where one finds PC/104 is vast,” Haris says. To say that any one application dominates would be misleading and would do a disservice to the PC/104 architecture: PC/104 is based on standard stackable and modular bus architectures widely accepted across most industries and then packaged on a stan-dard small form factor. The use of the vast array of functionalities of these products is endless.

“The architecture provides all the building blocks for designing SWaP-based products to enable overall lifetime program cost reductions,” Haris continues. “This architecture has been proven from the depths of the oceans to outer space, and from the Antarctic icecaps to the desert sands. You will find PC/104 running mission-critical weapon systems as well as general-purpose monitoring, tracking, and processing systems. In the end, the question should not be what are the types of applications that often make use of PC/104 technology, but are there any applications that have not made use of it.”


SBCs Focus on the military market



OpenSystems Media works with industry leaders to develop and publish content that educates our readers.

Check out our white papers.http://whitepapers.opensystemsmedia.com/

Tackling thermal design challenges of smaller, lighter and more efficient avionicsBy Mentor Graphics

This white paper demonstrates how thermal transient testing, combined with computational fluid dynamics, can help find the balance between size, weight, and power requirements (SWaP) and reliability and ensure that safety-critical devices work within their prescribed temperature limits.

Read the white paper: http://mil-embedded.com/white-papers/white-lighter-more-efficient-avionics/


http://whitepapers.opensystemsmedia.com/

http://mil-embedded.com/white-papers/white-lighter-more-efficient-avionics/

The future is here.

XPONENTIAL 2016 is the one event that advances the entire

unmanned systems industry. It is the intersection point for

commercial and defense applications, and it represents all

domains — air, land and sea.

Experience the latest technology you can’t find anywhere else.

xponential.org | #auvsiXPOMay 2-5, 2016 | New Orleans

http://www.xponential.org

https://twitter.com/auvsixpo

In the sensor-processing realm, much has been done with field-programmable gate arrays (FPGAs), chips that can be optimized not only for speed but also for power management. These devices’ one-of-a-kind firmware is expensive to create, however, and can be equally costly to upgrade. Therefore, military customers often express a preference for general programmable processors that can use open source software like Linux. Conventional CPUs, which fill the “general” bill, just can’t compete in per-formance with FPGAs, though.

This dilemma has created an opening for general-purpose graphics processing units (GPGPUs). Originally developed for the gaming market, these hybrid chips are designed for efficiency and have improved in power performance. They feature hundreds of parallelizable processing units, or cores, as well as mul-tiple CPUs. Fortunately, GPGPUs have proved to be adaptable to the military market. These software-programmable chips are able to process oceans of image data in a timely fashion, compress it, and transmit it to decisionmakers within tactical deadlines.

The latest GPGPU in NVIDIA’s low-power Tegra system-on-chip (SoC) product line, the Tegra X1, provides a teraflop of compute performance (1 trillion floating-point operations per second) at a power cost of only 10-12 watts.

That’s almost three times the raw performance of the company’s prede-cessor chip, the Tegra K1, which delivers

Size, weight, and power (SWaP) has long been the mantra for embedded electronics. Every military platform, from the humblest handheld device or miniature unmanned vehicle to the largest weapon system must face these constraints at some level. For battery-dependent devices, energy efficiency is a more urgent concern. The smaller the platform, the bigger the bite from power-hungry computers.

Although it’s sometimes overlooked, a key driver behind SWaP and system power concerns is chip-level performance per watt. Today’s advanced semiconductors, sporting billions of transistors, can burn a lot of power and dissipate a lot of heat. A major challenge for overall power budgets is constraining chip requirements within the tightest possible limits.

Cool power sensationBy Charlotte Adams

Sensor platforms are proliferating around the edges of the network

in both the civilian and the military spheres. For examples, think of the

remote devices on buses, trucks, and oil rigs that are monitored via

the Internet of Things (IoT) or the unmanned surveillance nodes in the

network-centered warfare infrastructure. To be effective, these “edge” devices need to be as

self-sufficient as possible, not just in processing capability but also in energy use.

The McHale Report, by mil-embedded.com Editorial Director John McHale, covers technology and procurement trends in the defense electronics community.

THE THE

The McHale Report,

technology and procurement trends

ARCHIVED MCHALE REPORTS AVAILABLE AT: WWW.MIL-EMBEDDED.COM/MCHALE-REPORT

COMs and SOMs GPGPUs



http://www.mil-embedded.com/mchale-report

326 gigaflops at a fractionally higher power output, or about twice the per-formance per watt of the predecessor chip’s GPU function. That’s in spite of the fact that the X1 has 256 GPU CUDA cores and eight CPU cores compared with the K1’s 192 CUDA GPU cores and four CPU cores. (CUDA, which stands for Compute Unified Device Architecture, is NVIDIA’s GPU programming model.)

Some of the reasons for this performance-per-watt improvement are the X1’s smaller process size (20 nm vs. 28 nm), more efficient memory technology, and enhanced power management features compared with the K1.

The X1 is likely to be attractive to mili-tary users, since it can be plugged into existing K1 boards as a more or less seamless upgrade to run K1 applica-tions, only faster.

An example of a minimal-footprint GPGPU product is the Abaco Systems mCOM10-K1, a ruggedized, extended-temperature, credit card-sized K1 module that is upgradeable to an X1 configura-tion. (Figure 1.)

The benefits from improved performance per watt will be significant, especially as the new technology is backwards-compatible. For one thing, it will be pos-sible to fuse higher-resolution sensor data, using more input devices simulta-neously. Additionally, new applications such as neural net-based automatic target recognition and autonomous navi-gation and mapping will become more plausible. The excess compute capacity in these new chip sets might even be suf-ficient to meet all the processing needs of small robotic vehicles. I

Charlotte Adams writes extensively on microelectronics, avionics, software, embedded computing, and other information technology developments for a number of military and aerospace publications. She worked for the U.S. Library of Congress for several years, after which her career took her into journalism; she served as editor of Avionics magazine. Charlotte received an honors degree in English Literature from Duke University.

www.abaco.com

Figure 1 | The Abaco Systems mCOM10K1 Type 10 Mini COM Express Module gives designers 326 gigaflops of performance while consuming minimal power.



http://www.elma.com

model of everything going on around the vehicle.

It requires a massive amount of com-puting to be able to interpret that data, because generally the sensors are dumb sensors that are just capturing informa-tion. That information really needs to be interpreted. For example, a video camera is bringing in 30 frames per second (fps), and each frame is basic-ally a still picture. That picture is com-prised of color values. There is a massive amount of computation required to be able to take those pixels and figure out, “is that a car?” or “is that a bicyclist?” or “where does the road curve?” It’s that type of computer vision coupled with deep neural-network processing that will enable self-driving cars.

The automotive industry, just now entering the age of artificial

intelligence (AI), is looking at the issues of vehicle safety and training for

the future of autonomous vehicles. In this Q & A with Danny Shapiro,

senior director of automotive at NVIDIA, he discusses how deep

learning technology is being put to use in the pursuit of fully autonomous

vehicles, which NVIDIA forecasts as perhaps closer than you might think.

Shrinking automotive AI to smaller form factor for safety, autonomous drivingBy Brandon Lewis, Technology Editor

PC/104 AND SFF: What are the biggest challenges facing developers of automotive safety systems today?

SHAPIRO: We’re working with a wide range of automakers, Tier 1 suppliers, and other research institutions on advanced driver assistance systems (ADAS) solutions and fully autonomous [driving]. The biggest challenge is being able to react to the randomness of the outside world, other people driving, and the fact that – in general – no driving situation is the same as another.

Our technology is able to handle this type of diverse environment that the car faces. Using deep learning, using sensor fusion, we’re able to build a complete three-dimen-sional map of everything that’s going on around the car to enable the car to make decisions much better than a human driver could.

The amount of computation that’s required for this is massive. If you look at any of the prototype self-driving cars on the market today, they all have a trunk full of PCs connected to a range of different sensors. What we’re doing is bringing the power of a supercomputer down into an automotive package that can be placed on the side of the trunk compartment, for example. We’ll then be able to take that inputs from cam-eras, from radar, from lidar, and be able to build that three-dimensional environment

PROCESSOR ARCHITECTURE Mobile Processors

NVIDIA DRIVE PX 2 platform uses deep learning to enable object detection and classification, map localization, and path planning. Image courtesy of NVIDIA.



pixel level build up what it recognizes in those scenes and learn to understand what’s a pedestrian, what’s a bicyclist, what’s another vehicle, what’s the road, what are the street signs. Again, this is a process that can take weeks or months in a supercomputer up in the cloud, but once we’ve developed this neural network that explains how to interpret information coming in from the video cameras, we’re able to deploy that in a car and run it in real time. As the video comes in from the front-facing camera it’s ana-lyzed at 30 fps, and we can understand everything that’s in that frame of video. And, if we combine cameras from all around the vehicle, then we can start to understand what’s happening and track objects over time. We’re able to monitor all the moving pieces around our vehicle – other cars, other pedestrians, as well as fixed objects – to make sure that we’re able to plan a path safely through traffic and around parked cars or other potential obstacles.

For safety reasons and the fact that we need to have virtually zero latency, everything will be standalone for the core system. Now, these systems will need to be connected

From a sensor fusion perspective, the ability to combine disparate types of information will improve reliability, but that adds extra levels of complexity. The more data that’s captured, for example from radar or lidar, the more processing that is required. There are these very dense point clouds that have to be inter-preted, but once you can combine other types of data with the visual data from a camera, that will increase the reliability of a system.

PC/104 AND SFF: Could you define “deep learning” in the context of vehicles?

SHAPIRO: Deep learning is a technique that’s been around for a while, and it’s not unique to automotive. Basically, it’s a computer model of how the human brain functions, modeling neurons and synapses and collecting very disparate types of information and connecting them together.

There are really two parts to deep learning. The first is having a framework that you start from and then load with information. It’s very similar to how a child learns – you give them informa-tion and they form memories of that information and then build upon it. The first time you’re trying to teach a child about things related to driving you might give them a fire truck and teach them that it’s a fire truck, and they learn that. Then the next time you give them a tow truck; well, they’ve learned the word “fire truck” so they call the tow truck a fire truck. So you correct them, tell them that it’s a tow truck, and then they’ve stored that piece of information and you just continue this model and expand upon that until eventually they can rec-ognize an ambulance or other types of trucks and cars and things like that. The more information you give them, the more they know. It’s just like learning a language too. It’s the vocabulary that’s taught over time.

For deep learning we’re doing this in a supercomputer. So instead of talking about a few different trucks, we’re feeding the system hundreds of thou-sands of miles of video of these scenes, and the system is then able to analyze the frames of video and then from a



http://acces.io

because they will communicate, and they will relay information back to the cloud as well as get information from the cloud, potentially weather informa-tion or traffic updates. But the concept of deep learning is that the training will take place offline and then a vehicle will get an over-the-air (OTA) software update with an improved neural.

There may be times during the training process that a car is driving and it detects something that it can’t classify. When that happens, it’s going to record that information and then upload that back to the data center at the end of the day. So when you have a fleet of these vehicles driving around collecting infor-mation, they’re all going to share that to the cloud, a new neural net model will be created, and an update will be sent down. For example, suppose you had trained a car just on a data set in a down-town, and when you took this vehicle out into the country it starts to see things that it hasn’t ever been trained for – maybe deer or moose. The car would record the information there and then upload that to the data center. A data scientist then is involved in the training process and will add that to a data set so that the next software update will enable deer detection or moose detection. This will be an iterative process whereby cars continue to get smarter and smarter through software updates.

In vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications I think we’re quite a long way off from any kind of uniform data coming in. But when it exists and we have intersec-tions or street signals that are conveying whether it’s a red light or a green light, that will just be an additional layer of data that the autonomous vehicle will be able to leverage.

PC/104 AND SFF: What’s going to help bring these high levels of computation down to price points and form factors suitable for mainstream vehicles? Moore’s law, or is it something else?

SHAPIRO: There are two different things coming into play here that are going to

take that trunk full of computers and bring it down to a very small, compact, efficient form factor. It’s not really about Moore’s law because Moore’s law is really slowing down. The way we’re combating Moore’s law is by increasing the parallel processing that takes place. So a GPU with its massively parallel capabilities will enable all of this data to be processed in real time. In addition, having an open platform that can be configured depending on the needs of the automaker will be key. That’s what we’ve done with our Drive PX solution, a highly parallel, very-high-performance supercom-puter that’s in a small, energy-efficient form factor that can run inside the vehicle. It’s been designed both as a development platform and as a system that can go into pro-duction. The combination of that hardware platform with a very robust development environment enables automakers to customize as they see fit. Each automaker has their own R & D efforts going on, their own teams that are working on different ways to solve these problems. The Drive PX platform is a solution that they can build upon. It’s not just a turnkey box in the car, but rather a solution automakers and suppliers can customize and use as a tool to differentiate their brand.

Drive PX (Figure 1) features two of our Tegra X1 processors. Each of those is a 1 tera-flops processor, so one trillion floating-point operations per second. If we go back to the year 2000, the United States’ fastest supercomputer was a 1 teraflops processor that took up 1,400 square feet and consumed 500,000 watts of power. This was a massive supercomputer in the year 2000; now it’s on a chip the size of your thumb-nail. We’re able to deliver a massive amount of computational horsepower to run the algorithms to analyze those frames of video, but also to fuse the data together – those radar or lidar point clouds coming in – to build a very accurate, detailed map. But we can also fuse other data. If we have a high-definition map from a third party we can better understand where we are on that map, which is really critical for navigation purposes and staying in a lane, or knowing which lane we need to be in. Also, when V2V communication is out there we’ll be able to take that data and fuse it as well – it just becomes another source of information that will help us better understand and anticipate what else is happening around our vehicle.

PC/104 AND SFF: Until we have fully autonomous vehicles, how is all of this information going to be displayed to drivers in a way that is digestible and useful, but still safe?

SHAPIRO: The key is to be able to have a very tight connection between the autono-mous car and the driver, and be able to give the driver confidence that the car is sensing what it needs to sense. So the in-vehicle displays will need to manage the handoff from the driver to the car and then back to the driver, but also be able to showcase what the

Figure 1 | The NVIDIA Drive PX platform features two Tegra X1 processors, each capable of 1 trillion floating-point operations per second for demanding image detection and recognition tasks in advanced driver assistance systems (ADAS).

PROCESSOR ARCHITECTURE Mobile Processors



Support every step of the way with open source vision

Support every step of the way with open source visionOPEN

Embedded systems that are built to endure

Embedded systems that are built to endureRUGGEDWe’ve never

discontinued a product in 30 years

We’ve never discontinued a product in 30 years LONG LIFE Unique embedded

solutions add value for our customers

Unique embedded solutions add value for our customersORIG

INAL

www.embeddedARM.com(480) 837-5200

TS-7250-V2Single Board ComputerExtensible PC/104 Embedded System with CustomizableFeatures and Industrial Temps

$165Starting at

$199Qty 100

Qty 1Available with

TS-ENC720 enclosure

800 MHz or 1 GHz Marvell PXA166 ARM CPU

Dual Ethernet8k or 17k LUT FPGAPC/104 Connector2 GB SLC eMMC Flash Storage512 MB DDR2 RAM

PC/104 Peripherals Multi-Function Daughter Cards

Digital I/O Boards

Intelligent battery back-upMulti-tech GSM, GPRS, HSPA modem boardsSoftware Controlled RelaysUltra Long Range Wireless

Our Line of PC/104 Peripheral Boards Oer Maximum Functionality at Minimum Cost.

$30Starting at

$32Qty 100

Qty 1Much more....

car is seeing and what the car’s intent is – we don’t want the car to do something that surprises the driver. Those kinds of systems are being worked on today, but there are both graphical as well as audi-tory ways of communicating.

Also, there will be opportunities to give the driver other information if they’re in autonomous mode, whether they’re reading their emails or in a conference call, doing a WebEx or video chat. Those systems will start to evolve, and we’ve seen some prototypes with concept cars where that’s happening, such as Audi and Volvo. The key thing is that the sys-tems are part of the vehicle. If there is a situation where the driver needs to be alerted, that can be done through that in-vehicle system rather than if somebody is busy looking at a tablet or a smartphone where there’s no con-nection to the vehicle. When that other entertainment or work experience is managed through the vehicle, it will be much safer.

PC/104 AND SFF: What do you see coming in the next five to ten years in the evolution of active safety systems?

SHAPIRO: We’re well underway towards developing autonomous cars. We have prototypes on the road already, and you see a very active automotive commu-nity that’s developing on Drive PX. We have more than 50 different automakers, Tier 1 suppliers, and other research insti-tutions using the platform, so we’ll see autonomous driving sooner than many people expect. Commercial deploy-ment is still a couple of years away, but the first phase of our work is coming to market in 2017 with Audi and their Traffic Jam Assist system based on our Tegra platform; beyond that, there will be numerous automakers that are going to be bringing our technology to market.

Longer-term, we’re going to see wide-spread adoption of autonomous cars, new business models, and ownership models. Over time we’ll see how that

plays out, but we have traditional auto-makers and nontraditional companies that are getting into the transportation space that will leverage autonomous vehicle technology.

Danny Shapiro is NVIDIA’s senior director of automotive, focusing on auto design and in-vehicle solutions for infotainment, navigation, and driver assistance. He is a 25-year veteran of the computer graphics and semiconductor industries and has been with NVIDIA since 2009. Prior to joining NVIDIA, Mr. Shapiro served in marketing, business develop-ment, and engineering roles at ATI, 3Dlabs, Silicon Graphics, and Digital Equipment. Danny holds a bachelor’s degree in electrical engineering and computer science from Princeton University and an MBA from the Hass School of Business at the University of California, Berkeley.

www.nvidia.com



http://www.embeddedARM.com

http://www.nvidia.com

FEATURES

ĄĄ Q-Service Plus helps our customers reduce time spent on troubleshooting while expediting the development process, thus shortening time-to-market of new products. Q-Service Plus benefits include cost savings, risk reduction and “at your service” support from AAEON’s US-based design and field engineers. With Q-Service Plus, AAEON is committed to and GUARANTEES: • Quick circuit review of your carrier board within 5 business days • Quick preliminary troubleshooting feedback within 1-2 business days • Quick BIOS modification within 5 business days • Quick compatibility & reliability de-bugging resolution within 3-5

business days

AAEON’s NanoCOM-BT Type 10 CPU module is a cutting-edge product that provides high performance and low power consumption in the embedded market.NanoCOM-BT adopts the latest Intel® Atom™ N2000/E3800 processor. The system memory deploys with onboard DDR3L 2GB or 4GB memory. In addition, Intel® I210 supports 10/100/1000Base-TX that allows faster network connections. This model applies three PCI-Express (x1), one LPC bus, and one SMBus. Moreover, two SATA 3.0Gb/s are config-ured on the NanoCOM-BT. NanoCOM-BT also equips six USB2.0 and one USB2.0/3.0 bus for flexible I/O expansions.The display of NanoCOM-BT supports LVDS/DDI simultaneous/dual view display. This brand new COM Express Module is developed to cater to the requirements of Automation, Medical, Ticket Machine, Transpor-tation, Gaming, KIOSK and POS/POI applications, to name a few.

NanoCOM-BT

COMs and SoMs

smallformfactors.opensystemsmedia.com/p365753

AAEON Electronics Inc.www.aaeon.com

[email protected] Toll Free: 1-877-TO-AAEON (1-877-862-2366) https://www.linkedin.com/company/aaeon

PC/1

04 a

nd S

mal

l For

m F

acto

rs

Reso

urce

Gui

de


AAEON Electronics, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

ACCES I/O Products, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-21

Active Silicon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

ADL Embedded Solutions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

ADLINK Technology, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-27

Advanced Micro Peripherals, Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Alphi Technology Corporation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

congatec inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Connect Tech, Inc. (CTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Connect Tech, Inc. (CTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Connect Tech, Inc. (CTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Curtiss-Wright . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Elma Electronic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Intermas, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

North Atlantic Industries. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

PEAK-System Technik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-24

RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28, 30

RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Themis Computer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

VersaLogic Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

WinSystems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Company Category Page

RESOURCE GUIDE INDEX


http://www.aaeon.com


https://www.linkedin.com/company/aaeon






















http://smallformfactors.opensystemsmedia.com/p365753

FEATURES

ĄĄ COM Express Type 10 • Extremely small size, 84mm x 55mm • 1x High Density Connector for Breakout Board Utilization • Expansion via Mini PCI Express • Use with Off-the-Shelf or Custom designed breakout boards • Extended Temperature Range -40°C to +85°CĄĄ COM Express Type 6

• 125mm x 95mm (4.92" x 3.74") • 3x Mini PCIe Modules • 4x GbE Ports with On-Board Magnetics • PCI Express x16 Bus Design Access • Use with Off-the-Shelf or Custom designed breakout boards • Extended Temperature Range -40°C to +85°C

Connect Tech’s latest COM Express® Type 10 and Type 6 carriers, change the design process completely! The high density board to board connectors can be used with either off-the-shelf or custom breakout boards, dramatically reducing the need for cabling.

With complex circuitry available on the carrier, such as Gigabit Ethernet, USB 3.0, Serial, and Display, makes for ease of use with off the shelf breakout boards, or easy design of a custom breakout board to meet your needs. In addition, both unused SATA Links and PCIe x1 Links with clocks are provided to the breakout board. All this allows for breakout board expansion to meet your design needs.

NEW! COM Express® Type 10 and Type 6 Rugged Carriers

COMs & SOMs


Connect Tech http://bit.ly/1Q3qY2Z

[email protected] 519-836-1291 linkedin.com/company/connect-tech-inc @connect-tech-inc

FEATURES

ĄĄ Astro Carrier for NVIDIA® Jetson™ TX1 • 87mm x 57mm (3.43" x 2.24") • 2 Gigabit (10/100/1000) Ports • USB and HDMI Ports • Use with COTS or custom break out boards • Extended Temperature Range -40°C to 85°CĄĄ Elroy Carrier for NVIDIA® Jetson™ TX1

• 87mm x 50mm (3.425” x 1.968”) • Head-to-Head Dual Mini-PCIe • Dual CSI 2-Lane Camera Interfaces • Extended Temperature Range -40°C to 85°C

Astro and Elroy carriers are designed specifically designed to work with the NVIDIA® Jetson™ TX1 providing a small form factor ideal for rugged applications where size, weight and power are critical.Astro Carrier for NVIDIA® Jetson™ TX1 is specifically designed to work with the NVIDIA® Jetson™ TX1 supercomputer-on-module. The Astro Carrier is a two board solution that provides access to many different features found on the Jetson TX1 module in an extremely small footprint (87mm x 57mm/3.43" x 2.24"). It makes use of a high density, board-to-board connector that allows for use with Connect Tech’s off the shelf or custom designed break out boards.Elroy Carrier for NVIDIA® Jetson™ TX1 with a lighter feature set than Astro, brings a lower cost carrier board solution to Jetson TX1 users. Designed to match the Jetson TX1 form factor, the Elroy’s design includes Mini-PCIe/mSATA expansion, HDMI Video, USB 3.0 and 2.0, and two Serial Ports for RS-232/485. In addition, two CSI 2-Lane Camera inter-faces are available for video or image capture. Elroy for Jetson TX1 is a single carrier board solution .

Astro and Elroy Carriers for NVIDIA® Jetson™ TX1

COMs & SOMs




FEATURES

PC/104 and Small Form

Factors Resource Guide



http://bit.ly/1Q3qY2Z






https://twitter.com/connect-tech-inc


https://www.linkedin.com/company/connect-tech-inc


ACCES I/O Products is pleased to announce the release of a new family of mini PCI Express (mPCIe) multi-port serial communication cards. These small, low-priced, PCI Express Mini cards feature a selection of 4 or 2-ports of software selectable RS-232/422/485 asynchronous serial protocols on a port by port basis. These cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale sys-tems, kiosk design, retail, hospitality, automation, gaming and more. The small size (just 50.95mm x30mm) allows for maximum performance in applications where space is a valuable resource.Each RS-232 port is simultaneously capable of supporting data communication rates up to 921.6 kbps. RS-422/485 modes support data communication speeds up to 3 Mbps. The cards provide ±15kV ESD protection on all signal pins to protect against costly damage due to electrostatic discharge. Existing serial peripherals can connect directly to industry standard DB9M connectors on the optional breakout cable accessory kits.The mPCIe-COM cards were designed using type 16C950 UARTs and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI and PCI Express 16550 type UART applications and allow users to maintain backward compatibility.

mPCIe-COM Family PCI Express Mini Cards

Hardware and Peripherals


ACCES I/O Products, Inc.www.accesio.com

[email protected] 1-858-550-9559 linkedin.com/company/acces-i-o-products-inc. twitter.com/accesio

FEATURES

ĄĄ PCI Express Mini Card form-factor (mPCIe) type F1, with latching I/O connectorsĄĄ 4 or 2-port serial communication cards with optional DB9M connectivityĄĄ Software selectable RS-232, RS-422, and RS-485 protocols, per port

stored in EEPROMĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each TX

and RXĄĄ Port-by-port field selectable termination for RS-422/485 applicationsĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standardĄĄ Supports data communication rates up to 3Mbps simultaneously, (RS-232

up to 921.6 kbps)ĄĄ Custom baud rates easily configuredĄĄ ±15kV ESD protection on all signal pinsĄĄ CTS, RTS, 9-bit data mode, and RS-485 full-duplex (4 wire) fully supportedĄĄ RS-232 only and RS-422/485 versions available

FEATURES

ĄĄ Ethernet 10/100 RJ45 connector for interfacing to CPU or networkĄĄ 48 or 24 channel high-current TTL digital I/O linesĄĄ Compatible with industry standard I/O racks such as Grayhill, Opto 22,

Western Reserve Controls, etc.ĄĄ Eight-bit ports software selectable for inputs or outputsĄĄ All 48 digital I/O lines buffered with 32 mA source/64mA sink current

capabilitiesĄĄ Jumper selectable I/O pulled up to 5V (via 10KΩ) for contact monitoring,

pulled down to ground or floatingĄĄ Resettable 0.5A fused +5VDC output per I/O connectorĄĄ OEM version (board only), features PC/104 size and mounting compatibilityĄĄ Small, (4"x4"x1.7") rugged, steel industrial enclosureĄĄ LVTTL (3.3V) and -40°C to +85°C industrial operating temperature

available as factory options

Designed for compact control and monitoring applications, this product features 48 or 24 industrial strength TTL digital I/O lines. This Ethernet device is an ideal solution for adding portable, easy-to-install, digital I/O to any Ethernet network, even wirelessly. The ETH-DIO-48 is excellent for use in applications sensing inputs such as switch closures, TTL, LVTTL, CMOS logic, and is ideal for controlling external relays, driving indicator lights, and more. Applications include home, portable, tablet, laboratory, industrial automation, and embedded OEM.

Available accessories include a broad range of ribbon cables, screw terminal boards, optically isolated adapters, electromechanical relay boards, and industry standard solid state module racks. Special order items such as conformal coating, custom software, right angle headers, and more, are also available.

ETH-DIO-48 Ethernet 48-Channel Industrial Strength Digital I/O



ACCES I/O Products, Inc.www.accesio.com/eth-dio-48


PC/1

04 a

nd S

mal

l For

m F

acto

rs

Reso

urce

Gui

de



http://www.accesio.com


http://www.accesio.com/eth-dio-48




https://www.linkedin.com/company/acces-i-o-products-inc.

https://twitter.com/accesio



FEATURES

ĄĄ Rugged, industrialized, four-port USB hubĄĄ High-speed USB 2.0 device, USB 3.0, and 1.1 compatibleĄĄ Extended temperature operation (-40°C to +85°C)ĄĄ Data transfer rates up to 480 MbpsĄĄ Supports bus-powered and self-powered modesĄĄ Three power input connectors (power jack, screw terminals, or 3.5" drive

Berg power connector)ĄĄ LED status indicators for power and overcurrent fault conditions for each

downstream portĄĄ USB/104 form factor for OEM embedded applicationsĄĄ OEM version (board only) features PC/104 module size and mountingĄĄ Includes micro-fit embedded USB header connectors in parallel with all

standard USB connectorsĄĄ Industrial grade USB connectors feature high-retention designĄĄ Small (4" x 4" x 1"), low profile, steel enclosureĄĄ 3.5" front panel drive bay mounting provision

This small industrial/military grade hub features extended temperature operation (-40°C to +85°C), high-retention USB connectors, and an industrial steel enclosure for shock and vibration mitigation. The OEM version (board only) is PC/104 sized and can easily be installed in new or existing PC/104-based systems as well. The USB-104-HUB now makes it easy to add additional USB-based I/O to your embedded system or to connect peripherals such as external hard drives, keyboards, GPS, wireless, and more. Real-world markets include Industrial Automation, Embedded OEM, Laboratory, Kiosk, Transportation/Automotive, and Military/Government.

This versatile four-port hub can be bus powered or self powered. You may choose from three power input connectors: DC power input jack, screw terminals, or 3.5" drive power connector (Berg). Mounting provisions include DIN rail, 3.5" front panel drive bay mounting, and various panel mounting plates.

USB-104-HUB – Rugged, Industrial Grade, 4-Port USB Hub





The mPCIe-ICM Series isolated serial communication cards measure just 30 x 51 mm and feature a selection of 4 or 2 ports of isolated RS232 serial communica-tions. 1.5kV isolation is provided port-to-computer and 500V isolation port-to-port on ALL signals at the I/O connectors. The mPCIe-ICM cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, and gaming.The RS232 ports provided by the card are 100% compatible with every other industry-standard serial COM device, supporting TX, RX, RTS, and CTS. The card provides ±15kV ESD protection on all signal pins to protect against costly dam-age to sensitive electronic devices due to electrostatic discharge. In addition, they provide Tru-Iso™ port-to-port and port-to-PC isolation. The serial ports on the device are accessed using a low-profile, latching, 5-pin Hirose connector. Optional breakout cables are available, and bring each port connection to a panel-mountable DB9-M with an industry compatible RS232 pin-out.The mPCIe-ICM cards were designed using type 16C950 UARTS and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI 16550 type UART applications and allow for users to maintain backward compatibility.

mPCIe-ICM Family PCI Express Mini Cards





FEATURES

ĄĄ PCI Express Mini Card (mPCIe) type F1, with latching I/O connectorsĄĄ 4 or 2-port mPCIe RS232 serial communication cardsĄĄ Tru-Iso™ 1500V isolation port-to-computer and 500V isolation

port-to-port on ALL signalsĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each

TX and RXĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standardĄĄ Supports data communication speeds up to 1 Mbps simultaneouslyĄĄ Custom baud rates easily configuredĄĄ ±15kV ESD protection on all signal pinsĄĄ 9-bit data mode fully supportedĄĄ Supports CTS and RTS handshaking















FEATURES

ĄĄ InterShell is a new aluminum housing enclosure composed of a top and bottom, two front panels, and four screwsĄĄ The simple housing design offers an uncomplicated solution for small

form factors for easy and quick assemblyĄĄ Color options are unlimited and customer-specific print is possibleĄĄ InterShell is used for the packaging of small electronic units such as

Eurocard formats with 100x160 mm, universal formats, or as mITX formats for exampleĄĄ Excellent EMC compliancyĄĄ InterShell is available in the following standard dimensions (h/w/d)

as well as customized formats: • 40x106.6x168.6 mm • 60x150x120 mm • 50x190x190 mm

Intermas develops electronic enclosure systems:Cabinets, housings, subracks, and an extensive range of accesso ries for the 19" rack systems and small form factors used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection.Intermas has an extensive product range of more than 10,000 sepa-rate components and more than 30 years’ experience.

Go towww.Intermas-US.com

for our new catalog.

InterShell Enclosures



Intermas US LLCwww.Intermas-US.com

[email protected] 800-811-0236

FEATURES

ĄĄ 24 x 1G Copper (10/100/1000 Mbps), 8 x 1G (SGMII) and 4 x 10G uplinks (SFI) ĄĄ 8, 12 or 24 x 10/100/1000 Mbps Port Switch ĄĄ Latest Generation 32-bit Switch Engine ĄĄ Web GUI or CLI Management ĄĄ Carrier Grade Ethernet Switching ĄĄ Air Cooled or Conduction Cooled options ĄĄ Suitable for standalone use or choose from PC/104 compatible

footprints ĄĄ Single Wide Range Input Voltage +9V to 36V or +4V to 14V ĄĄ Extended Temperature Range -40°C to +85°C

Connect Tech’s expansive line of Xtreme/GbE and Xtreme/10G Managed Carrier Ethernet Switches provide Carrier Grade Ethernet switching capabilities in an extremely small embedded form factor, excellent for high-end applications such as Mobile and Microwave backhaul. NEW! The natural progression of our growing line of Managed Ethernet Switches now includes a small form factor 10GbE Managed Carrier Ethernet Switch. Connect Tech’s Xtreme/10G Managed Ethernet Switch provides high density, high port count Layer 2 switching and Layer 3 routing with 10G uplinks. A total of 36 switchable ports, with 4 x 10G, 8 x 1G (SGMII) and 24 x 1G (Copper 10/100/1000Mbps) ports in an extremely small form factor, 85mm x 85mm. Xtreme/10G targets managed Layer 2 and Layer 3 equipment in SMB, SME, and industrial applications where high port count, 1G switching with 10G aggrega¬tion/uplinks are required. Choose RJ-45's, Rugged Positive Locking Headers or our Board to Board connector scheme that connects to readily available break out boards or high speed cables.

Xtreme/10G, Xtreme/GbE Managed Carrier Ethernet Switch





PC/1

04 a

nd S

mal

l For

m F

acto

rs

Reso

urce

Gui

de



http://www.Intermas-US.com

http://www.Intermas-US.com








CAN Interface for PC/104-Plus

The PCAN-PC/104-Plus card enables the connection of one or two CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot bracket supplied.

The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides.

The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.

PCAN-PC/104-Plus



PEAK-System Technik GmbHwww.peak-system.com/quick/PC104-2

[email protected] +49 (0) 6151-8173-20 @PEAK_System

FEATURES

ĄĄ Form factor PC/104ĄĄ Use of the 120-pin connection for the PCI busĄĄ Up to four cards can be used in one systemĄĄ 1 or 2 High-speed CAN channels (ISO 11898-2)ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/sĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance

with CiA® 102)ĄĄ NXP SJA1000 CAN controller, 16 MHz clock frequency ĄĄ NXP PCA82C251 CAN transceiverĄĄ 5-Volt supply to the CAN connection can be connected through a solder

jumper, e.g. for external bus converterĄĄ Extended operating temperature range from -40 to 85 °C (-40 to 185 °F)

Optionally available:ĄĄ Galvanic isolation on the CAN connection up to 500 V, separate for each

CAN channelĄĄ PC/104-ISA stack-through connector

CAN Interface for PC/104

The PCAN-PC/104 card enables the connection of one or two CAN networks to a PC/104 system. Multiple PCAN-PC/104 cards can easily be operated using interrupt sharing.

The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides.


PCAN-PC/104





FEATURES

ĄĄ Form factor PC/104ĄĄ Multiple PC/104 cards can be operated in parallel (interrupt sharing) ĄĄ 14 port and 8 interrupt addresses are available for configuration using

jumpersĄĄ 1 or 2 High-speed CAN channels (ISO 11898-2)ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/sĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance

with CiA® 102)ĄĄ NXP SJA1000 CAN controller, 16 MHz clock frequency ĄĄ NXP PCA82C251 CAN transceiverĄĄ 5-Volt supply to the CAN connection can be connected through a solder

jumper, e.g. for external bus converterĄĄ Optionally available with galvanic isolation on the CAN connection up to

500 V, separate for each CAN channelĄĄ Extended operating temperature range from -40 to 85 °C (-40 to 185 °F)





http://www.peak-system.com/quick/PC104-2






https://twitter.com/peak_system


CAN Interface for PCI/104-Express

The PCAN-PCI/104-Express card enables the connection of one, two, or four CAN buses to a PCI/104-Express system. Up to four cards can be stacked together. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. The card is available as a single, dual, or four-channel version.


PCAN-PCI/104-Express





FEATURES

ĄĄ PCI/104-Express card, 1 lane (x1)ĄĄ Form factor PC/104ĄĄ Up to four cards can be used in one systemĄĄ 1, 2, or 4 High-speed CAN channels (ISO 11898-2)ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/sĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) ĄĄ Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance

with CiA® 102)ĄĄ FPGA implementation of the CAN controller (SJA1000 compatible)ĄĄ NXP PCA82C251 CAN transceiverĄĄ Galvanic isolation on the CAN connection up to 500 V, separate for each

CAN channelĄĄ Supplied only via the 5 V lineĄĄ 5-Volt supply to the CAN connection can be connected through a solder

jumper, e.g. for external bus converterĄĄ Extended operating temperature range from -40 to 85° C (-40 to 185° F)ĄĄ Optionally available: PCI-104 stack-through connector

Four-Channel CAN Interface for PC/104-Plus

The PCAN-PC/104-Plus Quad card enables the connection of four CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides.


PCAN-PC/104-Plus Quad





FEATURES

ĄĄ Form factor PC/104ĄĄ Use of the 120-pin connection for the PCI busĄĄ Up to four cards can be used in one systemĄĄ 4 High-speed CAN channels (ISO 11898-2)ĄĄ Bit rates from 5 kbit/s up to 1 Mbit/sĄĄ Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) ĄĄ Connection to CAN bus through D-Sub slot brackets, 9-pin (in accordance

with CiA® 102)ĄĄ FPGA implementation of the CAN controller (SJA1000 compatible)ĄĄ NXP PCA82C251 CAN transceiverĄĄ Galvanic isolation on the CAN connection up to 500 V, separate for each

CAN channelĄĄ 5-Volt supply to the CAN connection can be connected through a solder

jumper, e.g. for external bus converterĄĄ Extended operating temperature range from -40 to 85 °C (-40 to 185 °F)ĄĄ Optionally available: PC/104-ISA stack-through connector

PC/1

04 a

nd S

mal

l For

m F

acto

rs

Reso

urce

Gui

de











FEATURES

ĄĄ Miniature SWaP-optimized quad-core NXP i.MX6 ARM processor systemĄĄ Weight: < 1.5 lbs (< 0.68 kgs)ĄĄ Modular I/O architecture: two slots for PCIe Mini-Cards

(for add-on I/O)ĄĄ mSATA rugged Flash solid state disk (SSD)ĄĄ 28 VDC filtered MIL-STD-1275/704/DO-160 power supply

for “dirty power” of aircraft and ground vehiclesĄĄ Rugged IP67 chassis with micro-mini MIL-performance circular

connectors

The Parvus DuraCOR® 310 Mission Computer is the company’s first ultra-small form factor (USFF) mission computer to feature a very low power quad-core ARM® microprocessor. Ideal for a wide range of applications and platforms that require an extremely size, weight, power and cost (SWaP-C) optimized mission computer, the DuraCOR 310 is designed to meet the demanding MIL-STD-810G, MIL-STD-461F, MIL-STD-1275D, MIL-STD-704F and RTCA/DO-160G environmental, power and EMI standards.75% smaller than traditional mission computers and ~50% lighter than Curtiss-Wright’s previous small, rugged mission computer, the DuraCOR 310 further establishes the company as a leading supplier of open standards-based, COTS, miniature mission computer solutions. This groundbreaking miniature mission computer features an NXP™ Semiconductor (formerly Freescale™) i.MX6 ARM processor on an industrial-grade Computer-on-Module (COM) tightly integrated with a Flash SSD. The super compact unit weighs less than 1.5 lbs., measures only ~39 in³ volume (est.), requires less than 10W of power, and supports a wide operating temperature range of -40 to +71ºC (-40to +160ºF) without fans or active cooling requirements.

Parvus DuraCOR 310

Processing


Curtiss-Wright Defense Solutionshttps://www.curtisswrightds.com

[email protected] +1.703.779.7800 www.linkedin.com/company/curtiss-wright-defense-solutions @curtisswrightds

FEATURES

ĄĄ Layer 2/3 Enterprise non-blocking network switch for demanding SWAP-C environmentsĄĄ 16x GigE Ethernet ports with auto tri-speed 10/100/1000Mbps

and MDIXĄĄ MIL-STD-1275E – Ground vehicle power; MIL-STD-704F –

Aircraft power (with no hold up); MIL-STD-461F – EMI; MIL-STD-810G – EnvironmentalĄĄ 10 or 16 port versionsĄĄ Full featured AMD Fusion APU for VICTORY or user applicationsĄĄ 1GB DRAM, 64GB SSDĄĄ Operating temperature: -40°C to 71°C

NanoSWITCH is a SWAP-C optimized rugged multi-layer gigabit Ethernet switch with an embedded x86 PC. The NanoSWITCH brings enterprise level layer 2/3 switching to rugged environments including military ground, air and sea vehicles, and unforgiving industrial environments. Typical applications include vehicle network switching, distributed architecture vehicle controller, VICTORY compliant switch, router, timing, and control, WAN/LAN interconnectivity and firewall, and shared processing and peripheral communications. NanoSWITCH provides 16x or 10x external Gigabit Ethernet ports that operate at rates of 10, 100, and 1000 Mbps. A full management suite is included, as well as a Command Line Interface (CLI) for controlling switch and routing opera-tions. The NanoSWITCH supports sophisticated IPv4 and IPv6 routing, including tunneling and IP Multicast, VLANs, and IETF, IEEE, and DSL Forum standards. The NanoSWITCH includes numerous Quality of Service (QoS) features to ensure that traffic is prioritized to deliver the superior performance for real-time appli-cations including system management, voice, video, and bandwidth-intensive file uploads and downloads. NanoSWITCH is available in a VICTORY software configuration. The VICTORY open standard, or “Vehicular Integration for C4ISR/EW Interoperability” stan-dard (http://victory-standards.org/), provides a common data-bus centric approach to sharing services and hardware components, eliminating redun-dancy and reducing SWAP in Army ground vehicles.

NanoSWITCH



Themis Computerwww.themis.com/nanoswitch

[email protected] 408-623-1545 http://www.linkedin.com/company/17952 @Themis_Computer





https://www.curtisswrightds.com


http://www.linkedin.com/company/curtiss-wright-defense-solutions

http://victory-standards.org/

http://www.themis.com/nanoswitch


http://www.linkedin.com/company/17952



https://twitter.com/themis_computer

https://twitter.com/curtisswrightds

FEATURES

ĄĄ 6th gen Intel® Core™ i7/i5/i3, Intel® Pentium® G4400/G4400TE and Celeron® G3900/G3900TE desktop processor with Intel® Q170/H110 chipsetsĄĄ Up to 32 GB dual channel DDR4 at 2133 MHzĄĄ Intel® Gen 9 graphics, 3x DP, LVDS co-lay with eDP (opt.)ĄĄ 1x PCIe x16 (Gen 3), 1x PCIe x1 (Gen 2), 1x full size Mini PCIe + USB

or mSATA, 1x half size Mini PCIe + USB, 1x SPI header for external BIOSĄĄ 7x USB 3.0, 4x USB 2.0; H110: 4x USB 3.0, 7x USB 2.0ĄĄ Smart Embedded Management Agent (SEMA) functions

ADLINK’s AmITX-SL-G is a compact embedded computing platform that fol-lows the Form, Fit, Function principle for scalable development; board designs feature a layout consistent for connector and pinout locations, allowing easy upgrades with no need to modify the enclosure or cabling, reducing time-to-market for embedded applications. The latest AmITX-SL-G combines the new 6th generation Intel® Core™ i7/i5/i3 processors and Intel® Q170/H110 chip-sets with one of the industry’s most versatile form factors. The result is a space-saving, entry-level embedded board with high processing speeds and fast graphics rendering for infotainment, industrial and medical applications.The AmITX-SL-G supports up to 32 GB of dual channel non-ECC DDR4 mem-ory at 1867 MHz, doubling the memory capacity while reducing the footprint of previous models. With the Intel® Q170 and H110 chipsets and HD Iris™ Pro graphics, the processor offers faster 3D imaging and video conferencing, ultra HD/4K resolution across three display ports for medical-grade images and low-power transcoding for HEVC/H.265, VP8, VP9 and VDENC formats.The Mini-ITX form factor is the smallest in the ITX inventory. At only 170 mm square and approximately 35 mm thick, its small size is ideal for self-service kiosks, on-display mount, stand-alone gaming systems or any limited-space application.

AmITX-SL-G Mini-ITX Embedded Board

SBCs and Boards


ADLINK Technologyhttp://www.adlinktech.com

[email protected] 800-966-5200 www.linkedin.com/company/adlink-technology @ADLINKTech_usa

FEATURES

ĄĄ 4 x USB 3.0 compliant downstream portsĄĄ Dual full USB 3.0 bandwidth, each channel split into 2 x USB

3.0 portsĄĄ Based on proven Renesas USB 3.0 Host ControllerĄĄ Rugged PCIe/104 form-factorĄĄ Universal operation: Type 1 or Type 2 hostsĄĄ Windows and Linux support

Active Silicon’s FireBird Quad USB 3.0 Controller supports four USB 3.0 ports arranged as two ports per host controller with each controller having its own PCI Express x1 Gen2 interface to give a combined total data throughput of 10 Gbps. This archi-tecture allows two USB 3.0 devices operating simultaneously at full bandwidth, or four devices operating simultaneously sharing the combined bandwidth of two full speed links.The USB 3.0 Host Controllers used are the proven Renesas µPD720202. Software support is based on the Renesas driver stack and is GenICam compliant.

FireBird Quad USB 3.0 Controller

SBCs and Boards


Active Siliconhttps://www.activesilicon.com/

[email protected] +44 (0) 1753 650 600 www.linkedin.com/company/active-silicon twitter.com/ActiveSilicon

PC/1

04 a

nd S

mal

l For

m F

acto

rs

Reso

urce

Gui

de



http://www.adlinktech.com


http://www.linkedin.com/company/adlink-technology

https://www.activesilicon.com/


http://www.linkedin.com/company/active-silicon



https://twitter.com/adlinktech_usa

https://twitter.com/activesilicon

FEATURES

ĄĄ 4th generation Intel® Atom™ ProcessorĄĄ PCIe104, miniPCI-e, and PCI-104 expansionĄĄ Dual Independent displaysĄĄ Dual Gigabit EthernetĄĄ 1x USB3.0 portĄĄ 4x USB2.0 portĄĄ Integrated audio controller

The TinyATOM is a highly integrated single board computer on the PCI/104-Express stackable form factor. The TinyATOM is powered by a 4th Generation Intel® Atom™ processor and offers a range of expansion options ideal for building high performance, rugged embedded systems.The TinyATOM is an industry standard PCI/104-Express form factor and offers both PCI Express and traditional 32bit PCI interfaces. The TinyATOM has 4Gbytes of DDR3 SDRAM and an on-board 8Gbyte solid state eMMC Flash drive for appli-cation and data storage. Off board data storage can be achieved using either the high speed SATA drive interface or the USB 3.0 port. Dual Gigabit Ethernet inter-faces provide extensive connectivity options. A single miniPCIe slot completes the expansion options and allows wireless Ethernet or high speed mobile broadband to be easily added to an embedded system.The TinyATOM is supported by Windows and Linux. Extended temperature available.

TinyATOM – Intel® Atom™ Based Low Power PCI/104-Express SBC

SBCs and Boards


Advanced Micro Peripheralshttp://www.amp-usa.com/pc104/proc/tinyatom.php

[email protected] 212-951-7205 @adv_micro_Perip www.linkedin.com/company/advanced-micro-peripherals

Relevant Applications: • Industrial Automation Controller • Portable Test Equipment • Mission computers • Backbone communication routers • Point-of-sale and Kiosk applications • Security, Transportation, Telematics • Embedded Internet/Intranet Appliance • Rugged Harsh Environment Applications

FEATURES

ĄĄ Ultra low power DM&P Vortex86DX3 SoC

ĄĄ Full ISA bus support

ĄĄ 2GB soldered DDR3L

ĄĄ 1x GbE, 1x Fast Ethernet

ĄĄ SATA, CFast

ĄĄ VGA and 18/24-bit single channel TTL/TFT

ĄĄ Smart Embedded Management Agent (SEMA) functions

ADLINK’s CoreModule CM1-86DX3 PC/104 SBC features a DMP Vortex86-DX3 single chip solution and excellent performance to power ratio. The board includes all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphics controller and audio controller together and an additional Gigabit Ethernet controller to form a complete PC, with all the standard peripherals already onboard.I/O includes two Ethernet ports (1x GBit and 1x 100MBit), four RS232/RS422/RS485 serial ports, PS/2 connectors for keyboard and mouse and two USB 2.0 host controllers to handle communication with external devices. A first generation SATA interface allows the connection of hard disk or CD drives. Applications that require non-moving storage can use the microSD card slot or bootable flash. System expansion can easily be realized over the PC/104, Mini-PCI-Express and I2C bus connectors. The CM1-86DX3 runs DOS, Win CE 6.0, WEC7, WES2009, WES7 and Linux operating systems. The Vortex86-DX3 SoC also offers a simulated advanced configuration and power interface (ACPI) to support Windows 7. The CM1-86DX3 also supports Smart Embedded Management Agent (SEMA) and SEMA Cloud functionality for remote management and control.

CM1-86DX3 PC/104 Single Board Computer

SBCs and Boards


ADLINK Technologyhttp://www.adlinktech.com

[email protected] 800-966-5200 www.linkedin.com/company/adlink-technology @ADLINKTech_usa





http://www.amp-usa.com/pc104/proc/tinyatom.php


http://www.linkedin.com/company/advanced-micro-peripherals

http://www.adlinktech.com


http://www.linkedin.com/company/adlink-technology



https://twitter.com/adv_micro_perip

https://twitter.com/adlinktech_usa

The LAN35MH08HR is an 8-port 10/100/1000 Managed Ethernet switch. This switch module has a total of 10 ports: eight ports are provided to I/O connectors, one port is available to the host CPU through a x1 PCI Express GigE controller, and one port is used as a stacking switch expan-sion port allowing full compatibility with RTD’s managed and unmanaged StackNET™ Ethernet switch family. Additionally, this allows the CPU to use the switch without the need for external cables. The LAN35MH08HR can also be used as an expandable, standalone 8-port Ethernet switch.The onboard CEServices Carrier Ethernet switching software provides a rich Layer 2 switching solution with Layer 3-aware packet processing. All of the industry-standard Managed Ethernet Switch features found in an enterprise rackmount switch are provided, such as VLANs, Spanning Tree, QoS, and SNMP. Additionally, the CEServices software provides fea-tures for carrier and timing-critical networks such as OAM, Synchronous Ethernet, and IEEE 1588. The switch may be configured via a web GUI interface, or a command-line console via USB, Telnet, or SSH.

Managed Scalable GigE Switch

SBCs and Boards


RTD Embedded Technologies, Inc.www.rtd.com/switch


FEATURES

ĄĄ -40 to +85°C operation, passively cooledĄĄ PCIe/104 stackable bus structureĄĄ Eight 1000/100/10 Mbps Ethernet ports plus one host port and one

stacking switch expansion portĄĄ Onboard tri-color LED for each Ethernet PortĄĄ RJ-45 jacks or 10-pin right-angle headersĄĄ Fully-managed Layer 2 Ethernet Switch with Layer 3-aware packet

processing • Support for all major Enterprise switching features such as VLANs,

Spanning Tree, QoS, and SNMP • Manageable via web GUI interface, SSH, Telnet, and Serial Console • Industry-standard CLI interfaceĄĄ Onboard PCI Express Ethernet Controller for interface to host cpuModuleĄĄ USB Device Port for Serial Console command-line interfaceĄĄ Passive heat sink included • Available in stackable, rugged enclosures

SBCs and Boards

FEATURES

FEATURES

ĄĄ ARINC 429-based PCIe-Mini card ARINC controllerĄĄ Up to 4 transmitters and 8 receivers channels for ARINC controllerĄĄ Programmable label recognition for 256 labels per channelĄĄ 32 x 32 Receive FIFOs and Priority-Label buffersĄĄ Dependent data rates for Transmit and ReceiveĄĄ Meets the ARINC 429 specifications for loading, level detection, timing,

and protocolĄĄ Software selected data rate of 12.5kbps or 100kbps with automatic slew

rate adjustmentĄĄ Burst and continuous mode availableĄĄ Programmable word length selection, with the parity bit generated

automaticallyĄĄ Programmable Interrupt support • Differential IRIG B Input

The PCIe-ARINC429-4/8 PCIexpress Mini board has a four ARINC-429 Controller that supports up to Four Transmit and 8 Receive lines that comply with ARINC-429 specifications.Each receiver has a user-programmable label recognition for any combination of 256 possible labels, 32 x 32 Receive FIFO, 3 priority label quick-access double-buffered registers and analog line receiver.The independent transmitter has a 32 x 32 Transmit FIFO and built-in line driver that generates the bipolar ARINC 429 differential voltage levels needed to directly drive the ARINC 429 bus.The status of the transmit and receive FIFOs and priority-label buffers can be monitored using the programmable external interrupt, or by polling the Status Registers.The PCIe-ARINC429-4/8 messages are transmitted and received at either bit rate of 12.5kbps or 100kbps. Windows and Linux Drivers with SDK are provided.

PCIe-Mini-ARINC429-4/8

SBCs and Boards


ALPHI Technology Corporationwww.Alphitech.com [email protected] 480-838-2428

PC/1

04 a

nd S

mal

l For

m F

acto

rs

Reso

urce

Gui

de



http://www.rtd.com/switch


http://www.Alphitech.com




FEATURES

ĄĄ Highest Performance Thin Mini-ITX board ĄĄ 6th Generation Intel® Core™ Mobile SOC U-Processors ĄĄ Low Profile (170mm x 170mm x 20mm) ĄĄ Ultra Low Power with 15W/7.5W TDP ĄĄ Outstanding Intel HD Graphics Performance (GT2)

• Up to 3x independent displays at 4k@60Hz resolution DP, eDP, LVDS

ĄĄ Highest flexibility with full I/O and high-speed PCI Express 3.0 ĄĄ Wide Range Power Input 12-24Volt ĄĄ congatec embedded Features using embedded Board

Controller ĄĄ Microsoft Windows 10/8/7 and Windows embedded

Standard support

Flat design meets high performance in congatec’s new conga-IC170 Thin Mini-ITX boards. The new boards stand out with their high scal-ability, ranging from 2.0 GHz Intel® Celeron® processors up to 3.4 GHz Intel® Core™ i7 processors. The industrial-grade boards offer a fully configurable thermal design power (TDP) from 7.5 to 15 watts and up to 32GB of DDR4 RAM as well as 4K multiscreen support. These advantages come in tandem with a comprehensive set of interfaces for the direct connection of various industry-specific extensions such as SIM cards and low-cost CMOS cameras. The boards feature a long-term availability of 7+ years and a rugged design to withstand harsh environments. For OEMs these benefits translate into easier design-in and a more time- and cost-efficient product development process.

Due to their high scalability, conga-IC170 Thin Mini-ITX boards are ideal for a wide variety of industrial applications. These range from fanless HMIs, control and SCADA systems, powerful and robust kiosk or retail systems, to slot machines and digital signage. With a height of just 20 millimeters, they are also suitable for extremely slim panel and industrial All-in-One PC designs. The optional Smart Battery support expands the range of implementations to include portable, battery-powered applications such as mobile ultrasound equipment in medical technology. The integrated board management controller and support for Intel® vPro™ technology with Intel® Active Management Technology (Intel® AMT) increase the reliability of distributed IoT system installations and in many cases make on-site maintenance unnecessary.

The feature set in detail: The conga-IC170 Thin Mini-ITX boards are equipped with the dual-core U-series SoC versions of the 6th gen-eration Intel® Core™ processors. The scale starts with the entry-level 2.0GHz Intel® Celeron® 3995U processor and then ranges from the Intel® Core™ i3 6100U (2.3GHz) and i5 6300U (2.4GHz, 3GHz turbo) up to the Intel® Core™ i7 6600 with a maximum turbo clock rate of 3.4GHz. Depending on the processor variant, the new boards offer a configurable TDP from 7.5 to 15 watts. With two SO-DIMM sockets the boards support up to 32GB DDR4-2133 memory. The integrated Intel® Gen9 Graphics supports DirectX 12 and Open GL 4.4 for high-performance 3D graphics on up to 3 independent 4k displays with 60 Hz (3840 x 2160) via 2x DP ++ and 1x eDP with the additional option to configure a dual channel 24bit LVDS interface. Hardware-accelerated encode and decode of HEVC, VP8, VP9 and VDENC video is also supported.

conga-IC170

congatec www.congatec.us

[email protected] 858-457-2600 www.linkedin.com/company/congatec-ag twitter.com/congatecAG

SBCs and Boards






http://www.congatec.us


http://www.linkedin.com/company/congatec-ag


https://twitter.com/congatecag

The CML24BT is an advanced PC/104 single board com-puter and controller with a PCI/104-Express stackable bus structure. This Intel Atom E3800-based CPU is exceptionally suited for intelligent systems requiring low power consump-tion in harsh thermal conditions. The CML24BT-series CPUs are available in quad-core, dual-core, and single-core con-figurations. Surface-mount Type 2 PCI Express connectors enable users to stack multiple peripheral modules above and below the CPU. All models include 4GB surface-mount single-channel ECC DDR3 SDRAM and a 32GB industrial-grade surface-mount SATA flash drive.

Intel Atom E3800-based SBC

SBCs and Boards


RTD Embedded Technologies, Inc.www.rtd.com/atom


FEATURES

ĄĄ PCI/104-Express stackable bus structureĄĄ Available in modular, rugged enclosures and eBuild systemsĄĄ Intel Atom E3800 Series Processor

• Clock Speed: 1.33 GHz, 1.46 GHz, and 1.91 GHz options • Max. Core Temperature: 110°CĄĄ 4GB Single-Channel DDR3 SDRAM (Surface-Mounted)

• Robust Error Code Correction (ECC)ĄĄ 32GB Surface-mounted industrial-grade SATA flash driveĄĄ 4 PCIe x1 Links, One SATA Port, 4 Serial Ports, 7 USB ports, Gigabit

Ethernet, Analog VGA, Embedded DisplayPort (eDP) 1.3 with Audio, on-board advanced Digital I/OĄĄ -40 to +85°C standard operating temperatureĄĄ Thermal-optimized passive heat sink included

SBCs and Boards

FEATURES

Based on the Texas Instruments TMS320C66x, RTD’s SPM34CP dsp-Modules are high performance fixed/floating point embedded DSP controllers designed around the PCIe/104 stackable bus structure. The onboard DSP chip supports high-performance signal processing appli-cations such as mission critical, imaging, test, and automation. Deter-ministic processing enables the DSP to outperform general purpose processors for time-critical applications. The C6678 platform is power-efficient and easy to use. The C66x CorePac DSP is fully backward com-patible with TI’s existing C6000 family of fixed and floating point DSPs.

The DSP chip has several high-speed data connections to the out-side world such as PCI Express, Serial Rapid I/O, and Gigabit Ethernet. Onboard flash permits true stand-alone operation of the DSP without a host, while the PCI Express connector alternatively permits the DSP to act as a co-processor to a PCIe/104 Type 2 host cpuModule.

High-Performance Multi-Core DSPs

SBCs and Boards


RTD Embedded Technologies, Inc.www.rtd.com/dsp


FEATURES

ĄĄ Texas Instruments TMS3020C66x DSP Core Subsystems (C66c CorePacs) • 1.25 GHz C66x Fixed/Floating-Point CPU Core • 4096 Kbyte On-chip RAM • 2GB DDR3 SDRAMĄĄ 1 Mbit I2C EEPROM for factory bootloader, 512 Mbit SPI Flash

for user bootloaderĄĄ Differential synchronous SyncBus, Dual Gigabit Ethernet, One

Serial Port (RS-232/422/485), 14 single-ended 3VTTL digital I/OĄĄ Four lanes of Serial Rapid I/OĄĄ Stackable PCI Express connectorĄĄ -40 to +85°C standard operating temperature

PC/1

04 a

nd S

mal

l For

m F

acto

rs

Reso

urce

Gui

de



http://www.rtd.com/atom


http://www.rtd.com/dsp




FEATURES

ĄĄ -40° to +85°C Operating TemperatureĄĄ Soldered-on RAM (up to 1 GB)ĄĄ Fanless Operation; High shock and vibeĄĄ DMP Vortex86DX2 32-bit ProcessorĄĄ VGA and LVDS video outputsĄĄ Mini PCIe/mSATA socketĄĄ PC/104-Plus expansion; SPI/SPX Expansion

Rugged PC/104-Plus Embedded ComputerFox is a rugged new PC/104-Plus™ single board computer (SBC). It features the compactness of the PC/104 form-factor, and the compatibility of the classic PC/104-Plus expansion interface – with ISA and PCI bus expansion. It also fea-tures extensive I/O capabilities, low power consumption, and fanless operation over the full industrial temperature range.The Fox is a full-featured SBC for low power embedded environments that require passive cooling. It delivers mid-range performance and lower power draw along with industry-standard PC/104-Plus compatibility.The Fox leverages DMP's Vortex86DX2 System on Chip. It offers full indus-trial temperature (-40º to +85ºC) operation, and low power requirements (5.3 Watts). It provides I/O expansion through the PC/104-Plus stackable bus (PCI + ISA), as well as a Mini PCIe socket, MicroSD socket, and a SPI/SPX interface.Designed and tested to withstand extreme temperatures, high-impact, and vibration, Fox features no moving parts and soldered-on RAM. This single board computer is an ideal choice for applications that require a rugged, high reliability computer.The Fox is backed by VersaLogic’s 5-year warranty and product life extension programs that can continue delivery well past the year 2025.

Fox (VL-EPM-19)

SBCs and Boards


VersaLogic Corporationhttp://www.versalogic.com/0316-PC104-Fox

[email protected] 503-747-2261 linkedin.com/company/versalogic-corporation @versalogic

FEATURES

ĄĄ -40°C to +85°C operationĄĄ TPM hardware securityĄĄ Fanless Operation; Latching connectorsĄĄ PC/104 Format: 4.3 x 3.8" (108 x 96 mm)ĄĄ One, two, and four-core modelsĄĄ Up to 8 GB RAM; VGA and DisplayPort video outputsĄĄ ISA, PCI and SPI expansion

PC/104-Plus “Bay Trail” Embedded ComputerBayCat is a rugged new PC/104-Plus™ single board computer (SBC) with on-board Trusted Platform Module (TPM) for enhanced security. BayCat combines high performance, low power consumption, and backwards compatibility with systems using PC/104-Plus ISA or PCI expansion. Built for extreme environ-ments, the BayCat is designed and tested for industrial temperature (-40º to +85ºC) operation and meets MIL-STD-202G specifications to withstand high impact and vibration. Latching connectors and fanless operation provide additional benefits in harsh environments.BayCat is available in single-, dual-, and quad-core processor options to meet a variety of price/performance/application requirements. BayCat, features a Mini PCIe socket with plug-in Wi-Fi modems, GPS receivers, and other mini cards such as MIL-STD-1553, Ethernet, and Analog. For stacking expansion using industry-standard add-on boards, the BayCat supports PC/104-Plus expansion. The BayCat’s on-board TPM security chip can lock out unauthorized hardware and software access providing a secure processing environment for applications in applications that require hardware-level security functions. Additional security is provided through built-in AES (Advanced Encryption Standard) instructions.The BayCat is backed by VersaLogic’s 5-year warranty and product life extension programs that can continue delivery well past the year 2025.

BayCat (VL-EPM-31)

SBCs and Boards


VersaLogic Corporationhttp://www.versalogic.com/0316-PC104-BayCat

[email protected] 503-747-2261 linkedin.com/company/versalogic-corporation @versalogic





http://www.versalogic.com/0316-PC104-Fox


http://www.versalogic.com/0316-PC104-BayCat




https://twitter.com/versalogic

https://twitter.com/versalogic

https://www.linkedin.com/company/versalogic-corporation

https://www.linkedin.com/company/versalogic-corporation

FEATURES

ĄĄ Freescale® i.MX 6™ Quad-core ARM® Cortex™-A9 ProcessorsĄĄ Fanless -40° to +85°C operational temperatureĄĄ Powered by PoE or +10-50VDC InputĄĄ 10/100/1000 Ethernet with IEEE-1588™

ĄĄ USB 2.0 and USB On-The-Go PortsĄĄ FlexCAN and RS-232/422/485 Serial PortsĄĄ 24 GPIO tolerant up to 30VDC

Designed for industrial applications and long-term availability, WinSystems’ SBC35-C398Q SBC features a quad-core ARM® processor with options for expansion and customization. The combination of processing power and industrial I/O provides a flexible solution for a number of applications including security, industrial control, medical, transportation and MIL/COTS. This low-power design operates from -40° to +85°C without a fan or heatsink for improved reliability.

Kick-start development with our SD Cards, available preloaded with our newly released real-time Linux distribution or Android™. Our factory engineers offer technical support from pre-sales through production.

SBC35-C398Q – Industrial ARM® SBC with Real-Time Linux

SBCs and Boards


WinSystemswww.winsystems.com

[email protected] 817-274-7553 www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc

FEATURES

ĄĄ Intel® Atom™ E3800 Processors with up to 4GB Soldered RAMĄĄ Two Fully Independent Displays (VGA, DisplayPort & LVDS)ĄĄ 1 Gb Ethernet ControllerĄĄ Fanless -40° to +85°C operational temperatureĄĄ 4 Serial Ports and 4 USB 2.0 portsĄĄ 24 Bidirectional GPIO with event senseĄĄ Bus Expansion: MiniPCIe, PC/104 & PC/104-Plus

The PPM-C407 from WinSystems utilizes the E3800 fam-ily of Atom™ processors from Intel® to provide low power and performance in the versatile PC/104 form factor. Designed for harsh environments and reliability, it includes soldered RAM for added shock and vibration resistance with an operat-ing temperature range from -40°C up to +85°C.WinSystems is offering the PPM-C407 in multi-core options depending on the application requirements. The scalable per-formance allows you to choose between low power single-core and higher performance dual or quad-core solutions.Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options.

PPM-C407 – Low Power PC/104-Plus SBC with Digital I/O

SBCs and Boards


WinSystemswww.winsystems.com

[email protected] 817-274-7553 www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc

PC/1

04 a

nd S

mal

l For

m F

acto

rs

Reso

urce

Gui

de



http://www.winsystems.com


http://www.linkedin.com/company/winsystems-inc-

http://www.winsystems.com


http://www.linkedin.com/company/winsystems-inc-



https://twitter.com/winsystemsinc

https://twitter.com/winsystemsinc

FEATURES

ĄĄ Designed for MIL-STD 810 OperationĄĄ Durable Milled Aluminum ConstructionĄĄ Durable Hyperboloid SATA ConnectorĄĄ Rated for 100,000 SSD InsertionsĄĄ Rugged Mounted for MIL-STD 810 Shock and VibrationĄĄ Positive Mating ActionĄĄ Ultra-Low Electrical ResistanceĄĄ 32GB to 64GB 2.5" SATA With Milled Aluminum Casing, SLC/MLC,

Industrial Temp RangeĄĄ Support for Military-Erase Protocols

• DOD NISPOM 5220.22-M • NSA/CSS 9-12 • NSA/CSS 130-2 • ARMY AR 390-19ĄĄ -40C to +85C Operation

The ADLRHD-1650 has been developed for military and industrial use scenarios that can benefit from MIL-STD 810 shock and vibration durability but also requires frequent SATA drive removal or swapping for data retrieval, maintenance, security and other purposes.

The ADLRHD-1650 features a durable hyperboloid connector with MIL-STD 810 shock and vibration tolerance, positive mating action, low electrical resistance and up to 100,000 2.5" SATA insertions. As well, the ADLRHD-1650 features Military-Class 2.5" SATA III SSDs with milled aluminum casing, ruggedly mounted internal PCB, long-life SLC NAND flash, -40C to +85C operation and Military Erase protocol support. Supported secure erase protocols include DOD NISPOM 5220.22-M, NSA/CSS 9-12, NSA/CSS 130-2, ARMY AR 390-19, and others.

MIL-STD 810 ADLRHD-1650 Removable Hard Drive Assembly

Systems


ADL Embedded Solutions Inc.www.adl-usa.com


FEATURES

ĄĄ Intel Atom E3800-3845 Quad, Intel Atom E3800-3827 DualĄĄ Up to 8GB DDR3L 1333MHz; 2x 204 SODIMM SocketsĄĄ 3x Gbit LAN; Intel i210 ĄĄ 4x USB2.0, Optional 1x USB 3.0ĄĄ Optional 802.11 WiFiĄĄ Optional 1x 2.5" SATA SSD (3Gbit/s)ĄĄ Optional 1x M.2 Key-B 2242 SATA; Up 64GBĄĄ Expansion: 1x M.2 Key-B 2280 with 1x PCIex1ĄĄ -20C to +60C Standard, Optional -40C to +70CĄĄ Voltage Input = 20V – 30VĄĄ Mounting: Din Rail; VESA; Bottom Mount

The ADLEPC-1600 is an IoT-Ready compact, fanless rugged embedded PC based on Intel’s E3800-series Atom processors with greatly improved performance-per-watt featuring Intel’s 7th generation graphics engine for stunning graphics performance. The ADLEPC-1600 features durable milled aluminum construction, and targets rugged IoT applications in a variety of environments where high mechanical stress or temperature extremes (up to -40C to +70C) are a consideration.

The ADLEPC-1600 features LAN and 802.11 WiFi cloud connectivity and USB 2.0, USB 3.0, and three Gb/s LAN ports making it ideal for deploy-ment in rugged IoT applications such as network routing, IoT gateways, network appliances, and many other industrial computing needs. The ADLEPC-1600 can be readily configured by the customer with Windows, Linux or other operating systems as well as application-specific software for gateways, routers, or other IoT applications.

APPLICATIONS: • General Purpose Industrial PC • Network Router • Industrial PC Controller • IoT Gateway Computer

ADLEPC-1600 IoT-Ready Embedded PC

Systems


ADL Embedded Solutions Inc.www.adl-usa.com






http://www.adl-usa.com


http://www.adl-usa.com




FEATURES

ĄĄ Choice of Intel Atom or Intel Core iX processorsĄĄ Rich I/O options include DVI, DisplayPort, USB 3.0, GbE, PCIe, plus

RS-232/422/485 based digital I/OĄĄ Commercial and rugged fanless systems with thermal performance

to -20 to +70CĄĄ PCI and PCIe expansion slots enable application-specific configura-

tions storage featuring CompactFlash and 2.5" SSD optionsĄĄ Mounting options including DIN rail wall, pole mount, 19" rackmount,

lab or desktop

Industrial and rugged computers are an essential part of applications like building automation, health care, transportation, facility man-agement, environmental monitoring, vehicular traffic management, defense, surveillance, and oil and gas exploration. They can be a front-end to another control element in a distributed processing environ-ment, or provide complete process control and data acquisition. They are more reliable and more durable than comparable commercial counterparts and include long life time support.

Elma’s wide selection of Industrial PCs offers you a choice of prod-ucts suitable to meet your needs. Our experienced staff can assist you with any system customization you may want at the unit volumes you need. Contact us to see how we can help build the right system for your project.

Small Form Factor Rugged & Industrial Systems

Systems


Elma Electronic Inc. http://www.elma.com/en/products/systems-solutions/application-ready-platforms/industrial-computing/

[email protected] 510-656-3400 @elma_electronic https://www.linkedin.com/company/elma-electronic

FEATURES

ĄĄ 163.6mm x 108.0mm x 96.3mm (6.438" x 4.250" x 3.790")ĄĄ 1x HDMI, 2x GbE, 2x USB 2.0, 802.11 a/b/g/n, 1x RS-232ĄĄ +9V to +36V Power InputĄĄ Designed to MIL-STD 810g and DO-160G for shock and

vibrationĄĄ Designed to IP67/68 ingress protection ratingĄĄ Extended Temperature Range -40°C to 85°C

The Kube is a small form factor, rugged embedded system based on the Intel Atom E3845. The Kube is designed to MIL-STD 810g and IP67/68. Housed in a compact enclosure with optional mounting brackets, the Kube is a feature rich COM Express® Type 10 System with USB, HDMI, Gigabit Ethernet, and WiFi capabilities.

The COM Express Type 10 base with Mini PCI Express expan-sion makes the Kube easy to modify. Custom face plates are easily accommodated using Connect Tech design services.

The Kube

Systems




FEATURES

SystemsPC

/104

and

Sm

all F

orm

Fac

tors

Re

sour

ce G

uide



http://www.elma.com/en/products/systems-solutions/application-ready-platforms/industrial-computing/


https://www.linkedin.com/company/elma-electronic






https://twitter.com/elma_electronic


Customer-configurableThe SIU31 is a highly configurable rugged COTS system or subsystem ideally suited for military, industrial, and commercial applications that require high-density I/O, communications, Ethernet switching, and pro-cessing. The SIU31 uses one NAI field-proven, 3U cPCI board to deliver off-the-shelf, SWaP-optimized COTS solutions that Accelerate Your-Time-to-Mission.Versatile ArchitectureNAI’s Custom-On-Standard Architecture™ (COSA™) offers a choice of over 40 intelligent I/O, communications, and Ethernet switch functions, as well as Single Board Computer (SBC) options. Pre-existing, fully-tested func-tions can be quickly and easily combined in an unlimited number of ways to meet system requirements. Individually dedicated I/O and communica-tions processors allow mission computers to manage, monitor, and control the functions via single or dual Ethernet ports. n.Eliminate man-months of integration with a configured, field-proven 3U cPCI system from NAI.

3U cPCI COTS System – SIU31 Sensor Interface Unit

Systems


North Atlantic Industries, Inc.http://www.naii.com/3U-cPCI-Sensor-Interface-Unit-SIU31/P280


Made in the USACertified Small Business

FEATURES

ĄĄ 1 x 3U cPCI Slots – allows installation of up to 3 I/O or Communications modules • 40+ modules to choose fromĄĄ SBC-less stand-alone operation supported via Ethernet connection

to your mission computerĄĄ Processor Options: NXP PowerPC QorIQ® P2041, Intel® Core™ i7,

Intel® Atom™ or ARM Cortex-A9ĄĄ MIL-STD-461F, MIL-STD-1275 & 704AĄĄ 28 VDC inputĄĄ 2.35" H x 8.70" D x 4.71" LĄĄ Customer Configurable I/O, Communications and ProcessingĄĄ Wind River® Linux/VxWorks®, Xilinx® PetaLinux,

Windows® Embedded Standard 7 OS SupportĄĄ COSATM ArchitectureĄĄ Operating temp: -40°C to +71°C conduction

cooled (air-cooled option)

RTD’s standard HiDANplus® embedded computer system provides a robust Commercial-Off-the-Shelf (COTS) solution enabling rapid up-time for mission-critical applications. The system includes a rugged single board computer, power supply, SATA card carrier, and room for an additional peripheral module. Without increasing the enclo-sure size, functional upgrades can include high-performance data acquisition, versatile networking options, or enhanced capabilities from a variety of special-purpose add-in modules. Additional con-figuration options include a removable SATA drawer.The milled aluminum enclosure with advanced heat sinking deliv-ers passively-cooled performance from -40 to +85°C. Integrated tongue-and-groove architecture with EMI gaskets create a water-tight solution with excellent environmental isolation. Keyed cylindri-cal connectors offer easy cable connections while maintaining the integrity of the environmental seal.

RTD Off-the-Shelf Mission Computer

Systems


RTD Embedded Technologies, Inc.www.rtd.com/systems


FEATURES

ĄĄ -40 to +85°C standard operating temperatureĄĄ Designed for high ingress protection in harsh environmentsĄĄ Milled aluminum enclosure with integrated heat sinks and

heat finsĄĄ Rugged Intel and AMD-based Single Board ComputersĄĄ High-performance, synchronized power supplyĄĄ 2.5 inch SATA card carrierĄĄ Designed to include an additional PCIe/104, PCI/104-Express

or PCI-104 peripheral module without increasing overall enclosure size





http://www.naii.com/3U-cPCI-Sensor-Interface-Unit-SIU31/P280


http://www.rtd.com/systems




http://www.computextaipei.com/tw

page advertiser - opensystems...

Documents