palestra 3 - fabricação de moldes por micro-usinagem
DESCRIPTION
Manufacturing of micro-moulds. Palestrante: Msc. Benedikt Gellissen - Instituto Fraunhofer de Tecnologias da Produção - FhG IPT - AlemanhaTRANSCRIPT
© WZL/Fraunhofer IPT© WZL/Fraunhofer IPT
Manufacturing of micro-moulds
Benedikt Gellissen
Fraunhofer Institute for Production Technology IPT
International Seminar: Application of new technologies in the metal mechanic sector
Joinville, Brazil, September 2011
Page 1© WZL/Fraunhofer IPT
Economic Developments in MST
91 93 95 98 00
93 95 97 99
94 96 98 00
123456789 billion US$
2468
10121416 billion US$
2
4
6
8
10
12 billion US$
510152025303540 billion US$
96 97 98 99 00 01 02
Batelle (1990) SEMI (1995)
SPC (1994) NEXUS (1998)
95 97 99
94 96 98 00
Source: NEXUS, VDI VDE-IT
The booming of microsystem technology (MST):
- Main focus on industries like life science, IT, bio-and sensor technology
- Annual growth of 18% from 1996 to 2002
- Estimated growth of the market from 2002 to 2005 of 28 to 65 billion US$
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Economic and Technical Developments
20
40
60
80
100
120
140
160
180
90 91 92 93 94 95 96 97 98 99USA (880)Japan (445)Germany (378)
Number of patent registrations
23 Fraunhofer Gesellschaft21 Robert Bosch GmbH16 Institut für Mikrotechnik Mainz GmbH15 Siemens AG
e.g.
Patent analysis of MSTfor microPRO Study in 2002:
- Based on the World Patent Index
- The following terms were taken under consideration: MST, Micro -mechanic, -optic, -fluidic, -assembly, UP- and micro machining
- 29.7% of the patent categories come from the field of plastics processing
Indications of upcoming mass production
Page 3© WZL/Fraunhofer IPT
International comparison - microPRO Study
§ Company activities were focused on optics, electronics production and the production of tools and machine tools
§ Trend towards integration of miniaturized systems into new (mass) products§ Development of extremely downscaled machine tools and complete assembly systems
Japan, Taiwan, Singapore
§ Strong influence by electronics production and semiconductor technology§ High process automation demanded
(due to prevailing high quantities in the above named sectors)§ Future market segments are seen in medical engineering, bio-technology and
in electro-optical products
USA
§ Predominantly affiliation of enterprises to mechanical engineering and precision engineering§ Industrially practiced miniaturization is closely connected to the watch industry § Technical know-how is currently used to open up new market segments like
information and communications technology
Switzerland
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Summary of mikroPRO Study
§ Numerous applications of micro manufacturing technologies in variousindustrial sectors
§ Broad basic research - some excellent results in single manufacturing technologies
§ There are deficits in the transfer of the technologies into real products,partly due to- low industrial maturity of the manufacturing technologies
(process stability)- lack of technological knowledge for the design and development
of new products (manufacturing specific design, technology limits,design rules)
- limited accessible knowledge of industrial product and processrequirements
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Typical branches –MST are found in different branches with the tendency for mass production
- Sensor technology- Optical elementsfor interior and exterior
- Micro mechanical devices- ...
- Medical technology- Biotechnology- Techniques for analysis- ...
- Optical data transfer and coupling
- Display technology- ...
Source: Cooke Corp., microparts, Euronano
Automotive industry Life sciences Telecommunication
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Due to developments in the industry -MST is still a chance for mould and die makers
Example of powder injection molding products; gear (MIM), (Source: IFAM)
Measuring instrument for alcohol (Source: IMT, TU Braunschweig)
Micro channel
Detectioncell
Micro pumpsBioreactor
Micro Electro-Mechanical Systems (MEMS)
Precision Engineering
Example of micro cast products (Source: FZK)
10 µm
(Source: Grundig)Test piece and human hair structured with dicing blades
Micro-structuring
(Source: DISCO Corp.)
Mic
ro M
ould
Mak
ing
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Focus of this presentation –Conventional Technologies in MST
Chip removalDiamond Carbide
EDMWire-EDM Sink-EDM
Workpiece material
NickelBrass
AluminiumPlastics
SteelCeramicsGraphite
Metals(Ceramics)
Metals(Ceramics)
MetalsGraphiteCeramics
Lateral structures 10 - 1000 µm 10 - 1000 µm 20 - 50 µm 20 - 40 µm 5 - 1000 µm
Aspect ratio 10 - 50 2 - 10 25 - 80 10 - 25 10 - 100
Geometricfreedom ++ ++ + + ++
Surface quality Ra
0.01 µm 0.3 µm 0.04 – 0.06 µm 0.2 – 0.4 µm 0.1 – 1.3 µm
LaseringNd:YAG
200µm200µm 200mm700mm200µm
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100 50 25 10 5
50
25
10
5
1
200
EDM
Chip removal
Grinding
Laser
Silicon etching
Str
uct
ure
[µ
m]
Surface roughness Ra [nm]
LIGA
Production processes in MST –Compromises and alignment with the costumer product
planar freeforms
Complexity of geometry
Silicon etching (40%)
Chip removal (22%)
EDM (16%)
LIGA (11%)
Grinding (9%)
Source: IPA, ILT, IPT
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Photolithography Etching of Silicon –Advantages are clearly visible but the limitations too
Source: Cranfield University, Zeiss
Silicon dioxidefilm to be etched
industrial wave length min. use of illuminate structure
1980 - 1986 436 nm 0.60 µm1986 - now 365 nm 0.35 µm1992 - now 248 nm 0.20 µm1998 - now 193 nm 0.15 µmR+D 157 nm 0.12 µmR+D 013 nm 0.08 µm
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Sources: Scholz, Impella, Wikipedia.de, Fraunhofer IPT
Intracardial blood pump Micro fuel cellFacette mirror
Reflecting structures
Typical products –The requirements towards the products functionality is spread widely
Lab on a chip
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Conventional Technologies in MST
Chip removalDiamond Carbide
EDMWire-EDM Sink-EDM
Workpiece material
NickelBrass
AluminiumPlastics
SteelCeramicsGraphite
Metals(Ceramics)
Metals(Ceramics)
MetalsGraphiteCeramics
Lateral structures 10 - 1000 µm 10 - 1000 µm 20 - 50 µm 20 - 40 µm 5 - 1000 µm
Aspect ratio 10 - 50 2 - 10 25 - 80 10 - 25 10 - 100
Geometricfreedom ++ ++ + + ++
Surface quality Ra
0.01 µm 0.3 µm 0.04 – 0.06 µm 0.2 – 0.4 µm 0.1 – 1.3 µm
LaseringNd:YAG
200µm200µm 200mm700mm200µm
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Insert
Solution to date
- Complex fabrication and positioning of the three electrodes
Aim
- Direct fabrication of the inserts by 5-axis micro milling
Micro Clip for medical applications -detail of clip mechanism
Insert with electrodes
•
ƒ
‚Insert
Electrode
Electrode
Electrode
Challenges
- Steel mould insert- Micro free-form surfaces - Undercut of 54 µm
Micro Clip (Design)
Source: Zumtobel Staff
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200 µm
Feature Awith undercut
Mould Insert (SEM image)
Feature A
Micro Clip (Mould Insert)
Source: Zumtobel Staff
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Intracardiac pump systemfor patient-friendly andeconomic treatment of acute heart diseases< Replacement of heart-lung
machines via intrabody< No surgical intervention< On site placement in the
heart through the leg artery< Post operation heart
support for up to 7 days< Outer diameter of pump 4.0
and 6.4 mm respectively< Pump performance up to
4,5 l/min
Application -Intracardiac Pump System
Measurements: 3.55mm x 7.7mmMaterial: PEEKSource: Impella CardioSystems AG
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Former process: Five axis milling of PEEK
Quelle: IBMT
<Single part manufacturing<High effort for manual finishing< Low reproducability
Recover® Technology: Manufacturing of Impeller
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Former process: Five axis milling of PEEK
Now: Injection moulding
Quelle: IBMT
<Single part manufacturing<High effort for manual finishing< Low reproducability
<Batch production< Low effort for manual finishing<Extremely high reproducability
Recover® Technology: Manufacturing of Impeller
Source: Horst Scholz GmbH + Co. KG
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Former process: Micro-EDM Now: Five axis micro milling
<High process knowledge< Two-step process<Effort for manual finishing
< 5 axis manufacturing necessary<One-step process
Manufacturing of Mould Inserts
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Conventional Technologies in MST
Chip removalDiamond Carbide
EDMWire-EDM Sink-EDM
Workpiece material
NickelBrass
AluminiumPlastics
SteelCeramicsGraphite
Metals(Ceramics)
Metals(Ceramics)
MetalsGraphiteCeramics
Lateral structures 10 - 1000 µm 10 - 1000 µm 20 - 50 µm 20 - 40 µm 5 - 1000 µm
Aspect ratio 10 - 50 2 - 10 25 - 80 10 - 25 10 - 100
Geometricfreedom ++ ++ + + ++
Surface quality Ra
0.01 µm 0.3 µm 0.04 – 0.06 µm 0.2 – 0.4 µm 0.1 – 1.3 µm
LaseringNd:YAG
200µm200µm 200mm700mm200µm
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UP-processes –Structures and processes strategies
Face milling
TurningUP-Planing
Fly Cutting
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n Ultraprecision machine for the machining of large workpieces by means of diamond milling and planing
n Max. working area 1000 x 1000 x 200 mm³
n Rotary table (C-axis)
n Hydrostatic bearings for all axis (not realised in vertical direction)
n Two portal slides for either mass compensation or usage of two tools
n Equipped with standard NC controller
UP-planing-machine for large-scaled structured surfaces
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ap
f
Manufacturedsurface
Vorschub
-
a
f
Tool shaft
Diamond tool
Vorschub
Cut directionxz xz
Spindle rotation
Tool
Part
Roughness
n Tools: mono crystalline diamond
n Structure size 3 µm, surface roughness 10 nm Ra
n Highest form accuracy
n Work pieces up to 1 x 1 m2
n High manufacturing times for big parts
Manufacturing technology for micro and nano structures
Fly cutting Planing
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Fly-Cutting – Applications
2 mm 50 mm
100 mm
10 mm
100 µm10 mm
0,5 mm 0,5 mm
Masterstruktur einer Beleuchtungs-optik Element eines Retroreflektors
HeißprägewerkzeugMasterstruktur eines großflächigen Reflektors
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Large area structuring with the fly-cutting process
n Long time machiningn Structure: triangular corner cubes (1 mm)n Size of workpiece: 400 x 400 mm2n Distance of cut: 6.15 kmn Machining time: 5.3 dn Machined at tangential feedn Investigation on tool wear
Machined master (CuNi18Zn20 400 x 400 mm2)Sample part with structure
2 mm
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Hybrid optics
10 mm
Sinus curve-surface
Facet mirror
HybridFTS
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Machine for the production of hybrid optics
Granite base plate
Height adjustment
Case
B-axis
Fast Tool
n Dynamic axis– Total weight 90 kg
– Moving mass 10 kg
– Max. acceleration 62 m/sec²
– Travel length of axis – Max. work piece diameter– Total weight – Dimensions
410 mm800 mm3.800 kg
1900x1500x1500
n MTC 410
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Reflector surface
n Freeform surface
n Scaleable geometry
n Diameter = 20 mm
n Non-rotationally symmetric portion: 0,45 mm
n Data type: NURBS(Non Uniform Rational B-Splines)
Manufacturing requirements
n Harmonic tool path
n Very high frequency position control
NURBS-Mirror surface Simulated tool pathy
[mm
]
Brightness distribution
NC code correction
Light source
Freeform-mirror Projection
Source: OEC AG
Freeform reflectors - computable, but not to manufacture?
x [mm]
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Summary –Limitation of UP Machining
Ultra precision machining with mono crystalline diamond tools
Recent developments < ultra precision machining of nonferrous materials by
turning, milling and fly cutting< extremely high surface quality of a few nanometers Ra< shape accuracy in the submicron range
Restrictions< machining of ferrous materials causes high wear< life time of nonferrous metals cavities
is not sufficient in many cases< galvanic process chain is time consuming, expansive
and with limited reproducibility
Galvanic layer separation There is a huge demand for flexible production technologies to machine wear resisted mould inlays
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CompetitivenessPrecision Glass Molding vs. Alternative Manufacturing Technologie
Grinding and Polishing
– Oldest technology for glass optics manufacturing
– Large variety geometries possible
– Nearly all optical glasses machinable
– Highest accuracies obtainable
Conventional Molding
– Technology for mass production
– Non-isothermal
– Accuracies satisfying for lighting optics
– Limitation in glass material choice
– Geometric variability limited by mold manufacturing
Precision Glass Molding
– Technology for mass production
– Obtainable accuracy satisfying for imaging optics
– Isothermal process– Nearly all optical glass
moldable– Ceramic molds– Accuracies in the range l to l/5
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Precision Glass Molding:An Integrative Approach
Optic Design
MoldedLens
Data Handling
FEMSimulation
Mold DesignMold
Manufact.Molding
Idea
n Optimization of the process sequence for precision glass molding towards higher efficiency and more complex optical elements
n Generation of an integrated approach for the data handling
Concept
n Consideration of each single process step including the different interfaces
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Precision Glass Molding The Process
Source: Fraunhofer IPT
Tg
Time
Tem
pera
tur F
orce
Homogizing
ForceTemperatur
PressingHeating Cooling
Temperatur and force cycle
1. Loading andN2-purging
2. Heating of glassand mold
3. Pressing
N2 Gas
IR -lamps
F
N2 Gas
4. Cooling and unloading
Process cycle
Mold
Isothermal molding process leads to high accuracies!
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An Integrative Approach:Data Handling
n Data flow (forward):– Optic design (IGES file)
– FE process simulation andNC code generation, both based on IGES file
– Mold manufacturing
– Molding
n Data flow (feedback)– Metrology data from mold
manufacturing to create adapted NC code
– Metrology data from molding to improve FE process simulation
Source: Zemax, Toshiba, ModuleWorks
Ideal data flow
Metrology
Data
Metrology Data
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Tool making for Precision Glass Molding
Challenges
n High Accuracy (shape deviation < 1µm)
n Optical surface quality (Ra < 10 nm)
n Mold material: carbide (HV10: 2825 GPa, Density: 15,75 g/cm³)
Process
n Ultra precision grinding (resolution < 1nm, air guided spindle)
n Resin bonded grinding tools for ductile machining
n 4-axis process for freeform applications
Source: Faunhofer IPT
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Precision Glass MoldingExamples
n Double sided condensor lens for homogenization of coherent (excimer lasers) or incoherent light sources (ultra high power lamps)
n Appr. 1800 single cavities with optical quality (1.2 mm in diameter)
5 mm10 mm
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Machine set-up for ultrasonic assisted turning
ultrasonic tool system
HF-generator
monitor
dynamometer
amplifier
oszilloscope
capacitive sensor
adjustableclamping device
workpiece
personalcomputer
spindle
control unit
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Comparison of Tool Wear in Diamond Cutting –Conventional Cutting versus Ultrasonic Assisted Cutting
material: X3 CrNiMoAl 13-8-2depth of cut: ap = 8 µmfeed: f = 5 µm
SVy~4 µm
rake facenose radius rε = 0,899mm
35µm
SVy~4 µm
rake facenose radius rε = 0,899mm
35µm
n Conventional cutting– cutting length < 50 m
n US-assisted cutting– cutting length > 5000 m
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Ultrasonic Assisted Diamond Tools (40kHz) - The Principle and Advantages
n diamond tool is loaded with ultrasonic vibration in cutting direction
– Amplitude 1 µm
– Frequency 80 kHz
n reduction of effective contact duration and process forces
n better inflow of coolant
n reduction of friction between tool and chip
reduced tool wear
ductile cutting
bottomdead centre
top deadcentre
0
2
4
6 amplitude [µm]
-6
-4
-2
0 0,5 1,0 1,5 2,0 2,5 3,5
T
workpiecemovement
tool movement
Ta Te Ta
(Ta)
vc-rot
vrel > 01
vc-os
point of separation (Ta)point of entrance (Te)
period without contact
vrel = 0 vrel < 0 vrel > 0
contact time [µs]
contactpoint (Te)
vrel > 0 vrel = 0
contact
2 3 4 5 6
contact
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Molds for micro optics manufacturing Concave and Convex Aspheres
Form deviation [nm]
-800
400600
-200
2000
-400-600
Radial Position [mm]-2-4 -3 -1 0 1 2 3 4
PV 144 nm
PV 204 nm
Form deviation [nm]
-300
-200
200
0
100
-2-4 -3 -1 0 1 2 3 4-5 5Radial Position [mm]
-100
n Manufacturing on Moore Nanotech 350 FG
n On machine measurement and compensation applied
n Shape accuracies on aspheres < 210 nm
n Tools with non controlled waviness
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µ-Moulds – Process combinations for new ideasDemonstrator Mould by the Fraunhofer IPT
Page 39© WZL/Fraunhofer IPT
µ-Moulds – Process combinations for new ideas Demonstrator with optimized Top Surface – Microscope Image
burr formation
Page 40© WZL/Fraunhofer IPT
Your contact to Fraunhofer IPT
Dipl.-Ing. Benedikt Gellissen
Fraunhofer Institute for Production Technology IPTSteinbachstraße 17, 52074 AachenPhone: +49 241 89 04-256Fax: +49 241 89 04-6256Mail: [email protected]