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Contents

회사

제품

미션

회사개요

핵심기술

조직도

고객사

하드웨어/검사소프트웨어

CM 테스트 시스템

CM 핸들링 시스템

반도체 핸들링 시스템

3

AUTOMATIONSOLUTION PARTNER

CCM 반도체

팸텍은고객의사업에최적의자동화솔루션을제공하는

사업파트너가되는것을목표로합니다.

미션

회사

4

회사명 팸텍 주식회사

CEO 김재웅

설립일 2003년 10월 5일

자본금 19.2억원

임직원수 총 135명

소재지경기도 화성시 동탄

경상북도 구미

제조캐파동탄 : 1410㎡

구미 : 400㎡

매출액 385억 (2020년)

사업영역

CM 테스트 시스템

CM 핸들링 시스템

반도체 핸들링 시스템

회사개요

R&D 35% Admin14%

Eng. 43% Sales 8%

직원구성비율

CCM 80% 반도체 20%

사업별매출비율

회사

5

핵심기술

CCM, 반도체자동화 장비가

융합된설계, 제어 기술

자동화장비설계기술

정밀모션제어기술

소자검사기술

영상처리소프트웨어개발기술

프로그램 : 알고리즘 7개,SW 2개, HW 3개

특허 : 카메라모듈검사,반도체자동화장비관련총 15개

회사

6

선행개발

국내영업 해외영업 통합미디어홍보

제조 생산관리 품질관리 CS

재경 구매 특허 IT경영지원

기구설계 시스템제어 영상기술 전장

조직도

C.E.O

영업

제조기술

경영지원

연구소

회사

77

고객사

LG 이노텍, LG전자,

스태츠 칩팩, SK 하이닉스,

삼성전기, 엠씨넥스,

방주, 자화전자, IM

LG 이노텍(중국, 베트남),

삼성전기(중국, 베트남), MC넥스(중국),

방주(베트남), Sharp, BYD, O-film

국내

해외

와이솔, 삼성전자,

SK 하이닉스, 라모스

Klasse, 와이솔(중국)

CompactCameraModule

Semiconductor

회사

8

하드웨어/검사소프트웨어

제품

MIUⅠ MIUⅡ

Sensor Interface MIPI 4 lane (1Gbps/lane)Parallel 16bit(CCIR601)HiSPILVDSIIC/SPI : 1ea

GPIO : 4ea

1ea of MIPI 8 lane (1.5Gbps/lane) 2ea of MIPI 4 lane (1.5Gbps/lane)HiSPILVDSIIC/SPI : 2ea

GPIO : 2ea

Buffer Memory 1GB DDR2 x 1ea 2GB DDR3 x 1ea

PC Interface USB3.0 : 2.5Gbps USB3.0 (Dual line) : 5Gbps

Sensor Power CH1-5 : 0.9-3.0V, 500mA

CH6 : Fixed (5V or 12V)

A/B Core : 0.9-2.8V, 1AA/B 3CH : 0.9-3.6V, 1A

A/B OTP : 1.0-10.5V, 500mA

Sensor Clock 1ea of Programmable 1KHz-68KHz 2ea of Programmable Up to

68MHz (0.1MHz step)

Current measure Standby : up to 1mA (0.2uA step)

Dynamic : up to 500mA (0.1mA step)

Standby : up to 2mA (0.4uA step)

Dynamic : up to 1A (0.2mA step)

Open/Short (Optional) Up to 50pin Up to 50pin

Built-in ISP LPMC-500CV : No

LPMC-600CV : YesYes

H/W Specification

Test Software

Test Items H/W Driver

• Electrical• Focus• Image Quality

• Custoemrs exclusive DLL • Simulatneous use with

Pamtek’s test items

Pamtek DLL User DLL

Pamtek APP

Pamtek SDK

PCFT® PCFT_SDK® SDK architecture

Electrical• Short• Open• Leakage• Current

Resolution

Image

• Defect• Stain/Blemish• Noise(FPN)• LSC/Color cal

- Shading(Lens/Color)- Calibration

• Focus adjustment• Infinite/Macro focus• AF calibration• OIS• Active alignment

Image quality

9

CM 테스트시스템

제품

Test Model Features Test items

VCM pre-focus TERA-VCM Full auto, 8sockets Focus test (AFA & lens test)

Active alignment PION-AA2 Full auto, 2sockets Focus adjustment, Lens bonding

PDAF calibration PION-CMF2 Full auto, 2sockets PDAF calibration, Writing values to EEPROM

OIS calibration Quantum-OIS4 Semi auto, 4sockets OIS test

Depth calibration TERA-HDC Semi auto, 4sockets Depth calibration

Zoom calibration TERA-ZC Full auto, 12sockets Zoom/Color calibration, AF calibration(Macro, infinite)

Focus test(Final) TERA-IMT Semi auto, 6sockets OS, Current, Image(white, dark), Focus(Macro, infinite)

DC test Quantum-DC Full auto, 4sockets Open/short, leakage, standby/dynamic current test

Image test Quantum-IT Full auto, 8sockets Image test

Actuator test Quantum-Act Full auto, 6sockets Actuator test

TOF test PION-TOFES/C/V Semi auto, 4sockets LIV test, Far/Near-field test, Calibration, Verification

Image senor test PION-ISIT Full auto, on tray test Image sensor image test

Active Alignment

Laser module (TOF)

Wafersawing

Calibration OQC (Final Test)

PDAF calibration

OIS calibrationDepth calibration

Zoom calibration

Misc.

+ +Misc.

Image Sensor

Actuator test

Image test

DC test

Focus test(integrated)

DieAttach

VCMPre-focus

HousingAttach

FocusAdjustment

LensBonding

HousingAttach

FocusAdjustment

LensBonding

http://www.pamtek.com/products/cm-test-system/http://www.pamtek.com/products/cm-test-system/

10

CM 핸들링시스템

제품

Pick&Place(Loading&Unloading)FlippingTransferringBendingFolding

Unfolding

Sorting Packing Misc.

Function Model Target device Operating items

Pick & Place HAND-CMP/LMP Camera / Laser module Loading&unloading

HAND-UNI Camera / Laser module Loading&unloading, Modular type design

HAND-TUL Tray Tray unloading, Module transferring

Flipping HAND-TF Tray Tray(To to bottom & bottom to top) flipping

Transfering HAND-CMCT/CMCC Camera module Carrier to Tray / Tray to Carrier transferring

HAND-LMTT Laser module Tray to Tray transferring

HAND-ISTC/ISCC Image sensor Tray to Carrier / Carrier to Carrier transferring

Bending HAND-B Camera module FPCB FPCB bending

Folding HAND-FL Camera module FPCB FPCB folding/Pressing, Film attach

Unfolding HAND-UFL Camera module FPCB FPCB unfolding/Pressing, Film detach

Sorting HAND-CMS Camera module Sorting NG camera modules by type

Packing HAND-TPI Tray Auto packing, Device barcoding

HAND-BPI Box Box forming/packing

http://www.pamtek.com/products/cm-handling/http://www.pamtek.com/products/cm-handling/

11

반도체핸들링시스템

제품

Reel tapeInspector& sorter

Logic testsystem

BIB testsystem

Memory T2BTransfer system

Memory testhandler

Misc.

RF moduletest handler

RF lasermarkingsystem

Particleremover

Dottingsystem

PCBTransfersystem

Packagelaser

markingsystem

Trayalignmentinspector

Misc.

Wafersortingsystem

PR stripper

Wafer lasermarkingsystem

Wafer filmexpander

SEM vertical samplePrep system

SEM horizontalsample prep

system

Misc.

PACKAGECHIP

MODULEPCB

WAFER

http://www.pamtek.com/products/semicon-handling/http://www.pamtek.com/products/semicon-handling/

Tel l 031. 371. 3100 / Fax l 031. 373. 3114

Website l www.pamtek.com

Email l pamtek@pamtek.com

Thank youPAMTEK CORPORATION

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