passive and active co-design, antenna- in-package, on-chip ... · 3. 3d printed mmwaveand thz...

Passive and Active Co-Design, Antenna-in-Package, On-Chip Antenna and 3D Printing Technology for MmWave and

THz Applications

Forum for Electromagnetic Research Methods and Application Technologies (FERMAT)

Dr. Bing ZHANG, Full Professor

College of Electrical and Information Engineering, Sichuan University, Chengdu, P. R. [email protected]

Copyright

©The use of this work is restricted solely for academic purpose. Theauthor of this work owns the copyright and no reproduction in any form ispermitted without written permission by the author .

2

AbstractWe introduce two co-designs of RF passive and active devices. By co-designing a 1.2 GHz oscillator with bandpass filters,

the phase noise and harmonic suppression are improved. By co-designing a 220 GHz on-chip antenna with reflection

amplifiers and driving amplifiers, the radiated power is enhanced. Then a historical review as well as outlook of the popular

processes to implement antennas for mmWave and THz applications are given. Investigations go into the aspects of design,

process and packaging. Great cost reduction is achieved when the Low Temperature Co-fired Ceramic (LTCC) process is

replaced by the Liquid Crystal Polymer (LCP), while equal performance remains. Methods to overcome the intrinsic

drawbacks of both the materials are discussed. Successful demonstrations are made up to 145 GHz of both LTCC and LCP

packaged antennas. The 3D printing technology is eye-catching nowadays, while most focuses are on the non-metallic 3D

printing technique. Here, we, for the first time, manage with successful demonstration to implement antennas by metallic 3D

printing technology up to the H-band (220-325 GHz). Information are given on the design precautions and process-related

surface roughness of the 3D printed antennas.

3

Keywords: Antenna-in-package, Antenna-on-chip, LTCC, LCP, Co-design, 3D printing, MmWave, THz.

Biography 4Bing Zhang (S’09-M’13-SM’16) is a Full Professor at the College of Electrical and Information Engineering, Sichuan University,Chengdu, P. R. China. He was born in Taiyuan, China. He received the B.E. from the Civil Aviation University of China 2004, theM.E. from Shanxi University 2008, and the Ph.D. degree from Nanyang Technological University 2012, all in Electrical andElectronic Engineering.

He was a Visiting Scholar with the University of Nice Sophia Antipolis, Nice, France, in May 2012, and a Visiting Scientist withTélécom Bretagne, Brest, France, in November 2014 and April 2015. He was a Post-Doctoral Researcher with the MEL, MC2,Chalmers University of Technology, Gothenburg, Sweden, from November 2012 to October 2015. He was a Research Fellow withDepartment of Electrical and Computer Engineering, National University of Singapore from November 2016 to August 2017. He is apart-time Consultant with Sunrise Company, Ltd., Guangzhou, China, where he is involved in developing mobile base stationantennas. He is the Chief Technology Officer of Blue Ocean Information Technology Company, Ltd., Wuhan, China, where he isinvolved in developing wearable electronic devices. His current research interests include design and co-design of RF passive andactive devices, mmWave/THz antennas, packaging of mmWave/THz devices, thin film materials and processes for mmWave/THzapplications, 3-D printing technologies for mmWave/THz passive and active device fabrication, wireless power transfer and energyharvesting.

Dr. Zhang was a recipient of the Foxconn Scholarship in 2008, the Singapore Ministry of Education Scholarship from 2009 to2012, the Dragon Venture Award in 2012, the Best Student Paper Award of the Asia-Pacific Conference on Antennas and Propagationin 2012, and the Young Scientist Award of the International Union of Radio Science (URSI, Commission B) in 2013. He is the TPCMember and TPC Chair of several international conferences. He serves as a Reviewer for journals including the PROCEEDINGS OFTHE IEEE, the IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, the IEEE TRANSACTIONS ON TERAHERTZSCIENCE AND TECHNOLOGY, the IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, the IEEETRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTRUING TECHNOLOGY, the IEEE MICROWAVEAND WIRELESS COMPONENTS LETTERS, the IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS and the IETELECTRONICS LETTERS.

5Presentation Outline1. Co-design of microwave passive and active components

1.1 Co-design of 1.2 GHz oscillator with bandpass filters

1.2 Co-design of G-band (140-220 GHz) on-chip antenna with reflection amplifiers and driving amplifiers

2. Package and integration of mmWave antennas and circuits

2.1 V-band (50-75 GHz) linearly-(LP)/circularly-polarized (CP) grid array antennas on low temperature co-fired ceramics (LTCC) for antenna-in-package (AiP) applications

2.2 A V-band scan beam array (SBA) fed by folded Butler Matrix

2.3 A D-band (110-170 GHz) Quad Flat No-lead Package (QFN) packaged GAA on LTCC

2.4 A D-band packaged GAA on Liquid Crystal Polymer (LCP)

3. 3D printed mmWave and THz devices

3.1 Introduction

3.2 3D printed mmWave and THz deivces

3.2.1 Dielectric 3D printed mmWave and THz devices

3.2.2 Metallic 3D printed mmWave and THz devices

3.3 Conclusions and future trends

References

Publications

6

1. Co-design of microwave passive and active components

71.1 Co-design of 1.2 GHz oscillator with bandpass filters

*B. Zhang, W. Zhang, R. Ma, X. Zhang, and J. Mao, “A co-design study of filters and oscillator for low phase noise and high harmonic rejection,” ETRI Journal, vol. 30, no. 2, pp. 344-346, Apr. 2008.

Schematic of the oscillator Photograph of the oscillator

8

Simulated output harmonics Measured output harmonics

16 dB and 20 dB harmonic suppression improvement for 2nd and 3rd harmonics!

Simulated phase noise Measured phase noise

18 dB phase noise improvement!

9

1.2 Co-design of G-band (140-220 GHz) on-chip antenna with reflection amplifiers and driving amplifiers

λ/4

Teledyne 250nm DHBT InP processSchematic of the antenna

*M. Bao, B. Zhang, and Y. Li, “An active antenna”, WIPO 13710871.8-1812.

10

Layout of the antenna with co-designed amplifiers

The driving amplifier

The reflection amplifier

180 190 200 210 220-25

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5

10

|S11

|, |S

22| a

nd

|S21

| (d

B)

Frequency (GHz)

|S11|

|S22|

|S21|

180 190 200 210 220-4

-2

0

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|S11

| (d

B)

Frequency (GHz)

11

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Co-polarization Cross-polarization

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Co-polarization Cross-polarization

Radiation patterns at 200 GHz E- and H-planes

12

2. Package and integration of mmWaveantennas and circuits

13

Statistics on 60-GHz antennas from IEEE Xplore For substrates classifications:PCB: includes Duroid, alumina, FR4 and other substrates from different vendors that compatible with the PCB process; Others: includes sillica, glass, quartz, ceramic, foam, polymer, resin and MEMS based antennas.For antenna classifications:Microstrip patch: also includes microstrip patch array; Dipole & monopole: also includes dipole or monopole array; Others: include antennas like lens, PIFA, IFA, cavity antenna, horn antenna, waveguide antenna.

2.1 V-band LP/CP GAAs on LTCC for AiP applications

14

*J. D. Kraus, “A backward angle-fire array antenna,” IEEE Trans. Antennas Propagat., vol. 12, pp. 48-50, Jan. 1964.

The first grid array antenna (GAA) was from J.D. Kraus in 1964:

• Non-resonant antenna

• Fed at the edge of the antenna

• The direction of the pattern is dependent upon the input signal’s frequency, resulting in 30 degree beam scan flexibility

Kraus’ GAA

The history of grid array antenna

15

*R. Conti, J. Toth, T. Dowling, and J. Weiss, “The wire-grid micrstrip antenna,” IEEE Trans. Antennas Propagat.., vol 29, pp. 157-166, Jan. 1981.

Conti’s GAA

Conti’s GAA :

• Resonant antenna

• Four grid arrays were adopted for mono-pulse radar

• The aperture was tapered to control side lobe level

16

*H. Nakano, I. Oshima, H. Mimaki, K. Hirose, and J. Yamauchi, “Center-fed grid array antennas,” in Proc. IEEE Int. Symp. Antennas. Propagat., vol. 4, pp. 2010-2013, 1995.H. Nakano and T. Kawano, “Grid array antennas,” in Proc. IEEE Int. Symp. Antennas Propagat., vol. 1, pp. 236-239, 1997.T. Kawano and H. Nakano, “Grid array antenna with c-figured elements,” in Proc. IEEE Int. Symp. Antennas Propagat., vol. 2, pp. 1154-1157, 1998.T. Kawano and H. Nakamo, “Cross-mesh array antennas for dual LP and CP waves,” in Proc. IEEE Int. Symp. Antennas Propagat., vol. 4, pp. 2748-2751, 1999.

Nakano’s GAA:(a) Dual polarizations(b) Meandering, high gain (21.1 dBi)(c) Circular polarization(d) Dual linear polarizations and circular polarization (with C-

figured element)

Nakano’s GAA(a) (b) (c) (d)

17

Zhang and Sun’s GAA

Zhang and Sun’s GAA:•The first 60-GHz GAA•The GAA was transformed into a standard package•Low temperature co-fired ceramic (LTCC) was used as antenna substrate and package

*M. Sun, Y. P. Zhang, Y. X. Guo, K. M. Chua, and L. L. Wai, “Integration of grid array antenna in chip package for highly integrated 60-GHz radios ,” IEEE Antennas Wireless Propagat. Lett., vol. 8, pp. 1364-1366, Jan. 2010.

18

*B. Zhang and Y. P. Zhang, “Analysis and synthesis of millimeter-wave microstrip grid array antennas,” IEEE Antennas Propagat. Mag., vol. 53, no. 6, pp. 42-55, Dec. 2011.

Typical structure of a microstrip (MS) GAA

• Radiating array: 0.017 mm thick copper

• Substrate: Rogers TMM4, relative permittivity = 4.5, loss tangent = 0.002, h = 0.254 mm, a = b = 15 mm

• Ground: 0.017 mm thick copper

• Feeding: coaxial cable through ground and substrate (p = 0.25mm, d = 0.5mm)

Analysis and synthesis of grid array antenna

19

50 52 54 56 58 60 62 64 66 68 70

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-10

0

10

20

30

40

50

60

70

Inp

ut

imp

eda

nce

(O

hm

)

Frequency (GHz)

Re (Zin)

Im (Zin)

a: (52 GHz): non-resonance

b: (57 GHz): series-resonance

c: (60 GHz): parallel-resonance

ab

c

Input impedance

20

50 52 54 56 58 60 62 64 66 68 70-18

-16

-14

-12

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-8

-6

-4

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0

|S11

| (d

B)

Frequency (GHz)50 52 54 56 58 60 62 64 66 68 70

-2

0

2

4

6

8

10

12

14

16

Gai

n (

dB

i)Frequency (GHz)

a: -8.85 dB b: -2.86 dBc: -16.29 dB

a: 7.26 dBib: 8.92 dBic: 14.12 dBi

a

b

c

a

b

c

Matching and gain

21

-60-45-30-15

0

030

60

90

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-60-45-30-15

0 Co Cross

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330

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0 Co Cross

E-plane H-plane

Radiation patterns and current distribution at 52 GHz (non-resonance)

Not equally distributed current

22

H-plane

-60

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030

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90

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0 Co Cross

E-plane

Radiation patterns and current distribution at 57 GHz (series-resonance)

Improved,but still not equally distributed

23

E-plane

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030

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90

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0 Co Cross

H-plane

Radiation patterns and current distribution at 60 GHz (parallel-resonance)

Equally distributed current!

24Division of the large radiating array into four sub grid arrays

Current distribution improved!

52 radiating elements 52 radiating elements

25

Radiation patterns of the GAA with single radiating array

Radiation patterns of the GAA with four sub grid arrays

57 GHz 60 GHz 64 GHz


Radiation patterns of the un-divided and divided array

Un-divided:

Divided:

26

Brown: 10 um AuGreen: Ferro A6M LTCC (εr = 5.9, tan δ = 0.002)

ts1 = ts5 = 0.1 mm, ts2 = 0.4 mm, ts 3 = ts4 = 0.4 mmfinal dimensions 15 × mm ×15 mm ×1 mm

ts1

ts2

ts3

ts4

ts5

gnd1

gnd2

l

s

l = 2s = 2.24 mm≈ λg @ 60 GHz

wl = ws = 0.12 mm

θθ

θ-180oθ-180o

x y

z

*B. Zhang and Y. P. Zhang, “Grid array antennas with subarrays and multiple feeds for 60-GHz radios,” IEEE Trans. Antennas Propag., vol. 60, no. 5, pp. 2270-2275, May 2012. B. Zhang, D. Titz, F. Ferrero, C. Luxey, and Y. P. Zhang, “Integration of quadruple linearly-polarized microstrip grid array antennas for 60-GHz antenna-in-package applications,” IEEE Trans. Comp. Packag. Manuf. Technol., vol. 3, no. 8, pp. 1293-1300, Aug. 2013

Design of the linearly-polarized GAA

27Zoomed view of the transition

28Parallel-plate mode distribution vs. the number of fencing vias

No fencing via: 2 fencing vias:

4 fencing vias: 7 fencing vias:

Parallel plate mode effectively

suppressed!

29

Bottom view

Fabricated antenna

Top view

30Simulated antenna’s performance vs. the number of fencing vias

50 52 54 56 58 60 62 64 66 68 70-50

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-5

0

|S1

1| (

dB

)

Frequency (GHz)

No fencing via2 fencing vias4 fencing vias7 fencing vias

50 52 54 56 58 60 62 64 66 68 704

6

8

10

12

14

16

18

Pea

k r

eali

zed

ga

in (

dB

i)

Frequency (GHz)

No fencing via2 fencing vias4 fencing vias7 fencing vias

Impedance bandwidth is notmuch affected by the numberof fencing vias

The gain increases with the number offencing vias for less power is dissipated bythe parallel-plate mode

31

50 52 54 56 58 60 62 64 66 68 70-40

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0

|S1

1| (

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)

Frequency (GHz)

Simulated Measured

50 52 54 56 58 60 62 64 66 68 702

4

6

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10

12

14

16

18

Pea

k r

eali

zed

ga

in (

dB

i)

Frequency (GHz)

Simulated Measured

Measured performance

Simulated Imp. BW: 54 – 66 GHz Measured Imp. BW: 50 – 65.6 GHz

Simulated performance:Maximum gain 16.3 dBi @ 60 GHz3-dB gain BW 57 – 66 GHz

Measured performance:Maximum gain 15 dBi @ 62 GHz3-dB gain BW 58.5 – 67 GHz

32

- 4 5

- 3 0

- 1 5

0

0

3 0

6 0

9 0

1 2 0

1 5 0

1 8 0

2 1 0

2 4 0

2 7 0

3 0 0

3 3 0

- 4 5

- 3 0

- 1 5

0 S im u la ted c o S im u la ted c ro ss M ea su red c o M ea su red c ro ss

- 4 5

- 3 0

- 1 5

0

0

3 0

6 0

9 0

1 2 0

1 5 0

1 8 0

2 1 0

2 4 0

2 7 0

3 0 0

3 3 0

- 4 5

- 3 0

- 1 5

0 S im u la ted co S im u la ted c ro ss M ea su red co M ea su red c ro ss


-4 5

-3 0

-1 5

0

0

3 0

6 0

9 0

1 2 0

1 5 0

1 8 0

2 1 0

2 4 0

2 7 0

3 0 0

3 3 0

-4 5

-3 0

-1 5

0

S im u la ted c o S im u la ted c ro ss M easu re d co M easu re d c ro ss

-4 5

-3 0

-1 5

0

0

3 0

6 0

9 0

1 2 0

1 5 0

1 8 0

2 1 0

2 4 0

2 7 0

3 0 0

3 3 0

-4 5

-3 0

-1 5

0

S im u la te d co S im u la te d c ro ss M e asu red co M e asu red c ro ss

-4 5

-3 0

-1 5

0

0

3 0

6 0

9 0

1 2 0

1 5 0

1 8 0

2 1 0

2 4 0

2 7 0

3 0 0

3 3 0

-4 5

-3 0

-1 5

0

S im u la te d co S im u la te d c ro ss M easu red co M easu red c ro ss

-4 5

-3 0

-1 5

0

0

3 0

6 0

9 0

1 2 0

1 5 0

1 8 0

2 1 0

2 4 0

2 7 0

3 0 0

3 3 0

-4 5

-3 0

-1 5

0

S im u la te d co S im u la te d c ro ss M easu red co M easu red c ro ss


E-plane E-plane E-plane

H-plane H-plane H-plane

Vertical beams in the broadside direction from 55 – 67 GHz.

33

*B. Zhang, Y. P. Zhang, Diane Titz, Fabien Ferrero, and Cyril Luxey, “A circularly-polarized array antenna using linearly-polarized sub grid arrays for highly-integrated 60-GHz radio,” IEEE. Trans. Antennas Propagat., vol. 61, no. 1, pp. 436-439, Jan. 2013.

θθ-90o

θ-180o θ-270o

l = 2s = 2.24 mm≈ λg @ 60 GHz

wl = ws = 0.12 mm


ts1 = ts5 = 0.1 mm, ts2 = 0.4 mm, ts 3 = ts4 = 0.2 mm, final dimensions 15 × mm ×15 mm ×0.9 mm

ts1

ts2

ts3

ts4

gnd1

gnd1

x y

z

Design of the linearly-polarized GAA

34

Subarray sensitivity analysis vs. feeding phase and amplitude

Phase I (degree)

Phase II(degree)

Phase III (degree)

Phase IV (degree)

Amp II (dB)

Amp II(dB)

Amp III(dB)

Amp IV(dB)

Case 1 θ θ–90 θ–180 θ–270 α α α α

Case 2 θ θ–90 θ–180 θ–270 α α-1 α-2 α-3

Case 3 θ θ–90 θ–180 θ–270 α α-2 α-4 α-6

Case 4 θ θ–100 θ–200 θ–300 α α α α

Case 5 θ θ–110 θ–220 θ–330 α α α α

50 52 54 56 58 60 62 64 66 68 70-1

0

1

2

3

4

5

6

7

Axia

l ra

tio

(dB

)

Frequency (GHz)

Case 1 Case 2 Case 3 Case 4 Case 5

50 52 54 56 58 60 62 64 66 68 702

4

6

8

10

12

14

16

Pea

k r

eali

zed

ga

in (

dB

i)

Frequency (GHz)

Case 1 Case 2 Case 3 Case 4 Case 5

The axial ratio is sensitive while the gain is not.

35Fabricated antenna

Top view Bottom view

36Measured performance

50 52 54 56 58 60 62 64 66 68 700

3

6

9

12

15

Axi

al r

atio

(d

B)

Frequency (GHz)

Simulated Measured

50 52 54 56 58 60 62 64 66 68 70-40

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-5

0

|S1

1| (

dB

)

Frequency (GHz)

SimulatedMeasured

50 52 54 56 58 60 62 64 66 68 70-2

0

2

4

6

8

10

12

14

16

18

Pea

k r

eali

zed

gai

n (

dB

i)

Frequency (GHz)

Simulated Measured

Simulated AR BW: 56.6 – 64 GHz Measured AR BW: 50 – 67 GHz

Simulated Imp. BW: 55.2 – 65.3 GHz Measured Imp. BW: 57.2 – 67 GHz

Simulated performance: Maximum gain 15.8 dBi @ 60 GHz3-dB gain BW 58 – 65 GHz

Measured performance:Maximum gain 13 dBi @ 61 GHz3-dB gain BW 59.1 – 67 GHz

37

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Simulated LHCP Simulated RHCP Measured LHCP Measured RHCP

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0


57 GHz 61 GHz67 GHz

phi=0o

phi=90o

phi=0o phi=0o

phi=90ophi=90o


Vertical beams in the broadside direction from 57 – 67 GHz.

38

*B. Zhang and Y. P. Zhang, “A scan beam array fed by folded Butler Matrix on LTCC for 60 GHz integrated radios,” in Proc. IEEE. Antennas Propagat. Soc. Int. Symp., Spokane, WA., Jul. 2011, pp. 1-4.

Schematic

Exploded view


ts1 = 0.3 mm, ts2 = ts3 = ts4 = ts5 = 0.2 mmpatch antenna separation = 2.5 mm = 0.5 λ0 @ 60 GHzfinal dimensions: 12 mm × 5.5 mm × 1.1 mm

x

y

z

2.2 A V-band SBA fed by folded Butler Matrix

39

55 56 57 58 59 60 61 62 63 64 65-26

-24

-22

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-16

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-12

-10

-8

-6

|S1

1| (

dB

)

Frequency (GHz)

Port 1 Port 2 Port 3 Port 4

55 56 57 58 59 60 61 62 63 64 651

2

3

4

5

6

7

8

9

Pea

k R

eali

zed

Gai

n (

dB

i)

Frequency (GHz)


Imp. BW:57 - 64 GHz (11.7%) when each port

excites

Maximum gain: 8.5 dBi @ 62 GHz when port 1 or 4 excites 7.6 dBi @ 60 GHz when port 2 or 3 excites

3-dB gain BW:57 - 65 GHz (13.3%) when port 1 or 4 excites57 - 64.7 GHz (12.8%) when port 2 or 3 excites


40

-150 -100 -50 0 50 100 150-70

-60

-50

-40

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-20

-10

0

Nor

mal

ized

Gai

n (

dB

i)

Theta (degree)


-150 -100 -50 0 50 100 150-70

-60

-50

-40

-30

-20

-10

0

No

rmal

ized

Gai

n (

dB

i)

Theta (degree)


-150 -100 -50 0 50 100 150-70

-60

-50

-40

-30

-20

-10

0

No

rmal

ized

Gai

n (

dB

i)

Theta (degree)



±8o (7.2 dB side lobe level) when port 1 or 4 excites







41

*B. Zhang, H. Gulan, T. Zwick, U. Oderfält, F. Carlsson, and H. Zirath, “Integration of a 140 GHz packaged LTCC grid array antenna with an InPdetector,” IEEE Trans. Comp. Packag. Manuf. Technol., vol. 5, no. 8, pp. 1060- 1068, Aug 2015

2.3 A D-band QFN packaged GAA on LTCC

Target: to design and implement a antenna-integrated QFN package of the D-band InP MMIC from 141-148.5 GHz

42

Design and integration of the D-band GAA on LTCC with InP MMIC


sub1 = 0.192 mm, sub2 = sub3 = 0.096 mm, sub4 = 0.096 mm, final dimensions 12 × mm ×12 mm ×0.48 mm

43Parallel plate mode suppression within the package

Not opened GND2 Opened GND2

Parallel plate mode effectively suppressed!

44

Radiation patterns at 145 GHz on E- and H-planes

Measured antenna performance

Simulated Imp. BW: 139 – 153 GHzMeasured Imp. BW: terrible

Simulated performance: maximum gain 18.8 dBi @ 149 GHz, 3-dB gain BW 140 – 151 GHzMeasured performance: maximum gain 17.6 dBi @ 146 GHz, 3-dB gain BW 140– 149 GHz

45Fabrication tolerance analysis

Misaligned stacked viasNot well-controlled screen printing

Designed: wp=58 µm, g1=g2=35µmFabricated: wp=46 µm, g1=44 µm, g2=46 µm

Via diameter 100 µmVia misalignment at least 50 µm

46

当前无法显示此图像。

Wire bonding test

Peel-off force: 7 gramIndustry standard: 3 gram

Peel-off of the 6µm gold when bonding wedge lift

47

Integration of GAA with D-band InP MMIC

A detector A five-stage LNA

48

Port 1

R = 10.5 Ω

Port 2

L = 45 pH

C1 = 15 fF C2 = 10 fF

135 140 145 150 155-16

-14

-12

-10

-8

-6

-4

-2

0

S-p

aram

eter

s (d

B)

Frequency (GHz)

|S21| HFSS Model

|S21| RLC Model

|S11| HFSS Model

|S11| RLC Model

100 125 150 175 20040

45

50

55

60

65

70

75

R (

Oh

m)

L (

pH

)

l (um)

L(pH)

5

10

15

20

25

R (Ohm)

Modeling of the D-band bond wires

Simulated average 1 dB insertion loss

49

140 142 144 146 148 150-5

-4

-3

-2

-1

0

|S21

| (dB

)

Frequency (GHz)

Measured frequency response of the antenna+detector

@141 GHz

@146 GHzMeasured frequency response of the bond

wire transition, average 2 dB

50The whole D-band QFN package

Top antenna Bottom box

512.4 A D-band GAA on LCP

*B. Zhang, C. Kärnfelt, H. Gulan, T. Zwick, and H. Zirath, “A low cost D-band packaged antenna on organic substrate for mass production,” IEEE Trans. Comp. Packag. Manuf. Technol., vol. 6, no. 3, pp. 359-365, Mar. 2016.

336 antennas in fabrication one run.

• Simplified structure• Low cost process• High fabrication capability

52

E-plane @ 145 GHz H-plane @ 145 GHz

Measured antenna performance

Simulated Imp. BW: 137 – 152 GHz Measured Imp. BW: 136 – 157 GHz

Sim max gain:16.8dBi@149 GHzMeas max gain:14.5 dBi@146 GHz

53

1 3 0 1 3 5 1 4 0 1 4 5 1 5 0 1 5 5 1 6 0-3 5

-3 0

-2 5

-2 0

-1 5

-1 0

-5

|S11

| (d

B)

F req u en cy (G H z)

w s-2 0 祄 w s-1 0 祄 w s w s+ 1 0 祄 w s+ 2 0 祄

1 3 0 1 3 5 1 4 0 1 4 5 1 5 0 1 5 5 1 6 0-2

0

2

4

6

8

10

12

14

16

18

Pea

k re

aliz

ed g

ain

(dB

i)


w s-2 0 祄 w s-1 0 祄 w s w s+ 1 0祄 w s+ 2 0祄

21' 4.1tan

21

RMScc

1 3 0 1 3 5 1 4 0 1 4 5 1 5 0 1 5 5 1 6 0-2 0

-1 5

-1 0

-5

0

|S11

| (d

B)


0 祄 0 .3 祄 0 .6 祄 0 .9 祄 1 .2 祄

1 3 0 1 3 5 1 4 0 1 4 5 1 5 0 1 5 5 1 6 0-4

0

4

8

1 2

1 6

2 0

Pea

k re

aliz

ed g

ain

(dB

i)


0 祄 0 .3 祄 0 .6 祄 0 .9 祄 1 .2 祄

Fabrication tolerance analysis

Surface roughness related Etching rate related

The antenna’s performance is robust against fabrication tolerance!

54

3. Metallic 3D printing technology of mmWave and THz applications

553.1 Introduction

Redrawn from “The free beginner’s guide to 3D printing”, online: http://3dprintingindustry.com/3d-printing-basics-free-beginners-guide/

563.2.1 Dielectric 3D printed mmWave and THz Device

Designs from University of Michigan Ann Arbor

SLA horn and transducer Machined metal holder

L-Shaped Horn+Transducer [1];Technique: SLA (Stereolithography Apparatus);Material: Emmerson and Cumming HiK dielectric powder;Frequency: Ka-band (26.5 – 40 GHz);Performance: 12 dBi, <-20 dB X-pol;Year: 2005.

Luneberg Lens [2];Technique: CSLA (Ceramic Stereolithography Apparatus);Functional band: Ka-band;Material: alumina;Performance: Maxi. 26 dBi gain @ 33 GHz, Gaussian beam;Year: 2007.

57Designs from University of Limoges

EBG (Electromagnetic Bandgap) BPF (Bandpass Filter) [3];Technique: CSLA ;Material: zirconia;Frequency: Ka-band;Performance: central freq. 32. 94GHz, -3dB BW 1.03%, insertion loss 3dB, ripple 0.5 dB;Year: 2007.

EBG Resonator [4];Technique: µSLA (Micro Stereolithography Apparatus);Material: alumina;Frequency: D-band (110-170 GHz);Performance: unloaded Q-factor 2500;Year: 2008.

58Designs from Queen Mary University of London

EBG Structure [5];Technique: CSLA ;Material: alumina;Frequency: W-band (75-110 GHz);Performance: bandgap 84-118 GHz;Year: 2007.

EBG Lens [6];Technique: CSLA ;Material: alumina;Frequency: W-band;Performance: -15 dB side lobe on E-plane, -10 dB side lobe on H-plane;Year: 2008.

59Designs from University of Arizona

WPS (Wood Pile Structure) EBG [7];Technique: PJ (Polymer Jetting) ;Material: acrylic polymer;Frequency: 600 GHz;Performance: fundamental EBG 180 GHz, 2nd EBG 278 GHz, 3rd EBG 372 GHz;Year: 2008.

Hollow-Core EXMT (Electromagnetic Crystal) Waveguide [8]; Technique: PJ ;Material: acrylic polymer;Frequency: G-band (140-220 GHz);Performance: propagation loss 0.03 dB/mm @ 105 GHz;Year: 2011.

Johnson EBG [7];Technique: PJ;Material: acrylic polymer;Frequency: 350 GHz;Performance: fundamental EBG @ 223 GHz;Year: 2008.

60Designs from University of Arizona

Hollow-Core EXMT Horn [9];Technique: PJ ;Material: acrylic polymer;Frequency: D-band (110-170 GHz);Performance: Maxi. gain 23 dBi@200 GHz;Year: 2012.

Luneberg Lens [10];Technique: PJ ;Material: acrylic polymer;Frequency: Q-band (33-50 GHz);Performance: N.A.;Year: 2014.

61Designs from Imperial College London

Waveguide [18];Technique: SLA ;Material: resin;Frequency: W-band;Performance: 11 dB/m attenuation;Year: 2015;

BPF [18];Technique: SLA ;Material: resin;Frequency: W-band;Performance: center frequency of 107.2 GHz, 6.8 GHz passband, and 0.95 dB insertion loss;Year: 2015;

Waveguide [27];Technique: RECILS ;Material: resin;Frequency: 0.75-1.1 THz;Performance: 0.64 dB/λgattenuation;Year: 2017;

IQ vector modulator [28];Technique: Polyjet ;Material: resin;Frequency: 0.325-0.5 THz;Performance: 20 dB attenuation;Year: 2017;

62Other designs

Lens [11];Technique: CSLA ;Material: alumina;Frequency: V-band (50-75 GHz);Performance: Imp. BW. 55-65 GHz, maxi. Dir. 21 dBi @ 64 GHz;Year: 2010,Institute: University of Rennes.

Waveguide [12];Technique: SLA ;Material: UV-curable polymer;Frequency: W-band;Performance: averaged 0.3 dB insertion loss;Year: 2011, Institute: Univ. Wisconsin-Madison.

Corrugated Horn [12];Technique: SLA;Material: UV-curable polymer;Frequency: W-band;Performance: N.A.;Year: 2011;Institute: Univ. Wisconsin-Madison.

63Other designs

Plasmonic Waveguide [13];Technique: PJ;Material: acrylic polymer;Frequency: THz;Performance: N.A.;Year: 2013;Institute: University of Utah.

Reflectarrays [14]; Technique: PJ;Material: acrylic polymer;Frequency: W-band;Performance: maxi. gain 25 dBi @ 100 GHz;Year: 2014;Institute: Colorado School of Mines.

64Other designs

Waveguide [15];Technique: SLA;Material: photopolymer;Frequency: H-band;Performance: averaged 0.4 dB insertion loss ;Year: 2014;Institute: SwissTo12.

Diagonal Horn [15];Technique: SLA;Material: photopolymer;Frequency: H-band;Performance: maxi. gain 26 dBi@ 320 GHz;Year: 2014;Institute: SwissTo12.

Lens [16];Technique: SLAMaterial: N.A.;Frequency: H-band;Performance: maxi. gain 26.5 dBi @ 268 GHz;Year: 2014; Institute: UESTC.

The first successfully marketed 3D printed mmWave devices!!

65

Offset Stepped-Reflector Antenna [17];Technique: SLA;Material: nylon;Frequency: Ka-band;Performance: maxi. Gain 40.4 dBi @ 30 GHz;Year: 2015;Institute: Technical University of Denmark.

Other designs

66

Ku-band (10-16 GHz) corrugated

horn

X-band (8-12 GHz) Luneberg lens

2.5 GHz frequency selective surface

100 GHz dielectric reflectarray

W-band (75-110 GHz) waveguide

Can we print metal?

3.2.2 Metallic 3D printed mmWave and THz Device

67Yes, we can!

Binder jetting and sintering

316L stainless steel

Selective laser meltingCu15Sn

68

Waveguide [19];Technique: SLM (Selective Laser Melting);Material: Ti-6Al-4V;Frequency: W-band;Performance: averaged 2dB insertion loss;Year: 2012;Institute: Catholic University of Leuven.

The only metallic 3D printed mmWave device before 2012. The reason for the rarity of metallic 3Dprinted mmWave and THz deivce is not technical, but business priority. The microwave industry iscraving for dielectric 3D printed devices to be more durable, while metallic ones are ignored.

69In 2015, Zhang started a series of experiments on metallic 3D printed mmWave and THz devices,with the purpose to find the suitable “process+material” for device fabrication [20] [21] [29].

Cost comparison*:Antenna print------------Manual polish------------Gold electroplating ----MMP treatment --------*Neglecting the technician training cost.

70316L stainless steel Cu15Sn

XRD pattern XRD pattern

Microstructure Microstructure

*B. Zhang, Z. Zhan, Y. Cao, H. Gulan, P. Linnér, J. Sun, T. Zwick, and H. Zirath, “Metallic 3D printed antennas for millimeter- and submillimeter-wave applications,” IEEE Trans. THz Sci. Technol., vol. 6, no. 4, pp. 592-600, Jul. 2016.

71

Raw SSManually polished

Cu15Sn

Gold plated SS

MMP SS Gold plated Cu15Sn

MMP Cu15Sn

V-Band 3D printed horn antennas

72um 316L 316L gold

electroplated

316L MMP

treated

Cu15Sn

manually

polished

Cu15Sn gold

electroplated

Cu15Sn MMP

treated

Spv 129 142.84 68.737 30.104 20.495 39.349

Sq 16.096 6.7389 9.4598 3.5233 1.699 0.54156

Sa 12.893 4.6351 7.8153 2.7919 1.2936 0.25213

IsoFlatness 127.42 128.27 59.557 25.494 19.887 37.67

V-band horns

Inner surface photos

Inner surface profiles

Our choice for the following experiments, balancing the cost and performance.

Measured inner surface roughness of 3D printed V-band horns

73

0 2 4 6 8 10 120.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

An

ten

na

loss

(d

B)

Surface roughness (um)

3D printed V-band antenna loss vs. surface roughness

743D printed E-, D- and H-band antennas

From top: E-, D- and H-band antennas Far-field measurement setup

75

60 65 70 75 80 85 90-55

-50

-45

-40

-35

-30

-25

-20

|S11

| (d

B)

Frequency (GHz)

Simulated M easured

60 65 70 75 80 85 9022

23

24

25

26

Ga

in (

dB

i)

F req uency (G H z)

S im ulated M easured

-180 -120 -60 0 60 120 180-70

-60

-50

-40

-30

-20

-10

0

10

No

rma

lize

d r

ad

iati

on

pa

tter

ns

(dB

)

Theta (degree)

Co-pol simulated Co-pol measured

-180 -120 -60 0 60 120 180-120

-100

-80

-60

-40

-20

0

Nor

mal

ized

rad

iati

on

pat

tern

s (d

B)

Theta (degree)

Co-pol simulated Co-pol measured

Performance of the 3D printed E-band horn antenna

0.5 dB difference


76

110 120 13 0 1 40 150 160 1 70-60

-50

-40

-30

-20

-10

|S11

| (d

B)


S im u la ted M easu red

110 12 0 13 0 1 40 15 0 160 1 7022 .0

22 .5

23 .0

23 .5

24 .0

24 .5

25 .0

Gai

n (

dB

i)


S im u la ted M easu red

-1 8 0 -1 2 0 -6 0 0 6 0 1 2 0 1 8 0-8 0

-7 0

-6 0

-5 0

-4 0

-3 0

-2 0

-1 0

0

1 0

No

rma

lize

d r

adia

tio

n p

atte

rns

(dB

)

T h e ta (d eg ree )

C o -p o l s im u la ted C o -p o l m ea su red

-18 0 -1 20 -60 0 6 0 1 2 0 1 80

-1 20

-1 00

-80

-60

-40

-20

0

Nor

mal

ized

ra

dia

tion

pat

tern

s (d

B)

T h eta (d egree)

C o -p o l s im u la ted C o -p o l m easu red

Performance of the 3D printed D-band horn antenna


0.7 dB difference

77

2 2 0 2 4 0 2 6 0 2 8 0 3 0 0 3 2 0- 9 0

- 8 0

- 7 0

- 6 0

- 5 0

- 4 0

- 3 0

- 2 0

- 1 0

|S11

| (d

B)

F r e q u e n c y ( G H z )

S im u la te d M e a s u r e d

2 2 0 2 4 0 2 6 0 2 8 0 3 0 0 3 2 02 1

2 2

2 3

2 4

2 5

Gai

n (

dB

i)


S i m u l a t e d M e a s u r e d

- 1 8 0 - 1 2 0 - 6 0 0 6 0 1 2 0 1 8 0- 8 0

- 6 0

- 4 0

- 2 0

0

Nor

mal

ized

rad

iati

on p

atte

rns

(dB

)

T h e t a ( d e g r e e )

C o - p o l s im u la t e d C o - p o l m e a s u r e d

-1 8 0 - 1 2 0 -6 0 0 6 0 1 2 0 1 8 0-1 2 0

-1 0 0

- 8 0

- 6 0

- 4 0

- 2 0

0

Nor

mal

ized

rad

iati

on p

atte

rn (

dB

)

T h e ta ( d e g r e e )

C o - p o l s im u la t e d C o - p o l m e a s u r e d

Performance of the 3D printed H-band horn antenna

1 dB difference


78

±5% dimensional tolerance

Fabrication tolerance analysis of the 3D printed antennas

79Fabrication tolerance analysis of the 3D printed antennas

D-band WR-06 H-band WR-03

Commercial Commercial

3D printed 3D printed

Not too bad

80

75 100 125 150 175 200 2250.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

An

ten

na

lo

ss (

dB

)

Frequency (GHz)

3D printed antenna loss vs. frequency

81

From top: 50 mm -, 100 mm - and bend waveguides

PNA measurement setup

*B. Zhang and H. Zirath, “Metallic 3D printed rectangular waveguides for millimeter-wave applications,” IEEE Trans. Comp. Packag. Manuf. Technol., vol. 6, no. 5, pp. 796-804, May 2016.

82

70 75 80 85 90-70

-60

-50

-40

-30

-20

-10

|S1

1| (

dB)

F requency (G H z)


70 75 80 85 90-0 .6

-0 .5

-0 .4

-0 .3

-0 .2

-0 .1

|S21

| (d

B)

F requency (G H z)


70 75 80 85 90-60

-50

-40

-30

-20

-10

|S11

| (dB

)

F requency (G H z)


70 75 80 85 90-1.25

-1.00

-0.75

-0.50

-0.25

0.00

|S21

| (d

B)

F requency (GHz)

Simulated M easured

70 75 80 85 90-70

-60

-50

-40

-30

-20

-10

0

|S11

| (dB

)

F requency (G H z)


70 75 80 85 90-6

-5

-4

-3

-2

-1

|S21

| (dB

)

F requency (G H z)


Performance of the 3D printed E-band waveguides

50 mm 100 mm Bend

0.4 dB insertion loss



83

110 120 130 140 150 160 170

-5

-4

-3

-2

-1

|S21

| (dB

)F requency (G H z)

Sim ulated M easured

110 120 130 140 150 160 170-100

-80

-60

-40

-20

|S11

| (d

B)

Frequency (GHz)

Simulated Measured

110 120 130 140 150 160 170-1.2

-1.0

-0.8

-0.6

|S21|

(dB

)

Frequency (GHz)

Simulated M easured

110 120 130 140 150 160 170

-80

-60

-40

-20

|S11

| (dB

)

Frequency (GHz)

Simulated M easured

110 120 130 140 150 160 170-3.0

-2.5

-2.0

-1.5

-1.0

|S2

1| (

dB)

F requency (GHz)

Simulated M easured

110 120 130 140 150 160 170-70

-60

-50

-40

-30

-20

-10

|S1

1| (

dB

)

Frequency (G H z)

Simulated M easured

Performance of the 3D printed D-band waveguides

50 mm 100 mm Bend

1 dB insertion loss

2 dB insertion loss


84

110 120 130 140 150 160 170-100

-80

-60

-40

-20

|S11

| (dB

)

Freqneucy (GHz)

50 mm SLM 100 mm SLM 127 mm commercial 254 mm commercial

110 120 130 140 150 160 170-7

-6

-5

-4

-3

-2

-1

0

|S21

| (d

B)

Frequency (GHz)

50 mm SLM 100 mm SLM 127 mm commercial 254 mm commercial

Comparison of D-band 3D printed with commercial waveguides

50 mm 3D printed

100 mm 3D printed

127 mm 3D commercial

254 mm 3D commercial

1 dB difference

85

1 1 0 1 2 0 1 3 0 1 4 0 1 5 0 1 6 0 1 7 0- 6 0

- 5 0

- 4 0

- 3 0

- 2 0

- 1 0

|S11

| (dB

)

F r e q u e c y ( G H z )

S L M C o m m e r c ia l

1 1 0 1 2 0 1 3 0 1 4 0 1 5 0 1 6 0 1 7 0- 6

- 5

- 4

- 3

- 2

- 1

0

|S21

| (dB

)


S L M C o m m e r c i a l

Comparison of D-band 3D printed with commercial bends

3.5 dB difference

87

Comparison of metallic, dielectric 3D printed and commercial waveguides

okay

88

+ =

+ =

BPF 81-86 BPF 71-76E-band

deplexer

E-band horn

E-band radio front-end

*B. Zhang and H. Zirath, “A 3D printed metallic radio front end for E-band applications,” IEEE Microw. Wireless Comp. Lett., vol. 26, no. 5, pp. 331-333, May 2016

8915 order BPF

11 order BPF

3D printed E-band BPFs

BPF 81-86

BPF 71-76

*B. Zhang and H. Zirath, “3D printed iris band-pass filters for millimeter-wave applications,” Electronics Letters, vol. 15, no. 22, pp. 1791-1893, Oct. 2015 .

90

Designed:71 - 76 GHzAverage 2dB passband insertion loss90 dB stopband attenuationMeasured:73.5 – 77.5 GHzAverage 8 dB passband insertion loss65 dB stopband attenuation

Designed:81 - 86 GHzAverage 1.5 dB passband insertion loss90 dB stopband attenuationMeasured:84 – 90 GHzAverage 3 dB passband insertion loss50 dB stopband attenuation70 75 80 85 90

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

10

S-P

aram

eter

(dB

)

Frequency (GHz)

S11 simulated

S11 measured

S21 simulated

S21 measured

70 75 80 85 90 95-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

10

S-P

aram

eter

(dB

)

Frequency (GHz)

S11 simulated

S11 measured

S11 simulated

S11 measured

Performance of 3D printed E-band BPFs

91

65 70 75 80 85-40

-30

-20

-10

0

10

|S11

| (d

B)

F requ ency (G H z)

S im u lated M easured

75 80 85 90 95

-30

-20

-10

0

|S22

| (d

B)

F requency (G H z)


65 70 75 80 85 90 95-40

-30

-20

-10

0

10

|S33

| (d

B)

F req uen cy (G H z)

S im ulated M easu red

65 70 75 80 85 90 95-160

-140

-120

-100

-80

-60

-40

-20

|S21

| (d

B)

F requency (G H z)

Sim ulated

M easured

65 70 75 80 85 90 95-100

-80

-60

-40

-20

0

|S31

| (d

B)

Frequency (G H z)

Simulated M easured

75 80 85 90 95-100

-80

-60

-40

-20

0

|S32

| (d

B)

Frequency (G H z)

Simulated

M easured

3D printed E-band deplexer

92

60 65 70 75 80 85-35

-30

-25

-20

-15

-10

-5

0

5

|S11

| (d

B)

Frequency (GHz)

Simulated

Measured

70 75 80 85 90 95

-15

-12

-9

-6

-3

0

3

|S22

| (d

B)

Frequency (GHz)

Simulated Measured

65 70 75 80 85 90 95-100

-90

-80

-70

-60

-50

-40

-30

|S21

| (d

B)

Frequency (GHz)

Simulated Measured

3D printed E-band radio front-end

93

Material Particle Size; Filament Size

Thermal Shrinkage (in Sintering/Post

Sintering/Melting)

Movement Control of the Electron/Laser/UV Beam

Dimensional Tolerance in 3D Printing

Electron/Laser/UV Beam Size; Nozzle

Size

94D-band WR-06 H-band WR-03

Commercial Commercial

3D printed 3D printed

Comparison of 3D printed and commercial waveguide flanges

Chamfered corner

Chamfered corner

Bumpy surfaceBumpy surface

95

Material Particle Size; Filament Size

Gaussianity of the Electron/Laser/UV

Beam

Movement Control of the Electron/Laser/UV Beam

Surface Roughness

in 3D Printing

Electron/Laser/UV Beam Size; Nozzle

Size

961. Material powder refinement? ……Maybe not.2. Development of surface treatment process……Definitely necessary.3. Development of hybrid dielectric 3D printed mmWave and THz devices……Now we have it.

4. Development of hybrid “dielectric+metallic” 3D printing technology…….Challenging.

A 3D printed toy withtwo different materials

3.3 Future trends

97References

[1] L. Schulwitz and A. Mortazawi, “A compact dual-polarized multibeam phased-array architecture for millimeter-wave radar,” IEEE Trans. Microw. Theory Tech., vol. 53, no. 11, pp. 3588-3594, Nov. 2005. [2] K. Brakora, J. Halloran, and K. Sarabandi, “Design of 3-D monolithic MMW antennas using ceramic stereolithography,” IEEE Trans. Antennas Propag., vol. 55, no. 3, pp. 790-797, Mar. 2007. [3] N. Delhote, D. Baillargeat, S. Verdeyme, C. Delage, and C. Chaput, “Ceramic layer-by-layer stereolithography for the manufacturing of 3-D millimeter-wave filters,” IEEE Trans. Microw. Theory Tech., vol. 55, no. 3, pp. 548-554, Mar. 2007.[4] T. Chartier, C. Duterte, N. Delhote, D. Baillargeat, and S. Verdeyme, “Fabrication of millimeter wave components via ceramic stereo- and microstereolithograpyprocesses,” J. Am. Ceram. Soc., vol. 91, no. 8, pp. 2469-2474, Jul., 2008. [5] Y. Lee, X. Lu, Y. Hao, S. Yang, R. Ubic, J. Evans, and C. Parini, “Rapid prototyping of ceramic millimeterwave metamaterials: simulations and experiment,” Microw. Opt. Technol. Lett., vol. 49, no. 9, pp. 2090-2093, Sep. 2007[6] Y. Lee, X. Lu, Y. Hao, S. Yang, J. Evans, and C. Parini, “Directive millimeterwave antennas using freeformed ceramic metamaterials in planar and cylindrical forms,” in Proc. IEEE APS Int. Symp., San Diego, CA, Jul. 2008. pp. 1-4. [7] Z. Wu, J. Kinast, M. Gehm, and H. Xin, “Rapid and inexpensive fabrication of terahertz electromagnetic bandgap structures,” Opt. Express, vol. 16, no. 21, pp. 16442-16451, Oct. 2008. [8] Z. Wu, W. R. Ng, M. Gehm, and H. Xin, “Terahertz electromagnetic crystal waveguide fabricated by polymer jetting rapid prototyping,” Opt. Express, vol. 19, no. 5, pp. 3962-3972, Feb. 2011. [9] Z. Wu, M. Liang, W. R. Ng, M. Gehm, and H. Xin, “Terahertz horn antenna based on hollow-core electromagnetic crystal (EMXT) structure,” IEEE Trans. Antennas Propag., vol. 60, no. 12, pp. 5557-5563, Dec. 2012.[10] K. Gbele, M. Liang, W. Ng, M. Gehm, and H. Xin, “Millimeter wave Luneburg lens antenna fabricated by polymer jetting rapid prototyping,” in Proc. 39th Int. Conf. Infrared, Millim. Terahertz Waves (IRMMW-THz), Tucson, TX, Sep. 2014, pp. 1.[11] N. Nguyen, N. Delhote, M. Ettorre, D. Baillargeat, L. Coq, and R. Sauleau, “Design and characterization of 60-GHz integrated lens antennas fabricated through ceramic stereolithography,” IEEE Trans. Antennas Propag., vol. 58, no. 8, pp. 2757-2762, Aug. 2010. [12] P. Timbie, J. Grade, D. van der Veide, B. Maffei, and G. Pisano, “Stereolithography MM-wave corrugated horn antennas,” in Proc. 36th Int. Conf. Infrared, Millim. Terahertz Waves (IRMMW-THz), Houston, TX, Oct. 2011, pp. 1–3.[13] S. Pandey, B. Gupta, and A. Nahata, “Terahertz plasmonic waveguides created via 3D printing,” Opt. Express, vol. 21, no. 21, pp. 24422-24430, Oct. 2013. [14] P. Nayeri, M. Liang, R. Sabory-Garcia, M. Tuo, F. Yang, M. Gehm, H. Xin, and A. Elsherbeni, “3D printed dielectric reflectarrays: low-cost high-gain antennas at sub-millimeter waves,” IEEE Trans. Antennas Propag., vol. 62, no. 4, pp. 2000-2008, Apr. 2014.[15] A. von Bieren, E. de Rijk, J. –Ph. Ansermet, and A. Macor, “Monolithic metal-coated plastic components for mm-Wave applications,” in Proc. 39th Int. Conf. Infrared, Millim. Terahertz Waves (IRMMW-THz), Tucson, TX, Sep. 2014, pp. 1–2.

98[16] S. Qu, H. Yi, C. Chan, and K. Ng, “Low-cost discrete dielectric terahertz lens antenna using 3D printing,” in Proc. IEEE Conf. Antennas Meas. App.(2014), Antibes Juan-les-Pins, France, Nov. 16-19, 2014, pp. 1-3. [17] L. Menéndez, O. Kim, F. Persson, M. Nielson, and O. Breinbjerg, “3D printed 20/30-GHz dual-band offset stepped-reflector antenna,” in Proc. Eur. Conf. Antennas Propag., Lisbon, Portugal, May 13-17, 2015, pp. 1-2. [18] M. Auria, W. Otter, J. Hazell, B. Gillatt, C. Long-Collins, N. Ridler, and S. Lucyszyn, “3-D printed metal-pipe rectangular waveguides,” IEEE Trans. Comp. Packag. Manuf. Technol., vol. 5, no. 9, pp. 1339-1349, Sep. 2015.[19] K. Caekenberghe, P. Bleys, T. Craeghs, M. Pelk, and S. Bael, “A w-band waveguide fabricated using selective laser melting,” Microw. Opt. Technol. Lett., vol. 54, no. 11, pp. 2572-2575, Nov. 2012. [20] B. Zhang, Z. Zhan, Y. Cao, H. Gulan, P. Linnér, J. Sun, T. Zwick, and H. Zirath, “Metallic 3D printed antennas for millimeter- and submillimeter-wave applications,” IEEE Trans. THz Sci. Technol. (in press).[21] B. Zhang, P. Linnér, C. Kärnfelt, P. L. Tam, U. Södervall, and H. Zirath, “Attempt of the metallic 3D printing technology for millimeter-wave antenna implementations,”in Proc. Asia Pacific Microw. Conf. (APMC2015), Nanjing, China, Dec. 6-9, 2015, pp. 1-3. [22] H. Gulan, S. Beer, S. Biebold, C. Rusch, A. Leuther, I. Kallfass, and T. Zwick, “Probe based antenna measurements up to 325 GHz for upcoming millimeter-wave applications,” in Proc. IEEE Int. Workshop Antenna Technol. (iWAT2013), Karlsruhe, Germany, Mar. 4-6, 2013, pp. 228-231.[23] B. Zhang and H. Zirath, “Metallic 3D printed rectangular waveguides for millimeter-wave applications,” IEEE Trans. Comp. Packag. Manuf. Technol., vol. 6. no.5, pp. 796-804, May 2016 .[24] F. Warner, “Attenuation measurement,” in Microwave Measurements, A. E. Bailey, Ed., 2nd ed. London, U.K.: IEE, 1989, pp. 132-134. [25] B. Zhang and H. Zirath, “3D printed iris band-pass filters for millimeter-wave applications,” Electron. Lett., vol. 15, no. 22, pp. 1791-1793, Oct. 2015.[26] B. Zhang and H. Zirath, “A 3D printed metallic radio front end for E-band applications,” IEEE Microw. Wireless Comp. Lett., vol. 26, no. 5, pp. 331-333, May 2016.[27] W. J. Otter, etc., “3D printed 1.1 THz waveguides,” IET Electron. Lett., vol. 53, no. 7, pp. 471-473, Mar. 2017.[28] W. J. Otter and S. Lucyszyn, ”Hybrid 3-D-printing technology for tunable THz applicatoins,” Proc. IEEE, vol. 105, no. 4, pp. 756-767, Apr. 2017. [29] B. Zhang, Y. X. Guo, H. Zirath, and Y. P. Zhang, ”Investigation on 3-D-printing technologeis for millimeter-wave and terahertz applications,” Proc. IEEE, vol. 105, no. 4, pp. 723-736, Apr. 2017.

References Cont.

99

Book Chapter:

B. Zhang and Y. P. Zhang, “Grid array antennas,” (invited) in Wiley Encyclopedia of Electrical andElectronics Engineering, (editor: John Webster), John Wiley & Sons, Inc.

Book:

B. Zhang, “Design and analysis of millimeter-wave packaged grid array antennas on low temperatureco-fired ceramics,” LAP Lambert Academic Publishing, Germany: Saarbrücken, ISBN 978-3-659-62443-8, 2014.

WIPO Patent:

M. Bao, B. Zhang, and Y. Li, “An active antenna”, WO 2014146715 A1.

Publications

100Journal Papers:

(1) B. Zhang, W. Zhang, R. Ma, X. Zhang, and J. Mao, “A co-design study of filters and oscillator for low phase noise and high harmonic rejection,” ETRI Journal, vol. 30, no. 2, pp. 344-346, Apr. 2008.

(2) B. Zhang and Y. P. Zhang, “Analysis and synthesis of millimeter-wave microstrip grid array antennas,” IEEE Antennas Propag. Mag., vol. 53, no. 6, pp. 42-55, Dec. 2011.

(3) B. Zhang and Y. P. Zhang, “Grid array antennas with subarrays and multiple feeds for 60-GHz radios,” IEEE Trans. Antennas Propag., vol. 60, no. 5, pp. 2270-2275, May 2012.

(4) B. Zhang, Y. P. Zhang, Diane Titz, Fabien Ferrero, and Cyril Luxey, “A circularly-polarized array antenna using linearly-polarized sub grid arrays for highly-integrated 60-GHz radio,” IEEE. Trans. Antennas Propag., vol. 61, no. 1, pp. 436-439, Jan. 2013.

(5) B. Zhang, D. Titz, F. Ferrero, C. Luxey, and Y. P. Zhang, “Integration of quadruple linearly-polarized microstripgrid array antennas for 60-GHz antenna-in-package applications,” IEEE Trans. Comp. Packag. Manuf. Technol., vol. 3, no. 8, pp. 1293-1300, Aug. 2013.

(6) B. Zhang, H. Gulan, T. Zwick, U. Oderfält, F. Carlsson, and H. Zirath, “Integration of a 140 GHz packaged LTCC grid array antenna with an InP detector,” IEEE Trans. Comp. Packag. Manuf. Technol., vol. 5, no. 8, pp. 1060-1068, Aug 2015.

(7) B. Zhang and H. Zirath, “3D printed iris band-pass filters for millimeter-wave applications,” Electronics Letters, vol. 15, no. 22, pp. 1791-1893, Oct. 2015.

Publications Cont.

101

(8) B. Zhang, C. Kärnfelt, H. Gulan, T. Zwick, and H. Zirath, “A low cost D-band packaged antenna on organic substrate for mass production,” IEEE Trans. Comp. Packag. Manuf. Technol., vol. 6, no. 3, pp. 359-365, Mar. 2016.

(9) B. Zhang and H. Zirath, “A 3D printed metallic radio front end for E-band applications,” IEEE Microw. Wireless Comp. Lett., vol. 26, no. 5, pp. 331-333, May 2016.

(10) B. Zhang, Z. Zhan, Y. Cao, H. Gulan, P. Linnér, J. Sun, T. Zwick, and H. Zirath, “Metallic 3D printed antennas for millimeter- and submillimeter-wave applications,” IEEE Trans. THz Sci. Technol., vol. 6, no. 4, pp. 592-600, Jul. 2016.

(11) B. Zhang and H. Zirath, “Metallic 3D printed rectangular waveguides for millimeter-wave applications,” IEEE Trans. Comp. Packag. Manuf. Technol., vol. 6, no. 5, pp. 796-804, May 2016.

(12) B. Zhang, Y. X. Guo, H. Zirath and Y. P. Zhang, “Investigation on 3-D-printing technology for millimeter-wave and Terahertz applications (invited),” Proceedings of the IEEE, vol. 105, no. 4, pp. 723-736, Apr. 2017.

Publications Cont.

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