physics of failure simulation and modeling specification webinar

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© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com © 2004 2010 Specifying and Satisfying Physics of Failure Requirements December 17 th , 2015

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© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com © 2004 – 2010

Specifying and Satisfying Physics of

Failure Requirements

December 17th, 2015

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Physics of failure

o Specifications

o Use environment

o Reliability Expectations

o Complexity vs. Accuracy and Precision

o Specifying the right amount

o Thermal stresses

o Temperature Cycling

o Power Cycling

o Mechanical loads

o Vibration

o Shock

o Communicating reliability throughout product development

o Pre-layout

o Layout

o Design Finalization

o Test validation

o Field prediction

o Protecting the IP

o Verification: Quality and Testing

o Failure Analysis

o Summary and Questions

Agenda

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o The use of science (physics, chemistry, etc.) to capture

an understanding of failure mechanisms and evaluate

useful life under actual operating conditions

o The ability of the materials to withstand stresses either once

(overstress) or repeatedly (wearout)

Physics of Failure (PoF)

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Stress exceeds the strength = Instant failure

Overstress

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Wearout mechanisms are the usual culprit

for failures

o Damage accumulation

o Reduces strength

o Stress continues

o Solder Joint Fatigue

o Mechanical Vibration

o Thermal Cycling

o Lead Fatigue

o Mechanical Vibration

o Plated Through-hole Fatigue

o Thermal Cycling

Wearout

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Understanding how a specific design will behave in

your specific environment

o How long will it last?

o How is it likely to fail?

o What are the goals?

o Lifetime

o Performance

o Environment

Specifying PoF

The bridge collapsing, in a frame from a 16mm

Kodachrome motion picture film taken by Barney Elliott

Wikipedia.com

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o How long does the CUSTOMER expect the device to

perform?

o How long is the warranty?

o Is there a chance the customer would like this extended?

o Cost of replacement?

o Materials

o Downtime

o Customer confidence

Lifetime

50+ Years

Later

1957 2010

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Low-End Consumer Products (Toys, pedometers, gadgets, etc.) o Do they ever work?

o Consumer electronics o Cell Phones: 18 to 36 months

o Laptop Computers: 24 to 36 months

o Desktop Computers: 24 to 36 months

o Home Appliances: 7 to 15 years

o Commercial electronics o Medical (External): 5 to 10 years

o Medical (Internal): 7 years

o High End Servers: 7 to 10 years

o Industrial Controls: 7 to 15 years

o Highly regulated o Automotive: 10 to 15 years (warranty)

o Avionics (Civil): 10 to 20 years

o Avionics (Military): 10 to 30 years

o Telecommunications: 10 to 30 years

o Solar: 25 years (warranty)

Examples of Product Lifetimes

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Define the probability of failure during product life

o At the desired lifetime, what is an acceptable reliability?

o Define the duty cycle

o Time in use

o Cycles per day

o Flights per year

o Dormant conditions

o Intensity of use

o Power cycles

o Low power to high power

o Low data rates vs. max load

Performance

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Shipping

o How well is the product protected during shipping?

o Assembly, test, manufacturing, storage …

o All the things that happen before the product is even turned

on

o Do you have a good understanding of how the product

will be used?

o Life cycle

o Life cycle phases

o Events

Defining the Use Environment

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Life Cycles can be complex

o Use cases

o Life cycle phases

o Environmental stress types and events

o Much of environmental data is typically unstructured

o Need to organize it in a way that clearly communicates the

intended use

Communicating the Use Environment: Challenges

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Life cycle editor

o Handles complex environments

o Shock

o Sinusoidal vibration

o Random vibration

o Thermal Cycling

o Power Cycling

o Formats environmental stresses as inputs

for analysis

o Clear and concise transfer of information

Structuring the Environment

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o How can I know without a doubt how long it will last?

o Capture all of the product’s design complexity and

manufacturing variation by building a representative

population

o Expose it to an environment exactly representative of your

use environment

o Wait 7 to 30 years

o To move things along we start making assumptions

Precision and Accuracy

Dailymail.co.uk

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Components conform to datasheet values

o Materials

o Dimensions

o Measurements can be used to modify models

o Assuming a uniform population

o The assembly is well manufactured

o Solder joint quality

o Plated through hole quality

o MSL processes followed

o Laminate quality etc.

o Everything behaves the way we expect it to

o For simulation, these are all reasonable assumptions

Key Assumptions for Simulation

ipctraining.org

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Higher levels of accuracy and precision come at a cost

o Detailed Multiphysics Models

o Engineering time

o Computational time

o Calculations

o Expert time

o Measurements

o Prototypes

o Testing

o Not enough can also come at a cost

o Striking the balance can be an art

o We can do much more than even 5 years ago with the information we already gather during product development

Cost and Approximation

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Ambient Temperatures

o Often more complex than single diurnal cycle

o Flight profiles, high load periods, heating from surrounding

equipment

Thermal Stresses in the Environment

o Measured values on the intended

platform

o Measured values on a similar platform

o Industry accepted average profiles

o Educated assumptions based on

estimated use environments

Acc

ura

cy

Risk

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Understanding what the power dissipating components are

o Thermal simulation tools o Tend to capture all components

o Flowtherm

o Icepack

o Testing o Thermal Imaging

o Thermocouples

o Ensure airflow is typical of use environment

o Hand Calculations o Tend to be more selective

o Components with self heating >5°C

o Relies on assumptions regarding component selection

o Should be verified during prototype build

Thermal Stresses in the Product: Power Dissipation

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

Thermal Stresses: PoF Reliability Prediction

Ambient

Environment

Thermal

Analysis Design Files

Non Operating Reliability

Duty Cycle

Operating Reliability

Derating Analysis, Solder Joint and PTH Predicted Lifetimes

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

Temp. Cycling: Reliability Prediction

Software Design the board

Apply the

temp. cycle

Find the failed components

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Shock and Vibration

o Estimate frequency of random events

o Potholes, door closure, landing, etc.

o Understand the vibration environment

o Rotating machinery, road vibration, harmonic and random

Mechanical Stresses in the Environment

o Measured values on the intended

platform

o Measured values on a similar platform

o Industry accepted average profiles

o Educated assumptions based on

estimated use environments

Acc

ura

cy

Risk

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Board close to resonance

o Components can shake off due to fatigue in leads or solder

o Time to failure is determined by intensity and frequency of

stress

o Component resonance

o Lead and solder fatigue

due to component motion

Concerns: Vibration

Displacement

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Happens as random events

o Failure mechanism

o Sensitive to intermetallic layer

thickness

o Brittle failure

o Board failures

o Pad cracking

o Lead failures

o Probabilistic

o Equally likely to fail at event

#20 as event #200

o Stress to probability of failure

Concerns: Mechanical Shock

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

Mechanical Stresses: PoF Reliability Analysis

Vibration

Environment

Lead

Modeling Design Files

Solder Joint Fatigue

Shock

Profiles

Shock Risk Analysis

Lead Fatigue Analysis

Natural Frequency

Analysis

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

Overall Life Curves

Combined PoF Reliability Analysis Outputs

Time to Failure by Component

Natural Frequency Behavior

Automated Report

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o What can we know and how soon can we know it?

PoF in the Development Cycle

Pre-layout Layout Design

Finalization Test

Validation Field

Prediction

PDR Reliability

Growth CDR

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o What can we know? o Board geometries and estimated material stackup

o Board mounting strategies and configuration

o Major component selection

o What can we do with it? o Bare Board Harmonic Analysis

o Yes, it will change once parts are on it, but it is a good place to start

o Evaluate mounting strategies

o Define high-risk zones for large components

o Component package selection validation

o Thermal Cycling

o Board material selection validation using largest components

o How do we specify it? o As part of PDR

o Harmonic Analysis and component package risk areas

o Board material selection and component package risk

o Specified as components greater than certain size

Pre-Layout

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o What can we know? o Preliminary design layout

o BOM

o Board stackup and approximate copper content

o What can we do with it? o Iterative analyses

o Thermal cycling reliability

o Coarse mesh mechanical analysis

o Reliability growth during the design phase

o Low cost

o High impact

o Specification o Periodic reporting for design revision reliability analysis

o Test and field environments

o Requires greater investment and involvement

o May be appropriate where higher levels of program risk are expected

Layout

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o What can we know?

o Design files

o Material and package selection

o Thermal analysis

o What can we do with it?

o Final field environment reliability prediction

o Qualification test performance prediction

o DFMEA, Derating analysis, CAF, ICT

o Specification

o Deliverable with critical design review (CDR)

o Automated reporting

o Verifies use of proscribed environment

o Verifies use of chosen materials

o Reduces program risk when releasing to test

Design Finalization

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Test to “Spec” (Industry standards) o Pass/Fail: Clipboard engineering

o Uses best practices and previous success

o Design by similarity

o Different requirements for every manufacturer or industry

o Physics of failure (POF) testing o Test to failure

o Failure analysis for failure mode verification

o One test per failure mode

o Creates prediction models that feed back to industry standards

o Combined approach o Physics of failure prediction

o Industry standards

Test Plan Strategies

Source: A. MacDiarmid,

“Thermal Cycling Failures”,

RIAC Journal, Jan., 2011.

Source:nationalparts

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Sherlock uses a damage accumulation method to calculate probability of failure

o Can be used for both field and test conditions

o An equivalent test for that failure mechanisms induces equivalent damage

o Encourages collaborative engineering through the supply chain

o Standard tests may not represent field

o Engineering over ‘opinioneering’

Test Validation

INSERT TWO TEMP CYCLING LIFE CURVES AND DRAW HORIZONTAL

LINE TO INDICATE DAMAGE PARITY

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Some markets are very competitive

o High levels of distrust in the supply chain

o Automated reporting can be selective

o Inner layer details

o Component suppliers and part numbers

o Allows for more open dialog

o Communicates reliability details

o Protects the design files

Protecting the Design

lifehacker.com

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o PoF Analysis during design is STILL simulation

o Remember those assumptions?

Verification

We still need to test!

Components Quality

Behavior

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Testing to specification

o Finite duration

o Likely zero failures

o Little reliability information gained

o Continue testing to failure

o Verify the failure mechanism is as expected

o Validates simulation

o Time to failure

o Dominant failure sites

o Provides confidence in field life prediction

Qualification Testing

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Sample selection

o Production, not prototype

o Possibly periodic

o IPC inspections plus representative destructive analysis

o PCB Quality

o Drill

o Microvias

o Laminate

o Registration

o Etching

o Assembly Quality

o Solder joint fillets

o Cleanliness

o Component Alignment

o Solder voiding

o Solder balls (BGAs)

o Bond line thickness (QFNs, etc)

o Critical Components

o Die size

o Lead-frame material

o Construction analysis

Quality Analysis

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o When the model doesn’t match test performance

o Find out why!

o Physics of failure is a discipline to be practiced

o Was there an unexpected material/feature?

o Laminate properties, component CTE, etc?

o Was there an unexpected stress?

o Unexpected temperature rise on components?

o Can the models be adjusted to account for the cause?

o Feed the knowledge back into design activity

Failure Analysis

© 2004 - 2007 © 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Contact DfR Solutions

o For examples of specification language

o Can be tailored to your needs and industry

o For assistance meeting a PoF specification

o Consulting, services, software

Specification Language and Compliance