PIC design across PIC design across platformsplatforms

Ronald BroekeRonald BroekeBright PhotonicsBright Photonics

OUTLINEOUTLINE

Introduction PIC applications & designs MPW Materials & platforms Design modules PICs in Phoxtrot

multi-wavelength Rxmulti-wavelength Txfiber optical sensing

radio over fibermux/demuxmodulators

switches(C)WDM

QAMAWGFTTH

BOTDRO-CDMA

amplifiersring-lasers

90-deg hybrids FM-IM conversion

MZI interferometerswavelength conversion

power splitters/combiners

Design House for Photonics ICs

Ap

plic

atio

n d

riv e

n d

esig

n

Custom PIC design Design libraries MPW & custom fab Prototyping

InP Silicon (SOI) SiN/Triplex Silica/PLC Polymer

PIC design across PIC design across platformsplatforms

Ronald BroekeRonald Broeke

Session: COMPONENTS & SYSTEMS FOR DATA CENTERS

PhoxTroT 3rd Symposium on Optical Interconnect in Data Centers

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PICs, a plethora of applications

PIC:Photonic Integrated CircuitHorizontal business model provides commercial access to ASPIC technology:

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Design for productsDesign for products

Sensor PICs for spectrometers, scanners, airplanes, ...

World record: atto-meter sensing Design for package Flexible prototyping

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Hybrid packagingHybrid packaging

BRIGHT photonics, LioniX, SMART photonics, PhoeniX Software, VLC photonics , XiO Photonics

InPTriplex (SiN)

Hybrid packaging: Best of 2 worlds

carrier substrate

InP chip

TriPleX chip

fiber array

fiber feed through

wire bonds

electrical connections

TEC

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Application example: 100 channel InP Rx (5 Application example: 100 channel InP Rx (5 THz)THz)

InP wafer (HHI)

GDS + photo

Measured response

Single AWG, sim vs meas.

Dark current PD

99% < 3 nA

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100 channel receiver: design100 channel receiver: design

Cascading principle: spectra Simulated cascade 1x10x10

Options for a 1x100 demux across 100 nm

Simulated 1x100

drawn to scale

1x

1x 10x

12 mmA

B

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Application example: SOI beam Application example: SOI beam formerformer

Re-circulating AWG loop

Integrated step-wise true time delay for beam formers in-home.

lambda design measured

nm ps ps

1552.93 0 0

1549.72 2.9 2.9

1546.12 5.7 5.7

1538.58 11.4 10.7

1534.25 14.3 13.4

1529.16 17.1 16.5

GDS + photo Performance

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Manufacturing PICsManufacturing PICs

InP

Silicon

SiN

InP ~10 MPW/ySilicon ~10 MPW/ySiN ~2 MPW/y ~2 MPW runs per month!

MPW = multi project waferIn a MPW a foundry fabricates PICs

Custom foundryCustom foundry MPW services in EuropeMPW services in Europe

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MPW prototyping timelineMPW prototyping timeline

Fabrication in FoundryDesign

Sub

missio

n

Time

Testing+Packaging

3-6 months1-2 months

➔ Timing depends on foundry and MPW schedule➔ Align with packaging during design➔ Custom fabrication faster but costly

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Material platformsMaterial platforms… a waveguide comparison… a waveguide comparison

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Chip design based on functional Chip design based on functional BBsBBs

AWG-demux

couplers

ring filters

phase modulator

amplitude modulator

WDM add-drop

picosecond pulse laser

multiwavelength lasers

tunable DBR lasers

tunable ring filters

true-time delay

gain or non-linear mixing

Application Functional BB Technological BB MaterialA. Passives B. Phase control C. Amplification

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Comparison of platformsComparison of platforms

RF: Tx, Rx All-in-one

Data centers4x25 GbitHigh volume

High quality passivesDemux. splitters

ModulatorsCheap hybrid

True-time delayMicrowave photonics

Telecom Txlow voltage RF modulators

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Supported MPW Foundries (design + modules)Supported MPW Foundries (design + modules)

+ many custom foundries

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Design time lineDesign time line

Physical level design Interconnect BBs

layout time

A. Design BBs from physics up without IP-blocks

B. Re-use BBs + IP-blocks

BBs

layout timeBBs

PDK

PDKPDK

design module

Time gained

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MPW prototyping timelineMPW prototyping timeline

Fabrication in FoundryDesign

Sub

missio

n

Time

Testing+Packaging

3-6 months1-2 months

➔ Timing depends on foundry and MPW schedule➔ Align with packaging during design➔ Custom fabrication faster but costly

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Multi-platform design modulesMulti-platform design modules

AWG MMI Interconnects Tapers Etc.

Foundry

Logic

Interface

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Design modulesDesign modulesDesign new BB, extend PDK Available for external usersRe-use default BBsAdd design functionality & design speed

AW

G

MM

I

Tap

er

Bu

s

Lase

r

Dio

des

Material

Slab

Control

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BB material libraryBB material library

“Material” underpins BB modules Multiple processes / Foundry Multiple Index models / process

M

EIM

Material library

Foundry-1

2D

Mea

sure

d2 N. . .

Layers (CS)Indices

process-1 2 . . .

mat

AWGMMI

TaperBus

LaserDiodes

Material

BrightModules

Slab

M

EIM

Foundry-1

2D

2 N. . .

Layers (CS)Indices

process-1 2 . . .

mat

overview

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AWG design (Mux - deMux)AWG design (Mux - deMux)

BrightAWG (GUI PhoeniX OptoDesigner)

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Design for manufacturingDesign for manufacturing

Logic to GDS DRC Underetch correction Multiple GDS layers Grid adaptation

Logic GDS

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Design across platformsDesign across platforms

Footprint

Spectra

Platform

2 mm 2 mm1.4 mm

BB-module

lambda central = 1.55 umchannel spacing = 0.8 nmFSR = 3.2 nm#in x #out = 1 x 4

HHI, InPLioniX, SiN IMEC, SOI

User application specs (AWG example)

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MMI design (power splitters)MMI design (power splitters)

BrightMMI (GUI PhoeniX OptoDesigner)

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MMI librariesMMI libraries

100 um

2x3

1x5

2x3 asym.

2x4, 90deg-hybrid

1x4

2x2, 72/28

2x4, 85/15

2x2

1x2

1x3

3x3

PDK extension for MMIs: Initialized scripted MMIs Predefined MMIs (GDS) Templates with MMI rules

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Bright-BB circuit simulation in AspicBright-BB circuit simulation in Aspic

BrightAWG in

GUI Aspic Circuit simulator

Via S-matrix

Symbolic AWG

parameter block

Spectra in Aspic GUI

BBs

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Bright-BB circuit simulation in VIP-photonicsBright-BB circuit simulation in VIP-photonics

Spectra in GUI100 channels cw

Spectra in GUI4 channels modulated at 5 GHz

Circuit in VPI:1+10 AWGs + 100 PDs

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PICs and optical routing in PhoxtrotPICs and optical routing in PhoxtrotMaterials: InP, SOI, Polymer, glass

PICs (SOI, InP): Linecard OAC,

Optical interconnects(polymer, glass): Linecard | SM OBP | SM, MM

Functions: Mux, deMux Power plittting Routing Tx (VCSEL), Rx (PD)EU-FP7-Phoxtrot

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SOI, Monolithic Photonic-Electronic SOI, Monolithic Photonic-Electronic integrationintegrationChallenges● Tooling interfaces

3D CAD tools Electronics design tools Photonics design tools

● Routing and element placement● DRC

Photonics level integration: Use electronics GDS as ref. in photonics design (vias, metal) Integrate routing electrical elements BB in library Add DRC on electronic GDS layers

Optical and electronic BB libraryOpto-electonic SOI chip

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Thank You

Ronald.Broeke @ BrightPhotonics.euInfo @ BrightPhotonics.euwww.brightphotonics.eu