pixel upgrade status and plan g.m. bilei firenze mar. 6 th 2013
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Pixel Upgrade Status and Plan
G.M. Bilei
Firenze Mar. 6th 2013
Introduction and news
• The Pixel project is progressing pretty much according to the plan
• ROC PSI46dig / TBM08 submission was done in early January 2013.- expect wafers (6) back in first half of April 2013
- plan to order 24 additional wafers (delivery mid May)
(enough for 3-4 wafers for each production center)
• Digital Test Boards will be produced by PSI (requested 15 for INFN)- Need to identify for each consortium one contact person to become
expert in maintaining them and support the consortium. Look for volunteer
• High rate Test Beam at FNAL with digital ROC this summer- Good opportunity to contribute and learn. As INFN we should participate..
• Pixel TDR Document now available, one per institute.
Firenze 6.3.2013
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2013 Pixel activities and goals
Many tasks to accomplish in 2013:
• CO2 cooling plant & piping
• Install extra LV-power cables for BPIX layer 1 (CAENPP1)
• Submission of digital TBM & ROC (PSI46dig) for Pilot System
• Production masks for PSI46dig ROC (BPIX Layer 2-4, FPIX)
• Production of Pilot System and integration into present FPIX
• Production of BPIX Supply Tubes & Mechanics for installation tests
• Installation test without beam pipe
• BPIX Supply Tube protoytpe with sector test of all electrical boards
• Preseries digital pixel modules with full functionality (sensor, HDI, cables, BB)
• High rate test pixel test beam at FNAL
Firenze 6.3.2013
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INFN plan and objectives for 2013
• Complete construction of 8 old modules with analog ROC at IZM- All parts are available. IZM delivery very soon- Complete setups and qualification of INFN production centers
• Evaluate, qualify together with KIT the Selex BB process and reassess cost.
• Select Bump Bonding vendor (IZM, Selex) by September at latest.
• Set up new readout systems for digital ROC in the lab and get experience
• Construction of few prototypes of new digital pixel modules
• Preparation for mass construction (new readout cards, database, software analysis etc.)
• Possibly participate to the FNAL high rate test beam in summer
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INFN draft Pixel schedule 2013
2013 INFN Pixel activities
Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Analog Module Bump Bonding at IZM
Construction and qualification 8 Analog Modules
INFN and KIT Bump Bonding R&D at SELEX
Qualification of Selex modules
INFN Selection of Bump Bonding Vendor
Digital Module Bump Bonding
Construction and qualification of 10 digital modules
Digital ROC and TBM
HDI for digital modules
Sensors
Digital Test Boards
Test Beam FNAL
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Milestone INFN Gruppo I Pixel Upgrade1/12/2013 Realizzazione primi prototipi nuovi moduli Pixel Upgrade con ROC Digitale
Overall schedule Pixel Construction
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Pixel Construction TDR milestones
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Half Layer 22 faces 8 modules/faces =176 modulesNeeds 250 modules allowing for 80% yield and 15% spares
Contribution to 50% of BPix layer 3
Draft INFN Plan2011 Start setting up2012-13 Production ~ 8 old analog modules2013 Production of few new modules2014 Start mass production2015 End module prod & integration2016 Commissioning and Installation
Module construction flow chart
Sensors test
ROC Test after dicing
TBM and HDI testing
Company Bump bond
Glue/bond TBM to HDI
Test before glue HDI to sensor
module characteri-
zation
Burn-in
X-ray calibration
PisaPisa
Catania
Bari
Perugia
Perugia/Pisa
Half LayerAssembly
and testing
Bare Moduletest
SiN-railsglue
Bond ROCs to HD
Glue HDI to bare module
Module testing
Padova
Pixel Construction Costs as TDR
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INFN contribution to construction 803 Ke (963 KCHF)
UK contribution on FED withdrawn. Currently 690 KCHF are missing
INFN Pixel Upgrade spending profile
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