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PMEG2005BELD20 V, 0.5 A low VF MEGA Schottky barrier rectifier4 August 2015 Product data sheet

1. General descriptionPlanar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier withan integrated guard ring for stress protection, encapsulated in a leadless ultra smallSOD882D (DFN1006D-2) Surface-Mounted Device (SMD) plastic package with visibleand solderable side pads.

2. Features and benefits• Average forward current: IF(AV) ≤ 0.5 A• Reverse voltage: VR ≤ 20 V• Low forward voltage VF ≤ 390 mV• AEC-Q101 qualified• Ultra small and leadless SMD plastic package• Solderable side pads• Package height typ. 0.37 mm

3. Applications• Low voltage rectification• High efficiency DC-to-DC conversion• Switch mode power supply• Reverse polarity protection• Low power consumption applications• Ultra high-speed switching• LED backlight for mobile application

4. Quick reference dataTable 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

δ = 0.5 ; f = 20 kHz; Tsp ≤ 140 °C;square wave

- - 0.5 AIF(AV) average forwardcurrent

δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C;square wave

[1] - - 0.5 A

VR reverse voltage Tj = 25 °C - - 20 V

VF forward voltage IF = 500 mA; pulsed; tp ≤ 300 µs;δ ≤ 0.02 ; Tj = 25 °C

- 353 390 mV

IR reverse current VR = 10 V; Tj = 25 °C - 28 50 µA

© Nexperia B.V. 2017. All rights reserved

Nexperia PMEG2005BELD20 V, 0.5 A low VF MEGA Schottky barrier rectifier

PMEG2005BELD All information provided in this document is subject to legal disclaimers.

Product data sheet 4 August 2015 2 / 14

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad forcathode 1 cm2.

5. Pinning informationTable 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 K cathode[1]

2 A anode

Transparenttop view

21

DFN1006D-2 (SOD882D)

sym001

1 2

[1] The marking bar indicates the cathode.

6. Ordering informationTable 3. Ordering information

PackageType number

Name Description Version

PMEG2005BELD DFN1006D-2 DFN1006D-2: leadless ultra small plastic package; 2terminals

SOD882D

7. MarkingTable 4. Marking codesType number Marking code

PMEG2005BELD 0010 1000

VENDOR CODE

MARKING CODE(EXAMPLE)

CATHODE BAR READING DIRECTION

READING DIRECTION

READING EXAMPLE:

01111011

006aac477

Fig. 1. SOD882D binary marking code description





8. Limiting valuesTable 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VR reverse voltage Tj = 25 °C - 20 V

IF forward current Tsp ≤ 140 °C - 0.5 A

δ = 0.5 ; f = 20 kHz; Tsp ≤ 140 °C;square wave

- 0.5 AIF(AV) average forward current

δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C;square wave

[1] - 0.5 A

IFRM repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25 - 3 A

IFSM non-repetitive peak forwardcurrent

tp = 8 ms; Tj(init) = 25 °C; square wave - 6 A

[2][3] - 370 mW

[1][3] - 735 mW

Ptot total power dissipation Tamb ≤ 25 °C

[4][3] - 1135 mW

Tj junction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad forcathode 1 cm2.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Reflow soldering is the only recommended soldering method.[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.





9. Thermal characteristicsTable 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

[1][2][3] - - 340 K/W

[1][4][3] - - 170 K/W

Rth(j-a) thermal resistancefrom junction toambient

in free air

[1][5][3] - - 110 K/W

Rth(j-sp) thermal resistancefrom junction to solderpoint

[6] - - 25 K/W

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reversepower losses PR are a significant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Reflow soldering is the only recommended soldering method.[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.[5] Device mounted on a ceramic PCB, Al2O3, standard footprint.[6] Soldering point of cathode tab.

006aac928

tp (s)10-3 102 10310110-2 10-1

102

103

Zth(j-a)(K/W)

10

duty cycle =1

0.750.5

0.33 0.250.2

0.1

0.020.01

0

0.05

FR4 PCB, standard footprint

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values





006aac929

tp (s)10-3 102 10310110-2 10-1

102

103

Zth(j-a)(K/W)

10

duty cycle =1

0.750.5

0.33

0.25

0.2 0.1

0.020.01

00.05

FR4 PCB, mounting pad for cathode 1 cm2

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values006aac930

tp (s)10-3 102 10310110-2 10-1

102

103

Zth(j-a)(K/W)

10

duty cycle =1

0.750.5

0.33

0.250.20.1

0.020.01

00.05

Ceramic PCB, Al2O3, standard footprint

Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

10. CharacteristicsTable 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

IF = 0.1 mA; pulsed; tp ≤ 300 µs;δ ≤ 0.02 ; Tj = 25 °C

- 79 105 mV

IF = 1 mA; pulsed; tp ≤ 300 µs;δ ≤ 0.02 ; Tj = 25 °C

- 137 170 mV

VF forward voltage


- 197 235 mV





Symbol Parameter Conditions Min Typ Max Unit


- 266 310 mV


- 353 390 mV

VR = 10 V; Tj = 25 °C - 28 50 µAIR reverse current

VR = 20 V; Tj = 25 °C - 87 200 µA

Cd diode capacitance VR = 1 V; f = 1 MHz; Tj = 25 °C - 31 40 pF

trr reverse recovery time IF = 0.5 A; IR = 0.5 A; IR(meas) = 0.1 A;Tj = 25 °C

- 1.6 - ns

VFRM peak forward recoveryvoltage

IF = 0.5 A; dIF/dt = 20 A/µs; Tj = 25 °C - 565 - mV

006aac931

10-3

10-2

10-1

1

IF(A)

10-4

VF (V)0.0 0.50.40.2 0.30.1

(1)(2) (3) (4) (5)

(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 85 °C(4) Tj = 25 °C(5) Tj = −40 °C

Fig. 5. Forward current as a function of forwardvoltage; typical values

006aac93210-1

10-2

10-3

10-4

10-5

10-6

10-7

IR(A)

10-8

VR (V)0 20155 10

(1)

(2)

(3)

(4)

(1) Tj = 125 °C(2) Tj = 85 °C(3) Tj = 25 °C(4) Tj = −40 °C

Fig. 6. Reverse current as a function of reversevoltage; typical values





VR (V)0 20155 10

006aac933

40

50

30

20

10

60

70Cd

(pF)

0

f = 1 MHz; Tamb = 25 °C

Fig. 7. Diode capacitance as a function of reversevoltage; typical values

006aac934

IF(AV) (A)0.00 0.750.500.25

0.10

0.15

0.05

0.20

0.25PF(AV)

(W)

0.00

(1)

(2)

(3)

(4)

Tj = 150 °C(1) δ = 0.1(2) δ = 0.2(3) δ = 0.5(4) δ = 1

Fig. 8. Average forward power dissipation as afunction of average forward current; typicalvalues

VR (V)0 20155 10

006aac935

0.4

0.8

1.2

PR(AV)(W)

0.0

(1)

(2)

(3)

(4)

Tj = 125 °C(1) δ = 1 (DC)(2) δ = 0.9; f = 20 kHz(3) δ = 0.8; f = 20 kHz(4) δ = 0.5; f = 20 kHz

Fig. 9. Average reverse power dissipation as afunction of reverse voltage; typical values

Tamb (°C)0 50 100 150 1751257525

006aac936

0.25

0.50

0.75

IF(AV)(A)

0.00

(1)

(2)

(3)

(4)

FR4 PCB, standard footprintTj = 150 °C(1) δ = 1(2) δ = 0.5(3) δ = 0.2(4) δ = 0.1

Fig. 10. Average forward current as a function ofambient temperature; typical values





Tamb (°C)0 50 100 150 1751257525

006aac937

0.25

0.50

0.75

IF(AV)(A)

0.00

(1)

(2)

(3)

(4)

FR4 PCB, mounting pad for cathode 1 cm2

Tj = 150 °C(1) δ = 1(2) δ = 0.5(3) δ = 0.2(4) δ = 0.1


Tamb (°C)0 50 100 150 1751257525

006aac938

0.25

0.50

0.75

IF(AV)(A)

0.00

(1)

(2)

(3)

(4)

Ceramic PCB, Al2O3, standard footprintTj = 150 °C(1) δ = 1(2) δ = 0.5(3) δ = 0.2(4) δ = 0.1


Tsp (°C)0 50 100 150 1751257525

006aac939

0.25

0.50

0.75

IF(AV)(A)

0.00

(1)

(2)

(3)

(4)

Tj = 150 °C(1) δ = 1(2) δ = 0.5(3) δ = 0.2(4) δ = 0.1

Fig. 13. Average forward current as a function of solder point temperature; typical values





11. Test information

time

IF

IR

trr

IR(meas)

006aad022

Fig. 14. Reverse recovery definition

001aab912

time

time

VFRM

VF

IF

VF

Fig. 15. Forward recovery definition

tptcy

P

t006aac658

duty cycle δ =

tp

tcy

Fig. 16. Duty cycle definition

The current ratings for the typical waveforms are calculated according to the equations:IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ withIRMS defined as RMS current.





11.1 Quality informationThis product has been qualified in accordance with the Automotive Electronics Council(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and issuitable for use in automotive applications.

12. Package outline

12-05-01Dimensions in mm

0.65

0.300.22

0.300.22

0.550.45

0.650.55

0.4max

1.050.95

2

cathode marking on top side (if applicable)

1

Fig. 17. Package outline DFN1006D-2 (SOD882D)

13. Soldering

solder lands

solder resist

solder paste

sod882d_fr

Dimensions in mm

1.40.2

0.3

0.4

1

1.3

0.8(2×)

0.6(2×)

0.7(2×)

Fig. 18. Reflow soldering footprint for DFN1006D-2 (SOD882D)





14. Revision historyTable 8. Revision historyDocument ID Release date Document status Change notice Supersedes

PMEG2005BELD v.4 20150804 Product data sheet - PMEG2005BELD v.3

Modifications: • Section "Marking": updated Figure 1.



PMEG2005BELD v.1 20120111 Preliminary data sheet - -





15. Legal information

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Productstatus [3]

Definition

Objective[short] datasheet

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Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

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Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperiasales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.

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Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.

Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

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Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

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16. Contents1 General description ............................................... 12 Features and benefits ............................................13 Applications ........................................................... 14 Quick reference data ............................................. 15 Pinning information ...............................................26 Ordering information .............................................27 Marking ................................................................... 28 Limiting values .......................................................39 Thermal characteristics .........................................410 Characteristics .......................................................511 Test information ..................................................... 911.1 Quality information ............................................. 1012 Package outline ................................................... 1013 Soldering .............................................................. 1014 Revision history ...................................................1115 Legal information .................................................1215.1 Data sheet status ............................................... 1215.2 Definitions ...........................................................1215.3 Disclaimers .........................................................1215.4 Trademarks ........................................................ 13

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 04 August 2015