pmt high voltage control board specification control ...kitamura/hvdocs/bigdocs/ctrl_scd/9… ·...

REVISIONSLTR. ECN DESCRIPTION DATE APPROVED

- NA Original release 04/01/23

SHEET REVISION STATUS

SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18REVISION - - - - - - - - - - - - - - - - - -

SHEET 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36REVISION - - - - - - - - - - - - - - - - - -

SHEET 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54REVISION - - - - - - - - - - - -

SHEET 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72REVISION

SHEET 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90REVISION

SHEET 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108

REVISION

CONTROLLED DIST. LIST1 16 ANTARCTIC ASTRONOMY AND ASTROPHYSICS2 17 RESEARCH INSTITUTE3 18 THE UNIVERSITY OF WISCONSIN - MADISON, WISCONSIN4 19 TITLE

5 20 ICECUBE6 21 PMT HIGH VOLTAGE CONTROL BOARD7 22 SPECIFICATION CONTROL DRAWING

PMT High Voltage Control Board of 38

Document # 9400-0027-SCD Revision: -

8 23 ORIGINATOR DATE ENGINEER DATE CHECKER DATE

9 24

10 25 LEVEL 2/LEAD DATE PRODUCT ASSURANCE DATE PROJECT APPROVAL DATE

11 26

12 27 FILENAME PROJECT NO.

13 28 9400-0027-SCD.yymmdd.doc 900014 29 DRAWING NO. SCALE SIZE SHEET

15 30 9400-0027-SCD NA A Page 1 of 38



Contents

1 INTRODUCTION 41.1 Purpose 41.2 Scope 41.3 Responsibility and Records 4

1.3.1 Document Responsibility 41.3.2 Document and Verification Records 4

1.4 Item’s Function in the IceCube System 5

2 APPLICABLE DOCUMENTS 62.1 Project Requirements 62.2 Reference Documents 62.3 Order of Precedence 6

3 REQUIREMENTS 73.1 Item Identification 7

3.1.1 Definition 73.1.2 Functional Description 73.1.3 Functional External Interfaces 73.1.4 Schematic Diagram 8

3.2 Performance Requirements 93.2.1 Functional Requirements 93.2.2 Electrical Requirements 93.2.3 Mechanical Requirements 133.2.4 External Interface Requirements 153.2.5 Environmental Requirements 263.2.6 Storage Requirements [TBD] 26

3.3 Design and Construction Requirements 273.3.1 Electrical and Electronic Parts 273.3.2 High Voltage Generator 273.3.3 Coatings, Platings, and Corrosion Prevention [TBD] 273.3.4 Adhesives and Sealants [TBD] 273.3.5 Printed Circuit Board 273.3.6 Component Placement 283.3.7 Restricted Parts, Materials, and Processes 283.3.8 Reliability 283.3.9 Quality 29

4 VERIFICATION 304.1 Responsibility 30



4.2 Special Tests and Examinations 304.3 Requirement vs. Verification Cross Reference with Section 3 30

5 PREPARATION FOR DELIVERY 315.1 Identification—Part Number and Serial Number 315.2 Final Visual Inspection 315.3 Packaging and Shipping 31

6 DEFINITIONS 326.1 IceCube Acronyms 326.2 IceCube Glossary 35

7 APPENDIX 36

Figures

Figure 1 Functional Block Diagram 8Figure 2 HV Control Board Envelope 13Figure 3 HV Control Board PCB Dimensions 14Figure 4 High voltage output cable end preparation requirement 22Figure 5 Interface Cable Attachment 24

Tables

Table 1 Voltage and Current Specification for Digital Signals 16Table 2 Timing Specification 17Table 3 Digital Interface Signals 17Table 4 Digital Interface Devices 18Table 5 Interface Signal Multiplexing 18Table 6 Device Addressing Scheme 18Table 7 POWER_ON 19Table 8 HV_DISABLE 19Table 9 Ribbon Cable Connector Pin Assignment 25



1 INTRODUCTION

1.1 PurposeThis IceCube Specification Control Drawing (SCD) specifies the performance, fabrication, verification, and production acceptance requirements for the PMT High Voltage Control Board used on the IceCube PMT Modular High Voltage Power Supply.

1.2 ScopeThis Specification Control Drawing shall be applicable to the design, development, integration, verification, production, validation, logistics, field deployment and disposal of the PMT High Voltage Control Board.

1.3 Responsibility and Records

1.3.1 Document ResponsibilityThe IceCube Project of the Antarctic Astronomy and Astrophysics Research Institute (AAAIR) at the University of Wisconsin – Madison (UW) is responsible for writing and updating these requirements to ensure they are correct, complete and current. UW AAARI Quality Assurance is responsible for ensuring this document and changes to it are properly reviewed, approved and maintained.

1.3.2 Document and Verification RecordsRecords of this document and associated verification and qualification records shall be maintained as follows:

a. The approved and signed original of this document shall be maintained per UW AAARI 9000-0004, Document Management Process.

b. Changes to this document shall be via Engineering Change Notices (ECNs) as described in UW AAARI 9000-0004, Document Management Process.

c. Verification records shall be maintained as described in Section 4 of this document in compliance with UW AAARI 9000-0003, IceCube Quality Plan.



1.4 Item’s Function in the IceCube SystemThe IceCube Neutrino Observatory System at the South Pole requires high voltage for one Photomultiplier Tube (PMT) in each of its Digital Optical Module (DOM) sensors. The PMT High Voltage Control Board is one of two subassemblies of the PMT Modular High Voltage (HV) Power Supply. The adjustable-output PMT HV Power Supply creates and supplies approximately 2000 volts maximum anode bias and multiple dynode bias voltages to the PMT inside each DOM sensor. The PMT HV Control Board creates and controls this high voltage in accordance with digital commands from the DOM Main Board. For instance the PMT HV Control Board may adjust its output high voltage to obtain different PMT photon sensitivities. The PMT HV Control Board also measures and reports the value of the output high voltage. The output high voltage is delivered to the PMT HV Base Board where it is applied to the anode for signal extraction and proportionately distributed to the PMT electrodes. There are 5120 Digital Optical Modules in the IceCube system, each containing a PMT HV Control Board in a PMT Modular HV Power Supply. The IceCube system has 4800 DOMs deployed over a kilometer deep in the Antarctic ice with 320 additional DOMs installed on the ice surface, all used for scientific research.



2 APPLICABLE DOCUMENTSThe following documents of the exact issue shown are applicable requirements for this Configuration Item only to the extent they are invoked by specific requirements herein.

2.1 Project Requirementsa. PMT Modular HV Power Supply Engineering Requirements Document, 9400-0016-

ERD

b. PMT HV Generator Source Control Drawing, 9400-0068-SCD (Rev -)

c. PMT HV Base Board Specification Control Drawing, 9400-0028-SCD

d. PMT HV Power Supply Interface Control Document, 9400-0016-ICD

e. PMT HV Control Board Schematic, 9400-0027-SCH (Rev A)

f. PMT HV Control Board Ribbon Cable Assembly Drawing, 9400-0022-DWG (Rev -)

g. PMT HV Control Board Component Envelope Drawing, 5549C104 Rev B, Physical Sciences Lab, University of Wisconsin–Madison (Needs revision. Refer to information in the present document.)

2.2 Reference Documentsa. JESD8-B, “Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated

Circuits”, JEDEC Solid State Technology Association, September 1999.

b. IPC-2221, §6.3 Electrical Clearance, “B-4 External Conductors with Permanent Polymer Coating” [TBR]

c. “Book of iButton Standards”, Dallas Semiconductor Corporation, Application Notes Number 937, January, 2002.

d. MIL-HDBK-217F (N1/2)—Parts Stress and Analysis method [TBR]

2.3 Order of Precedencea. Conflicts within this document shall be resolved as directed by the IceCube System

Engineer in collaboration with the Project Lead responsible for this Design Item.

b. Conflicts between other documents as they relate to or impact this document shall be resolved as directed by the IceCube Project Manager in collaboration with the IceCube System Engineer.



3 REQUIREMENTS

3.1 Item Identification

3.1.1 DefinitionThe PMT High Voltage Control Board (HV Control Board) is a printed circuit board (PCB) assembly, containing the High Voltage Generator module, power inputs, control logic, output voltage control, and digital interface circuitry, and, together with the PMT HV Base Board, constitutes the PMT Modular High Voltage Power Supply. The HV Control Board is mechanically mounted as a daughter board to the DOM Flasher Board and is electrically connected to the PMT HV Base Board via a high-voltage cable and to the DOM Main Board via a digital interface cable. No electrical connection, including grounds, is present between the HV Control Board and the DOM Flasher Board.

3.1.2 Functional DescriptionThe HV Control Board derives all the power from the DOM Main Board and generates a high voltage in the range of approximately 1000 to 2100 VDC and supplies it to the PMT HV Base Board, where the high voltage potential is divided and distributed to the individual electrodes of the PMT (Figure 1). The digital interface circuitry supports the following commands issued by the DOM Main Board:

a. Adjust the HV Generator output voltage

b. Report the measured value of the HV Generator voltage output

c. Report the digital serial number uniquely identifying each individual HV Control Board

d. Respond to power supply power ON/OFF commands

e. Respond to high voltage output ENABLE/DISABLE commands

f. The digital interface circuitry providing the above functions may be either internal or external to the HV Generator either in part or as a whole.

All the power for the HV Generator and the digital interface circuitry is provided by the DOM Main Board.

3.1.3 Functional External InterfacesThe HV Control Board has four external functional interfaces:

a. Power input from the DOM Main Board

b. Bidirectional digital control and data from/to the DOM Main Board

c. High voltage output to the PMT HV Base Board



d. Structural mount to the Flasher BoardThese interfaces are illustrated in Figure 1.

3.1.4 Schematic DiagramRefer to the IceCube document # 9400-0027-SCH.

HV Generator

Digital Interface

HV ControlBoard

PMT HV Base Board

PMT Modular High Voltage Power Supply

High Voltage

DOM Main Board PMT

StructualMount

PMT Anode SignalDigital Control& Response

Flasher Board

Power

. . . . .

Dynode VoltagesStructual Mount

Figure 1 Functional Block Diagram

3.2 Performance Requirements

3.2.1 Functional Requirements

3.2.1.1 High Voltage Generation

The HV Control Board shall generate an adjustable high voltage output for the PMT HV Base Board, using the power provided by the DOM Main Board.

3.2.1.2 Digital Command Response

The HV Control Board shall respond to the following digital control commands issued by the DOM Main Board:

a. ON/OFF command for switching the primary power of the entire HV Control Board

b. ENABLE/DISABLE command for enabling or disabling the high voltage output

c. Serial DAC code for setting the High Voltage output value

3.2.1.3 Digital Output

The HV Control Board shall provide the following digital output to the DOM Main Board:

a. Serial ADC code for the High Voltage Monitor Output value

b. Serial digital code uniquely identifying the individual HV Control Board

3.2.2 Electrical Requirements

3.2.2.1 Input Voltage

3.2.2.1.1 +5 Volts DC

The HV Control Board shall receive a power input voltage of +5 VDC ±5%.

3.2.2.1.2 –5 Volts DC

The HV Control Board shall receive a power input voltage of -5 VDC ±5%.

3.2.2.2 Input Current

3.2.2.2.1 +5 Volts Input Current

The HV Control Board input current for +5 Volt power shall not exceed 70 mA [TBR].

document.doc



3.2.2.2.2 –5 Volts Input Current

The HV Control Board input current for -5 Volt power shall not exceed 30 mA [TBR].

3.2.2.3 Input Power

The total input power to the PMT HV Control Board shall not exceed 350 mW [TBR].

3.2.2.4 Internal Grounds

3.2.2.4.1 Analog Ground

a. The analog signal ground on the HV Control Board shall be referenced by the HV Generator and by the appropriate analog ground pin(s) of the DAC, the ADC, and, if present, the voltage reference device.

b. The shielding case of the HV Generator shall be connected to the analog ground.

c. The analog ground shall be connected to the DOM Main Board interface connector pin(s) designated as DGND at a single point.

3.2.2.4.2 Digital Ground

Digital Ground and Power Ground shall be one on the PCB and shall refer to the net designated as DGND on the DOM Main Board interface connector.

3.2.2.4.3 RF Ground

The HV Control Board shall use the Power Ground as the RF ground.

3.2.2.4.4 Power Ground

Power Ground and Digital Ground shall be one on the PCB and shall refer to the net designated as DGND on the DOM Main Board interface connector.

3.2.2.5 High Voltage Generation

3.2.2.5.1 Power ON/OFF Transients

The HV output upon power up of the HV Control Board shall be within ±1V [TBR].

3.2.2.5.2 High Voltage Enable/Disable [TBR]

a. The HV output shall reach within ± 5% of the target value in less than 30 seconds after receiving a HV enable command under a resistive load of 130 M ± 5%.

b. The HV output shall reach below 100V in less than 30 seconds after receiving a HV disable command under a resistive load of 130 M ± 5%.

Note “Disable” means disabling the high voltage generation circuitry, such as the oscillator, while the rest of the HV Control Board is powered.

document.doc



3.2.2.5.3 HV Adjustment

3.2.2.5.3.1 Voltage Adjustment Range

The HV Control Board high voltage output shall be adjustable over a minimum range of 1000 to 2047 VDC when measured using a resistive load of 130 M ± 5%.

3.2.2.5.3.2 Minimum Adjustable Voltage

The low-end of the adjustable high voltage range of the HV Control Board shall be greater than –5 VDC when measured using a resistive load of 130 M ± 5%.

3.2.2.5.3.3 Maximum Adjustable Voltage

The high-end of the adjustable high voltage range of the HV Control Board shall be less than 2100 VDC when measured using a resistive load of 130 M ± 5%.

3.2.2.5.3.4 Voltage Adjustment Resolution

The HV Control Board shall use a 12-bit resolution DAC for digitally setting the value of the high voltage output.

3.2.2.5.3.5 Voltage Adjustment Linearity

The HV Control Board high voltage output and the corresponding digital command code shall have a linear relationship over the specified adjustment voltage range with a slope of 0.5 Volts ± [TBD] Volts per bit when measured using a resistive load of 130 M ± 5%.

3.2.2.5.4 High Voltage Quality

3.2.2.5.4.1 Voltage Stability (Absolute bound around set point)

a. The high voltage output of the HV Control Board shall not deviate from the set point by more than 0.2% over any eight-hour period, once the output value has reached within this range of the set point, under a stable operating temperature.

b. The high voltage output of the HV Control Board shall not change from the set point at a rate any faster than 0.2% per hour.

3.2.2.5.4.2 Voltage Ripple (Noise)

The HV Control Board high voltage output ripple voltage, originating from the HV Generator, shall be less than 5 mVpp when measured with a resistive load of 130 M ± 5%.

Note Laboratory measurements show that far greater ripple amplitudes are acceptable in order to meet the requirement for the PMT Modular HV Power Supply, which specifies the ripples to be less than 0.5mVpp when measured at the end of the resistively-terminated pulse-output cable.

document.doc



3.2.2.6 High Voltage Monitoring

3.2.2.6.1 Voltage Monitoring Output

The HV Control Board shall allow monitoring of the high voltage output using an ADC and transmit its value to the DOM Main Board as a digital code upon command.

3.2.2.6.2 Voltage Monitoring ADC Resolution

The HV Control Board shall use a 12-bit resolution ADC for monitoring the value of the high voltage output.

3.2.2.6.3 Voltage Monitoring Linearity

The HV Control Board high voltage output being monitored and the corresponding digital value shall have a linear relationship in the specified adjustment voltage range with a slope of 0.5 V ± [TBD] Volts per bit when measured using a resistive load of 130 M ± 5%.

3.2.2.6.4 Voltage Monitoring Accuracy

The HV Control Board high voltage output value that is digitally reported shall be within ±2% [TBR] of the true value.

Note The value is based on a prototype evaluation.

3.2.2.7 Current Sourcing Capability

3.2.2.7.1 Current Sourcing at Minimum Operating Temperature

The HV Control Board shall provide a DC current sourcing capability of a minimum of 12 nA at the minimum operating temperature specified herein, as determined by the output voltage changing less than 10V when the current is varied from zero to the specified minimum current.

3.2.2.7.2 Current Sourcing at Maximum Operating Temperature

The HV Control Board shall provide a DC current sourcing capability of a minimum of 240 nA at the maximum operating temperature specified herein, as determined by the output voltage changing less than 10V when the current is varied from zero to the specified minimum current.

3.2.2.7.3 Pulsed Current Sourcing [TBR]

The HV Control Board shall provide a current sourcing capability of a minimum of 60 mA for an isolated single 1 sec square-pulse, at the minimum operating temperature specified herein, as determined by the output voltage changing less than 10V when the current is changed from zero to the specified pulse current during the pulse time. [TBR]

document.doc



3.2.3 Mechanical Requirements

3.2.3.1 Overall Size and Volume Constraints

a. The maximum height of the components on the bottom side of the HV Control Board shall be no greater than 16 mm.

b. The maximum height of the components on the top side of the HV Control Board shall be 22 mm minus the printed circuit board thickness (1.6mm typical).

c. All the components on the HV Control Board shall be wholly contained within the component envelope, defined in Figure 2, except for:

Interface ribbon cable

HV output cable

Stand-offs for mounting the HV Control Board to the next higher assembly.

d. The lateral extent of the HV Control Board, defined by the “Component Side View” in Figure 2, shall be as specified in the next section.

22

16

4.3

1.6REF

40°

Units: mm

(Component Side View)

Figure 2 HV Control Board Envelope

document.doc



3.2.3.2 PCB Dimensions

The overall shape of the printed circuit board of the PMT HV Control Board shall be as shown in Figure 3, where the dimensions are for the maximum extent of the board outline, corresponding to the “Component Side View” in Figure 2.

a. The maximum board outline dimensions shall be observed to within ±0.5 mm.

b. The relative locations of the three mounting holes shall be observed to within ±0.5 mm. [TBR]

c. The ribbon connector mounting location, relative to the mounting holes, shall be observed to within ±1 mm.

50.09

85.56

59.35

87.70

95.81

18.21

25.22

99 REF

R105

R56.08

39.24

42.96

45.70

7.5 REF

PIN #1LOCATION

3 X 3 BOARDMOUNTING HOLES

UNITS: MM

APPROX. AREAFOR HV OUTPUTCABLE ATTACH

RIBBONCONNECTOR ONTOP SIDE

COMPONENT SIDE VIEW

Figure 3 HV Control Board PCB Dimensions

3.2.3.3 Weight

The fully assembled HV Control Board shall weigh no greater than 100 grams [TBR].

Note The actual unit in use (PY3) weighs approximately 85 grams.

document.doc



3.2.4 External Interface Requirements

3.2.4.1 Electric Power

The HV Control Board shall receive all of its electric power from the DOM Main Board through the conductors in the DOM Main Board-to-HV Control Board interface cable.

3.2.4.2 Grounding

3.2.4.2.1 Digital Signal Grounding

External Digital Signal Grounding shall be via multiple common/shared return conductors in the ribbon cable between the HV Control Board and the DOM Main Board.

3.2.4.2.2 RF Signal Grounding

External RFI and EMIC Grounding shall be via multiple common/shared return conductors in the ribbon cable between the HV Control Board and the DOM Main Board.

3.2.4.2.3 Power Grounding

Power Grounding shall be via multiple common/shared return conductors in the ribbon cable between the HV Control Board and the DOM Main Board.

3.2.4.2.4 High Energy Grounding

External High Energy Grounding shall be via multiple common/shared return conductors in the ribbon cable between the HV Control Board and the DOM Main Board.

3.2.4.2.5 Safety Grounding

External Safety Grounding shall be via multiple common/shared return conductors in the ribbon cable between the HV Control Board and the DOM Main Board.

3.2.4.3 Analog Signals

The HV Control Board shall have a single analog high-voltage output, defined in Section 3.2.1.

3.2.4.4 Special Discrete Signal

The HV Control Board’s serial number shall be read out by the DOM Main Board using the Dallas 1-Wire protocol from the on-board device, referred to as the IDENT device. The IDENT device signal specification is distinct from that of the digital signals; however, it shall share the digital line MISO with the ADC, as shown in Table 5. See Section 3.2.4.5.7.2 for the IDENT signal specification.

document.doc



3.2.4.5 Digital Signals

3.2.4.5.1 Voltage, Current, and Timing

3.2.4.5.1.1 Applicable Standard(s)

The logic levels and corresponding voltages between the HV Control Board and the DOM Main Board communications shall comply with the specifications in JESD8-B, “Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated Circuits”, JEDEC Solid State Technology Association, September 1999.

3.2.4.5.1.2 Voltage and Current Specification [TBR]

The voltage and current specifications for the digital communication between the HV Control Board and the DOM Main Board shall be as shown in Table 1.

Table 1 Voltage and Current Specification for Digital Signals

Parameter Min. Max. Units

Voltage output from HV Control Board

Logic “High” 2 3.3 V

Logic “Low” -0.3 0.8 V

Voltage input to HV Control BoardLogic “High” 2.4 3.6 V

Logic “Low” 0 0.4 V

Current out of HV Control Board - 10 A

Current into HV Control Board - 2 mA

Note 1 The device on the DOM Main Board with which the HV Control Board communicates is a Xilinx CoolRunner II operating with a 3.3V I/O voltage. The device is capable of driving a 3.3V LVTTL input as well (i.e., it can source more than 2 mA into an LVTTL input.)

Note 2 The table summarizes the specifications of JESD8-B, assuming the I/O supply for the CoolRunner II varies over 3.0V to 3.6V and the HV Control Board input sinks a maximum of 2 mA.

Note 3 The voltage and current specifications do not apply to the IDENT signal. For the IDENT signal, the requirements specific to the Dallas 1-Wire protocol shall apply.

3.2.4.5.1.3 Timing Specification [TBR]

The digital interface devices on the HV Control Board shall meet the timing specification in Table 2 in sending and receiving digital signals.

Table 2 Timing Specification

Clock frequency 0.1 - 1 MHz

Clock duty ratio 20 – 80 %

Rise Time for all logic and clock 0.3 - 9.0 ns

Fall Time for all logic and clock 0.8 – 10.5 ns

document.doc



Note 1 The timing specification here does not apply to the IDENT signal. The IDENT device operation relies on its unique timing requirements.

Note 2 The rise time / fall time values are from “Cool Runner-II I/O Characteristics”, Xilinx Document No. XAPP382 (v 1.0), November 11, 2002. The value ranges correspond to the load capacitance range of 0 to 100 pF.

Note 3 JESD8-B does not specify timing. A possibly applicable standard for the timing is JEDEC Document No. 13-B, “Standard Specification for Description of ‘B’ Series CMOS Devices”, May 1980; however, the Xilinx datasheet (Note 2) is probably more up-to-date and suites better for the present purpose.

3.2.4.5.2 Digital Interface Signals

The HV Control Board shall communicate with the DOM Main Board using the digital interface signals identified in Table 3. (“IN” = Input to the HV Control Board.)

Table 3 Digital Interface Signals

Signal Name Direction Description

POWER_ON IN Board power ON (active high)

HV_DISABLE IN HV output disable (active high)

CS0 IN Chip-select bit 0

CS1 IN Chip-select bit 1

SCLK IN Serial clock

MISO OUT Master-In-Slave-Out serial data

MOSI IN Master-Out-Slave-In serial data

3.2.4.5.3 Digital Interface Devices

3.2.4.5.3.1 On-Board Interface Devices

The serial digital interface devices listed in Table 4 shall be present on the HV Control Board.

Table 4 Digital Interface Devices

Device Function Part number

IDENT Provide board serial number

Dallas Semiconductor (Maxim) DS2401 or equivalent

DAC Digital-to-analog conversion for HV output adjustment

Linear Technology LTC1257IS8 or equivalent

ADC Analog-to-digital conversion for HV output monitor

Linear Technology LTC1286IS8 or equivalent

document.doc



3.2.4.5.3.2 Signal Multiplexing

The interface devices shall share the MISO, MOSI, and SCLK signals, as shown in Table 5.

Note The operation of the IDENT device requires the signal on the MISO line to have a rate of logic transitions in the range specified in the Dallas 1-Wire signaling protocol. The device for multiplexing MISO for IDENT and ADC data must, therefore, support both the normal (fast) CMOS transitions and the slow 1-Wire signaling transitions. The use of an analog switch, rather than a logic multiplexer, will accomplish such a requirement.

Table 5 Interface Signal Multiplexing

Device MISO MOSI SCLK

IDENT data

DAC data clock

ADC data clock

3.2.4.5.4 Device Addressing Scheme

The two “chip-select” signals, CS0 and CS1, are used to select a digital function, as shown in Table 6.

Table 6 Device Addressing Scheme

CS0 CS1 Explanation

1 1 Read from IDENT or write a word to DAC (default )

0 1 Update DAC output on falling edge of CS0

1 0 Operate ADC while CS1 remains low.

0 0 (not allowed)

3.2.4.5.5 POWER_ON

The HV Control Board’s power shall be controlled by the logic state of POWER_ON as shown in Table 7.

Table 7 POWER_ON

Logic Level Function

0 Board power off

1 Board power on

document.doc



3.2.4.5.6 HV_DISABLE

a. The HV Control Board’s HV output shall be disabled or enabled, according to the logic state of HV_DISABLE, as shown in Table 8.

b. The HV_DISABLE shall be remain in logic “0” while POWER_ON is “0” or within 0.5 sec. after POWER_ON becomes “1”.

c. The logic level of HV_DISABLE shall not change more than once per second.Note The requirements (a) and (b) are due to the specification of the HV Generator.

Table 8 HV_DISABLE

Logic Level Function

0 Enable HV output

1 Disable HV output

3.2.4.5.7 Board Serial Number—IDENT

3.2.4.5.7.1 Required Pull-Up Resistor

The HV Control board shall provide a 5k pull-up resistor (closest value in 5% or better) to +3.3VDC (relative to DGND) for the IDENT device serial signal line.

3.2.4.5.7.2 Device Operation

The IDENT device shall communicate with the DOM Main Board, serving as the bus master, according to the Dallas 1-Wire signaling protocol (See “Book of iButton Standards”, Dallas Semiconductor Corporation, Application Notes Number 937, January, 2002.).

3.2.4.5.8 HV Output Adjustment—DAC

3.2.4.5.8.1 Number Format

The DAC shall use a 12-bit unsigned straight binary encoding with the digital value 000 (hex) representing the DAC output of 0 VDC.

3.2.4.5.8.2 DAC Device Operation

a. The analog output of the DAC shall be updated by the DOM Main Board in the following sequence:

(1) While CS0 = “1” and CS1 = “1”, the 12 data bits are written to the DAC on the rising clock edge starting from MSB, using MOSI and SCLK lines.

(2) CS0 is pulled low momentarily. (The DAC output is updated on the falling edge of CS0.)

b. The HV Control Board shall support the following maximum operating speed parameters of the DAC:

document.doc



(1) Maximum serial clock frequency = 1.4 MHz

(2) Minimum clock high time = 350 nsec.

(3) Minimum set-up time after the data bit is set to the next rising clock edge = 250 nsec.

(4) Minimum hold time of the data bit after the rising clock edge = 25 nsec.

(5) Minimum wait before CS0 goes low after the last data bit is set = 250 nsec.

(6) Minimum duration in which CS0 remains low = 150 nsec.Note Source: Linear Technology LTC1257 datasheet.

3.2.4.5.9 HV Output Monitor—ADC

3.2.4.5.9.1 Number Format

The digital output code transmitted by the HV Control Board ADC shall be in 12-bit unsigned straight binary with the digital value 000 (hex) representing 0 VDC.

3.2.4.5.9.2 ADC Device Operation

a. The operating sequence and timing of the ADC shall be according to 9400-0016-ICD.

b. The analog input to the ADC is read out as a 12-bit digital word by the DOM Main Board in the following sequence:

(1) CS1 is pulled low.

(2) The SCLK line is made to go from low to high three times.

(3) The 12 data bits are read out on the rising edge of the clock, starting from MSB, using SCLK and MISO.

(4) CS1 is set high.

c. The HV Control Board shall support the following maximum operating speed parameters of the ADC:

(1) Maximum serial clock frequency = 200 kHz

(2) Minimum clock high time = 2 sec.

(3) Minimum set-up time for the first rising clock edge after CS1 going low = 2 sec.

(4) Minimum wait after the falling clock edge to the data bit read-out = 250 nsec.

Note Source: Linear Technology LTC1286 datasheet

document.doc



3.2.4.6 Interconnections

3.2.4.6.1 High Voltage Output Cable

3.2.4.6.1.1 Cable Type

The high voltage output cable or wires shall consist of two parallel, twisted, or coaxial conductors, one having the high voltage potential with respect to the HV Control Board Power Ground, and the other being the high voltage return that is referenced to the same ground.

Note The current design (PY3) employs a custom coaxial medium, specified in detail in the IceCube document #9400-0068-SCD (HV Generator source control drawing).

3.2.4.6.1.2 Voltage Rating

The high voltage cable or wires shall be rated at 5000 VDC minimum breakdown over all the operational environments and operational life specified herein.

3.2.4.6.1.3 Minimum Bending Radius

The high voltage cable or wire shall have a minimum bending radius of less than 25 mm over all the operational environments and operational life specified herein.

Note The custom coaxial cable in use as of PY3 has a minimum bending radius of 24 mm.

3.2.4.6.1.4 Cable Termination

The high voltage cable or wires shall be electrically and mechanically terminated inside the High Voltage Generator module.

3.2.4.6.1.5 Mechanical Integrity

The high voltage cable or wires shall not degrade when the cable or wires are pulled with a maximum of 5 kg of force in any direction from the surface of the HV Control Board.

3.2.4.6.1.6 Cable Length

The high voltage output cable or wires shall be 250 ± 15 mm long measured from the top surface of the HV Control Board PCB to the end of the insulation.

3.2.4.6.1.7 Cable Exit Location

The high voltage output cable or wires shall exit at the approximate location specified in Figure 3.

3.2.4.6.1.8 Cable End Preparation

The end of the high voltage cable shall be stripped and tinned as shown in Figure 4.

Note The figure applies only to the custom coaxial cable in use as of PY3.

document.doc



0.20 max

Shield Insulation

Centerconductor

Jacket

0.05 min

Units: Inches

Center conductor tinnedportion = 0.20 max. from end.

0.375 ± 0.125

0.90 ± 0.20

0.55 ± 0.05

0.20 max

0.050 max

Solder tinned portion

Figure 4 High voltage output cable end preparation requirement

3.2.4.6.2 Digital Interface Cable

3.2.4.6.2.1 Cable Specification

The digital interface cable shall be according to the specification in IceCube document #9400-0022-DWG (Rev -):

a. The digital interface cable shall be a 24-conductor, 1-mm-pitch flat IDC ribbon cable with 28 AWG (7/36) wires [7 strands of 0.127-mm-diameter wire].

b. The HV Control Board side of the cable shall have a solderable male connector, and the DOM Main Board side shall have a female connector.

c. Correct length of the cable, connector part numbers, and connector orientations shall be observed according to the specification.

3.2.4.6.2.2 Attachment to the HV Control Board

The male-connector-side of the interface cable shall be soldered directly to the HV Control Board at the location specified in Figure 3 and in the orientation shown in Figure 5.

document.doc



3.2.4.6.3 Signal Assignment

The signal assignment to the interface cable conductors is as shown in Table 9.

Note The following requirements are being observed: The interface cable carries digital signals, ground connections, and power connections. Each signal, including power and ground, has at least two conductors allocated for

redundancy.

3.2.4.7 Mounting Points

3.2.4.7.1 Mounting Provisions for Next Higher Assembly

The HV Control Board shall provide holes and clearances for mounting it to the DOM Flasher Board using stainless-steel hexagonal stand-offs. The clearance zones shall be concentric with the mounting holes and have a minimum diameter of 9.5 mm. There shall be no copper foil within this diameter.

3.2.4.7.2 Mounting Locations

The HV Control Board mounting locations for installation into the next higher assembly shall be as shown in Figure 3.

3.2.4.8 Test Points

Voltage measurement test points shall be provided on the component side of the HV Control Board for measuring all inputs and outputs of the High Voltage Generator (except for the high voltage output, which is to be measured at the end of the output cable).

document.doc



PIN #1

PIN #1

ORIENTATION KEY

COMPONENT (TOP) SIDE

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

21 22

23 24

PIN LAYOUTVIEWED FROM TOP

ORIENTATION KEY

Figure 5 Interface Cable Attachment

document.doc



Table 9 Ribbon Cable Connector Pin Assignment

Pin # Signal Name Description

1 DGND Digital and power ground

2 SCLK Serial clock

3 SCLK Serial clock

4 MOSI Master-out-slave-in

5 MOSI Master-out-slave-in

6 MISO Master-in-slave-out

7 MISO Master-in-slave-out


9 CS0 Chip-select bit 0

10 CS0 Chip-select bit 0

11 CS1 Chip-select bit1

12 CS1 Chip-select bit1

13 POWER_ON Board enable/disable

14 POWER_ON Board enable/disable

15 +5V Main power (+)

16 +5V Main power (+)



19 -5V Main power (-)

20 -5V Main power (-)



23 HV_DISABLE HV disable

24 HV_DISABLE HV disable

document.doc



3.2.5 Environmental Requirements

3.2.5.1 Temperature

3.2.5.1.1 Operating Temperature

The HV Control Board shall meet all performance requirements when operating over an ambient temperature range of –40 °C to +27 °C.

3.2.5.1.2 Non-Operating Temperature

(Shall be consistent with the DOM-level requirements.)

3.2.5.1.3 Storage/Transport Temperature

The HV Control Board shall withstand a storage and transport temperature range of –55 °C to +45 °C for a period of [TBD] months without any degradation in performance.

3.2.5.2 Thermal Shock


3.2.5.3 Pressure

3.2.5.3.1 Operating Pressure

The HV Control Board shall meet all performance requirements while operating at 1 atmosphere in air or while operating inside a pressure vessel with a sustained internal Nitrogen gas atmospheric pressure of 40,000 Pa to 100,000 Pa.

3.2.5.3.2 Non-Operating and Storage/Transport Pressure


3.2.5.4 Mechanical Shock and Vibration


3.2.5.5 Electromagnetic Interference/Compatibility


3.2.5.6 Humidity


3.2.5.7 Radioactivity


3.2.6 Storage Requirements [TBD]

document.doc



3.3 Design and Construction Requirements

3.3.1 Electrical and Electronic Partsa. To the extent practical, all electrical and electronic components used for the HV

Control Board shall meet the lowest operating temperature of –55C, as specified by the component manufacturer, where “practical” means that such components are readily available for the operating temperature of –55C or lower.

b. The vendor of the PMT High Voltage Control Board shall supply IceCube with a list of electrical and electronic components used that do not meet the –55C or lower operating temperature.

3.3.2 High Voltage GeneratorThe High Voltage Generator, specified in IceCube document # 9400-0068-SCD, shall be a self-contained, metal-shielded, potted module requiring only input power and control signals to deliver high voltage via a pigtail output cable. It shall be designed with wire leads for direct solder to the HV Control Board with its insulated high voltage output lead(s) long enough to reach the HV Base Board when mounted in a DOM.

3.3.3 Coatings, Platings, and Corrosion Prevention [TBD]

3.3.4 Adhesives and Sealants [TBD]

3.3.5 Printed Circuit Board

3.3.5.1 Printed Circuit Board Material

The PMT HV Control Board PCB dielectric board material shall be FR-4 with a nominal thickness of 1.6mm (1/16 inches).

3.3.5.2 Copper Foil Thickness

The PMT HV Control Board PCB shall use the copper foil thickness of 1 oz / ft2 [TBR] for electrical traces and solder pads.

3.3.5.3 Solder Mask

A solder mask shall be applied to both the top and bottom sides of the Printed Circuit Board (PCB) with masked clearance including, but not limited to, the following items:

a. All solder padsb. Through holes for component pins and leadsc. Test pointsd. Designated clear solder pad areas for jumpers, grounding wire, etc.

document.doc



3.3.5.4 Silk Screen Marking

Silk screen markings shall include, but not be limited to, the following items:

a. Supplier identifierb. IceCube Project identifier (“IceCube”)c. Part number and revision number (“HV Control Board”)d. Component reference designatorse. Connector reference designators with pin #1 marked clearlyf. Test pointsg. HV Generator pins

3.3.6 Component PlacementThere are no restrictions in component placement as long as the component envelope (Figure 2) is observed, except for the following items. (The component side (top side) is defined to be the side facing away from the next higher assembly to which the HV Control Board is mounted.)

a. Digital interface cable shall be mounted from the component side at the designated location and in orientation (3.2.4.6.2.2)

b. High voltage output cable shall exit from the component side at the designated location (3.2.4.6.1.7)

c. Mounting holes locations and clearance areas shall be observed (3.2.4.7)d. Test points shall be accessible from the component side (3.2.4.8)

3.3.7 Restricted Parts, Materials, and Processes(Shall be consistent with the DOM-level requirements.)

3.3.8 ReliabilityThe HV Control Board shall have a Mean Time To Critical Failure (MTTCF) of greater then [TBD] hours as predicted in accordance with the Parts Stress Analysis method of MIL-HDBK-217F (N1/2) [TBR].

document.doc



3.3.9 Quality

3.3.9.1 Acceptance Inspection and Tests

The supplier shall perform and record in-process and Final Acceptance Inspection and Tests on each HV Control Board using pass/fail criteria to a level adequate to demonstrate that the item was fabricated with the correct materials and processes and the item properly functions at limit and nominal electrical inputs at standard temperature and pressure.

3.3.9.2 Environmental Stress Screening

All units shall pass the ESS test.

a. Units exhibiting statistical anomalies in functional tests after the ESS, but otherwise within specifications, shall fail this test.

b. Manufacturer shall document the ESS test plan.

c. Test data and pertinent record shall be captured on-line (no manual entry) and shall be available for a minimum of 15 years henceforth.

3.3.9.3 Functional Tests

All units shall undergo and pass a functional test suite, defined by IceCube, before and after the ESS.

3.3.9.4 Workmanship

a. The components shall be free from physical or electrical defects upon receipt at the purchaser’s facility.

b. Labeling on the units shall be undamaged and legible upon receipt.

3.3.9.5 Certificate of Conformance

All shipments of the HV Control Boards shall be accompanied by a Certificate of Conformance (C of C), indicating that all units meet the specifications as defined in this document.

document.doc



4 VERIFICATION

4.1 Responsibility

4.2 Special Tests and Examinations

4.3 Requirement vs. Verification Cross Reference with Section 3

document.doc



5 PREPARATION FOR DELIVERY

5.1 Identification—Part Number and Serial NumberThe HV Control Board shall be indelibly and legibly marked with part number and serial number, traceable to revision and manufacture date code. Such traceability information shall be made available to IceCube.

5.2 Final Visual InspectionAll units shall undergo and pass a final visual inspection prior to shipping.

5.3 Packaging and ShippingThe HV Control Board shall be packaged in ESD-protective packaging and shipped by common carrier. The mode of shipping shall not introduce additional risk of unanticipated accidental damage to the unit.

document.doc



6 DEFINITIONS

6.1 IceCube Acronyms

document.doc



AAARI Antarctic Astronomy and Astrophysics Research Institute

ADC Analog-to-Digital Converter

ATWD Analog Transient Waveform Digitizer

AWG American Wire Gauge

cm Centimeter

CMOS Complementary Metal Oxide Semiconductor

C of C Certificate of Conformance

CS0 Chip-select bit 1

CS1 Chip-select bit 0

DAC Digital-to-Analog Converter

DAQ Data Acquisition System

DC Direct Current

DFL Dark Freezer Laboratory

DGND Digital Ground

DOM Digital Optical Module

DOMMB Digital Optical Module Main Board

ECN Engineering Change Notice

EM Electromagnetic

EMC Electromagnetic Compatibility

EMI Electromagnetic Interference

ERD Engineering Requirements Document

ESD Electrostatic Discharge

ESS Environmental Stress Screening

FAT Final Acceptance Test

HV High Voltage

Hz Hertz

ICD Interface Control Document

ID Inside Diameter

IDC Insulation Displacement Connector

IPC Institute for Interconnecting and Packaging Electronic Circuits

K Kilo (103)

Kg Kilogram

LED Light-Emitting Diode

LSB Least Significant Bit

m Meter / Milli (10-3)

document.doc



M Mega (106)

mA Milliampere

MKS Meter-kilogram-second

mm Millimeter

MISO Master-In-Slave-Out

MOSI Master-Out-Slave-In

MSB Most Significant Bit

MTTCF Mean-Time-To-Critical-Failure

MTTF Mean-Time-To-Failure

mV Millivolt

mW Milliwatt

n Nano (10-9)

OD Outside Diameter

OM Optical Module

p Pico (10-12)

Pa Pascal

PCB Printed Circuit Board

PE Photoelectron

pF Pico Farad

PMT Photomultiplier Tube

P/N Part Number

PSL Physical Sciences Laboratory, University of Wisconsin-Madison

P/V ratio Peak-to-valley ratio

PY Project Year

RF Radio Frequency

RFI Radio Frequency Interference

s, sec Second

SCD Source Control Document / Specification Control Document

SCLK Serial Clock

SI Système International d’Unités

SMB Sub-Miniature B

SPE Single Photoelectron

STF Simple Test Framework

TBD To Be Determined

TBR To Be Reviewed

document.doc



UL Underwriters Laboratory

UW University of Wisconsin

V Volt

VDC Volt DC

W Watt

document.doc



6.2 IceCube Glossary

document.doc

Anode A PMT dynode, the last in the multiplier chain and typically larger than the preceding dynodes, that collects the final charge pulse.

Cathode The active surface of the photomultiplier from which photoelectrons are initially liberated.

Zero The temperature, in degrees Celsius, at which water changes state from a liquid into a solid.



7 APPENDIX

document.doc