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July 2016© 2016 Uniqarta, Inc.
© 2016 Uniqarta, Inc.
Today’s ICs not Suitable forTomorrow’s Flexible Devices
Standard ICs are too thick to bend
2
Thinned ICs are flexible
© 2016 Uniqarta, Inc.
Today’s Assembly Technology Can’t Handle Thin ICs
3
Challenges
• Thinning/Handling
• Dicing
• Pick-up
• Cracking
• Accuracy
• Throughput
• Interconnections
© 2016 Uniqarta, Inc.
The Ideal FHE Assembly Solution Must:
• Address all aspects of the assembly problem
• Be a post-process for any standard semiconductor wafer
• Leverage existing tooling
• Be compatible with printed conductors
• Not impact IC performance
• Be reliable and economical
4
© 2016 Uniqarta, Inc.
FlexChip™ Process Designed for Ultra-Thin ICs
5
patents pending
© 2016 Uniqarta, Inc.
On-Chip Handles Facilitate FlexChip Assembly
patents pending6
Thinned, Diced Wafer Handle Removal(pick-and-place or laser)
Die Placement
handle IC
ultra-thin IC
© 2016 Uniqarta, Inc.
How to connect printed conductors to fine pitch IC bond pads?
7
ChipStamp™ Flexible Interposer
• No vias• Thin profile• Flexible/stretchable• Off-line manufacturing
patent pending
ultra-thin IC
interposer with
redistribution circuit
flex substrate
© 2016 Uniqarta, Inc.
FHE Die Assembly Ecosystem
device wafers
WaferThinning &
Dicing
Interposer Fabrication &
Assembly
FHESystem
Integration*
* Non-IC Integration: passives, sensors, power sources, etc.
(if interposers not required)
FHE Assemblies
printedflex circuits
ExistingFlexible Electronics
Ecosystem
Existing Semiconductor
Ecosystem