presentation title. 60pt. book

Consume. Collaborate. Contribute.

Open. Together.

Consume. Collaborate. Contribute.Consume. Collaborate. Contribute.

O p e n D o m a i n S p e c i f i c A r c h i te c t u r e :T h e I m p a c t o f O D S A

By:Bapi Vinnakota – OCP ODSA Sub-Project LeadKevin Drucker – Facebook ODSA Lead

Consume. Collaborate. Contribute.Open. Together.

The Impact of Open Domain Specific Architecture (ODSA)Agenda

• Background on the Open Compute Project

• Open Domain Specific Architecture (ODSA) Sub-Project

• Drivers for Domain Specific Architectures

• Evolution of the industry

• Chiplet and SIP use cases

• Market Opportunity

• ODSA Collaboration


ODSA: Open Domain-Specific Architecture

• Domain-specific architecture: Programmable devices optimized for specific applications or class of applications. Meet the demands of high-intensity workloads in the data center and at the edge – e.g. machine learning, video processing

• Chiplets: Implement an integrated product as a collection of die in a single package, instead of a single die. Each die is a chiplet. Can reduce development and manufacturing costs.


The Impact of Open Domain Specific Architecture (ODSA)History of Open Compute Project (OCP)

• In 2009 Facebook, confronting exponential growth, was forced to rethink infrastructure architecture

• Small team of engineers spent next two years re-envisioning and designing software, servers, racks, power supplies, cooling and data center design

• In 2011 Facebook shared it’s designs and released them to the public

• Along with Intel, Rackspace, Goldman Sachs and Andy Becholtsheim, the Open Compute Project (OCP) was launched and the Open Compute Project Foundation created

• Today, OCP has grown into a massive global community with over 150 member companies

Over 150 Companies !!!


The Impact of Open Domain Specific Architecture (ODSA)ODSA within OCP: A new Server Sub-Project)

• ODSA organized within the Open Compute Project (OCP):

⎻ ODSA aligned as OCP Server sub-project

⎻ Initial concept brought to OCP by Netronome

⎻ First silicon focused effort within OCP

• Extending Moore’s Law:

⎻ Domain-Specific Architectures: Typically programmable silicon products that accelerate high-intensity workloads (e.g. Tensorflow, Network Processor, Antminer…)

⎻ Chiplets / SIPs go beyond MCM → Build complex products from multiple die, instead of monolithic devices, to reduce TTM, R&D expense and manufacturing costs.

• Open Domain-Specific Architecture: An architecture for a domain-specific products

⎻ Today: All multi-chiplet products are based on proprietary interfaces

⎻ Tomorrow: Select best-of-breed chiplets from multiple vendors

⎻ Incubating a new group, to define a new open interface and standards to build a PoCSpecifications

SERVER


The Impact of Open Domain Specific Architecture (ODSA)Cambrian Explosion of Workloads

Early Compute Era

Standard Computation HPC Computation

Standard Computation

Standard Computation

Graphics Computation

Modern Computation

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k Cha

in

Cognitiv

e Se

curit

y

NLPRobo

tic P

As

Auton

omou

s Veh

icles

Mac

hine

Lea

rning

Neura

l Net

works

Deep Le

arning

Patte

rn R

ecog

nitio

n

RT T

rans

lation

AI and Machine-learning and data-heavy workloads have

exploded in past 5 years and will diversify as new applications

are discovered constantly…

Spon

ges

Mollusk

s

Prok

aryo

tes

Euka

ryot

es

Hemich

orda

ta

Echino

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Comb Je

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Early Precambrian Era

Late Precambrian

Prokaryotes

Eukaryotes

Early Cambrian

Plac

ozoa

Arthro

pods

Wor

ms

Chord

ata

Bio-Diversity Exploded from single cells into multi-cell

organisms during the Cambrian explosion; all major

phyllawere established in this transition

Metazoans

All images from Creative Commons


The Impact of Open Domain Specific Architecture (ODSA)Chiplet and SIP Technology Is Happening Today!

PROVEN IN EXISTING BUSINESS MODELS

[L. Su, IEDM’17]

CHIPLET VS MONOLITHICS

DIE COST 1X DIE COST 0.59X

I/O I/O

I/O I/O

L1 L1

L1 L1

CPU

CPU

CPU CPU

CPU

CPU

CPU CPU

I/O L1

CPUCPU

I/O L1

CPUCPU

I/O L1

CPUCPU

I/O L1

CPUCPU

• Many major semiconductor companies have brought to market chiplet / SIP based products

• Developed using hybrid flows of internally developed tools and EDA industry available point solution

• ODSA seeks to enable internally developed and 3rd party chiplets to be readily integrated

• ODSA seeks to democratize this evolution of chiplet and SIP technology for the larger mass market through an open eco-system marketplace

• Focus on three (3) use cases:

⎻ IO Disaggregation, Core Disaggregation, System Integration


The Impact of Open Domain Specific Architecture (ODSA)Major Chiplet / System in a Package (SIP) use cases: IO Disaggregation

• Use case: IO Disaggregation

• What:

⎻ Separating core and un-core

⎻ High speed IO Interfaces moved to chiplets

⎻ Ex: PCIe I/F, Memory I/F, Network I/F

• Why:

⎻ Focus resources on value added core functions

⎻ Reduce development and qual intervals → shorter TTM

⎻ PPA: Target IP / Core to process nodes that yield highest Performance, Power, Area for a given function

I/O I/O

I/O I/O

L1 L1

L1 L1

CPU

CPU

CPU CPU

CPU

CPU

CPU CPU

L1

L1

CPU

CPU

CPU CPU

CPU

CPU

CPU CPU

I/O

L1

L1

I/O

I/O

I/O


The Impact of Open Domain Specific Architecture (ODSA)Major Chiplet / System in a Package (SIP) use cases: Logic Disaggregation

• Use case: Logic Disaggregation

• What:

⎻ Sub-divide large area of monolithic low yield device into multiple lower area / higher yielding devices

• Why:

⎻ Shift final product from costly, non-linear portion of semiconductor yield curve to lower-cost, higher yielding linear portion

I/O I/O

I/O I/O

L1 L1

L1 L1

CPU

CPU

CPU CPU

CPU

CPU

CPU CPU

Illustration Of

Semiconductor

Yield Curve

Die Area

Yie

ld L

oss

I/O L1

CPUCPU

I/O L1

CPUCPU

I/O L1

CPUCPU

I/O L1

CPUCPU


The Impact of Open Domain Specific Architecture (ODSA)Major Chiplet / System in a Package (SIP) use cases: Combined

I/O I/O

I/O I/O

L1 L1

L1 L1

CPU

CPU

CPU CPU

CPU

CPU

CPU CPU

L1 CPUCPU

Now how about we add KGD memory…

I/O

I/O I/O

I/O

Combined IO and Logic Disaggregation

L1 CPUCPU

L1 CPUCPU L1 CPUCPU

• Optimize for process node vs. PPA→Select the best node for the given function

• Maximize yield curve for linear intercepts

• Amortize cost of development and qualification of the chiplets and re-use them for subsequent products

• Combine with known good die chiplets (KGD) from 3rd parties


The Impact of Open Domain Specific Architecture (ODSA)Major Chiplet / System in a Package (SIP) use cases: System Integration

• Use case: System Integration

• What:

⎻ Integrate multiple SoCs and components into a single SIP package

⎻ Obtain KGD from multiple 3rd party suppliers

⎻ Ex: co-packaged optics and switch

• Why:

⎻ Significant system footprint reduction

⎻ IO power reduction: driving inches of PCB vs. mm of substrate ➔ mJ→ pJ

⎻ Huge win @ scale: even 5W ~ 10W savings power system adds up to MW savings

I/OLASER I/O

I/O I/O

I/OSWITCH SWITCH

SWITCH SWITCHI/OLASER

I/O LASER

I/O LASER

I/OLASER SWITCH SWITCH

SWITCH SWITCHI/OLASER

I/O LASER

I/O LASER


The Impact of Open Domain Specific Architecture (ODSA)Transformative Market Opportunity: The Tip of the Spear

• Independent research from IHS Markit

• Four (4) segments for chiplets analyzed (SoCs, MPU, GPU, PLD (FPGA/CPLDs)

• Six Verticals (wireless, wireline, consumer, computing, industrial, automotive)

Subset of IHS Markit Data: •System on a Chip (SoC)

segment•Conclusion: Immediate

opportunity for chipletsand an open interface

Tip of the spear !!!0

100

200

300

400

500

600

2018 2019 2020 2021 2022 2023 2024

Wireless Communications Consumer Electronics Wired Communications

Computing & Data Storage Industrial Electronics Automotive Electronics

SoC SAM by Market Segment

© 2019 IHS Markit

SoC

s built

wit

h C

hip

lets

$(M

)

Excludes embedded x86 MPUs marketed as SoCs. Includes Configurable SoCs from PLD Vendors.

Source: IHS Markit


The Impact of Open Domain Specific Architecture (ODSA)Transformative Market Opportunity: The End Game

• Initially dominated by compute uses case, other market segments grow to dominate• Takeaway: an open chiplet eco-system with open interface standards is a huge opportunity

0

500

1,000

1,500

2,000

2,500

3,000

3,500

2018 2019 2020 2021 2022 2023 2024

Computing & Data Storage Wired Communications

Wireless Communications Consumer Electronics

Industrial Electronics

Overall Chiplet SAM by Market Segment

Aggre

gat

e P

roce

ssor

Mar

ket

built

wit

h C

hip

lets

$(M

)

0

10,000

20,000

30,000

40,000

50,000

60,000

2020 2025 2030 2035

Computing & Data Storage Wired Communications

Wireless Communications Consumer Electronics

Industrial Electronics Automotive Electronics

Extended Chiplet SAM by market segment

Aggre

gat

e P

roce

ssor

Mar

ket

built

wit

h C

hip

lets

$(M

)


The Impact of Open Domain Specific Architecture (ODSA)Growth of ODSA since Inception

7 10

35

52

65

85

0

10

20

30

40

50

60

70

80

90

OCT DEC JAN MAR JUN SEPT

Cumulative Company Count

0

20

40

60

80

100

120

140

160

180

Jan March June Sept

Attendance in ODSA Events

Source: OCP ODSA Survey, Workshop Registration Data


The Impact of Open Domain Specific Architecture (ODSA)ODSA Vision of Chiplet Eco-System

PCIeSerDes

XSR, Kandou,..BoW

Parallel

AIB, HBM,…

PIPE Interface Adapter Common Abstraction

PCIe Link Layer

SA

TAC

CIX

Inter-Chiplet

Link Layer

Intra-Chiplet

Link Layer

Routing

Cache

Coherent

Non-

CoherentISF

Pac

kage

agg

rega

tion S

tack

Die

dis

aggr

ega

tion S

tack

Inter-chiplet PHY and packaging options

CX

L

Tile

Lin

k

Organic substrate

Interposers/bridges

HOST

STORAGE

NET

WO

RK

X8 PCIe G3 (64Gbps)40G Ethernet optical

40G Ethernet copper

NFP

FPGA

CPUF

F

QSFP 40G

QSFP 40G

MTP

MTP

F

F

QSFP 40G

QSFP 40G

MTP

MTPDRAM

DRAM

F

F

F

F

PCIe x4 Gen3

Chiplet

Marketplace

OCP Form Factors drive Power,I/O

Footprint, Performance

Multi-technology

ODSA stack

Reference

architectures for:

Networking, Storage,

Inferencing, Training,

Video and Image

processingBusiness, Tools

Workflow to assemble

Product


The Impact of Open Domain Specific Architecture (ODSA)ODSA Vision of Chiplet Eco-System

KEY INDUSTRY ASKS

• Readily available, integrated End-to-End SIP level Modelling

and Development Flows and Tools:

• Functional, Electrical, Mechanical, Thermal, Testability,

Manufacturing

• Common chiplet data exchange formats to share chiplet

information between 3rd parties

• Coalesce around common chiplet model formats

• Shared standards for integration of Known Good Die (KGD)


!! Coming Along Nicely !!

On-die custom protocol (could be open e.g. AXI)

Off-package protocol (e.g. PCIe)

DMACache

Coherent

PCIeSerDes

XSR, USR,..BoW

Parallel

AIB, HBM,…

PIPE Interface Adapter PHY-type specific Abstraction

PCIe Link Layer

SA

TAC

CIX

Inter-Chiplet Link Layer Intra-Chiplet

Link Layer

Routing

Cache

Coherent

Non-

CoherentISF

Pa

ck

age

aggre

ga

tio

n S

tack

Die

dis

aggre

ga

tio

n S

tack

Inter-chiplet PHY and

packaging options

CX

L

Organic substrate

Interposers/bridges

CH

I B

us

Tile

Lin

k

NO

C

PC

Ie

Off-package bus adapter New chiplet-aware stackOn-die bus adapter

Package aggregation Die disaggregation

Interface(CXS/CXL/OPENCAPI)

On-die Bus

AC

E L

ite

Bu

s

Chiplet agnostic logical design Chiplet-aware design

The Impact of Open Domain Specific Architecture (ODSA)ODSA Stack: Current View


PCIeSerDes

XSR, Kandou,..BoW

Parallel

AIB, HBM,…

PIPE Interface Adapter Common Abstraction

PCIe Link Layer

SA

TA

CC

IX

Inter-Chiplet Link

Layer

Intra-Chiplet

Link Layer

Routing

Cache

Coherent

Non-

CoherentISF

Pa

ck

age

aggre

ga

tio

n S

tack

Die

dis

aggre

ga

tio

n S

tack

Inter-chiplet PHY and packaging options

CX

L

Tile

Lin

k

Organic substrate

Interposers/bridges

Please Help! Join a Workstream!

Join Interface/Standards:(Mark Kuemerle/Ramin Farjad/

Robert Wang/David Kehlet)

DevelopPackaging + Socket, Dev Board

Provide FPGA IP

Provide ODSA chiplets

Provide PHY Technology

Join the PoC, Build fast:(Quinn Jacobson/Jawad Nasrullah/

Jayaprakash Balachandran)

Join Business, IP and workflow:(Sam Fuller/Dharmesh Jani)

Develop software Define test andassembly workflow

Provide Chiplet IP

Workstream contact information at the ODSA wiki

Define ArchitecturalInterface

The Impact of Open Domain Specific Architecture (ODSA)ODSA Workstreams


Project Objective Organizations Participating Recent Results Upcoming Milestones Needs

PHY Analysis PHY requirementsPHY analysisCross-PHY abstraction (PIPE)

Alphawave, AnalogX, Aquantia, Avera Semi, Facebook, Intel, Kandou, Netronome, zGlue,

PHY Analysis paper(published at Hot Interconnect)

PIPE abstraction

BoW Interface No technology license fee, easy to port inter-chiplet interface spec

Aquantia, Avera Semi, Netronome

BoW Interface proposal(published at Hot Interconnect)

BoW specification 0.7End September, 2019

Test chips, Chiplet library supporting interface

Prototype product that integrates existing die from multiple companies into one package

Achronix, Cisco, Netronome, NXP, Samtec, Sarcina, zGlue,Macom, Facebook

Decomposable design flow. Committed schedule End user End user participation~30% funding is open

Chiplet design exchange

Open chiplet physical description format. Ayar, Cadence, NXP, zGlue, Draft spec ZEF Exchange format draft specification

Link and Network Layer

Interface and implementations –requirements and proposals

Achronix, Avera Semi, Intel, Netronome, NXP, Xilinx

Multi-chiplet test Test requirements for an open-chipletinterface

Chiplet monitoring Monitoring infrastructure for chipletoperation

Business workflow Formalize learnings from prototype effort

Wiki: https://www.opencompute.org/wiki/Server/ODSA, meet Fridays at 8 AM Pacific Time. Please join us.

Engineers from:

Achronix, AnalogX, ASE, Avera Semi, Ayar, Cadence, Cisco, Facebook,

Ferric, Intel, Kandou, Macom, Marvel, Netronome, NXP, On Semi,

Samtec, Sarcina, Synopsys, Xilinx, zGlue

The Impact of Open Domain Specific Architecture (ODSA)Active Projects

https://www.opencompute.org/wiki/Server/ODSA


The Impact of Open Domain Specific Architecture (ODSA)ODSA Collaboration Results

• Physical Interface Definition:

⎻ PHY: Multi-company (zGlue, Netronome, Alphawave, Aquantia) analysis. First cross-PHY analysis published at Hot Interconnect

⎻ Bunch of Wires (BoW) PHY – new low-cost inter-chiplet PHY. Developed cooperatively by Aquantia, Avera Semi and Netronome with input from Xilinx, Global Foundries. Published at Hot Interconnect, IEEE Micro (Jan’20).

⎻ PIPE Abstraction – a new layer to “abstract” the interface PHY. Supported by Intel in their most recent PHY specification.

• SIP Proof-of-concept / Prototype:

⎻ Software development vehicle: Designed collaboratively by Cisco, Facebook, Macom, zGlue. Components from Achronix, NXP, Netronome. Working toward integrated into SIP. Design is highly scalable → able to add new participants easily.

• Chiplet Design Exchange (CDX) Project:

⎻ Project to facilitate the design of physical chiplet information for CAD tool integration (zGlue, ASE, Cadence, Macom)

• Independent Market survey conducted by IHS Markit

• Everything is on our wiki - https://www.opencompute.org/wiki/Server/ODSA

https://www.opencompute.org/wiki/Server/ODSA


Time to begin planning Implementation• PHY Layer:

• Open or nearly-open PHY layer

• Association to share development costs for proprietary PHY layer

• Combination of the two

• Adapter Logic

• PIPE adapter logic

• IO Coherent link layer protocol –an ODSA member company may offer

• Coherent link layer protocol – open

• Bus adapters

• Easy to use no-friction interface will be widely used

• Open source implementation is a good start

The Impact of Open Domain Specific Architecture (ODSA)Looking Ahead


Next ODSA Workshop: 2019-Dec-18 @ Facebook, Menlo Park Ca

IF YOU WANT TO GO FAST, GO ALONEIF YOU WANT TO GO FURTHER, GO TOGETHER

AFRICAN PROVERB


Open. Together.

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