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Pringles Chip Challenge By: Sidath Wanigasinghe and Kevin Kubis

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Page 1: Presentation7

Pringles Chip ChallengeBy: Sidath Wanigasinghe and Kevin Kubis

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Problem Definition

We need send the chip to our contact at Conant without the chip breaking

The package needs to be small in size

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Brainstorming ProcessPossible Ideas Wrap chip in aluminum foil and place in jello Wrap chip in aluminum foil, with a layer of

petroleum jelly inside a box Wrap chip in aluminum foil and a layer of

plaster/paper mache Make styrofoam molding of the chip and pad the

outside of the box

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First Primary Idea

Styrofoam mold

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Second Primary Idea

Paper Mache mold around the chip

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Third Primary Idea

Placing the chip inside Jello

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Client Company: Pringles Department of Procter & Gamble.

Target Consumer: PLTW students and teachers at J. B. Conant High School and William Fremd High School.

Designers: Sidath Wanigasinghe, Eric Killian, and Kevin Kubis.

Problem Statement: Ship a single Pringle’s chip from one high school to the other without it breaking using the United States Postal Service.

Design Statement: We want to be able to successfully ship a single chip using the most cost-effective method possible, yet keeping the chip in one piece.

Constraints: Use the United States Postal Service flat rate boxes.Keep the chip in one piece.The chip must be edible when it arrives.

Design Brief

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Durability Safety Size Totals

Paper Mache Mold

4 4 4 12

Chip in Jello 3 4 3 10

Styrofoam Mold

5 4 5 14

Decision Matrix

Durability: How much force the package can resist-Scale 3-5

Safety: Will the chip be safe and snug?-Scale 3-5

Size: How large is the package, ideally it should be small.-Scale 3-5

Bad Average Good3 4 5

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Package Opening

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Testing

•The pringles chip container was wrapped in a layer of bubble wrap and polyester cotton. It turned out to be a very effective padding/cushioning system.

•I dropped it three times from my room window, which is 11 feet off the ground. Each time the pringles chip came out of the box unscathed.

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Conclusion

After doing all the steps of the design process, we successfully made a sufficient package that could send the chip over to Conant