PRINTED CIRCUIT BOARDS MANUFACTURE

2 3

Technical CapabilitiesParameter Standard Option

PCB type

Double-sided PCB with HAL Pb free, Ni/Au or chem. Sn 265 × 325 mm; 265 × 430 mm 320 × 520 mm

Double-sided PCB with silkscreen 265 × 325 mm; 265 × 430 mm 320 × 520 mm

Double-sided PCB with HAL PbSn 265 × 325 mm; 265 × 430 mm 320 × 430 mm

Multilayer PCB 265 × 325 mm; 265 × 403 mm

Hybrid PCB (FR4+HF) 265 × 325 mm

Number of layers

Maximum number of layers 16

Materials

Standard materials

FR4 Tg135°C (Isola De104), FR4 Tg150°C (Isola IS 400), FR4 Tg180°C (Isola 370HR), Thermalclad 1.5 mm (35 µm, 70 µm Cu; 100 µm dielectric), Ventec 4B5 1.5 mm (70μm Cu; 50μm dielectric); 1.0 mm (35 μm a 70 μm Cu), RO4350B, RO4003, RO3003, I-tera MT-40

Rogers, Arlon, Duroid atd.

Thickness

Standard thickness for one and two-sided PCB 0.5 mm, 0.8 mm, 1.0 mm, 1.2 mm, 1.5 mm, 2.0 mm, 2.4 mm, 3.2 mm

Board thickness tolerance upto th. 1 mm ± 0,1 mmover 1 mm ± 10%

Multilayer thickness 0.5–3.2 mm

Multilayer thickness tolerance upto tl. 1 mm ± 0.1 mmover 1 mm ± 10%

Core thickness0.1 mm, 0.15 mm, 0.20 mm, 0.25 mm, 0.30 mm, 0.36 mm, 0.41 mm, 0.51 mm, 0.71 mm, 0.90 mm, 1.00 mm, 1.2 mm, 1.5 mm

Copper thickness for inner layers 18 μm, 35 μm 70 µm, 105 µm

Thickness of final Cu layer (tolerance depends on layout) 35 μm 18 μm–140 μm

Thickness of Cu layer in holes ≥ 20 μm Cu IPC-6012 D table 3-4 25 µm

Aspect Ratio

TPH Aspect Ratio ≤ 1:10

Blind via Aspect Ratio ≤ 1:1

Mechanically drilled hole sizes

Smallest finished PTH 0.10 mm

Standard tolerance ± 0.08 mm ± 0.05 mm

Holes offset (without releasing clamp) ≤ 0.05 mm

Routing

Smallest routed radius 1.00 mm 0.3 mm

Routing offset ± 0.10 mm

V-scoring

Scoring offset ± 0.2 mm

Parameter Standard OptionLayout

Smallest track width 100 μm

Minimum track spacing 100 μm

Annular ring (finished diameter) 100 μm

Internal layer clearance ≥ 250 μm ≥ 180 μm

Technology

Buried vias / Blind vias YES

Impedance control YES

Blind micro vias (0,15 mm min. drilled dia) YES

Buried microvias (through an individual internal laminate) YES

Plugged vias (non conductive paste) YES (type: V; VI; VII)

Press-fit YES

Solder mask and legend

Soldermask type and supplier Peters, Sun Chemicals

Soldermask colors green, blue, black, red, white

Minimum solder mask web 150 μm 100 μm

Minimum solder mask clearance to pad 80 μm 50 μm

Legend colors white, black, yellow

Minimum legend line 130 μm 100 μm

Surface finishes

HAL lead-free (min. PCB thickness 0,8 mm) YES

HAL PbSn (PCB thickness 0,8 mm) YES

Galvanic Ni/Au YES

Immersion Ni/Au YES

Immersion Ag YES

Chemical tin YES

Hard gold connectors YES

Test

Electrical test ATG A7, A5, A3

AOI Orbotech Fusion 20

Artwork format

Artwork format ODB++, GERBER RS-274-X, Gerber RS-274-X2 Gerber RS-274-D, DXF, Eagle

Quality

Quality certification ISO 9001:2015, ISO 14001:2015, UL94V-0, UL796

Production cycle time

Standard production cycle time – days 5 WD prototype < 0.50 m2,8 WD series > 0.50 m2

Quick turn capability days 2 WD 24 hours

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Standard Stackup4-layers PCB, material IS400 (Tg 150), 1.6 mm +/- 10 %

4-layers PCB, material IS400 (Tg 150), 1.0 mm +/- 10 %6-layers PCB, material IS400 (Tg 150), 1.0 mm +/- 10 %

4-layers PCB, material IS400 (Tg 150), 0.8 mm +/- 10 %

8-layers PCB, material IS400 (Tg 150), 1.6 mm +/- 10 %

1080

150

150

1080

10801080

1080

1080

1080

Basic materials

Material type Resin system Reinforcement type Tg [°C] T260

[min]T288 [min]

Td [°C]

CTEz [ppm/°C]

CTEz [50-260°C]

Dk [100MHz/1GHz/5GHz]

Df [100mHz/1GHz/5GHz]

Breakdown voltage [kV]

CTI [class (V)]

Moisture absorbtion [%] Typical applications

MSC TC-LAM 1.3 Insulated Metal Substrate 5052 Al 100 2 – – 5.5 (1MHz) – ≥ 5 0 (>600) 0.1 coolers, LED, power converters

VT4B5 Ceramics filled IMS 5052 Al 120 – > = 5 380 4.8 (1MHz) 0.016 (1MHz) ≥ 4 0 (>600) ultra bright LED substrate, power conversion, PDP, LED, regulator for TV, monitor

drives, rectifier, power supply (TC 4,2W/m.K)

VT4B3 Ceramics filled IMS 5052 Al 130 – > = 5 380 4.8 (1MHz) 0.016 (1MHz) ≥ 4 0 (>600) ultra bright LED substrate, power conversion, PDP, LED, regulator for TV, monitor

drives, rectifier, power supply (TC 3W/m.K)

FR4 DE 104 Laminate glass fibres 135 12 – 315 70 4.2 4.46/4.37/4.32 0.020/0.022/0.024 > 50 2 (250–399) 0.3 standard industrial applications

FR-4-86 UV BLOCK Laminate glass fibres 140 20–30 2–5 310 50–70 4.2 4.7 (1MHz) 0.020 (1MHz) 60 3 (175–249) 0.1 standard industrial applications

FR4 IS400 Laminate glass fibres 150 > 60 > 10 330 40 3.3 4.00/4.28/4.21 0.020/0.0179/0.0222 > 50 3 (175–249) 0.18 standard industrial applications with thermal performance and high reliability products

370HR Laminate glass fibres 180 60 30 340 45 2.8 4.24/4.17/3.92 0.0150/0.0161/0.0250 > 50 3 (175–249) 0.15 high performance electronics, HDI boards, servers, personal electronics, military and aerospace, layer count reduction, sequential lamination

R3003Laminate with PTFE and ceramics

glass fibres – – – 500 24 3.0 (10GHz) 0.001 (10GHz) – – > 0.1automotive radar applications, GPS antennas, cell phone systems - power amplifiers and antennas, patch antenna for wireless communications, direct broadcast satelli-tes, datalink on cable systems, remote meter readers, power backplanes

R4350B Laminate with ceramics glass fibres > 280 – – 390 46 3.38 (10GHz) 0.0021 (GHz) 31.2 – 0.06 cellular base station antennas and power amplifiers, microwave P2P links, automoti-

ve radar and sensors, RFID tag

I-tera MT40 Laminate glass fibres 200 – – 360 12 2.8 3.45 (10GHz) 0.0031 (GHz) 45 3 0.1 HF boards, hybrid boards; special through hole treatments not needed, alternative for PTFE materials

RT/Duroid 5880 PTFE laminate glass fibres > 260 – – 500 237 – 1.96 (10 GHz) 0.0009 (10GHz) – – 0.015commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave applications, military radar systems, missile guidance systems, point-to-point digital radio antennas

Basic Materials Application

on stock / on request

6-layers PCB, material IS400 (Tg 150), 1.6 mm +/- 10 %

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Single and double-sided PCBUnified panel – double-sided PCB – active areastandard 265 x 325 mmbig 265 x 430 mmmaterial: 1.0 18/18 µm Cu

1.5 18/18 35/35 70/70 µm CuNon-standardSingle-sided Thickness (mm)Cu 18 µm 0.5 0.8 1.0 1.2 1.5 2.0Cu 35 µm 0.5 0.8 1.0 1.2 1.5 2.0 Cu 70 µm 1.5 2.0 2.4Double-sided Thickness (mm)Cu 18 µm 0.5 0.8 1.0 1.2 1.5 2.0 2.4 3.2 Cu 35 µm 0.8 1.0 1.2 1.5 2.0 2.4Cu 70 µm 1.0 1.5 2.0Cu 105 µm 1.5Al material-dielectric 0,10mm / 0,05mm(VT4B5)panel – active area: 200 × 275

275 × 430material: 1.0 00/70 00/35 µm Cu

1.5 00/35 00/70 µm Cu

Multilayer PCBCore material IS400 (Tg 150°)Thickness (µm) Thickness Cu (µm)100 18–35150 18–35200 18–35250 105300 18–35–70360 35410 35510 35–70710 35–70900 351000 18–35–701200 18–351500 18–35Core material 370HR (Tg 180°)Thickness (µm) Thickness Cu (µm)200 35–70300 35710 18–35–70–1051200 35

Multilayer PCBMultilayer unified panel Active areastandard 265 × 325 mmbig 265 × 403 mmPrepreg – material IS400 (Tg 150°)type Thickness (µm) Resin106 58 74%1080 79 65%1080 [FZ99] 89 69%2113 102 57%2116 119 53%7628 201 46%Prepreg – material 370HR (Tg 180°)type Thickness (µm) Resin106 58 76%1080 76 66%2116 122 56%7628 185 50%Cu foil (µm)5 / 9 / 18 / 35 / 70

High-frequency PCB double-sided Material Thickness (µm) Cu foil (µm) Panel sizeI-tera MT 40 1500 18 265 × 430 mmRogers RO 4350B 1500 18 265 × 430 mmCore for hybrid PCB Rogers RO 4350B 508 35 265 × 325 mmRogers RO 4350B 254 35 265 × 325 mmRogers RO 4003C 200 18–35 265 × 325 mmRogers RO 3003 127 18–35 265 × 325 mmI-tera MT 40 127 18 265 × 325 mm

Basic Materials Specification Drilling, Routing, CountersinkDrill ø (mm) Routing tool ø (mm)

0.15 1.15 2.80 4.60 0.60 AL – material

0.20 1.20 2.90 4.70 0.70 1.00

0.25 1.25 3.00 4.80 0.80 1.50

0.30 1.35 3.05 4.90 0.90 2.00

0.35 1.45 3.10 5.00 1.00 3.00

0.40 1.50 3.15 5.10 1.10

0.45 1.55 3.20 5.20 1.20

0.50 1.65 3.30 5.30 1.30

0.55 1.70 3.40 5.40 1.40

0.60 1.75 3.50 5.50 1.50

0.65 1.85 3.60 5.60 1.60

0.70 1.95 3.70 5.70 1.70

0.75 2.00 3.80 5.80 1.80

0.80 2.10 3.90 5.90 1.90

0.85 2.20 4.00 6.00 2.00

0.90 2.35 4.10 6.10 2.10

0.95 2.40 4.20 6.20 2.40

1.00 2.50 4.30 6.30 2.50

1.05 2.60 4.40 6.40 3.00

1.10 2.70 4.50 6.50

Attention! After plating, drilled hole diameter is reduced by 0.1 mm due to the metal in the holes! Therefore, it‘s important to get information if holes diameter in data are finished or drilled. If there is no comment, the PCB manufacturer assumes holes dimension are finished.

finished hole drilled hole size of drilled hole

Tools of countersink

The smallest hole diameter for the IMS material is 0.80 mm.

Dimension of tools countersink

Angle

6,00 mm 90 ° (standard)

6,00 mm 120 °

6,00 mm 140 °

1. finished holes – holes after plating

2. drilled holes – final holes will be reduced about 0.10 mm

3. aspect ratio – ratio of hole depth to hole diameterThru VIA – min. size 0.15 mm. aspect ratio 1:10Blind VIA – min. size 0.15 mm. aspect ratio 1:1Buried VIA – min. size 0.15 mm, aspect ratio 1:10

výsledný otvor

1. 2. 3.

vrtaný otvor průměr vrtaného otvoru

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Construction Rules

Construction class

3 4 5 6 7 8

Minimum track width / space (mm) – space 0.40 0.30 0.20 0.15 0.125 0.10

Annular ring (mm) – annular ring 0.20 0.18 0.15 0.125 0.10 0.10

Minimum drill dia. (mm) – drill 0.20 0.20 0.20 0.20 0.20 0.15

The maximum allowed conductor trace width with the minimum conductor trace spacing, depending on the respective copper thickness (in µm)

Inner layers Outer layers

Copper thickness Min. conductor width / Min. spacing Copper thickness Min. conductor width / Min. spacing

9 100 9 100

18 100 18 100

35 100 35 150

70 150 70 200

105 200 105 300

Tolerance of PCB

routing (min. size 20 x 20 mm) ± 100 µm

routing with bridges ± 100 µm

scoring ± 200 µm

Copper thickness

METRIC INCH OUNCE

5 µm 0.00019“ 1/7 OZ.

9 µm 0.00035“ ¼ OZ.

18 µm 0.00070“ ½ OZ.

35 µm 0.00140“ 1 OZ.

70 µm 0.00280“ 2 OZ.

105 µm 0.00420“ 3 OZ.

Production dimensions

Standard production sizes – active area

PCB type Small panel Big panel

single / double-sided 265 × 325 mm 265 x 430 mm

multilayer 265 × 325 mm 265 x 403 mm

Maximum PCB Dimensions

Single and double sided

PCB without silkscreen, HAL Pb free, Ni/Au or chem. Sn 320 × 520 mm

PCB with silkscreen 320 × 520 mm

PCB with surface finish HAL PbSn 320 × 430 mm

Multilayer

PCB with silkscreen and arbitrary surface finish 265 × 403 mm

Limits of Technology

Galvanic Au – surface finish / gold fingers 265 × 325 mm

core

≥10

0 μm

prep

reg

≥100

μm

NPT

hole

burie

dvi

avi

a

drill

≥ 1

50 µ

m

pad

≥ 35

0 µm

pitc

h ≥

300

µm

pitc

h ≥

400

µm

pad

Ø 5

50 µ

min

ner l

ayer

blin

d vi

a

track

to tr

ack

≥ 10

0 µm

track

wid

th ≥

100

µm

pad

to tr

ack

≥ 10

0 µm

track

to N

PTH

≥ 1

50 µ

m

drill

to tr

ack

≥ 20

0 µm

pad

to p

ad ≥

100

µm

drill

≥ 1

50 µ

m

pad

≥ 35

0 µm

via

/ bur

ied

via

aspe

ct ra

tio =

1:1

0(d

epth

/ di

amet

ral)

blin

d vi

aas

pect

ratio

= 1

:1(d

epth

/ di

amet

ral)

stag

gere

d vi

a

drill

to c

oppe

r≥

200

µm

stac

ked

via

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Surface FinishesSurface Finishes

Process / requirement HAL lead-free ENIG Immersion

tin HAL Leaded Galvanic Au Immersion Ag

Thickness (µm) 2–40Ni 3–7

0.9–1.1 2–30Ni 3–7

0.1Au 0.05 Au 1

Max. PCB dimension (mm) 320 × 520 320 × 520 320 × 520 320 × 430 310 × 410 320 × 520

RoHS compatible; Pb free + + + − + +

Suitable for fine pitch − ++ ++ − >> 2 ++

Planarity − − ++ ++ − − ~ ++

Multiple soldering ++ + ~ ++ >> 2 +

Al bonding − − ++ − − − − >> 2 +

Au bonding − − − − − − − >> 2 −

Storage life (months) 12 12 6 12 12 6

Legend: ++ excellent + good ~ average − fair −− poor >> 2 depends on the second surface

HAL (Hot Air Solder Levelling)The PCB is immersed in a molten. Solder is applied to exposed pads. Excess solder is blown off by „air knives“ which blow hot air across the surface of the board. The thickness depends on the solder surface tension and used to be in range 2–40 μm.

Immersion silverImmersion silver has the best usage in HF applications. Because of missing Nickel it‘s ideal for high frequency signals. Silver is better conductor than Au or Cu. It is easily solderable finish - Ag thickness is only 0.1 µm so even flatless is great. It is commonly used for high construction classes of the printed boards. Storaging shouldn‘t exceed 6 months.

ENIG (Electroless Nickel Immersion Gold)From the chemical point of view, the gold is an optimal element for a top covering of PCB. Regarding the fact, gold doesn‘t oxidize and temperature and storage condi-tions have practically zero influence on a lifetime in comparison with others surface finishes. Gold is melted in the solder and the solder itself creates joint with a nickel layer.

Immersion tinImmersion tin creates really thin layer of chemical tin, common 0.9 up to 1.1 μm, which protects base copper against oxidation and provides high solderable surface. We are using acid electroless bath, which avoid to creating of whiskers and bath is in vertical application. Due to the extreme sensitivity of immersion tin, care should be taken to handle and storage conditions. In every step of processing is recommended manipulation only in gloves. Fulfillment of storage conditions, < 25°C and < 50 % RH, ensures soldering for 6 months. High-quality and trouble-free soldering is achieved by the early processing of panels with this surfacce finish.

Data Format Requirements

Data Format

PreferredGerber RS-274XGerber X2

Others

ODB++Eagle.brd soubor (show version of Eagle)Gerber-274D with table D-codesDXFHPGL

Drilling data

ExcellonSieb & Meyer 1000/3000You can use Gerber RS-274X file for drilling data. Pads like holes andfinnish size. (recommended)

Note:Attention! The size of drilling hole will be smaller in approximately 0,10 mm because there will be copper in the holes and thats why please adduce note if there are size of holes like drilling or finnished size.

The data provided by the customer to prepare the production documentation for PCB production must meet certain criteria to ensure efficient and proper processing.

Data FormatThe CAM department processes data in the InCam software and therefore prefers data primary in GERBER format. ODB and BRD formats are possible, but not desired. These formats retain the attributes from the design software, also avoiding various errors e.g. mirror layers or incorrect order inner layers.

Eagle

We recommend exporting data to the Gerber RS-274X and keeping the same name of layers that can be learned for future PCB.

CAM processor – GATEMANumber layer Layers1, 17, 18 TOP16, 17, 18 BOTTOM29 solder mask Top30 solder mask Bottom21, 25 silkscreen Top22, 26 silkscreen Bottom20 dimension / routing 44, 45 drilling46 routing31 solder paste Top32 solder paste Bottom

Single panel

the closest track to PCB edge space between pcbs

track width to definedimension

recommendedtechnological frame

Scoring 0.500 mm 0.0 mm 0.10 mm 5–10 mmRouting 0.200 mm 2.0 mm 0.10 mm 10 mm

Multipanel with routing tabs or scoring

the closest track to PCB edge space between pcbs

track width to definedimension

recommendedtechnological frame

Scoring 0.500 mm 10.0 mm 0.10 mm 5–10 mmRouting 0.200 mm 2 mm 0.10 mm 10 mm

Multipanel routing to single PCB

the closest track to PCB edge space between pcbs

track width to definedimension

recommendedtechnological frame

Routing 0.2 mm 4.5 mm 0.10 mm –

A AA AA A

ABB

D B

C

ABB

D B

C

12 13

Recommended Not recommended

Dimension of PCB

in a separate layer in the signal layers

width of line is 0.20 mm line width is 0.0 mm

layer name is *dim.ger

Signal layers

readable text in the TOP layer layers without text

one layer = one file all layers in the one file

surface GND hatched GND

without mirroring. with the same zero point strewn

min. insulation gap of 0.20 mm img. b < 0.20 mm

min. insulating gap PTH holes inside 0.25 mm img. c < 0.20 mm

min. Insulation gap NPTH holes inside 0.20 mm img. d < 0.20 mm

min. annular ring is 0.15 mm on final hole img. a < 0.10 mm

copper 0.50 mm from the edge of the board for scoring < 0.30 mm

do not make pads by line

Solder maskmin. overlap pad is 0.05 (one side) img. e 1:1 with signal layer

min.bridge is 0.10 mm (green), 0.15 mm (other colors) img. f

Drilling (size of tools)

min. hole is 0.15 mm

min.blind via is 0.15 mm

plated hole = copper on the top and bottom side copper on one side = non plated hole

Routing routing tool is 2.0 mm < 0.60 mm

Silkscreenline width is 0.135 mm < 0.135 mm

text like polygon

Soldermask Colors

Green

Red

Legend Colors

Other Technologies

White Black Yellow

Blue

Peelable mask Carbon paste Via filling

White Black

TOP

IN2

IN3

BOT

NPThole

viablindvia

burriedvia

a b

e f

dc

14 15

Quality Management

UL number E254630 – Product safety certification for USA market. It provides a proof of conformity of the product according to American and Canadian safety regulations. Gatema products are UL certified in accordance with the UL 796 (94/V0) and UL 94 standard and are harmonised with the norms IEC 60707, 60695-11-10 and -20. Tests are valid for single, double and multi-layer boards.

Supplied products are in compliance with European Parliament and European Council regulations concerning disposal of electric and electronic waste (WEEE) and restrictions in using dangerous substances in electric and electronic appliances (RoHS I and II). The products comply with the Regulation of restriction of usage of some dangerous substances in electric and electronic appliances according to RoHS 2002/95/ES and RoHS 2 2011/65/EU regulations. In other words our products do not contain prohibited substances such as lead, mercury, cadmium, hexavalent chromium and fire extinguishers (PBB, PBDE).

In correlation with the article 33, par. 1, of the European Parliament regulation and European Council (ES) no. 1907/2006 about registration, evaluation, permitting and restricting chemical substances - REACH - Gatema is obliged to inform customers on defined chemical substances that are contained in their products according to the list of substances (SVHC) published by the agency for chemical substances (ECHAA) and which are used in concentrations larger than 0,1 % hm. Our products do not contain any of the SHVC substances that are listed on this document in concentrations above 0,1 % hm.

Gatema fully identifies with the policy of reducing usage of gold, wolfram, tin and tantal originating from problematic areas of Congo and its nearest surroundings. These areas are notorious for violent exploitation of human labour in inhumane conditions used to obtain the above mentioned minerals. Profits from sales of material acquired in such a way are then used primarily for financing armed conflicts. As a result of such a negative trend and with a goal of suppressing such activities, a new law is born in the United States in 2010 called Dodd-Frank Wall Street reform and Consumer protection act, usually referred to in cases of Conflict minerals issues, or in short referred to as 3TG (Tungsten, Tin, Tantal, Gold).

ISO CERTIFICATES

We are fully aware of how important satisfaction of customers is with the quality of available products and services provided while keeping gentle and considerate method and approach towards the nature protection during production. As we respect this, we have decided to build up and maintain our integrated system of quality and environment management according to current and relevant ISO norms.

Achieving the certificates is a formal confirmation of the fact that we continuously pay attention to enhancing customer experience while simultaneously improving the efficiency of our internal processes directly influencing the quality of our products and services we provide our customers with.

The ISO 9001:2015 norm is an internationally acknowledged norm for quality management systems implemented in a company. Thanks to improving processes, the implementation of such a system leads to higher work effectiveness and productivity and to lowering overheads, bettering internal personnel relationships as well as to enhancing relationships towards a customer. We are utilizing the quality management system in an effort to meet the demands and expectations of our customers and other interested parties whilst ensuring top quality of our products and services. The ISO 14001:2015 norm is an internationally acknowledged norm for environmental management systems. We comply with the requirements of this norm as part of fulfilment of our commitment for environment protection consisting in prevention.

The list of surcharges is indicative and serves as a preliminary pricing! By combining different technologies, the total surcharge may increase. The amount of individual supplements may change. To confirm the price, it is necessary to check the specification and data by the sales department.

Surcharges

Surcharge type Surcharge

Screen print single side white 0 %Screen print double side white 2 %Screen print 1 side black,yellow, 2 %Screen print 2 side black, yellow, 4 %Solder mask green 2 sided 0 %Solder mask blue, white, red, black 5 %Solder mask multicolor 10 %Peelable mask (TOP) 5 %Peelable mask (BOT) 5 %Graphite paste (TOP) 8 %Graphite paste (BOT) 8 %End Cu outer  35 µm 5 %End Cu outer  70 µm 10 %End Cu outer  105 µm 10 %End Cu inner  70 µm 10 %End Cu inner  105 µm 20 %X-OUT up to 15 pc/panel 10 %X-OUT up to 30 pc/panel 15 %X-OUT up to 50 pc/panel 20 %PTH slots 5 %Plated edge/halfholes 10 %Chamfering 45 or 20 deg. 5 %Depth mill 10 %Countersink 5 %Pressfit 10 %Technology (class) > 150 µm 3–6 class 0 %Technology (class) > 125 µm 7 class 10 %Technology (class) > 100 µm 8 class 20 %Blind VIA TOP 10 %Buried VIAs BOT 10 %Buried VIA 1 drilling process 10 %Mill 2 mm tool 2 %Mill 1 mm tool 4 %V-CUT 2 %Special material IS 400 for 1 and 2 side 7 %Special material FR4 High Tg (HR 370) 12 %Microsection one microsection 40 EURImpedance control (+2WD) set up 30 EUR 20 %Board thickness other than (1–2mm) 10 %Hard gold (connectors) 20 %Hard gold (surface) 30 %Panelisation of different boards tooling + 20 € for every extra board 10 %Drilling density per 1 dm2 1001–1250 per 1 dm2 10 %

1251–1500 per 1 dm2 15 %1501–2000 per 1 dm2 20 %2000 or more per 1 dm2 30 %

Surcharges

16 17

Delivery Terms Notes

Below, you will find a table with offered production terms, including extra charges for express production.This is the number of days needed for the production. It is necessary to add time for transport to the delivery date.For recieved orders after 12:00 we count the first day of production next following work-day.

For express (next day) production it is necessary to deliver the order and data as follows: �4-layer PCB with immersion gold (ENIG) – before 10:00 a.m. �4-layer PCB with HAL and 2-layer PCB with immersion gold – before 12:00 a.m.

Table of production terms with express surcharge (in %) Limitation

Number of working days 1 2 3 4 5 6 7 8

1 up to 8-layer PCBSAMPLE 200* 100 80 30 0 upto 50 dm²

Series 300* 150 100 80 60 40 25 0 above 50 dm²

10-layer and moreSAMPLE – – 200 150 100 60 30 0 upto 50 dm²

Series – – – 200 150 100 60 0 above 50 dm²

Stencil

laser – 100 40 20 0

etched – 100 40 20 0

drilled 100 75 40 20 0

Legend:* on request – cannot be manufactured in required term0 standard production term

Terms and surcharges in case of HDI boards, boards of non-standard material and orders exceeding 1,5 m2 must be checked andconfirmed by our sales department. Terms for orders manufactured in co-operation must always be confirmed by our sales person.

Gatema a.s.Průmyslová 2503/2CZ 680 01 BoskoviceID: 60749954VAT-ID: 60749954+420 516 456 322pcb@gatema.czwww.gatema.com

August 2019, © 2019 G

atema a.s.