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Prismo D-BlueTM, a New MOCVD Platform f G N b d HB LED P d tifor GaN-based HB LED Production
Yingbin Liu, Shiping Guo & Zhiyou Du
Advanced Micro-Fabrication Equipment Inc.d a ced c o ab cat o qu p e t c
© 2009 AMEC. The information contained herein is subject to change without notice.
AMEC Productive Innovation
Our MissionTo advance technology, increase productivity and reduce costs for manufacturers
Copyright © 2013 AMEC, All Rights Reserved 2
of semiconductors and emerging energy-related devices like LEDs
Fast Facts
Profile−Founded in 2004, AMEC provides advanced micro-fabrication equipment and associated
process expertise to global semiconductor manufacturers and leading companies in adjacent l t d t lik lid t t li htienergy-related sectors like solid-state lighting.
−Privately held & supported by global investors, including Walden International, Lightspeed Venture Partners, Goldman Sachs, Shanghai Venture Capital Company Ltd. and others.
Markets Served−Semiconductor front end [advanced dielectric etcher for critical and non-critical applications]−Semiconductor back end & beyond [TSV etcher for wafer-level packaging, MEMS & 3DIC
applications].−Solid-state lighting [MOCVD tool for HB-LED manufacturing].
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Fast Facts cont/d…..
Technology & Products−Powered by advanced technology, AMEC’s products feature a common platform design
optimized for ultra-high productivity and low CoO. The portfolio includes: Primo D-RIETM, Primooptimized for ultra high productivity and low CoO. The portfolio includes: Primo D RIE , Primo AD-RIETM and the Primo SSC AD-RIETM dielectric etch systems; the Primo TSV200TM etcher, and the new Prismo D-BlueTM MOCVD platform.
Leadership Pedigree−100+ IC process technology experts, including 40 from Silicon Valley.
IP Portfolio−Robust patent position
I t ll d BInstalled Base−209 Etch stations in production at 17 tier-one fab sites across every region in Asia. − Includes tier-one foundries and IDMs, as well as packaging companies.
Global PresenceGlobal Presence−R&D HQ in Shanghai. Business operations, sales and support offices in Japan, Korea and
Singapore. New manufacturing hub in Taiwan. Soon to establish US presence. Headcount
−350+ employees worldwide.
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A Foundation in Advanced Etch ProductsC iti l Di l t i t hi f 2X d b dCritical Dielectric etching for 2Xnm and beyondDecoupled dual frequency (60MHz & optional 2 or 13MHz) RF CCP technology, and very high pumping conductanceSingle Station Chamber cluster technology
Primo SSC AD-RIE
Primo DSC AD-RIE
Single Station Chamber cluster technology(up to 6 process chambers)
Dielectric etching for 2Xnm and beyondDecoupled dual frequency (60MHz & switchable 2 or 13MHz)Decoupled dual frequency (60MHz & switchable 2 or 13MHz) RF CCP technologyDual-station Chamber cluster technology(up to 6 process stations)
Primo D-RIE
( p p )
Dielectric etching for advanced Logic and MemoryDecoupled dual frequency (60MHz & 2MHz) RF CCP technologytechnologyDual-station chamber cluster technology(up to 6 process stations)
Th h Sili Vi t hiPrimo TSV200EPrimo TSV300E
Through-Silicon-Via etchingICP technologyDual-station chamber cluster technology(up to 6 process stations)
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(up to 6 process stations)300mm/200mm wafer processing available
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Shanghai Hub Expands for Growth
AMEC Manufacturing StandardsISO 14001 / 9001 CertifiedOSHAS 18001 Certified
R&DBuilding 1
HQ & Operation Building 2
66
R&D Building 1 of 6,500m² Class 100 R&D Lab in operation since 2005 HQ and Operation Building 2 for high-volume manufacturing $1B capacity50,000m² adjacent lot reserved for future expansion
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j pAdditional Manufacturing of 218m2 Class 1000 area in Taiwan since 2011
The Prismo D-BlueTM MOCVD Platform
A New Class of MOCVD Tool For Today’s LED Fab ~ Enabling High-Quality HB-LED Devices
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High productivity & high yields with low cost-of-ownership benefits
Prismo D-Blue MOCVD Platform
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Prismo D-BlueTM : Superior Process Flexibility
1 chamber
direct add on
2 chambers n-GaN p-GaN
Process Flexibility
n-GaN
p
MQW3 chambers
Can process in sequential mode or parallel full-stack runs
4 chambers
p
Flexible system configuration with independent chamber control
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Capable of running processes in parallel or sequentially
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Prismo D-BlueTM : Excellent Footprint Efficiency
AMEC MOCVD Reactor
tprin
t 30%
Foot Single Reactor
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30% footprint advantage over competitive single-reactor tools
Prismo D-BlueTM : Superb Process Performance
Uniformity Within-wafer 1.2nm, wafer-to-wafer 1.3nm were achieved for MQW wavelength uniformitywavelength uniformity
− Multiple zone gas injection system− Specially designed gas distribution injector− Multiple zone heating system
RepeatabilityWith no recipe adjustments during marathon run 0 6nm (STDEV) run-to-With no recipe adjustments during marathon run, 0.6nm (STDEV) run torun repeatability was achieved
− No particle or deposition on showerheadN l i i t b t− No cleaning or maintenance between runs
− Stable temperature control system Run-to-run repeatability demonstrated during customer demos and at the p y gbeta site
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Prismo D-BlueTM : High Reliability and Serviceability
Reliability
Zero-failure during marathon test, enabled by:− AMEC’s industrial-proven software− Maturity of system automation and control
Maturity of transfer module− Maturity of transfer module− SEMI standards implemented on Design, Integration and Testing
Serviceability
Easy serviceability enabled by:− A specially designed MO vacuum line for bubbler change− Fully automated and programmable reactor open/close − Sophisticated architecture that matches stringent SEMI-equivalent
standards
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Uniformity of 49X2’’: 2mm Edge Exclusion
Average=5.98μmWafer-to-wafer uniformity: 0.4%Within-wafer uniformity: 1.0%
Average=454nmWafer-to-wafer uniformity: 1.3nmWithin-wafer uniformity: 1.2nm
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y y
13
Uniformity of 54X2’’: 2mm Edge Exclusion
Average=5.69μmWafer-to-wafer uniformity: 0.66%Within-wafer uniformity: 1.0%
Average=460.7nmWafer-to-wafer uniformity: 1.2nmWithin-wafer uniformity: 1.2nm
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Uniformity of 14X4’’: 2mm Edge Exclusion
14X4’’ Demo MQW structure: 14X4’’ Demo MQW structure:Average wavelength: 460.8nmWafer-to wafer uniformity: 1.1nmWithin wafer uniformity: 1.4nm (max: 1 6nm min: 1 0nm)
Average thickness: 5.4umWafer-to wafer uniformity : 1.7%Within wafer uniformity : 1.5% (max: 1 8% min: 0 9%)
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1.6nm, min: 1.0nm) (max: 1.8%, min: 0.9%)
Marathon Run Sequence
PM Coating run with susceptor A
1st run with susceptor B
2nd run with susceptor A
3rd run with susceptor B......15th run with
susceptor B16th run with susceptor A susceptor Bsusceptor Bsusceptor A
18th run with susceptor A
PM Coating run with susceptor B
19th run with susceptor B
......22st run with susceptor Ap
1. Identical recipe without any changes during Marathon run2. A/B two susceptors alternative for marathon run
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3. A/B two susceptors baked in another MOCVD chamber
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Marathon Run : Wavelength of MQW
10
11
461
463Peak wavelength trend
8
9
10
457
459
461
n(nm
)
e(nm
) 16 Runs 5 Runs
5
6
7
451
453
455
er d
evia
tion
ngth
ave
rag
3
4
5
447
449
451
afer
to w
afe
ak w
avel
en
PM PM
1
2
443
445
Wa
Pea
T t l 21 R (f ll l d) ith i d l th ithi / 2
04411 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 18 19 20 21 22
Run #
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Total 21 Runs (full load) with same recipe and wavelength range within +/- 2nm
Marathon Run: Thickness of GaN
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Total 21 Runs (full load) with same recipe and U% of GaN Thickness << 2%
MOCVD Reactor Match Data
Alpha Reactor A
Alpha Reactor B
Beta Reactor 1 Spec Range
Thickness(average um) 3.505 3.342 3.187 3.177 - 3.512
Wavelength( ) 464.0 462.3 464.3 458.5 - 468.5(average nm) 464.0 462.3 464.3 458.5 468.5
Both layer thickness and PL wavelength from 3 reactors are within ±5% MRS spec.
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Beta Tool Single Layer Performance
Item General spec AMEC result @ customer
Undoped GaN
Growth rate > 2 μm/hr 2.37μm/h
Within-wafer uniformity <2% 0.6%1
Undoped GaN(无掺杂氮化镓)
Within wafer uniformity 2% 0.6%
W-W uniformity <2% 0.3%
Mobility @RT >350cm2/Vs 541 cm2/Vs
18 3 18 3
2 Si doped GaN(N型氮化镓)
Doping level >2X1018 cm-3 2.7X1018 cm-3
Mobility @RT >250 cm2/Vs 292 cm2/Vs
Mg doped GaNdoping level >1X1017 cm-3 2.8X1017 cm-3
3 Mg doped GaN(P型氮化镓)
p g
Mobility >5 cm2/vs 7 cm2/vs
4 AlGaN(铝镓氮)
Al composition 15%-20% 17.6% (铝镓氮) Alloy uniformity Max-min <2% 1%
5InGaN /GaN MQW
(铟镓氮/氮化镓 多层
Wavelength range 450-460 nm 459.2 nm
Within-wafer uniformity <2 nm 1.09 nm5 (铟镓氮/氮化镓 多层
量子阱) W-to-W uniformity <2 nm 1.23 nm
Run-to–run uniformity <2 nm 0.44 nm (3 runs)
6 u-GaN crystalline (002) FWHM <300 arcsec 223 arcsec
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6 y(无掺杂氮化镓晶格) (102) FWHM <400 arcsec 258 arcsec
Beta Tool LED Production Performance
8X20 chip Vf(V)@ 20 mA
VZ(V)@-10uA
IR(uA) @ -10V
IV(mW)@ 20 mA WLD(nm) ESD(%)
>4000V
AMEC tool 3.01 49.9 0.03 25.3 458.1 100
Other production tools 3.05 49.9 0.02 25.0 455.6 >95
Production LED 2 8 3 3 >40 <0 1 >24 447 5 467 5 >90specs 2.8-3.3 >40 <0.1 >24 447.5-467.5 >90
10X30 chip Vf(V)@ 60 mA
VZ(V)@-10uA
IR(uA) @ -8V
IV(mW)@ 60 mA WLD(nm) ESD(%)
>4000V@ 60 mA @ 10uA @ 8V @ 60 mA >4000V
AMEC tool 3.08 57.03 0.01 61.65 456.6 100
Other 3 12 52 2 0 01 66 4 455 1 95Other production tools 3.12 52.2 0.01 66.4 455.1 >95
Production LED specs 2.95-3.3 >20 <0.2 >60 450-460 >90
• Qualified for two LED products by a beta customer. Overall performance matched their existing production reactors – the same ones used by most LED manufacturers.
• Achieved brightness equivalent of ~130 lm/W for a “middle power” white-color packaged LED
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g q p p g- based on the customer’s measurement standard.
Summary
AMEC is a leading provider of advanced technology to manufacturers of semiconductors and LEDs
In Q1 2013, the company introduced its MOCVD (Prismo D-BlueTM) platformIn Q1 2013, the company introduced its MOCVD (Prismo D Blue ) platform
The first Beta system has already passed Beta evaluation and is running Epi production at a customer LED production line in China
With innovations that distinguish the tool from other MOCVD contenders, the Prismo D-BlueTM tool has demonstrated the superb process performance required for a mature production-worthy MOCVD tool. It consistently shows excellent p y ysystem uniformity and breakthrough repeatability, as well as high reliability
The Prismo D-BlueTM is simply a better class of MOCVD tool offering:E ti l f t i fl ibilitExceptional manufacturing flexibilitySuperb production efficiency & process performanceEasy serviceabilityCompact footprint
AMEC strives to provide customers worldwide with products that are optimized for technology innovation & performance as well as unmatched service & support
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technology innovation & performance, as well as unmatched service & support
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Thank You!Thank You!
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