processability and thermal characterization of atard epoxy rtm resin
DESCRIPTION
PROCESSABILITY AND THERMAL CHARACTERIZATION OF ATARD EPOXY RTM RESIN. Peter J. Joyce U.S. Naval Academy Robert F. Boswell and Neil A. Graf Naval Air System Command. Objective. Thermally characterize the selected SI- ZG-5A epoxy resin, formulated by A.T.A.R.D. Laboratories - PowerPoint PPT PresentationTRANSCRIPT
PROCESSABILITY AND THERMAL PROCESSABILITY AND THERMAL CHARACTERIZATION OFCHARACTERIZATION OF
ATARD EPOXY RTM RESIN ATARD EPOXY RTM RESIN
Peter J. Joyce
U.S. Naval Academy
Robert F. Boswell and Neil A. Graf
Naval Air System Command
Sept. 12, 2001 ASC 16 Technical Conference
ObjectiveObjective
Thermally characterize the selected SI- ZG-5A epoxy resin, formulated by A.T.A.R.D. Laboratories resin characterization cure modeling
SI-ZG-5A selected by AMIPC partner Boeing Anhydride curing epoxy resin system Properties similar to leading epoxy systems Low viscosity Wide process flexibility
Sept. 12, 2001 ASC 16 Technical Conference
Manufacturer’s Cure CycleManufacturer’s Cure Cycle
Time (hrs)
Tem
pera
ture
(C
) 176°C
65°C
4 hrs
6 hrs
0.54°C/min.
Sept. 12, 2001 ASC 16 Technical Conference
Baseline Thermal AnalysisBaseline Thermal Analysis
Differential scanning calorimetry (DSC),TA Instrument Model 2920
Thermogravimetric analysis (TGA), Rheometric dynamic analysis (RDA)
Rheometrics Scientific RDA II analyzer 25-mm aluminum parallel plates with a gap setting of 0.8 mm
Oscillated at 1.0 Hz frequency while a constant 10% strain was applied
Sept. 12, 2001 ASC 16 Technical Conference
Differential Scanning CalorimetryDifferential Scanning Calorimetry
0
50
100
150
200
250
300
0 200 400 600 800 1000 1200 1400
Time (min)
Tem
pera
ture
, (C
)
-1.4
-1.2
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
Hea
t Fl
ow (
mW
)
Heat Flow
Temperature
(Manufacturer’s rec. cure cycle 50:50 mix ratio)
Tg = 207°CHR = 350J/g
Sept. 12, 2001 ASC 16 Technical Conference
Rheometric Dynamic AnaylsisRheometric Dynamic Anaylsis
0.01
0.1
1
10
100
1000
10000
100000
1000000
10000000
0 50 100 150 200 250 300 350
Time (min)
G' (
dyn/
cm2)
G
" (d
yn/c
m2)
20
40
60
80
100
120
140
160
180
Tem
p (C
)
G'G"
Eta* PTemp
Min Viscosity: 2.4 cP, 79 min
Gel Pt.227 min
Sept. 12, 2001 ASC 16 Technical Conference
Thermogravimetric AnalysisThermogravimetric Analysis
Measured an 8-10 % weight loss.Reduced to ~6% with degassing.Due to the volatility of the catalyst.
Part A - < 4% weight loss (25-180°C @ 3°C/min.)Part B - ~ 98% weight loss
Sept. 12, 2001 ASC 16 Technical Conference
Cure Cycle ModificationCure Cycle Modification
208206205201
170175
180185
190195
200205
210215
220
0 1 2 3 4 5 6 7 8
Hold time (hrs)
Gla
ss tr
ansi
tion
tem
per
ature
(dC)
Eliminating initial 65°C hold exhibited negligible effect.Reducing 176°C from 6 hrs to 3 hrs, little effect.
Sept. 12, 2001 ASC 16 Technical Conference
Varying Mix RatioVarying Mix Ratio
00
228
211
207206203
224
180
185
190
195
200
205
210
215
220
225
230
30 40 50 60 70
Fraction component A
Gla
ss tr
ansi
tion
tem
pera
ture
(dC)
Sept. 12, 2001 ASC 16 Technical Conference
Cure Kinetics AnalysisCure Kinetics Analysis
Variable heating rate method (Duswait, 1974)Heating rates:
0.2C/min.0.5C/min.1.0C/min.5.0C/min.10.0C/min.20.0C/min.
Sept. 12, 2001 ASC 16 Technical Conference
Dynamic DSCDynamic DSC(5(5°C/min.)°C/min.)
Sept. 12, 2001 ASC 16 Technical Conference
Summary Dynamic DSC testingSummary Dynamic DSC testingHEATING RATE
(º C/min)PEAK HEIGHT
(º C)ENTHALPY
(J/g)
0.2 86.8 272
0.5 100.1 298
1.0 113.5 316
2.0 127 373
5.0 143 393
10.0 158 362
20.0 175 288
Sept. 12, 2001 ASC 16 Technical Conference
Cure Kinetics AnalysisCure Kinetics Analysis
To calculate the activation energy,
A plot of the log-heating rate versus the reciprocal of the absolute temperature at a constant conversion will have a slope of 0.457 E/R.
The constant conversion point was taken at the peak exotherm.
d
d KE R
log
( / ). /
1
0 457
Sept. 12, 2001 ASC 16 Technical Conference
Arrhenius PlotArrhenius Plot
y = -3.7115x + 9.6146
R2 = 0.9996
-1
-0.5
0
0.5
1
1.5
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9
1000/[Temperature (K)]
Log
[Hea
ting
Rat
e (C
/min
.)]
E = 64 kJ/mol
Sept. 12, 2001 ASC 16 Technical Conference
Cure Kinetics AnalysisCure Kinetics Analysis
The Arrhenius frequency factor can be calculated from the equation:
A = 7.36 min-1
AE
RT
E
RT
2
Sept. 12, 2001 ASC 16 Technical Conference
Cure Kinetics AnalysisCure Kinetics Analysis
Assuming a first order reaction, the rate constant, k, may be calculated from the equation
ln lnk AE
RT
Sept. 12, 2001 ASC 16 Technical Conference
Cure Kinetics AnalysisCure Kinetics Analysis
0
0.5
1
1.5
2
2.5
0 50 100 150 200 250
Temperature (ºC)
Rat
e C
onst
ant
(1/m
in)
Sept. 12, 2001 ASC 16 Technical Conference
Cure Kinetics AnalysisCure Kinetics AnalysisBy utilizing the rate constant, percent
conversions were calculated.
0
10
20
30
40
50
60
70
80
90
100
0 0.5 1 1.5 2 2.5 3 3.5 4
Time (hr)
Per
cen
t C
onve
rsio
n (
%)
65ºC
100ºC
175ºC
Sept. 12, 2001 ASC 16 Technical Conference
ResultsResults DSC
Tg = 207°C, HR = 325-375 J/g (3501-6/474 J/g) RDA
min= 2.3 cP after 79 min. @ 65°CGel point ~ 4 hrs
Cure cycle modifications Initial hold @ 65°C can be eliminated 2nd hold @ 176°C can be reduced from 6 hrs to 3 hrs
Cure kinetics analysisActivation Energy, E = 64 kJ/molLog frequency factor, A = 7.36 min-1
Sept. 12, 2001 ASC 16 Technical Conference
Cure ModellingCure Modelling
Lee, Loos, and Springer (1982)Calculate total heat of reaction,
Calculate the amount of heat, H, released up to time, t
dtdt
dQH
ft
R
0
dtdt
dQH
t
0
Sept. 12, 2001 ASC 16 Technical Conference
Cure ModellingCure Modelling
The degree of cure, , is defined as
Calculate the rate of degree of cure, d/dt
RH
H
RHdtdQ
dt
d
Sept. 12, 2001 ASC 16 Technical Conference
Cure ModellingCure ModellingCurve fit
54
44
33
24
1 KKKKKdt
d
70 75 80 90 100 115 120
K1 -3.63E-04 -6.17E-04 -3.82E-04 -1.92E-03 -4.27E-03 -5.66E-03 -1.55E-03K2 6.85E-04 1.14E-03 3.79E-04 3.88E-03 8.49E-03 1.08E-02 -8.78E-04K3 -6.16E-04 -9.46E-04 -4.38E-04 -3.24E-03 -6.86E-03 -9.39E-03 -2.97E-04K4 2.67E-04 3.68E-04 3.59E-04 1.20E-03 2.42E-03 3.89E-03 2.21E-03K5 2.75E-05 5.94E-05 8.54E-05 7.63E-05 2.16E-04 3.78E-04 4.55E-04R2 9.97E-01 9.93E-01 9.84E-01 9.96E-01 9.97E-01 9.91E-01 9.75E-01
Sept. 12, 2001 ASC 16 Technical Conference
Cure ModellingCure Modelling
5 4, 3, 2, 1, ,1
)ln()ln(
5 4, 3, 2, 1, ,exp
iTR
EAK
iRT
EAK
iii
iii
Ongoing. . .
Sept. 12, 2001 ASC 16 Technical Conference
AcknowledgementsAcknowledgements
ONR, Dr. Ignacio PerezMr. Roland CochranMr. Stan NgDr. Reza Malek-Madani