product end-of-life disassembly instructionsh22235.€¦ · 2. remove gfx and cpu cooler (see...

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PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions Product Category: Personal Computers

Marketing Name / Model [List multiple models if applicable.]

OMEN X by HP Desktop PC 900

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes

Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm

5

Batteries All types including standard alkaline and lithium coin or button style batteries

1

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

7

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)

HDD Fan 170g and PCI Fan 170g and PSU fan and CPU LC FAN 290g and GFX LC FAN 170g

6

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing refractory ceramic fibers

http://standards.corp.hp.com/elclass/AMF87701.htm

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Components, parts and materials containing radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Screw driver Hex 2.5

Micro shear

Screw driver PH2

Screw driver PH1

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove Top cover. (see Figure 1-2) 2. Remove Gfx and CPU cooler (see Figure 3-6 ) 3. Remove MB (see Figure 7-9) 4. Remove the DIMM,CPU and Battery (see Figure 10-13) 5. Remove the MB tray (see Figure 14) 6. Remove the Function Board (see Figure 15-16) 7. Remove the HDD (see Figure 17-18) 8. Remove the ODD (see Figure 19-21) 9. Remove the Voodoo grille light board (see Figure 22-23) 10. Remove the Front lighting board (see Figure 24-26) 11. Remove the Rear Bezel (see Figure 27-30) 12. Remove the Antenna cable (see Figure 31) 13. Remove the HDD FAN (see Figure 32) 14. Remove the FRONT_TOP_FILTER (see Figure 33) 15. Remove the PCI FAN (see Figure 34) 16. Remove the ODD SATA cable (see Figure 35-41) 17. Remove the HDD SATA cable (see Figure 42-43) 18. Remove the EXTEND POWER CORD (see Figure 44) 19. Remove the PSU from chassis (see Figure 45-48) 20. Remove the Electrolytic Capacitors from PSU board HP P/N: 854201-003 (DPS-1300AB-5 A) (see Figure 49-60) 21. Remove the Electrolytic Capacitors from PSU board HP P/N: 854200-004 (Niagara 600W) (see Figure 61-73) 22. Remove the CPU LC FAN (see Figure 74-75) 23. Remove the GFX LC FAN (see Figure 76)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).


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Figure1 Press the button on rear bezel

Figure2 Remove the top cover

Figure3 Release 12 screws

Figure4 Release GXF and GFX bracket screw and cable then remove GFX card LC

Figure5 Unplug the cable of fan and pump

Figure6 Release the CPU Pump screw to remove CPU LC


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Figure7 Unplug all cable conn from PCA.

Figure8 Release 8 pcs screws from PCA

Figure9 Remove PCA from chassis

Figure10 Push the hooks on both sides and then pick up the memory

Figure11 Rotate the handle and open it up

Figure12 Remove the CPU from board


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Figure13 Remove the battery from the PCA

Figure14 Release 2 pcs screws from MB tray and take off MB tray

Figure15 Unplug all cable conn from function board PCA

Figure16 Release 5 pcs screws from function board PCA

Figure17 Open HDD Door and PUSH HDD locker to left

Figure18 Pull up HDD cage and release 4 screws to remove HDD


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Figure19 Use pin to open ODD Tray

Figure20 Release ODD latch and hold

Figure21 Press ODD unlock bar to PUSH off ODD

Figure22 Open Voodoo grill cover

Figure23 Disconnect cable

Figure24 Remove Front bezel


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Figure25 Remove Tape and unplug cable connect

Figure26 release 14 screws to remove 3 front light board

Figure27 Release 4 screws from rear cover

Figure28 Remove Rear PSU Grille

Figure29 Release 1 screws from AC_IN connect

Figure30 Remove Rear cover


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Figure31 Release 4 screws from 2 Antenna cable and remove it

Figure32 Release 4 screws from HDD FAN and remove it

Figure33 Remove FRONT_TOP_FILTER

Figure34 Release 4 screws from PCI FAN and remove it

Figure35 Release 1 screw and take off cable holder

Figure36 Release 2 screws from rear side


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Figure37 Release 2 screw at front side

Figure38 Arrange all the cables those through the POWER PARTITION

Figure39 Release 2 screw at the bottom of power partition

Figure 40 Rotate and take off power partition

Figure41 Release 2 screw from power partition and remove ODD cable

Figure42 Release 4 screw to remove 2 HDD SATA BKT


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Figure43 Release 4 screw and remove 2 HDD SATA cable

Figure44 Release 1 screws and unplug connect to remove extend power cord

Figure45 Release 3 screws

Figure46 Pull out PSU

Figure47 Release 4 screw and remove psu bkt

Fig 48


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Fig 49 Remove screws for top

Figure50 Remove screws for back

Figure51 Remove screw for profile

Figure52 Disconnect fan connector

Figure53 Cut the cable tie



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Figure55 Remove FG screw

Figure56 Remove MAIN PCB screw

Figure57 Remove AC inlet screw

Figure58 Remove component for MAIN PCB (C801A/C801B/C801C diameter or height are more than 25mm)

Figure59 Remove fan screw


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Figure62 Remove screw for bottom

Figure63 Remove screw for top

Figure64 Remove cover

Figure65 Remove FG screw

Figure66 Remove PCB2 screw


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Figure67 Remove plastic cover for PCB2

Figure68 Remove L/N wire & jump wire use solder iron

Figure69 Disconnect fan connector

Figure70 Remove PCB1 screw

Figure71 Remove plastic cover for PCB1

Figure72 Remove AC inlet & Fan screw


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Figure73 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it

Figure74 Release 4 screw from CPU LC Fan Guard

Figure75 Release 4 screw between Fan and radiator then remove CPU LC FAN

Figure76 Release 4 screw between Fan and radiator then remove GFX LC FAN


product end-of-life disassembly instructionsh22235.€¦ · 2. remove gfx and cpu cooler (see...

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