product end-of-life disassembly instructions - hewlett packardh22235. · hp z640 workstation...
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Product End-of-Life Disassembly Instructions Product Category: Workstations
Marketing Name / Model [List multiple models if applicable.] HP Z640 Workstation Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
With a surface greater than 10 sqcm Yes
5
Batteries All types including standard alkaline and lithium coin or button style batteriesYes
1
Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm
Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height
Denali 925w PSU 2
External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardantsweighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent chambers, and service stations.
EL-MF877-00 Page 1 Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers
Components, parts and materials containing radioactive substances
2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if
applicable) Screwdriver T-15 Micro shear 170II Solder iron Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove/disengage any security devices that prohibit opening the workstation. 2. Disconnect the power cord from the electrical outlet and then from the workstation. 3. Disconnect all peripheral device cables from the workstation. 4. Remove the access panel.(see Figure 1 below) 5. Disconnect SATA/FUI cables from the MB.(see Figure 2-4 below) 6. Disconnect other power cables from the MB.(see Figure 5-8 below) 7. RemoveODD SATA cables from the chassis.(see Figure 9-10 below) 8. Remove HDD/ODD/GFX from chassis.(see Figure 11-16 below) 9. Remove the heatsink from MB.(see Figure17-18 below) 10. Separate the fan from CPU heatsink.(see Figure 19-20 below) 11. Remove the CPU/MEM from MB(see Figure 21-24 below) 12. Remove MB from chassis(see Figure 25-26 below) 13. Remove front and rear system fan from chassis(see Figure 27-32 below) 14. Remove PSU from chassis(see Figure 33-34 below) 15. Remove FIO cables and FIO assembly from chassis(see Figure 35-40 below) 16. Remove PSU cables from chassis(see Figure 41-46 below) 17. Remove front and rear handle(see Figure 47-50 below) 18. Remove top panel and front upper vent.(see Figure 51-52 below) 19. Remove PSU cover.(see Figure 53-56 below) 20. Disconnect all the cables and remove the Electrolytic Capacitors.(see Figure 57-59 below) 21. Dispose of all removed components according to regulatory requirements.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2 Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure1 Remove the Access Panel
Figure2 Disconnect HDD SATA cables from MB
Figure3Disconnect ODD SATA cable from MB
Figure4 Disconnect the FIO cables(USB3.0/FUI/Audio cable) from MB
Figure5 Disconnect MB power cable from MB
Figure6 Disconnect MEM and CPU power cables from MB
EL-MF877-00 Page 3 Template Revision B
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Figure7 Disconnect front system fan cable from MB
Figure8 Disconnect rear system fan cable from MB
Figure9 Disconnect SATA cable from ODD
Figure10 Remove the ODD SATA cables from clips
Figure11 Press the HDD’s latch on HDD cage
Figure12 Remove the HDD from cage
EL-MF877-00 Page 4 Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure13 Lift the ODD’s latch on ODD cage
Figure14 Remove the ODD/Blank from cage
Figure15 Loose the PCIE retainer
Figure16 Remove the graphic card from MB
Figure17 Disconnect CPU Heatsink power cable from MB
Figure18 Loose the 4 screws and remove Heat sink
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Figur19 Loose the 4 Heatsink screws
Figure20 Separate the fan from heatsink and fan guard
Figure21 Rotate the ILM handle and open it up
Figure22 Remove the CPU from the board
Figure23 Remove the Memory from the board
Figure24 Press the latch(red mark) and Remove the battery from MB
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Figure25 Rotate the MB clip
Figure26 Remove MB from chassis
Figure27 Remove graphic card power cable from front system fan housing
Figure28 Press the front system fan latch on fan guard and remove it
Figure29 Press the 3 latch to Separate the fan from front fan housing
Figure30 Separate the front system fan from fan guard
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Figure31 Loose the screw of rear system fan and remove it
Figure32 Press the 4 latch Separate the rear system fan from fan guard
Figure33 Disconnect the power cables(M1,G3,R3) from PSU
Figure34 Rotate the PSU handle and lift the PSU
Figure35 Remove the speaker cable from clip
Figure36 Disconnect the speaker cable
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Figure37 Disconnect the FIO cable from FIO PCA
Figure38 Cut the FIO cable tie
Figure39 Remove the front panel
Figure40 Loose the screw and remove the FIO assembly
Figure41 Loose the screw of chassis bottom left and right trim foot
Figure42 Remove the left and right foot from chassis
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Figure43 Loose the 2 screws of side panel
Figure44 Slide and remove the side panel
Figure45 Cut 4 cable tie on the chassis bottom
Figure46 Remove the cables
Figure47 Loose the screw of chassis front handle
Figure48 Remove the front handle
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Figure49 Loose the screw of chassis rear handle
Figure50 Remove the rear handle
Figure51 Push and remove the top Panel
Figure52 Remove front upper vents
Figure53 Remove 5 screws from PSU side top
Figure54 Remove 4 screws from PSU side bottom
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Figure55 Remove 3 screws from PSU side left
Figure56 Pull the side-cover out, then open covers away
Figure57 Cut 2 ties from inner wire (blue mark) then remove 4 screws from main-PCB then removes the main-PCB and house-keeping-PCB
Figure58 Remove 2 connectors (blue mark) then remove 4screws (red mark) then remove the EMI-PCB
Figure59 Remove the big capacitors (C3,C4height>2.5cm) from EMI-PCB using solder iron
EL-MF877-00 Page 12 Template Revision B
PSG instructions for this template are available at EL-MF877-01