bullProvides a means to align a pattern on a chip to the pattern on a mask and then to expose this pattern

UV-light

Mask quartz + Cr pattern

Photoresist

substrate

MASK ALIGNER INTRODUCTION

Pump service corridor

Lamp power supply

The aligner

Lamp house

microscope

Microscope Translation-control Mask holderAlignment stage

Manometer boxMirror house Sample

holder

Mercury lampbull g - line 436 nm bull h-line 405 nm

bull i - line 365 nm

S-1800 series are g-line photoresit

Mercury lamp

bull Life time 600 hbullNitrogen cooling is very importantbullLamp must be cool before restarting hellip or you risk damaging the lamp Therefore wait ~30 minutes after previous use But it is better to leave the lamp on for several hours than turn off and on and off and on hellipbullThe first exposure after turning on the lamp should be done with no wafer

1048766If the bulb explodes it will fill the lithography area with toxic mercury vapor This can cause severe neurological damage EVACUATE THE LAB FOR AT LEAST 30 MIN The mask aligner will also be seriously damaged1048766

Mercury lamp power supply

bull It can be operated at constant power or constant Intensity

bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm

In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the intensity selected

bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEWBefore NOW

Turn onoff the whole machine and Nitrogen in service corridor

ONLY H2 and air switches on the aligner controller unit

No vacuum no possibility of different exposures modes

Vacuum is available Possibility to choose

Height adjustment in contact NEVER height adjustment in contact

The Lever separation was not used

The lever separation must be used

Exposures in constant power mode

Exposures in constant intensity mode

Air pressure and nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel limits

X 3mm

Y 3mm

3

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

Pump service corridor

Lamp power supply

The aligner

Lamp house

microscope

Microscope Translation-control Mask holderAlignment stage

Manometer boxMirror house Sample

holder

Mercury lampbull g - line 436 nm bull h-line 405 nm

bull i - line 365 nm

S-1800 series are g-line photoresit

Mercury lamp

bull Life time 600 hbullNitrogen cooling is very importantbullLamp must be cool before restarting hellip or you risk damaging the lamp Therefore wait ~30 minutes after previous use But it is better to leave the lamp on for several hours than turn off and on and off and on hellipbullThe first exposure after turning on the lamp should be done with no wafer

1048766If the bulb explodes it will fill the lithography area with toxic mercury vapor This can cause severe neurological damage EVACUATE THE LAB FOR AT LEAST 30 MIN The mask aligner will also be seriously damaged1048766

Mercury lamp power supply

bull It can be operated at constant power or constant Intensity

bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm

In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the intensity selected

bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEWBefore NOW

Turn onoff the whole machine and Nitrogen in service corridor

ONLY H2 and air switches on the aligner controller unit

No vacuum no possibility of different exposures modes

Vacuum is available Possibility to choose

Height adjustment in contact NEVER height adjustment in contact

The Lever separation was not used

The lever separation must be used

Exposures in constant power mode

Exposures in constant intensity mode

Air pressure and nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel limits

X 3mm

Y 3mm

3

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

Lamp house

microscope

Microscope Translation-control Mask holderAlignment stage

Manometer boxMirror house Sample

holder

Mercury lampbull g - line 436 nm bull h-line 405 nm

bull i - line 365 nm

S-1800 series are g-line photoresit

Mercury lamp

bull Life time 600 hbullNitrogen cooling is very importantbullLamp must be cool before restarting hellip or you risk damaging the lamp Therefore wait ~30 minutes after previous use But it is better to leave the lamp on for several hours than turn off and on and off and on hellipbullThe first exposure after turning on the lamp should be done with no wafer

1048766If the bulb explodes it will fill the lithography area with toxic mercury vapor This can cause severe neurological damage EVACUATE THE LAB FOR AT LEAST 30 MIN The mask aligner will also be seriously damaged1048766

Mercury lamp power supply

bull It can be operated at constant power or constant Intensity

bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm

In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the intensity selected

bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEWBefore NOW

Turn onoff the whole machine and Nitrogen in service corridor

ONLY H2 and air switches on the aligner controller unit

No vacuum no possibility of different exposures modes

Vacuum is available Possibility to choose

Height adjustment in contact NEVER height adjustment in contact

The Lever separation was not used

The lever separation must be used

Exposures in constant power mode

Exposures in constant intensity mode

Air pressure and nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel limits

X 3mm

Y 3mm

3

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

Mercury lampbull g - line 436 nm bull h-line 405 nm

bull i - line 365 nm

S-1800 series are g-line photoresit

Mercury lamp

bull Life time 600 hbullNitrogen cooling is very importantbullLamp must be cool before restarting hellip or you risk damaging the lamp Therefore wait ~30 minutes after previous use But it is better to leave the lamp on for several hours than turn off and on and off and on hellipbullThe first exposure after turning on the lamp should be done with no wafer

1048766If the bulb explodes it will fill the lithography area with toxic mercury vapor This can cause severe neurological damage EVACUATE THE LAB FOR AT LEAST 30 MIN The mask aligner will also be seriously damaged1048766

Mercury lamp power supply

bull It can be operated at constant power or constant Intensity

bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm

In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the intensity selected

bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEWBefore NOW

Turn onoff the whole machine and Nitrogen in service corridor

ONLY H2 and air switches on the aligner controller unit

No vacuum no possibility of different exposures modes

Vacuum is available Possibility to choose

Height adjustment in contact NEVER height adjustment in contact

The Lever separation was not used

The lever separation must be used

Exposures in constant power mode

Exposures in constant intensity mode

Air pressure and nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel limits

X 3mm

Y 3mm

3

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

Mercury lamp

bull Life time 600 hbullNitrogen cooling is very importantbullLamp must be cool before restarting hellip or you risk damaging the lamp Therefore wait ~30 minutes after previous use But it is better to leave the lamp on for several hours than turn off and on and off and on hellipbullThe first exposure after turning on the lamp should be done with no wafer

1048766If the bulb explodes it will fill the lithography area with toxic mercury vapor This can cause severe neurological damage EVACUATE THE LAB FOR AT LEAST 30 MIN The mask aligner will also be seriously damaged1048766

Mercury lamp power supply

bull It can be operated at constant power or constant Intensity

bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm

In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the intensity selected

bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEWBefore NOW

Turn onoff the whole machine and Nitrogen in service corridor

ONLY H2 and air switches on the aligner controller unit

No vacuum no possibility of different exposures modes

Vacuum is available Possibility to choose

Height adjustment in contact NEVER height adjustment in contact

The Lever separation was not used

The lever separation must be used

Exposures in constant power mode

Exposures in constant intensity mode

Air pressure and nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel limits

X 3mm

Y 3mm

3

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

Mercury lamp power supply

bull It can be operated at constant power or constant Intensity

bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm

In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the intensity selected

bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEWBefore NOW

Turn onoff the whole machine and Nitrogen in service corridor

ONLY H2 and air switches on the aligner controller unit

No vacuum no possibility of different exposures modes

Vacuum is available Possibility to choose

Height adjustment in contact NEVER height adjustment in contact

The Lever separation was not used

The lever separation must be used

Exposures in constant power mode

Exposures in constant intensity mode

Air pressure and nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel limits

X 3mm

Y 3mm

3

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEWBefore NOW

Turn onoff the whole machine and Nitrogen in service corridor

ONLY H2 and air switches on the aligner controller unit

No vacuum no possibility of different exposures modes

Vacuum is available Possibility to choose

Height adjustment in contact NEVER height adjustment in contact

The Lever separation was not used

The lever separation must be used

Exposures in constant power mode

Exposures in constant intensity mode

Air pressure and nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel limits

X 3mm

Y 3mm

3

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

WHATrsquoS NEWBefore NOW

Turn onoff the whole machine and Nitrogen in service corridor

ONLY H2 and air switches on the aligner controller unit

No vacuum no possibility of different exposures modes

Vacuum is available Possibility to choose

Height adjustment in contact NEVER height adjustment in contact

The Lever separation was not used

The lever separation must be used

Exposures in constant power mode

Exposures in constant intensity mode

Air pressure and nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel limits

X 3mm

Y 3mm

3

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

Air pressure and nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel limits

X 3mm

Y 3mm

3

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

ONLY MOVE THE THIN ENDS

Travel limits

X 3mm

Y 3mm

3

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

CONTACT ARM

CONTACT-SEPARATION LEVER

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

Exposure modes Mode How does it work Resolution comments

Vacuum Contact (HP)

vacuum is drawn between the mask and the wafer prior exposure

~08 microm pitch RISK OF BREAKING THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask

~15 microm pitch RISK OF BREAKING THE MASK

Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment

Depends on separation

SAFE It has to be adjusted manually

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13

1 Fiber optic light pipe

2 Single field splitfield shutter

3 Rotation for focus

4 Objective separation for splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise

Left objective=left shutter half way right shutter fully anticlockwise

Right objective=left shutter fully clockwise right shutter half way

MICROSCOPE

• Slide 1
• Slide 2
• Slide 3
• Mercury lamp
• Slide 5
• Mercury lamp power supply
• Slide 7
• WHATrsquoS NEW
• Slide 9
• Slide 10
• Slide 11
• Exposure modes
• Slide 13