qualcomm qet5100m envelope tracker module · market analysis 18 o market positionning o market...

©2019 by System Plus Consulting | SP19425 – Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Qualcomm QET5100M Envelope Tracker Module

SEMCO’s Embedded Die Packaging Technology in the Qualcomm QET5100M Envelope Tracker ModuleSP19425 – PACKAGING report by Stéphane ELISABETH

Laboratory Analysis by Peggy GALLOISNovember 2019 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Qualcomm

o Envelope tracking technology

o Motorola Moto Mod 5G teardown

Market Analysis 18

o Market Positionning

o Market Trends and Drivers

o Embedded die technology and Roadmap

o Embedded Die Market Forecast

Physical Analysis 25

o Summary of the Physical Analysis 26

o Embedded Die Package Assembly 28

Package Views & Dimensions:

X-Ray, Opening

Package Cross-Section

o IC Die 59

Die View & Dimensions

Delayering & main Blocs

Die Process

Die Cross-Section

Die Process Characteristic

Physical Comparison: TDK’s vs. SEMCO Embedded Die technology 76

Manufacturing Process 80

o IC Die Front-End Process & Fabrication Unit

o Embedded Packaging Process & Fabrication Unit

Cost Analysis 95

o Summary of the cost analysis 96

o Yields Explanation & Hypotheses 97

o IC die 100

Die Front-End Cost

Die Wafer & Die Cost

o Embedded Die Packging 103

Embedded Die Panel Cost

Embedded Die Panel Cost per process steps

Embedded Die Panel Cost per module

Final Assembly Cost

Module Cost

Selling price 114

Feedbacks 118

SystemPlus Consulting services 120




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical & Cost Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Qualcomm QET5100M.

The embedded die market has recently become attractive, as it’s set to build rapidly on total revenue estimated at $21 million in 2018. Yole Développement estimates that this revenue will nearly quadruple by 2021, with a compound annual growth rate (CAGR) for consumer applications around 28%. Several players are known to produce such packaging in the industry such as TDK, Intel, AT&S, Schweizer, …. New players are trying to enter this market by developing new technologies. Samsung Electro-Mechanics Co. (SEMCO) has started a new wave by introducing its recent six-layer embedded PCB substrate technology into the Qualcomm QET5100M envelope tracker for handset applications.

The module embeds a Qualcomm Envelope Tracking Integrated Circuit (IC) into a SEMCO 6-layer PCB substrate and features an integrated DC-DC converter assembled by Amkor. This technology extends the package size beyond the IC surface area. This allows additional passive components to be mounted on top of the laminated module.

SEMCO’s embedded die technology is a Chip-First Face-Down process realized at panel scale level. Unlike AT&S’s or TDK’s embedded die process, SEMCO uses a 2-layer PCB core with a cavity and a 4-layer built-up structure to embed the die. With this new approach and Amkor’s partnership, SEMCO has shown that PCB makers takes a larger role by adding considerable value.

The report includes an in-depth physical analysis of the envelope tracking module, and a complete description of the manufacturing process flow. Also, we compare SEMCO’s embedded die technology with TDK’s Semiconductor Embedded in SUBstrate (SESUB) to understand the technology choices made by each company.




Overview / Introduction

Company Profile & Supply Chain o Qualcommo Envelope tracking technologyo Motorola Moto Mod 5G

Teardown

Market Analysis

Physical Analysis



Cost Analysis


Related Reports

About System Plus

Motorola Moto Mod 5G Teardown

Motorola Moto Mod 5G Overview©2019 by System Plus Consulting

Dimensionso Height: 160.0 mmo Width: 72.9 mmo Thickness: 7.1 mm

Weighto 127 g





Company Profile & Supply Chain o Qualcommo Envelope tracking technologyo Motorola Moto Mod 5G

Teardown

Market Analysis

Physical Analysis



Cost Analysis


Related Reports

About System Plus

Motorola Moto Mod 5G Teardown

• XX

Motorola Moto Mod 5G Overview©2019 by System Plus Consulting

Qualcomm QET5100M

Envelope Tracker






Market Analysis

Physical Analysis o Synthesiso Package Assembly

o Views & Dimensionso Cross-Sectiono Synthesis

o IC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section



Cost Analysis


Related Reports

About System Plus

Summary of the Physical Analysis

Molding

Envelope Tracker IC

Qualcomm QET5100M Assembly©2019 by System Plus Consulting

Envelope Tracker IC Assembly:

o Embedded Die assembly

o WLCSP followed by XX in Cavity

o Electrical Connections and support: X-Layer PCB Substrate

Envelope tracker IC Die:

o Process:

XX XX nm XP XM

o Placement : XX.






Market Analysis






Cost Analysis


Related Reports

About System Plus

Package View & Dimensions

Package Top View©2019 by System Plus Consulting

XX

mm

XX mm

• Package: XX

• Dimensions: XX x XX x XX mm

• Pitch: XX mmXX mm

• Marking: QET5100M004HC848MGS

Package Side View©2019 by System Plus Consulting

Package Bottom View©2019 by System Plus Consulting






Market Analysis






Cost Analysis


Related Reports

About System Plus

Package Overview

Package Top View©2019 by System Plus Consulting

Package Top View – X-Ray ©2019 by System Plus Consulting

• The die is packaged using embedded diepackaging.

• Die area : XX mm²(XX x XX mm)

• The die area represent XX% of the chip area.

• XX

Die






Market Analysis






Cost Analysis


Related Reports

About System Plus

3D X-Ray Analysis – Cavity Layer #4

Package Top View – Opening©2019 by System Plus Consulting

• XX.

• The pads are SMD (Solder Mask Defined) pad type.

• Min pads Pitch: XX mm

• The pads seems to be circular.

• Pads Dimensions: Ø XX mm

• Pad to Cavity edge: XX mm

Ø: XX mm

XX mm

XX mm

XX mm

Package Top View – X-Ray – Fourth Layer ©2019 by System Plus Consulting






Market Analysis






Cost Analysis


Related Reports

About System Plus


Cross-Section Plan©2019 by System Plus Consulting

• Dielectrics Layers Thickness:• Solder Mask : XX µm• Layer #1 : XX µm

• The PCB substrate is made with XX layer and XX layer.






Market Analysis






Cost Analysis


Related Reports

About System Plus



• Copper Line Thickness:• Line #X : XX µm• Line #X : XX µm

• Micro-Via Dimension:• #X Diameter: XX µm• #X Depth: XX µm






Market Analysis






Cost Analysis


Related Reports

About System Plus



• The PCB substrate has cavity to embed the die.






Market Analysis






Cost Analysis


Related Reports

About System Plus

Package Cross-Section – Copper reveal






Market Analysis






Cost Analysis


Related Reports

About System Plus

Die Overview & Dimensions

• Die Area: XX mm²(XX x XX mm)

• Nb of PGDW per XX-inch wafer: XX

• Pad number: XX

XX

mm

XX mm

Die Overview – Optical View ©2019 by System Plus Consulting






Market Analysis






Cost Analysis


Related Reports

About System Plus

Die Cross-Section – RDLs






Market Analysis

Physical Analysis

Physical & Cost Comparisono SESUB vs. SEMCO’s ED


Cost Analysis


Related Reports

About System Plus

Package Comparison – TDK SESUB vs. SEMCO Embedded Die






Market Analysis

Physical Analysis


Manufacturing Process Flowo IC Die Front-End Processo IC Fabrication Unito SEMCO ED Process Flowo Assembly Unit & Process

Cost Analysis


Related Reports

About System Plus

Packaging Process Flow (1/4)






Market Analysis

Physical Analysis


Manufacturing Process Flowo IC Die Front-End Processo IC Fabrication Unito SEMCO ED Process Flowo Assembly Unit & Process

Cost Analysis


Related Reports

About System Plus

Packaging Process Flow






Market Analysis

Physical Analysis



Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso IC Wafer & Die Costo Embedded Die Package Costo Assembly Costo Component Cost


Related Reports

About System Plus

Embedded Die Panel Cost






Market Analysis

Physical Analysis



Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso IC Wafer & Die Costo Embedded Die Package Costo Assembly Costo Component Cost


Related Reports

About System Plus

Final Assembly Cost






Market Analysis

Physical Analysis



Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Complete Module Price

Related Reports

About System Plus

Estimated Manufacturer price






Market Analysis

Physical Analysis



Cost Analysis


Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

ADVANCED PACKAGING• Status of Advanced Substrates 2019• Status of the Advanced Packaging Industry 2019• Advanced RF System-in-Package for Cellphones 2019

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

PACKAGING• TDK SESUB Bluetooth Module• ASE/Deca M-Series Fan-Out Process• Advanced packaging technology in the Apple Watch

Series 4’s System-in-Package



https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/


https://www.systemplus.fr/reverse-costing-reports/asedeca-m-series-fan-out-process/


https://www.i-micronews.com/products/status-of-advanced-substrates-2019/

https://www.i-micronews.com/products/status-of-the-advanced-packaging-industry-2019/

https://www.i-micronews.com/products/advanced-rf-sip-for-cellphones-2019/

https://www.systemplus.fr/reverse-costing-reports/tdk-sesub-bluetooth-module/










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SEMCO'S EMBEDDED DIE IN QUALCOMM QET5100M



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qualcomm qet5100m envelope tracker module · market analysis 18 o market positionning o market...

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