ramesh job paper
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Job Paper Ramesh Raju Navan
Electrical Engineering Department IIT Bombay
Professional Objective
Research and development in the area of fabrication, characterization and Simulation of advance MOS transistors and process integration technology. Interested in early exploration of advanced technologies and systems.
Areas of Interest
CMOS/VLSI Technology, Organic/Polymer Electronics, Design and Simulation of Devices, Novel material characterization and Device Structures.
Title of PhD Thesis: ASIC Design using Organic Thin Film Transistor
Introduction
The field of low-cost organic electronics is a relatively new topic of research in the
domain of semiconductor technology. Activities started in the 1980s by demonstrating organic
field effect transistors (OFETs) which make use of special organic compounds for the
semiconducting channel instead of crystalline silicon. These OFETs cannot compete with
silicon-based transistors regarding switching speed or packing density but provide prospects of
considerably reducing fabrication costs, large-area manufacturing (i.e. direct application of
electronic structures onto large substrates), or implementing mechanically flexible integrated
circuits. These advantages generate applications of OFETs where fabrication costs or flexibility
are more important than e.g. switching speed of the transistors. One example is the
implementation of extremely low-cost radio-frequency identification (RFID) tags. Fabrication
costs below one Cent would e.g. boost application of RFID devices as price tags in supermarkets.
Owing to their complex fabrication, silicon-based RFID tags cannot reach this price target.
Currently, low-cost organic electronics is in the early stages of development and
optimization of devices and processes. Various materials and fabrication processes are
continuously tested and optimized. Circuit simulation is an important part in this process as it
provides insight into the performance potential of existing or hypothetical OFET generations in
OFET based circuits. In the course of circuit simulation, devices are modeled and the electrical
performance of typical application circuits is analyzed. Employing circuit simulation in the
process of optimizing devices consists of numerous iterations of modeling devices, simulating
application circuits, and extracting performance figures from simulation results. Therefore,
efficient methods of modeling OFET devices and analyzing OFET-based circuits by use of
circuit simulation are needed in order to automate the analysis process as much as possible.
Scientific Contribution of PhD Thesis Work
Progress in the simulation-based circuit analysis of organic transistors could be made in
this work. Second, a novel methodology for extracting device parameters has been developed.
The transistor characteristics drain-current (ID) vs. drain-source voltage (VDS) are inspected. A
novel device simulation technique was developed for organic TFTs. ISE-TCAD was used by
replacing device parameters for Silicon with that of Pentacene. An acceptable match was
observed in simulated and measured characteristics of the devices by tuning the device
parameters. The results obtained from device simulation procedure were thus used to generate
the LUTs for the organic devices which were used for circuit simulation.
Patterned gate p-type OTFTs with HfOx as high-k gate dielectric materials were
fabricated for circuit applications, which showed low operating voltages (-4V). All p-type
organic inverters composed of enhancement mode load and driver were fabricated which operate
at a low operating (0 to 4V) and bias voltages (VDD = 4V). Another approach for simulation was
to extract spice parameters of OTFTs with the PSO algorithm. This was done for both Pentacene
and P3HT based devices.
Figure OTFT structure in Bottom Gate Bottom contact configuration with patterned gate (Al)
Figure Output (IDS-VDS), transfer IDS-VGS (triangles) and IDS
1/2 -VGS (solid line) characteristics of a typical fabricated OTFT with HfOx as gate dielectric
(W/L=15200µm /20µm)
Figure Measured vs. Simulated IDS− VDS characteristics for OTFTs fabricated (Data scaled to width W=1μm)
Figure DC transfer characteristics and Transient response of the simulated all p-type enhancement mode organic inverter for VDD= 5.0 V. Inset shows the schematic of Inverter.
Several methods of surface improvement were tried and compared with each other. A
novel procedure for OTS deposition was theorized and verified experimentally to be correct.
OTS deposition on silicon dioxide was found to give the highest mobilities among all the
methods tried of 0.26 cm2/Vs.
We also demonstrated the fabrication of ZnO/P3HT nanocomposite transistors. A
comparative picture was presented between these composite based and pristine P3HT transistors.
Our results indicate a tenfold mobility enhancement in the composite transistors compared to
pristine ones, without any significant deterioration in threshold voltage or on-off current ratio.
However, there is still scope for further improvement in terms of better dispersion of ZnO
nanostructures and the possibility of obtaining higher on-off current ratios.
Figure Cross sectional view of the P3HT/ZnO nanocomposite based bottom contact organic filed effect transistor. Transfer (IDS-VGS) characteristics comparison for different concentration of ZnO nanorods in P3HT/ZnO nanocomposite where VGS is varied from 10 to -40V & VDS = -40V
The use of metallated porphyrin SAM for the tuning of the threshold voltage of pentacene
based OTFTs has been studied. The Id-Vg curves showed that porphyrin SAMs having different
central metal atoms are responsible for the change in the threshold voltage values of the
corresponding OTFTs. The formation of SAM was confirmed by the UV-Vis spectroscopy.
We have also demonstrated a low voltage organic field effect transistor with a
photopatternable nanoparticle (BT) SU-8 composite with a dielectric constant in the range of 14.
The material is a good candidate for all-polymer FETs as its implementation does not require
expensive deposition techniques, the process is large area compatible and the gate dielectric
easily photopatternable. The BT concentration in SU-8 is optimized from the dielectric constant
and the leakage current point of view. We have demonstrated excellent OFET performance at a
BT wt% of 0.88 which gives a dielectric constant of around 14. At this BT concentration, the
SU-8 composite is still photopatternable. With higher BT concentration, the surface roughness
increases which increases the leakage current and degrades the mobility. This work therefore
establishes a promising photopatternable high-k dielectric process for fabrication of OFETs and
circuits through a solution processing method.
Figure Capacitance verses frequency plots for different concentration of BT nanoparticles
blended into the SU-8 dielectric films and Dependence of resistivity and dielectric constant on BT wt% and Cross-section of Organic Inverter
A new compact OTFT-based ADC using only p-type transistors, fabricated in the same
process, is designed and simulated using LUT-based approach in SEQUEL circuit simulator, the
LUT data is obtained from fabricated pentacene-based OTFTs using sputtered SiO2 as a gate
dielectric and source/drain contacts made of gold. The LUT simulation approach is validated at
the circuit level using the measurements taken on fabricated OTFT-based inverter. The ADC
circuit is designed using proposed 4-transistor architecture to control the switching voltage of a
differential inverter. Though the designed ADC is aimed for high voltage levels of around tenths
of volts its operation was limited to 5V due to increased leakage of Pentacene-based organic
transistors at high voltages.
Figure Block diagram of the ADC circuit synthesized using the voltage divider
and the differential inverter circuit
Figure (a) Differential inverter circuit using four P-type transistors. (b) LUT-based simulation results of the switching characteristic of the inverter for higher values of VIN, the output voltage tends to the
threshold voltage of M2 i.e. around 2.3V.
Figure (a) Cascade circuit of a differential and simple inverter for each single bit of ADC (b) Simulation results of the ADC
Research and Development Expertise
Working in Microelectronics and Nanotechnology lab of Department of Electrical Engineering, at Indian Institute of Technology, Bombay, INDIA and also did internship at Nanyang Technological University, Singapore (25thFeb to 30th May, 2008), I have exposure in semiconductor processing, characterization & simulation. Specifically, I have worked on the following aspects as part of my Ph.D. Lithography Oxidation, Depositions, Metallization All chemical etching, cleaning and safety procedures for the Device fabrication Electrical characterization Device Physics based analysis of fabricated MOS devices and Organic Field Effect
Transistors (OFETs). Process & Device simulation using ISE-TCAD Circuit simulation using simulators like SPICE, SEQUEL.