rapid bluetooth® deployment on intel® atom™clarinoxblue for iot rapid bluetooth® deployment on...

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ClarinoxBlue for IoT Rapid Bluetooth® Deployment on Intel® Atom™ The Internet of Things is quickly entering every aspect of our lives. Two essential components are key to delivering on the promise of IoT: robust, affordable and ever-more powerful hardware, powered by market-leading processors such as the Intel® Atom™ processors and the ability to quickly bring up a stable and feature-rich connectivity solutions. Implementing Bluetooth into a design is a complex but necessary step in bringing IoT solutions to market. The complexity and cost can be avoided by using ClarinoxBlue pre-built, pre-integrated, pre- qualified soſtware stacks. ClarinoxBlue Bluetooth soſtware enables a quick, economical, and robust path to market. clarinox.com/clarinoxblue

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Page 1: Rapid Bluetooth® Deployment on Intel® Atom™ClarinoxBlue for IoT Rapid Bluetooth® Deployment on Intel® Atom™ The Internet of Things is quickly entering every aspect of our lives

Cla

rinoxBlue

for Io

T

Rapid Bluetooth® Deployment on Intel® Atom™

The Internet of Things is quickly entering every aspect of our lives.

Two essential components are key to delivering on the promise of IoT: robust, affordable and ever-more powerful hardware, powered by market-leading processors such as the Intel® Atom™ processors and the ability to quickly bring up a stable and feature-rich connectivity solutions. Implementing Bluetooth into a design is a complex but necessary step in bringing IoT solutions to market.

The complexity and cost can be avoided by using ClarinoxBlue pre-built, pre-integrated, pre-qualified software stacks. ClarinoxBlue Bluetooth software enables a quick, economical, and robust path to market.

clarinox.com/clarinoxblue

Page 2: Rapid Bluetooth® Deployment on Intel® Atom™ClarinoxBlue for IoT Rapid Bluetooth® Deployment on Intel® Atom™ The Internet of Things is quickly entering every aspect of our lives

ClarinoxBlue Protocol Stack Features•Dual-mode or single-mode Bluetooth/BLE stack options available•Multiple simultaneous profiles•Multiple simultaneous roles•Separates applications from profiles•Supports blocking and non-blocking API calls•Enables single and multi-threaded applications•Integrates command/response based APIs•Suitable for applications in consumer, industrial, transport and health & medical devices

Versions 2.0, 2.1+EDR, 3.0, 4.0, 4.1 and 4.2

Classic Profiles A2DP, AVRCP, BIP, BPP, CTN, DI, DUN,

FTP, GAP, GAVDP, HCRP, HDP, HFP, HID, HSP, MAP, MPS, OPP, PAN, PBAP, SDAP, SPP,

Classic Protocols AVCTP, AVDTP, BNEP, HCI, L2CAP,

MCAP, OBEX, RFCOMM, SDP

Low Energy Profiles/Services AIOP, AIOS, ANP, ANS, BAS, BCS,

BMS, BLP, BLS, CGMP, CGMS, CPP, CPS, CSCP, CSCS, CTS, DIS, ESP, ESS, FMP, GAP, GLP, GLS, HIDS, HOGP, HPS, HRP, HRS ,HTP, HTS, IAS, IPS, IPSP, LLS, LNP, LNS, NDCS, OTP, OTS, PASP, PASS, PLXP, PLXS, PXP, RSCP, RSCS, RTUS, ScPP, SCPS, TIP, TDS, TPS, UDS, WSP, WSS, Custom

Low Energy Protocols ATT, GATT, SM

Audio Support (SCO) Yes

HCI Transport SDIO, UART 3-Wire, UART-BCSP,

UART-H4, USB

Application areas Smart Home, Automotive IVI, Consumer, Health & Medical, Industrial, Internet of Things (IoT), Transportation

Supported Intel® platforms Intel® Atom™

Bluetooth

HOST CONTROLLER INTERFACE

LINK MANAGER / LINK CONTROLLER

APPLICATION ADAPTATION LAYER

APPLICATIONS

BASEBAND

BLUETOOTH RADIO

GAPSDAPPANA2DP,

AVRCP,VDP

HSP, HFP,SAP, DUN

FTP, SYNC, OPP, PBAP,SPP, MAP

HDP

SDP AUDIOAVDTPAVCTP

BNEP

L2CAP

OBEX

MCAP

SPP GroupMedical Group PAN Group Audio Video Group

RFCOMM

Telephony Group