request for proposal (rfp ) for fabrication, assembly
TRANSCRIPT
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 1 of 74
Request for Proposal (RFP)for
Fabrication, Assembly, Integration, Testingand Supply of Electro-Optic Sensors (EOS)
Type-S
TECHNICALANNEXURE
LABORATORY FOR ELECTRO-OPTICS SYSTEMS (LEOS)INDIAN SPACE RESEARCH ORGANISATION (ISRO) PEENYA,
BANGALORE – 560058
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 2 of 74
Fabrication, Assembly, Integration, Testing and Supply of Electro-OpticSensors (EOS) Type-S
CONTENTS
1. Introduction2. Scope of work3. Specification for Fabrication, Assembly, Integration, Testing and Supply of Electro-
Optic Sensors (EOS) Type-S3.1 Introduction3.2 Work specification3.3 Terms and Conditions4. Statement of work for fabrication, assembly, integration, testing and supply of
Electro-Optic Sensors (EOS) Type-S4.1 General4.2 Scope of work4.3 Phase – I Training Activities And Documents4.4 Phase-II Production Activities for Fabrication, Assembly, Integration, Testing and
supply of Electro-Optic Sensors (EOS) Type-S.4.5 Inspection and Auditing4.6 Non conformance management4.7 Photographic Records4.8 Component Management4.9 Test Systems4.10 Schedule, Planning and Reporting/Quality Control4.11 Cost Breakup for Realization of EOS Type-S packages4.12 Intellectual Property Rights4.13 Roles and Responsibilities4.14 List of deliverables by vendor4.15 Safety precautions to be followed by vendor4.16 Delivery Schedules4.17 Payment Terms
Appendix A: Activities for Fabrication, assembly, integration, testing and Supply of Electro-Optic Sensors (EOS) Type-S.
Appendix B: Typical list of consumables used for Electro-Optic Sensors (EOS) Type-S.Appendix C: Typical list of Equipment for card/package fabrication and Assembly.Appendix D: Typical list of Test equipment used for Electro-Optic Sensors (EOS) Type-S.
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 3 of 74
LIST OF ABBREVIATIONS
LEOS-Laboratory for Electro Optic SystemsISRO-Indian Space Research OrganizationRFP-Request for ProposalEOS- Electro Optic SensorFIM-Free Issue of MaterialsTVAC-Thermal VacuumQC-Quality ControlPCB-Printed Circuit BoardESD-Electro Static DischargeEEE-Electrical Electronic and Electro MechanicalF/T-Functional testsLD-Liquidated DemurrageSMD-Surface Mount DevicesRCP-Radiation Shielding, Coating and PottingPTH-Plated through holeQA-Quality AssuranceNCR-Non Conformance ReviewPWB-Printed Wired Board
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 4 of 74
FABRICATION, ASSEMBLY, INTEGRATION, TESTING AND SUPPLYOF ELECTRO-OPTIC SENSORS (EOS) TYPE-S
1.0 Introduction
Laboratory for Electro Optic Systems (LEOS), an ISO 9001:2015 certified unit of ISRO is the
lead Centre in Indian Space Research Organization (ISRO) responsible for realization of all
Sensors for various ISRO Satellite programs. ISRO is embarking on a mission to double the
number of satellites to be put in orbit in the next five years and realizing 10 to 12 spacecrafts per
year in future. This calls for a large number of Sensors to be fabricated, tested and made ready for
integration with Satellite. To meet this requirement, it is planned to involve industries, wherever
required, to realize Sensor subsystems. LEOS wishes to forge long term working relationship with
vendors for realizing this hardware.
In order to increase the throughput of sensors for future satellite programs, the sensors are
standardized for production. LEOS has established facilities at its premises for production
of various types of Sensors. This hardware is to be produced with Industry Partners who are
familiar and have experience in Space Electronic Hardware realization. The vendors should
follow applicable quality and reliability standards, production practices, testing procedures and
documentation methods etc towards manufacturing of aerospace packages.
In pursuit of the above, it is decided to fabricate 45 (Forty-Five) Numbers of Electro-Optic
Sensors (EOS) Type-S through the vendors. The scope of work to be carried out by the vendor
is described in detail in the subsequent chapters as indicated below.
Section-2 gives the Scope of the work involved. Section-3 gives a detailed description of the
work, the terms and conditions, manpower requirements, the schedule, the reference standards
to be followed, documents involved and the responsibilities of LEOS and Vendor. Section 4
gives a detailed list of the documentation and the sub activities of the work involved, the
review requirements, Quality requirements, payment terms and the delivery schedules
involved.
The Appendix A,B,C,D indicate the fabrication and testing requirements for the Electro-Optic
Sensor (EOS) Type-S and also a detailed list of materials required.
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 5 of 74
2.0 Scope of work
Electro-Optic Sensors (EOS) Type-S consists of Flexi Rigid Electronic PCBs which are
integrated in a mechanical housing with a custom built optical assembly, tested and delivered
as a package after all tests. The activity involves procurement of PCB’s, Mechanical housings
and consumables from ISRO approved sources by the Vendor. EEE components, optical
modules, PCB spool files and Mechanical drawings will be supplied by LEOS as inputs. The
PCB’s are wired and tested. These tested PCB’s and optical modules are integrated with the
mechanical housings and performance evaluation at various stages and assembly is carried out
as per the procedure. Electro-Optic Sensors (EOS) Type-S 45(Forty-Five) Numbers are to be
produced after completion of these tests within a time duration of 48(Forty-Eight) months. All
the test equipment and required facilities for completion of the tests will be provided by LEOS.
The details involved in the production of the Electro-Optic Sensors (EOS) Type-S are
discussed in Section 3.
The production of Electro-Optic Sensors (EOS) Type-S through vendor is planned in two
phases. In Phase-I, the vendor’s personnel will be trained for fabrication, assembly, inspection
and testing of the first Electro-Optic Sensors (EOS) Type-S by LEOS engineers. In Phase-II, the
vendor will produce the hardware independently in LEOS. The ultimate aim is to make
the vendor well versed with the fabrication practices, Quality control procedures and their
implementation to ensure the reliability of the product.
3.0 Work Specification for Fabrication, Assembly, Integration, Testing andSupply of Electro-Optic Sensors (EOS) Type-S
3.1 Introduction
The Electro-Optic Sensors (EOS) Type-S RFP is planned to be produced by external vendors
by giving suitable training. The detailed work specification is discussed in this document. The
various responsibilities of Vendor and LEOS to execute the work is also provided.
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3.2 Work Specification
The activities involved in realizing the Electro-Optic Sensors (EOS) Type-S are as enlistedbelow.
Fabrication of precision mechanical parts. Fabrication of Printed Circuit Boards. Procurement of consumables for package fabrication.
Printed Circuit Board (PCB) Wiring.
Testing of wired PCBs.
Integration of PCB’s, optical modules and mechanical housings.
Sub-assembly level Performance tests.
Final Assembly.
Testing of Assembled Package in front of Simulators.
Environmental tests.
Final Ambient Performance Tests.
Reports Preparation for Certification.
Representative activities, flow charts, component lists for Electro-Optic Sensors (EOS) Type-
S are enclosed in Appendix-A. Details of the consumables used for package fabrication is
given in Appendix B. A representative list of equipment for package fabrication and assembly
is given in Appendix C. A representative list of equipment used for testing is given in
Appendix D. Copies of Mechanical drawings, PCB fabrication and wiring details, Assembly
document, and Electrical configuration etc. of Electro-Optic Sensors (EOS) Type-S shall be
made available at LEOS for Vendor’s reference at start of production.
3.3 Terms and Conditions
3.3.1 Validity of the contract:
The Contract is for Supply of 45(Forty-Five) Electro-Optic Sensors (EOS) Type-S in 48 (Forty-
Eight) months from the date of Contract. If delivery of sensors is delayed beyond schedule due
to reasons attributable to Vendor, demurrage clauses will apply. In such case vendor is required
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 7 of 74
to complete the activities and deliver the sensors with no additional financial implication to
LEOS.
LEOS proposes to finalize a firm and fixed price contract. However, due any unforseen
exigencies due to LEOS, leading to delay in the execution of the contract, beyond the contract
period, standard price variation clause of per GFR2017 is applicable and the typical formula for
Price variation reproduced here
P1=P0{F+a[M1/M0]+b[L1/L0]}-P0
Where
P1 is the adjustment amount payable to the supplier (a minus figure will indicate a reduction in
the contract price).
P0 is the contract price at the base level.
F is the fixed element not subject to price variation.
a is the assigned percentage to the material element in the contract price.
b is the assigned percentage to the labor element in the contract price.
L0 and L1 are the wage indices at the base month and year and at the month and year of
calculation respectively.
M0 and M1 are the material indices at the base month and year and at the month and year of
calculation respectively.
3.3.2 Deliverables by LEOS
Soft copy of all necessary mechanical and thermal drawings for fabrication and
thermal treatment of all mechanical parts as Free Issue of Materials (FIM).
Details of consumables to be procured for card and package fabrication as Free Issue of
Materials (FIM).
All necessary details for PCB fabrication along with list of approved sources as FIM.
All screened EEE components and optical assemblies necessary for the production as
Free Issue of Materials (FIM).
Test jigs for card level tests, test consoles and all special test equipment as Free Issue of
Materials (FIM)
Facilities for PCB wiring, testing, assembly and environmental test facilities as Free Issue
of Materials (FIM)
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 8 of 74
3.3.3 Material procurement and Parts fabrication by vendor:
Flight Quality PCB’s with all necessary tests and reports.
The space qualified raw material like Al 6061-T6, Titanium alloy (Ti-6AL-4V), SS 304,
etc., required for fabrication of mechanical parts which are shown in mechanical
drawings of Appendix A.
Consumables used for sensor assembly, a list of which is given in Appendix B with an
approximate quantity.
All document copies like log books, fabrication details for card and package, assembly
documents required for each package fabrication.
The vendor shall fabricate the mechanical parts from LEOS approved sources only
Procurement of all items used for flight packages s h a l l be made only from LEOS
approved sources only.
3.3.4 Reference Standards to be followed for Card/Package Fabrication:
The following documents shown in Table-3.1 shall serve as reference documents for the contract
and will be made available at the production site. They cover various phases of activity including
facility requirements and certification, manpower certification, ESD and clean room
requirements. Vendors shall comply with requirements as listed out in these documents and
which are applicable to them.
Table-3.1: Reference Standards to be followed
Document Identification Document title
ISRO-PAX-300 Rev1 Workmanship Standards for the Fabrication ofSpace Electronics Packages.
ISRO-PAS-207 Storage, Handling and Transportation requirementsfor Electronics hardware.
ISRO-PAS-100 Rev 1 Non Conformance Control Requirement for ISROProjects.
ISRO-PAS-201-Rev1 Failure Reporting, Analysis and Corrective ActionProcedures
ISRO-PAS-400 Contamination Control and CleanlinessRequirements
MIL-HDBK-263B ESD Control Hand BookISRO-LEOS-QAG-MTA-GL-01 Space Electronics Production Assurance Guideline
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3.3.5 Reference Documents for Electro-Optic Sensors (EOS) Type-S:
The approved reference copies of all applicable documents specific to Electro-Optic Sensors
(EOS) Type-S namely PCB fabrication and wiring details, Mechanical parts fabrication details,
mechanical assembly, electrical configuration, test matrix and log sheets shall be provided by
LEOS. Vendor shall follow the documents provided by LEOS as a guideline to carry out all
the activities. He shall record the test results and observations in the standard log sheet formats.
For detailed list of documentation refer Section 4.3. All the documents are to be used at LEOS
premises only. These should not be reproduced by any means. The copy rights of the documents
used in the course production rests with LEOS.
3.3.6 Schedule:
Phase–I: Training and realization of 1st package will be 4 months from the date of
release of Contract.
Phase-II: Delivery of 44 numbers (2nd to 45th) of Electro-Optic Sensors (EOS) Type-S
to be realized in 44 months from the training package or 48 months from the date of
release of Contract. A minimum of 6 (six) packages to be delivered every six months.
Delivery schedule chart is shown in Fig-1.
The vendor is free and encouraged to complete the activities and deliver sensors before
the schedule without any financial implications on LEOS.
3.3.7 Facilities Requirements
LEOS shall provide all the required facilities at LEOS production labs for wiring,
assembly, Ambient Performance test, environmental tests and calibration as per ISO-9001-2015
standards in vogue. The Vendor is required to carry out Wiring of PCB’s, testing at card and
package level, assembly of package and environmental tests at LEOS.
3.3.8 Manpower Requirements
1. The Vendor shall provide requisite qualified personnel supervised by a team leader for
effectively executing the project (Table 3.2 below). The team leader should be a B.E
(Electronics/Electrical) with 5 years of working experience in Aerospace/ Defense projects
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and knowledgeable in Aerospace standards. The following Table-3.2 provides minimum
man power requirements for Phase-I and Phase-II and is indicative only.
Table-3.2: Minimum Manpower Requirements for completion of ContractSl.No Engineer
/TechnicianResponsibility Qualification
MinimumNo. ofstaff
Activities involvedin
1 Test Engineers(Electronics/Electrical)
Testing B.E. With 65%marks 3 Card/Package TestingActivities anddocumentation
2 MechanicalEngineer + QA
Assembly,Environmental tests
BE with 65% marks 2+1 Card/PackageMechanicalActivities &documentation
3 Technicians +QA(Electrical)
Wiring andInspection
2+1 PCB and package levelwiring anddocumentation.
4 Team Leader Overall In charge B.E(ECE/EEE)with min 5 yearsexperience inaerospace industry
1 Monitoring all aboveactivities, verification oftest results, schedulingactivities to meetdelivery schedule
2. Responsibility to suitably deploy the manpower and operate extended hours if required to
meet the delivery schedules lies with the Vendor. Delivery Schedules are to be met without
fail.
3. The Vendor shall comply with statutory rules connected with relevant and current Contract
Labor Act, Employees Provident Fund Act, Employees State Insurance Act, Insurance Act,
Payment of Wages Act, Workmen’s compensation Act, etc., and shall submit necessary
registration documents whenever called for. Vendor shall indemnify LEOS towards
compliance of minimum salaries.
4. The vendor shall insure each of technical persons deployed towards the execution of the
production contract with following minimum coverage in the event of an accident.
(a) In the event of death or permanent disability resulting from loss of both limbs:
Rs.10,00,000/- (Indian Rupees Ten Lakh)
(b) In the event of other permanent disability: Rs.7,00,000/- (Indian Rupees Seven Lakh).
The original insurance documents for each of the technical persons deployed towards the
execution of production contract shall be deposited to LEOS within 10 days of signing
the contract and would be retained at LEOS till the completion of production contract.
ITI(Technician,QA) /Diploma(QA)Certificate withFirst class
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5. The vendor personnel employed to carry out this activity have to work for a minimum
period of 48 months or till completion of this contract whichever is earlier. Training to the
vendor personnel will be given during the 1st phase only. Vendor should retain trained
human resources till end of contract work after training. Any training to personnel recruited
at a later stage for this activity will be charged to the vendor by LEOS. Repeated training
would increase time and resources and hence limited to two times only including initial
training. Charges for training manpower beyond the training period (2nd time) is as
indicated
Engineer (B.E/Diploma,. Electronics/Mechanical) :Rs 40,000/-
Technician (ITI Electrical) :Rs 30,000/-
6. Additional Replacement manpower to be provided by Vendor in training phase to cater to
employee attrition.
7. All the engineers and technicians will be trained and evaluated before inducting them on
actual flight version packages.
8. Manpower requirements shown are representative and Vendor may suitably scale up the
requirements to meet the delivery schedule.
9. The employees of vendor deployed to LEOS/ISRO for undertaking the work,
antecedents/police verification shall be carried out by the Vendor at his cost and when
necessary, such records will have to be produced by them (Vendor) to authority concerned.
The Vendor shall give undertaking to purchaser (LEOS) to the effect that the
engineers/technicians/employees deputed at the premises of purchaser for carrying out the
services are not involved in any crime or unlawful activities. In case of any
misbehavior/discourteous behavior they shall be immediately replaced.
10. Transport/Conveyance, canteen and medical facilities will not be extended to vendor/vendor
personnel deployed at LEOS. The vendor shall be responsible for the same.
11. The employees deputed to undertake the work by the vendor shall remain the employees of
vendor and they will not acquire any claim for future employment or regularization in LEOS
or any other LEOS, ISRO centers.
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3.4 General Terms & Conditions
3.4.1 Should any component(s)/part(s)/material(s) etc., issued by LEOS to vendor be damaged
or rendered unusable/unserviceable during the realization of the Sensor, it shall be
compensated on actuals by vendor with penal interest.
3.4.2 Procurement/fabrication of other hardware by Vendor shall be from LEOS approved
vendors to ensure consistency in Quality and cost advantages.
3.4.3 Vendor shall strictly follow/adhere Quality Assurance guidelines, requirements given by
LEOS.
3.4.4 Vendor to provide warranty for a period of one year from the date of acceptance by
LEOS the performance of each of the sensor supplied by it to LEOS against
workmanship defects. Vendor shall carryout necessary repair and testing free of charge
during the warranty period.
3.4.5 The vendor shall accept and implement any modifications in components /materials/tests
/methods necessitated by functional requirement/improvement/on-orbit observations for
LEOS project needs, and brought out by LEOS, in the sensor units supplied by vendor at
no extra cost, unless the modifications call for major changes in the sensor. In the event
of configuration change requiring change in PCB or Mechanical housings, vendor would
be reimbursed suitably for PCB procured or housings fabricated. Compensation shall be
mutually agreeable basis. The date of reckoning for sensor delivery would be suitably
modified. For the deployed manpower vendor shall quote/claim for hourly basis.
3.4.6 All the information/documentation (in all forms) of the activities/works forms intellectual
property of LEOS. LEOS has complete, exclusive right on the
information/documentation (in all forms). The vendor guarantees that all the technical
information and knowhow provided by LEOS within the scope of this contract shall be
treated as confidential and will not be divulged to any other party. The Vendor also
undertakes and guarantees that the documentation issued by LEOS shall be kept by
vendor in safe custody and in good condition for the entire period of this contract. Vendor
shall return all the documents to LEOS and declare in writing that no other copy exists
with him or the personnel employed by him. Further the vendor shall execute a non
disclosure agreement with LEOS.
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3.4.7 The vendor shall not disclose the production details to any other entity, without explicit
permission from LEOS. He shall not advertise/disclose/divulge or transfer by any means
in any brochures, pamphlets or in seminars/conferences without explicit, written
permission from LEOS.
3.4.8 The first sensor produced by vendor independently, after training, is considered as first
article which shall be subjected to higher level testing. On successful completion of first
article, vendor shall be given clearance for further production activities.
3.4.9 The vendors personnel deployed at LEOS for activities of contract shall carry out
pending work, if any, towards meeting schedules beyond office hours and on holidays,
with consent from LEOS, without any financial implications to LEOS.
3.4.10 The vendor shall be an established/Registered Indian company (with majority stake with
Indian owners; documentary proof to be provided) without any insolvency, and actively
doing business for past 5 years.
3.4.11 Vendor shall have valid ISO9001/AS1900 certification and confirm the same in the
quotation. Documentary evidence to be provided.
3.4.12 The vendor shall have a minimum of 3 years of experience in the nature of the present
proposed work. Documentary evidence to be provided.
3.4.13 The vendor shall have executed and successfully completed atleast one work/order
involving similar kind and scope of work involving wiring, fabrication, assembly and
testing for Aerospace, ISRO or similar organizations in India. Details are to be filled as in
Table 3.3 and necessary details with documentary proof to be provided.
Table-3.3: Experience of Vendor for past 2 years ending with current year.).(Mandatory; be sent along with or as part of technical bid; otherwise bid would be considered
invalid)Sl.
NO.Brief description
of of Work.Name of Customer,
category of customer(Aerospace, ISRO,
Defence)
Duration,Number of
products, cost,number ofmanpowerdeployed
Nature/quantum ofwork
(eg., wiring,assembly, testing,operating specialequipment etc.,)
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3.4.14 The vendor shall not sub-contract either whole or any part of the work to other vendors
except for procurements and mechanical parts/PCB fabrication.
3.4.15 LEOS reserves the right to enter into parallel/adhoc contract with one or more Vendors
during the currency of this contract for same sensor.
3.4.16 Under exigencies, LEOS may have to short close its commitment to produce sensor by
vendor under this agreement. Should such exigency arise, LEOS would issue a THREE
months notice to vendor for such short closure of the Order/contract. Upon issue of short
closure notice, a committee, formed by LEOS shall work out the details of actions to be
completed by either parties, relating to free issue of materials, contract commitments,
balance of work, compensation etc., to mutual satisfaction. The committee shall complete
the evolution of mutually agreed action plan within 30 days from the date of issue of
short closure notice.
3.4.17 Both LEOS and vendor shall have the right to terminate this agreement by giving a notice
of THREE months in writing to the other for any other reason, not specified in and which
shall be by mutual consent. The payments would be made to the extent of deliverables by
vendor. Unused raw material/PCB/Mechanical parts to be handed over to LEOS and the
committee (mentioned in 3.4.16 above) shall decide all these modalities of stock taking
and termination.
3.4.18 During the effective period of this contract, if it is found that the sensors manufactured by
vendor, after training period, fail to meet the workmanship standards, fabrication and
assembly requirements repeatedly the matter may be brought to the notice of vendor by
LEOS for rectifications, free of cost to LEOS. If after a reasonable period, necessary for
rectification has not been affected or the sensor do not still meet the specifications, LEOS
reserves the right to revoke the order/contract granted to vendor without any notice and
no liability on the part of LEOS. The criteria of a defect/rework being attributable to
workmanship or design will be made by LEOS.
3.4.19 LEOS reserves the right to terminate the revoke/cancel order or terminate the contract if
vendor fails to deploy required resources towards training/executing within a reasonable
period of time (one month from the date of order) or fails to meet the obligations under
this contract.
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3.4.20 Breakup of supply & service component embedded in the quoted price, to be mentioned
in percentage. (Please note for supply GST is applicable @5% since LEOS is issuing
GST Concessional Certificate and for service @18%).
3.4.21 Customs Duty Exemption: LEOS will be issuing Custom Duty Exemption Certificate
under Notification NO.5/2018 dated 25-01-2018 for imported components required for
execution of this contract. All other duties and taxes to be borne by the Vendor.
3.4.22 Arbitration/Settlement of Disputes: Disputes if any shall be settled mutually, failing
which it will be referred to a one-man arbitration appointed by Director, LEOS in
accordance with the Arbitration and Conciliation Act, 1996 and alterations/modifications
thereof whose decision shall be final and binding on both the parties.
3.4.23 Secrecy and Non Disclosure Agreement: All documents prepared for fabrication, test
procedures, log books, drawings, schematics and any other communication, codes
revealed during the process of testing will be exclusive property of LEOS and vendor
shall have no right what so ever on them. These documents are to be strictly confidential
and should not be reproduced, copied/transmitted to any media without the explicitly
permission of LEOS. Further, the vendor must not quote any of these works in any
publications or to any of their customers without explicit permission from LEOs and
adhere to strict confidentiality.
3.4.24 Compensation for damages caused for persons, goods or property: The vendor shall
indemnify and hold harmless, LEOS and/or any Officer, employees or assignees thereof
against any loss, damage or expense resulting from damage to property or personnel
injury arising out of willful misconduct or gross negligence of the Vendor or their
personnel in the execution of the work under this contract. The Vendor shall at its
expense, defend any suit or proceedings brought against LEOS on account thereof, and
shall satisfy all judgments and pay all expenses which may be incurred by or rendered
against them, in connection therewith.
3.4.25 All defective parts fabricated by Vendor are property of LEOS and shall not be returned.
3.4.26 All materials procured by Vendor are to be subjected to Third party inspection and test
certificates to be submitted to LEOS.
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Section 4Statement of work for fabrication, assembly, integration, testing and supply of
Electro-Optic Sensors (EOS) Type-S
4.1 General
This statement of work comprises of nature of work and the responsibilities of the vendor inconnection with the fabrication, assembly, integration, testing and supply of Electro-OpticSensors (EOS) Type-S
4.2 Phase-1 and Phase-II Activities
The scope of the work is planned in two phases.
PHASE – I :In this phase, the vendor will be trained at LEOS by LEOS representatives. During this phase,the vendor will be trained for actual fabrication and testing of sensors. Training and realizationof first package shall be completed within 4 (four) months from the date of release of Contract.Further the vendor has to get all the required details from LEOS towards Consumablesprocurement, PCB procurement and procurement of raw materials for mechanical partsfabrication. He has to procure the materials and submit to LEOS the reports and conformancecertificates for clearance to use in Phase-2 Production Activities.
PHASE – II:In this phase, the vendor is totally responsible, for the fabrication of PCB’s and mechanical partsready for assembly in all respects. This includes mechanical parts fabrication, 100% metrology,thermal treatment (Anodising and Black painting) of parts etc. and PCB procurement. Thevendor is totally responsible for wiring of PCBs, inspection, testing at sub assembly level,assembly of total package and testing them for their performance, environmental tests andcalibration as per the approved production and test documents. The remaining 44 packages willbe fabricated and tested independently by the vendor in 44 months from the date of trainingcompletion or 48 months from the date of Contract with the 44th package delivered by the end of48th month and as per the delivery schedule given in Fig.1
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4.3 PHASE – I TRAINING ACTIVITIES AND DOCUMENTS4.3.1 TRAINING PACKAGE AND DOCUMENTS TO BE REFERRED:The approved reference copies of all applicable documents namely PCB wiring, packageassembly, test matrix and log sheets shall be provided by LEOS. Based on the referencedocuments, the party has to make hard copies for the production package folders of eachindividual card and packages. The documents provided by LEOS are comprehensive describingevery minute details so as to enable the vendor to understand the requirement and produce thehardware required as per specifications and test every aspect of the functionality without leavingany issue/Sensor, without change of parts, consumables, process, procedure and method, withoutany additional Sensor/process. To summarize, these documents are self-instructive to the vendorand contain every requirement of LEOS in view that he/she should be ultimately able tofabricate, assemble, test and deliver with the least participation from LEOS. The card / packagefolder should have the following details filed based on the master copy provided by LEOS.
The documents supplied are as follows and typical contents of the document are as discussedbelow.
4.3.2 DOCUMENT TO BE REFERRED FOR PCB WIRING
01. PCB Layout, number of layers etc.02. Component details in the LEOS standard format.03. Component positioning / mounting details with component marking details.04. Drilling details for components mounting etc., on PCB.05. Mechanical details such as dimensions and stack holes sizes scheme of mounting etc.06. Mechanical housing details and stacking diagram and position of the card in the stack.07. Connector details and identification of input/output.08. Component placement and lead bending requirements specific to components.09. Conformal coating, potting and lacing requirements10. Fabrication / soldering specifications like temperature solder material, soldering time and
specific tools to be used.11. Handling precautions of the components.12. ESD protection methods and practices.13. Any special notes, as called for.14. List of Applicable ISRO / Other documents.15. Others
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Layout marking etc. Inspection procedure etc. Soldering / desoldering Card identification marks Card mechanical, electrical inspection records Solder masks (if applicable) Special land patterns Cleaning Procedure
4.3.3 DOCUMENT TO BE REFERRED FOR MECHANICAL PARTS FABRICATIONa) Approved Mechanical Fabrication Drawings for mechanical fabrication.b) Drawings used for thermal treatment of Mechanical Parts.c) Details of Sample coupons.d) Quality control log books and formats for inspection / metrology / after fabrication and
thermal treatment of parts.e) Details of raw materials used like mechanical properties, chemical composition,
4.3.4 DOCUMENT TO BE REFERRED FOR ASSEMBLY OF PACKAGE.The vendor has to refer to the master copy of the assembly document provided by LEOS andstrictly follow the sequence/procedures as explained during the training of first package. Thevendor has to ensure availability of the following documents/details before starting thefabrication activities01. Flow chart showing the sequence of activities during sensor fabrication.02. Description of each activity giving the previous activity to be completed and other pre-
requisites.03. Materials, parts and special epoxies to be used.04. Tools and Instrument used for assembly.05. Documents for wire routing, connector mounting on PCB etc.06. Interconnection details such as card to mother board / package to package etc.07. Connection details input / output designations etc.08. Interconnection harness requirements etc.09. Stacking details10. Mechanical details such as card to card to spacing, torque requirements etc.11. Assembly procedure for parts including cleaning, handling procedure and precautions to be
taken.
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12. Assembly environment.13. Check points / test points.14. Failure report / correction mechanism15. Log books with formats at all stages of sub-assembly and system level assembly.16. Rework procedure at different stages, incase of re-work is called for. Report of fabrication
deviations, authorizations, QC Check points.17. Time required for each activity, type of infra structure / overheads needed and estimated
utilization time on each facility and infrastructure man-hours required for each activityincluding engineers, technicians and management and supervisory staff.
18. Rework procedures.
4.3.5 DOCUMENT TO BE REFERRED FOR TEST PROCEDURE FOR EACH CARDAND SUB-ASSEMBLY
The vendor has to refer to the master copy of the test procedure document provided byLEOS and strictly follow the sequence/procedures as explained during the training of firstpackage. The vendor has to ensure availability of the following documents/details beforestarting the testing activities. Each card / sub assembly functional inputs and outputs are tobe understood and discussed with LEOS engineers while undergoing the training. Card level /sub assembly test procedure document shall have the following details01. Circuit diagram with identification of input / output and destination information.02. Block schematic03. Functional description04. Input / output specification05. Environmental requirements06. Test set up, special simulators and jigs and procedures07. ESD protection requirements08. Log book09. Analysis report10. Precautions during tests11. Environmental tests, if any12. Burn in components / devices if any13. Test results, anomalies, corrections, reviews
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4.3.6 DOCUMENT TO BE REFERRED FOR TEST PROCEDURE FOR ASSEMBLEDPACKAGES.
The vendor has to refer the master copy of “Test procedure document for assembledpackages” provided by LEOS. The document contains the following details
Test Specifications: Details of various environmental tests, calibration procedure. Equipment and special jigs, simulators, mechanical equipment and special facilities for
assembly including cleanliness requirements at the place of test. Procedure for all interface checks Identification of inputs / outputs ports and their designations, expected type of signals, levels
and limits Detailed test matrix and expected results for every test Test set up required for every test to be described and to be documented. The requirement in terms of interfaces, test and measuring instruments. Test procedure for performance evaluation using special simulators, logging and test results. Alignment procedure and log sheets Precautions to be taken during tests
4.3.7 RESPONSIBILITIES OF LEOS DURING PHASE – 1
LEOS shall supply all the necessary drawings, wiring, assembly & test procedures for makingprototype sensors. The vendors will be exposed to actual fabrication work and inspectionpractices and testing of sensors. The vendor personnel will be trained by LEOS for carryingout various tasks involved in realization of first package. All the required facilities relevant tothe activity shall be provided by LEOS. The performance of fabrication, test and evaluationpersonnel of the vendor will be tested and certified by LEOS for their eligibility in theactual fabrication and testing activities.
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4.3.8 RESPONSIBILITIES OF THE VENDOR DURING PHASE – IThe vendor shall position the required manpower as specified in section 3.3.8 at LEOS. Thepersonnel have to participate and get trained at each stage of fabrication, assembly andtesting. The personnel must familiarize with all the activities viz; understanding sensorterminology, understanding the mechanical drawings, mechanical parts fabrication and 100%inspection, understanding the thermal treatment aspects of mechanical parts, helicoilfixing, fabrication and assembly procedures, fabrication sequential flow- charts, mechanicaland electrical functional aspects, Quality control, ESD related, handling of special devices, testconsoles, equipment, simulators, card and package test parameters and specifications, interfaceaspects , mechanical assembly of cards and packages, environmental tests and procedures bythorough understanding of documents provided and the application of these documents forcompletion of each stage activity etc.
The vendor personnel have to get familiarized with management of folders/files containingcomplete data related to card level fabrication, package level activities folder and assemblydocument. These documents reflect the history, traceability and progress of work on day-to-day basis with record of execution of activity. The package will be certified based on theevaluation of sensor delivery requirements by auditing.
The vendor shall position the required manpower at LEOS. All the documents as explained inthe previous section shall be prepared for the first package as per the training given by LEOS andget them approved before the final documents are submitted. Changes/modifications if any fromthe documented procedures that may arise during the training period shall be recorded and usedby the vendor for updating the existing documents after necessary approvals from LEOS.
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4.4 PHASE–IIPRODUCTION ACTIVITIES FOR FABRICATION, ASSEMBLY, INTEGRATION,TESTING AND SUPPLY OF ELECTRO-OPTIC SENSORS (EOS) TYPE-S.
This activity shall be executed at LEOS production facility by the Vendor personnel. Vendorhas to carry out all activities towards package realization independently. During the fabricationprocess, the following are to be followed without exception wherever applicable.
4.4.1 MECHANICAL PARTS FABRICATION
Mechanical parts fabrication as per approved drawings by fabricators approved by LEOS. Matching of parts. Serial number, Part number marking, engraving & marking of parts. Inspection of Mechanical Parts for QC. Acceptance /Rejection / Rework reports. Anodizing the parts as per approved drawings by facility approved by LEOS. Drilling, Tapping, Fitting, Helicoils fixing etc. Black painting/black dying of the parts as per approved drawings. Certificates for all thermal treated parts.
4.4.2 PCB FABRICATION
PCB fabrication as per approved spool files by an approved facility. Carrying out all tests on PCBs as specified for aerospace requirements. Visual and Mechanical Inspection reports. Submission of PCB’s along with traceability, inspection reports including Group B test
reports, test coupons to LEOS for obtaining clearance. Storage of PCB in proper condition as per procedure.
4.4.3 PCB WIRING
All the PCBs connectors, buffer connectors, auxiliary and temporary wiring shall be made asper the standards defined by LEOS.
The vendor shall strictly adhere to the ESD protection measures. The vendor shall maintain a folder to each card being fabricated and to log all relevant
information as per the prescribed log book.
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Vendor shall receive components and carry out inward inspection as per component list. Getting necessary clearance for components deviating from component list or getting
replacement components. Pre-fabrication activities – card cleaning, baking and PTH filling. Component mounting, inspection and soldering and lead bending wherever applicable. Provision of chotherm and heat sinks wherever required as per the fabrication procedures. The vendor shall follow the fabricated procedures as per the guidelines of LEOS and inspect
at every stage before proceeding to the next stop. Any deviations, anomalies observed and noticed must be logged and reported to the
concerned authorities and to proceed only after clearance by competent authorities. The vendor shall make the card ready for functional tests, after completion of the fabrication
and inspection of the cards. The vendor shall obtain clearance from LEOS for functional testing and carry out the testing. Vendor shall make arrangements for the incorporation of test selectable components to
realize the design goals and complete card level testing. After completion of card testing the vendor shall carry out radiation shielding, coating,
potting, Dam and fill as per the fabrication procedures and guidelines of LEOS. Vendor shall inspect the cards after conformal coating and carry out card tests and get
clearance for next activity/assembly/initial Ambient Performance test.
4.4.4 CARD TESTING
Follow all ESD precautions for testing of the cards. To make ready all the cards and subassemblies fabricated for functional tests by visual
inspection and passive measurement of various parameters. To make the test setup as per the card test procedure and setup verification which may
include reading the stimuli’s power sources, setting up the voltage and current limits, testequipment, log books etc.
To log the test conditions, test results and reporting any deviations to the subsystem incharge and proceed only after necessary clearance.
Every card to be checked as per the pre-determined procedure and tabulate the results in theprescribed format.
After completion of the test on each card, the results are to be viewed and their complianceto be recorded. Any deviations are to be notified.
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Anomaly reporting / corrective actions / trouble shooting / waivers to be followed as perISRO guidelines.
Package level assembly and testing is to be carried out after clearance for all cards.
4.4.5 PACKAGE ASSEMBLY AND PACKAGE LEVEL TESTS
After completing functional tests of all cards following activities will be carried outo Package Temporary Assembly: All the cards will be integrated and tested.o Package Final Assembly: All the cards and optical modules will be integrated with
the mechanical housings as per the approved assembly procedure. The assembledpackage shall be offered to LEOS for clearance for further activities.
o Initial Ambient Performance Checks: The assembled package will undergo Ambientperformance checks as per the test matrix. Testing is to be carried out with theassociated test jigs, test equipment and simulators.
o Stabilization tests: Package will undergo stabilization thermovac and vibrationfollowed by alignment in front of special simulators
o Vibration Test: After completing ambient performance tests and obtaining necessaryapproval/clearance from LEOS and mandatory inspection by QA, the packages willundergo vibration as per the test levels given by LEOS.
o Thermovacum Test: The packages have to undergo thermal-vacuum (TVAC) testafter vibration test. The temperature-time profile and vacuum limits (TVACprofile) will be provided by LEOS. Cursory Package performance will be monitoredthroughout thermovac and detailed readings as per test matrix will be done as per thespecified time indicated in the test profile.
o Final Ambient Performance Checks: the package after completion of all above testswill undergo Final ambient performance checks as per the test matrix. Results will beverified for matching with the results of initial ambient performance checks.
o Pre-certification: After completion of all tests, all data is to be compiled in therequired form and data is to be submitted to LEOS for obtaining QA certificate.
4.4.6 REWORK / RETESTS
To conduct the tests both on cards and package and total systems as and when required (apartfrom the above tests) due to various anomalies, requirements, suggestions, etc. If any failureoccurs at sensor level testing at any stage of the testing, the entire testing cycle is to be repeatedtowards meeting the specifications.
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4.5 INSPECTION AND AUDITING
The flight fabrication activity involves inspection and audit by the vendor QC personnel. Theyshall carry out inspection on 100% basis at all stages of activity and shall make specific mentionof inspection in the fabrication folder. For inspection guidelines, vendor may refer to thereference documents section. Subsequently before every higher stage of activity as indicated inTRR, audit shall be carried out internally to assure that all activities at the earlier stage arecompleted. Formal stage audits will be carried out by LEOS and clearance will be given toproceed to next stage. The Mandatory Inspection points are where LEOS shall mandatorilyaudit/review the progress of activity and readiness of hardware for further activity . LEOS reservesthe right to inspect/audit hardware at any stage of the activity.
4.6 NON-CONFORMANCE MANAGEMENT
For non-conformances observed during fabrication, assembly and testing, following are therecommended guidelines:
All non-conformances related to materials, fabrication, assembly, testing etc to bereported to LEOS within 24 hours in writing.
For all Non-conformances, LEOS shall recommend next course of action. The NCR shall be addressed to Focal Point, LEOS.
Focal Point from Vendor shall ensure complete reporting of all non-conformances andthe assessment of Vendor to LEOS.
LEOS shall after receipt of NCR discuss in the appropriate forum and suggest furthercourse of action.
4.7 PHOTOGRAPHIC RECORDS
Photographs of the hardware shall be maintained. A checklist for mandatory photographicrecords will be given and it is the responsibility of the vendor to produce photographs as per thechecklist. Further Photographic evidence needs to be maintained as a record of thefabrication/assembly activity. Towards this purpose, fabrication records shall also carry record ofphotographs meant to record fabrication activity completion, rework completion, conformalcoating completion, tray wiring and package assembly. Images shall be captured only byinstruments provided by LEOS for this activity.
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4.8 COMPONENT MANAGEMENT
1. All the EEE parts and optical modules shall be issued to vendor based on the requirementfor realization of the packages.
2. The components given by LEOS for fabrication work shall be received and acknowledgedby the vendor.
3. Vendor shall maintain all records of components received and utilized, unused componentsetc., and submit to Focal Point, LEOS a statement at the time of package delivery and returnthe unused components.
4. Vendor shall take utmost care in handling and transportation of the components.
5. Defective components, if any, found should be accounted and informed to the LEOS forreplacement.
6. Vendor is responsible for keeping track of the expiry date of the components and to wire thecomponents within the expiry date.
7. Vendor shall be responsible for any loss/ damage of components and shall make suitablecompensation to LEOS.
8. The components supplied by LEOS against each order will be used by the vendor for thesole purpose for which it is intended.
4.9 TEST SYSTEMS
Test consoles, Custom made card jigs and Electro optical simulators, general purposeinstruments required for testing at card and package level shall be provided by LEOS.
4.10 SCHEDULE, PLANNING AND REPORTING / QUALITY CONTROL
4.10.1 SCHEDULE AND PLANNING
The total time schedule of activities shall be met without fail. Schedules to be made for eachindividual package. Vendor shall make detailed plan for all sub-activities involved in realizingthe packages and communicate the same to LEOS to ensure timely availability of LEOSpersonnel and facilities wherever applicable.
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4.10.2 STATUS REPORTING
Status report of major activities like fabrication, testing and documentation shall be submitted forreview on weekly basis. Any deviation from the agreed plan shall be informed to LEOS forapproval/ratification.
4.10.3 LOG BOOKS, FOLDERS AND FILE MAINTENANCE
All log books, test procedures, test results, individual card and package folders and files to bemaintained as per procedures of LEOS in vogue.
4.10.4 FOCAL POINT
Vendor will identify the focal point for all communications / instructions to have bettermanagement. Similarly, LEOS shall identify an Officer to communicate with the Vendor.
4.10.5 QUALITY PROVISIONS
Vendor shall use facilities for the fabrication, assembly and testing of Electro-OpticSensor which are approved by LEOS. All approved practices of Quality assurance ofelectronic systems, assemblies shall be adhered to. All processes used shall be approvedby LEOS-QA. All materials and components used shall be approved by LEOS-QA. AllISRO documents on Quality assurance shall be applicable Towards Review / acceptance /non-conformance / rework / authorization / waivers.
Vendor should strive to have minimum non-conformances and completely avoidrecurring of the same non-conformance by ensuring proper checks as required at allstages.
The Quality of the package will be judged based on the total number of non-conformances
4.10.6 PRICE BREAKUP FOR REALIZATION OF ELECTRO-OPTIC SENSORS (EOS)TYPE-S
The clear breakup of price for carrying out PCB wiring, PWB testing, mechanical assembly,package level testing and environmental tests, cost of consumables, fabrication cost andPCBs and mechanical parts are to be indicated as per Table-4.1 for Electro-Optic Sensors(EOS) Type-S. Vendors while making their techno-commercial bids shall carefully gothrough the requirements as spelt out in this document and respond accordingly. The price
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breakup should be given as a percentage of the total price only. No price information is to bementioned while providing the breakup
(Mandatory: The above table-4.1 to be submitted in technical bid onlymentioning the price as % of total price per sensor; Actual price to besubmitted in price bid only. otherwise bid would be considered invalid)
Sl.No ActivityPercentage
PriceRemarks
1 Wiring, Assembly and Testing (Services)
1.1 PCB Wiring
Refer Appendix A1.2 Wired PCB Testing
1.3 Package Assembly
1.4 Assembled Package Tests
2 PCB, Materials, Consumables and Fabrication (Supply)
2.1 PCB for Electro-Optic Sensors (EOS) Type-SRefer Appendix A
2.2 Fabrication cost of Mechanical housings forElectro-Optic Sensors (EOS) Type-S
2.3 Consumables for package Refer Appendix B
3 Total price per sensor
Table-4.1: Price Break-up for Electro-Optic Sensor(EOS) Type-K(as a % of total price of one sensor; for example, if total price is x, andcost of PCB wiring is y (y < x), then column-3 to be entered as value of(y/x*100))
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4.11 INTELLECTUAL PROPERTY RIGHTSAll documents prepared shall be the property of LEOS and all the intellectual property rights of
all documents shall be solely with LEOS. The intellectual property rights of all sensors produced
shall be with LEOS-ISRO. Vendor can at no point in time or in any format claim the design or
sensor as his own product. Exclusive, Full, complete IPR Rights rests with LEOS.
4.12 ROLES AND RESPONSIBILITIESThis section outlines the roles and responsibilities of LEOS and Vendor so as to provideclarity and to enable smooth operation of the contract. The responsibilities of LEOS and Vendorare shown in Tables -4.3.
4.12.1 RESPONSIBILIITES OF LEOS Necessary infrastructure essential for carrying out the Realization of Hardware. Training and certification of Fabrication, Technicians, training for Test Engineers
shall be provided for the first package only.
Audit/Clearance of consumables & materials procured by vendor.
Supply of EEE parts and special components as required for the realization ofhardware as per RFP and the same is to be collected by vendor as per PurchaseProcedure.
All software in embedded form. Provide sufficient documentation to carry out the activities as per contract.
Carry out audits and provide approvals for the fabrication, assembly and testing.
Disposal for all Non conformances arising at various stages of package realization.
4.12.2 RESPONSIBILIITES OF VENDOR
The vendor shall execute the work as per the content and delivery schedulementioned in the RFP.
The Vendor is responsible for safe custody of the materials supplied by LEOS. Vendor shall procure and use approved consumables, where applicable. Maintain records towards traceability of all mechanical parts, and consumable like
batch. No, Expiry data etc with each package. Ensure calibration validity of Test & Measurement equipment. Rework as well as replenishment of rejected Sensors on the basis of the feedback
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from LEOS. The vendor shall nominate a technically qualified person as a Focal Point for work
scheduling, progress review and for interaction with LEOS. Submission of periodic progress report. Procurement of consumables and materials, obtaining approvals for their
acceptance & Storage at LEOS by submitting relevant reports/certificates ofconformance/compliance.
Interaction with various agencies in LEOS for smooth execution of the fabrication,testing and documentation during the period of contract through Focal Point, LEOS
Deployment of technical manpower at LEOS to carry out the stated works. Ensure submission of periodic reports. Report all non-conformances arising at any stage during fabrication and testing
within 24 hours of its occurrence to LEOS and obtain approvals for continuingwith further activities.
Safe custody of the equipment, test jigs, test consoles given towards variousactivities at LEOS.
All parts supplied by Vendor and found defective are property of LEOS and shallnot be returned in lieu of replacements.
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Table 4.3: Activity Responsibility Matrix for LEOS and Vendor
SL. No. ACTIVITY RESPONSIBILITY Remarks
1 PCB Gerber files/Films LEOS
2 PCB Vendor
3 Mechanical Drawing LEOS
4 EEE Components LEOS
5 Mechanical Housings and fasteners Vendor
6 Consumables/Materials Procurement Vendor List of materials will be given by LEOS
7 Consumables Qualification Vendor By NABL accredited Lab certificate
8 Audit for Consumables LEOS Audit/Clearance by LEOS
9 Incoming Inspection, Storage & Handling ofcomponents before start of fabrication activity
Vendor
10 PCB Wiring Details LEOS Reference document will be given in the trainingperiod and has to be followed for all packages
12 PCB Wiring Vendor
13 Card Level Audit prior to card F/T Vendor and LEOS
14 Card Level Test setup Vendor Test setup preparation to be carried out by vendor
15 Testing of cards Vendor Card Level test procedure shall be given in thetraining period and to be followed for all packagesand cards
16 Card Test Results clearance LEOS
17 Radiation shielding, Conformal coating, potting Vendor
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SL. No. ACTIVITY RESPONSIBILITY Remarks
18 Clearance for Functional test after coatingand potting
Vendor
19 Testing of cards after RCP Vendor
21 Package Assembly and wiring Vendor
22 Buffer harness for package level testing Vendor Wires and gold plated connectors will be provided by LEOS.23 Package level Test setup preparation Vendor Test system will be provided by LEOS. Any required harness to be
fabricated by Vendor. Test setup to be done by Vendor
24 Initial Ambient Performance Test Vendor
25 Package Permanent Assembly Vendor
26 Package Assembly Inspection as perMandatory Inspection Points
LEOS &Vendor
27 Package Tests after Assembly Vendor
28 Package Stabilization Environment testsclearance
LEOS
29 Stabilization Thermovac Vendor Facility given by LEOS30 Stabilization Vibration Vendor and LEOS Facility given by LEOS28 Package Clearance for Vibration LEOS29 Vibration Test Vendor and LEOS Facility given by LEOS30 Package Tests after Vibration Vendor31 Package Clearance for Thermovac LEOS Facility given by LEOS32 Thermovac Test Vendor and LEOS LEOS shall give the Specifications document.33 Final Ambient Performance Test Vendor Tests to be done as per procedures provided in training phase
34 Pre-certification process Vendor & LEOS All the necessary Consolidated test results and observations to beprepared for precertification
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4.13 LIST OF DELIVERABLES BY VENDOR
o All relevant certificates relevant to raw materials procured including proof of
purchase of raw material, mechanical inspection reports, detailed dimensional
sheets (sheets consisting of 100% inspection details), thermal treatment reports.
o All PCB fabrication reports and inspection reports.
o Electro-Optic Sensors Type-S fully fabricated and tested as per requirement.
o Fabrication history folders for each card and package.
o Test results in hardcopy and softcopy form, log books, analysis reports, failure
analysis, samples rejections etc.
o Sample test coupons (thermal treatment), unused surplus materials/ components.
o Warranty certificate related to workmanship defects for a period of 12 months
from the date of delivery
4.14 SAFETY PRECAUTIONS TO BE FOLLOWED BY VENDOR
The vendor personnel should strictly adhere to the general work rules, procedures and office
timings followed at LEOS and keep harmonious relations with staff during their stay at LEOS.
The personnel of vendor must adhere to all the safety guidelines while handling components,
cards, packages, while testing and transporting, particularly the ESD protection measures such as
wearing ESD overcoats, footwear / chapel, wrist - band etc.
4.15 DELIVERY SCHEDULE:
1. The Sensors should be delivered /completed within stipulated time from the release of
Contract or issue of last free issue of material (component/inputs/test facility) whichever
is later.
2. Delivery schedule shall be as indicated in Fig.1 in the RFP. Vendor shall be responsible
to maintain schedule. The date of delivery shall be the period as indicated in the RFP and
is to be calculated from the date of last free issue of material (components/inputs/test
facility) by LEOS. Delays attributable to awaiting clearances/test facilities availability
etc. which are to be provided by LEOS, shall not be taken into consideration for delivery
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period. LD clause may be applicable for delay in delivery beyond the delivery period
indicated in Fig-1 and subject to above mentioned conditions.
3. In order to carry out reworks due to reasons like change in design the vendor has to quote
separately on hourly basis for each individual.
4. All reworks due to fabrication, assembly, handling and transportation shall be done by
vendor free of cost and within the delivery schedules.
4.16 PAYMENT TERMS
Payment shall be made either on completion of all activities as per RFP or split bills for each
package as per milestone payment terms as provided in Table-4.4.
Table 4.4: Milestone Payments for Electro-Optic Sensors (EOS) Type-S
Total Package level (%)Card Wiring Cards testing Card
Readiness forAssembly
with Optics
Package FinalAssembly, Testingand Readiness forEnvironmental tests
Vibration,Thermovac
Testing ,FinalTests & Pre-Certification.
- - 20 40 40
Test procedures and test specifications for all stages and end product specification compliance
are provided to the vendor at the start of the contract. Payments shall be made on completing
activities of all stages and meeting the final specifications
4.17 LIQUIDATED DAMAGES
If the CONTRACTOR fails to deliver the complete package to STORES within the time
stipulated in the CONTRACT or any extension thereof, the PURCHASER shall recover from the
CONTRACTOR as Liquidated Damages a sum of one-half of one percent (0.5%) of the price of
the undelivered packages for each week of delay. The total amount of liquidated damages per
package shall not exceed 10% of CONTRACT price of each package.
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4.18 PERFORMANCE BANK GUARANTEE
The Contractor shall furnish Performance Bank Guarantee for 10% of Contract Value, valid till
expiry of warranty period of 12 months with a claim period of 60 days.
4.19 SECURITY DEPOSIT
The Contractor Shall furnish Security Deposit immediately after signing of the Contract by way
of Bank Guarantee for 10% of Contract Value, which shall be valid till fabrication, testing and,
supply and acceptance of last delivered package as per the delivery schedule and additional 60
days.
4.20 SECURITY DEPOSIT CUM PERFORMNCE BANK GAURANTEE
Alternately The Contractor Shall furnish Security Deposit cum Performance Bank Guarantee
immediately after signing of the Contract by way of Bank Guarantee for 10% of Contract Value,
which shall be valid till fabrication, testing and, supply and acceptance of last delivered package
as per the delivery schedule and an additional period of 14 months
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Activity Month 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
Start of Activity T0
Documentation completion
Card Fabrication
Card Testing
Stack Assembly &Testing
Ambient Performance checks
Delivery of 1st Electro Optic sensor (EOS) Type-S T4
Delivery of 2nd to 7th EOS Type-S T10
Delivery of 8th to 13th EOS Type-S T16
Delivery of 14th to 19th EOS Type-S T22
Delivery of 20th to 25th EOS Type-S T28
Delivery of 26th to 31st EOS Type-S T34
Delivery of 32nd to 37th EOS Type-S T40
Delivery of 38th to 43rd EOS Type-S T46
Delivery of 44th to 45th EOS Type-S T48
End of Phase 1.Delivery of 1stElectro-OpticSensor (EOS)
Type-S
End of Phase 2. Delivery of45th EOS Type-S
Fig.1: DELIVERY SCHEDULE FOR ELECTRO-OPTIC SENSOR (EOS) TYPE-S
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APPENDIX A
Activities for Fabrication. Assembly, Integration, Testing and Supply of
Electro-Optic Sensors (EOS) Type-S
Electro-Optic Sensors (EOS) Type-S consist of Two flexi Rigid PCB’s. Tested and approved Optical
Modules are integrated with electronic cards and mechanical housing to realize this packages. This
section discusses the fabrication, assembly, integration and testing requirements of Electro-Optic
Sensors (EOS) Type-S. A typical drawing of the Electro-Optic Sensors depicting the major parts is
shown in Fig-A1. An exploded view of the various parts is shown in Figure-A2
Figure-A1: Typical Electro-Optic Sensor (EOS) Type-S
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Realization of Electro-Optic Sensors (EOS) Type-S involves the following activities
a. Fabrication of the Mechanical Parts as per drawings and their inspection and approval.
Mechanical parts and their details are given in Section A1, Table A1 and Fig-A3 to Fig-A11,
b. Fabrication of the Flexi Rigid and rigid PCBs as per spool files, their inspection and approval.
Details of PCB’s are indicated Section A2, Table-A2, Figs A-12 to A-15 and Section 4.
c. Receipt of components and their inspection. Component details are indicated in Table-A3
d. Wiring of PCB’s including mechanical mounting of connectors, heat sink plates etc followed by
radiation shielding, coating and potting. PCB wiring requirements are indicated in Table-A4 and
Section 4.
e. Testing of PCB’s is indicated in Table-A6 and Section 4.
f. Temporary package assembly.
g. Final assembly of the package. (Table A6 and Section 4)
h. Initial ambient performance tests. (Table A6 and Section 4)
i. Environmental tests (Table A6, Fig-A12, Fig-A13 and Section 4)
j. Final ambient performance tests of the package. (Table A6 and Section 4)
k. Results compilation and package certification. (Table A6 and Section 4)
Figure-A2: Typical Electro-Optic Sensor (EOS) Type-S
DETECTOR HOUSING
DETECTORHOUSINGCOVER
BUSH FORCARD MOUNT
CARDMOUNT
RTVPAD
ELECTRONICSHOUSING
CUBE PLATE& CUBE
HEAT SINK
SPACER
OPTICS
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 39 of 74
A1 Mechanical parts details:
The various mechanical parts of Electro-Optic Sensors (EOS) Type-S are shown in Table: A1.The mechanical diagrams of the major parts are shown in Fig-A3 to Fig-A11. The activitiesinvolved in fabrication of these parts are discussed in Section 4.
Table A1: Mechanical parts details
Mechanical part Sub assembly DimensionOptics Mount 1
Refer mechanicaldrawings of major
parts given in Fig- A3to A11. Part tolerancesto be strictly followed.
All parts are to beanodized. Blackpainting is to be
carried out for partsshown in Fig-A4 and
Fig-A5
Electronic housing 1
Cover plates 4
Cube Mount 1
Other Parts
Focusing ring 1
Detector Housing 1
Detector Housingcover 2
Card Mount 2
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 40 of 74
Figure-A3: Bush for Card Mount and Focus Space for Electro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 41 of 74
Figure-A4: Detector Housing for Electro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 42 of 74
Figure-A5: Detector Housing Cover for Electro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 43 of 74
Figure-A6: Electronics Housing for Electro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 44 of 74
Figure-A7: Card Mount for Electro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 45 of 74
Figure-A8: Card Mount With Slot for Electro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 46 of 74
Figure-A9: Heat Sink for Electro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 47 of 74
Figure-A10: Card Wiring Fixture for Electro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 48 of 74
Figure-A11: Card Holder for Card Wiring Fixture for Electro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 49 of 74
A2 PCB fabrication details
The Electro-Optic Sensors (EOS) Type-S have 2 types of PCB’s whose dimensions and componentcount of each card is shown in Table-A2 and the component details are indicated in Table-A3. Theactivities involved in fabrication of these PCB’s and typical man hours are discussed in Table-A4.The PCB’s are flexi rigid PCB’s which are manufactured to aerospace standards with all thenecessary tests and reports. PCB material is Polyimide for the rigid portion and Polyimide 35 NDupont Pyralux AP (Adhesive less) or equivalent for the flexible portion. PCB is to be sourced fromISRO approved vendors including Group B Reports. The detailed activities involved in wiring ofPCBs are discussed Section 4. The list of Deliverables for PCB procurement are as follows
1. Fabricated PCBs, as per the specifications.
2. Conformance certificate for the product (PCB’s), meeting the requirements of MIL-PRF-
55110F for rigid PCB and MIL-P-50884 for rigid flexi PCB. IPC compliance for
laminate materials (IPC-4101for Rigid PCB, IPC-4204 for Flex PCB, IPC-4203
for Flexi cover Lay, IPC-SM840 for Solder Mask), Micro-Section report along
with the micro-sectioned samples shall accompany the consignment.
3. Mechanical inspection report including Warp and Twist measurement.
4. Two test-coupons per card / panel (1 Vertical and 1 Horizontal, along wi th traceable
codes of the cards)
5. Group A inspection report.
6. Group B inspection and micro section report.
7. Flexing endurance test for static application in accordance with IPC-TM-650 to be
carried out for flexi-rigid cards. Test samples and report shall be provided.
8. BBT report as per IPC-ET-652, both for continuity and isolation after hot air
leveling of the PCB.
9. Final visual inspection report of all the cards for pad, pattern, spacing, dimension and
surface condition like weave texture, measling, creasing, blisters & de-lamination etc.
Detailed checklist will be provided by LEOS at the time of ordering.
10. Guarantee Certificate: One year guarantee certificate shall be provided.
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 50 of 74
Table A2: PCB detailsPCBNo
Type Layers No ofRigidPCBs
Dimension of Eachrigid PCB
Componentcount
Remarks
L W1 Flexi Rigid
PCB-18 1 80mm 50mm 37 Refer Fig-A12 and A13
2 Flexi RigidPCB-2
8 4 80mm(Approx.)
80mm(Approx.)
175 Refer Fig-A14 and A-153 Rigid PCBs connectedby Flexible PCB. FlexiPCB length of 29 mm toconnect 2 PCBs and 20mm to connect 3rd PCB.
Figure-A12: Mechanical Drawing of Flexi-Rigid PCB-1of Electro-Optic Sensors (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 51 of 74
Figure-A13: PCB Data Sheet of Flexi-Rigid PCB-1 ofElectro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 52 of 74
Figure-A14: Mechanical Drawing of Flexi-Rigid PCB-2of Electro-Optic Sensor (EOS) Type-S
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 53 of 74
Figure-A15: PCB Data Sheet of Flexi-Rigid PCB-2 ofElectro-Optic Sensor (EOS) Type-S
/Polymidee
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 54 of 74
Table A3 Component list for Electro-Optic Sensors (EOS) Type-S
Component Type Component Style Quantity
Integrated Circuits
8-pin FP 2CDFP-14 1CDFP-16 3CDFP-24 1CDFP-28 1CDFP-36 1CFP-86 1CQFP-256 1SOP-64 1JLCC84 1MBCFP-16 3MFP-20 1
Diodes DO-35 9PAC-E 3
Transistors TO18 4TO257 1
Connectors FRB-PLUG-29pin 2
Capacitors
CDR01 6CDR02 23CDR33 58CTC21E-C 11CTC21E-D 8
ResistorsRM1206 77RWR80 8RER50 1
Note: Above list is representative and not exhaustive.
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 55 of 74
Table A4: Activities Involved In PCB Wiring And Approximate Time RequiredS.No CARD
FABRICATIONNo of sub activities Approx Man
HoursManpowerInvolved
1 Card -01 a Component Segregation
50
Technicianscertified for wiringand inspection byLEOS.
Mechanicalengineers to theextent of card levelMechanicalactivities.
Note: For radiationshielding, coatingand potting, onlyman hours isindicated. Curingtime is extra.
b Bare PCB Cleaning, Baking and PTH fillingc Component Inspectiond SMD Component Mounting and Inspectione Connector Mounting ,Torquing and Ecobondingf Flatpacks Tinning , Lead formation,g IC's Mounting and Inspectionh Soldering of componentsi Leaded Component Mounting and Inspectionj Card inspectionk Cleaningl Radiation Shielding and Pottingm Conformal Coatingn Connector Ecobonding
2 Card -02 a Component Segregation
150
b Bare PCB Cleaning, Baking and PTH fillingc Component Inspectiond SMD Component Mounting and Inspectione Connector Mounting ,Torquing and Ecobondingf IC's Mounting and Inspectiong Soldering of componentsh Leaded Component Mounting and Inspectioni Card inspectionj Cleaningk Radiation Shielding and Pottingl Conformal Coating and Connector Ecobonding
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 56 of 74
A3 Card and Package Testing details
Electro Optical Sensors (EOS) Type-S sensors undergo card level tests once the PCB’s are fabricated.The cards are assembled temporarily into a package form and tested at an integrated level. ApprovedOptics Modules are integrated with the mechanical housing and cards and the package is calibrated infront of optical simulators. Once the performance is ensured, the package is assembled permanentlyand under goes environmental tests and alignment.
Electro Optical Sensors (EOS) Type-S sensors underogo stabilization vibration and thermovac followedby acceptance vibration and thermovac. Electrical performance of sensors is tested prior to and afterthese test and during the test for acceptance thermovac. Package will undergo Vibration on a vibrationshaker as per the levels specified by LEOS and thermovacum performance checks in a thermovacumchamber. The package is to be prepared for the tests, tested to the required levels and its conformance tothe test matrix to be monitored. The package performance is to be ensured throughout the test andadequate monitoring for specifed parameters to be logged in a periodical basis
A list of tests that are carried out on the sensor are given in Table-A5 and Table-A6. The summary ofactivities involved and the corresponding references for the sub activities are given in Table-A5. Table-A6 gives a list of the activities at various stages, the responsibilities of the personnel and theapproximate time involved in the activities. The thermovac profiles are shown in Fig-A16 and Fig-A17.The flowcharts of the inputs for the various activities and the activity sequence are indicated in Fig-A18to Fig-A24. A detailed list of the activities involved in testing are also discussed in Chapter 4.
Table-A5: Card and Package Wiring, Assembly and Testing details
S.No Activity Activity Reference1 Card Wiring Table A42 Card level Functional Tests Table A6: Card and
Package levelActivities
3 Package Assembly4 Package level tests
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO-OPTIC SENSORS (EOS) TYPE-S Page 57 of 74
TABLE A6: CARD AND PACKAGE LEVEL TESTSS.No CARD TESTS No of sub activities Approx Man
Hours Manpower Involved
1 Passive and Active Checksof Card -01
a Passive checks. 16
Test Engineers
b Test setup preparation and performanceverification
c Photographsd Functional Tests
2 Passive and active checksof Card-01 after Radiationshielding
a Passive checks 16b Performance verificationc Photographsd Functional Tests
3 Passive and Active Checksof Card -02
a Passive checks. 8b Test setup preparation and performance
verificationc Photographsd Functional Tests
4 Passive and active checksof Card-02 after Radiationshielding
a Passive checks 8b Performance verificationc Photographsd Functional Tests
5 Stack level Testing a Health checks and interface tests betweencard-01 and card-02
4
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ELECTRO-OPTIC SENSORS (EOS) TYPE-S Page 58 of 74
S.No
CARD TESTS No of sub activities ApproxMan Hours
Manpower Involved
6 Permanent Assembly andFocusing Activities
a Audit of all cards 8 QA (electrical andMechanical)
Cooler assembly with heat sink and package levelwiring, Cube bonding
24 Technician wiring,Electrical Engineer,Mechanical engineersCard-01 and Card-02 assembly as per procedure 24
Final package assembly 87 Focusing in front of Simulator -1 16 Electrical and Mechanical
Engineers8 Baffle adapter fixing and
assembly level potting16 Mechanical engineers
9 Initial Ambient Performancetests in front of simulator -1
a Power on checks 6 Test Engineersb Performance Checks and Calibration tests and report
generation6 Test Engineers
c EEPROM secondary programming 4 Test Engineers10 Initial Ambient Performance
tests in front of simulator -2a Mounting of Sensor in Front of Simulator 3 Mechanical Engineersa Programming of Calibration Parameters 17
Test Engineersb Functional Tests using Simulator-2c Report generation
11 Alignment test after each stageof environmental tests
a Isolation and Power on checks 30 Mechanical and TestEngineersb Alignment checks (Mechanical and Electrical)
12 Stabilization Thermovac Tests Sensor preparation, chamber booking, loading andunloading of sensor from thermovac
6 Mechanical Engineers
13 Stabilization Vibration Tests Sensor preparation, shaker booking, loading andunloading of sensor
8 Mechanical Engineers14 Acceptance Vibration Tests 8 Mechanical engineers15 Active Thermovac Tests a Sensor preparation for Thermovac. 3 Mechanical
Loading and unloading of sensor from thermovac. 8 Test Engineers
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ELECTRO-OPTIC SENSORS (EOS) TYPE-S Page 59 of 74
b Active tests during Thermovac and data logging andcompilation
24 Test Engineers(Total time of test is as perprofile. Time indicated isfor work to be carried out
by personnel)
c Periodic Sensor Monitoring during entire duration ofThermovac
20
14 Final Ambient Performancechecks in front of Simulator-1
a Performance Checks and report generation 8
Test Engineers15 Final Ambient Performancechecks in front of Simulator-2
a Final calibration parameters programming 3
b Functional tests and report generation 816 Data preparation for certification a Compilation of all data as per requirements for
certification12 Mechanical and Test
Engineers17 Mechanical parts inspection Verify fabricated mechanical parts as per the
approved drawings given, after thermal treatment,black painting and get approval from LEOS for nextactivity
56
Mechanical Engineers
18 Helicoil fixing Fix the helicoils to mechanical parts as per theapproved drawings
8
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO-OPTIC SENSORS (EOS) TYPE-S Page 60 of 74
2hrs 6hrs2hrs
Ambient
2hrs2hrs6hrs
+50°
-10°
1 2
Fig A16: Stabilization Thermovac Test Profile
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO-OPTIC SENSORS (EOS) TYPE-S Page 61 of 74
Temperature: Ambient : +25°C ; Hot: 50° C ; Cold: -10°C
Profile: 5 short cycles,2 hrs dwell at each extreme temperature,2 long cycles of 24hrs dwell.
Hot
Cold
1 2 3 4 5#
#
#
#
# : Measurements
Ambient
Fig A17: AcceptanceThermovac Test Profile
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ELECTRO-OPTIC SENSORS (EOS) TYPE-S Page 62 of 74
FLOWCHARTS FOR FABRICATION, ASSEMBLY, INTEGRATION ANDTESTING OF ELECTRO-OPTIC SENSORS (EOS) TYPE-S
PCB’s READINESS(To be fabricated by
Vendor)
MECHANICAL PARTSREADINESS(To be fabricated byVendor)
START
A
CONSUMABLESREADINESS
(To be P by Vendor)
COMPONENTSREADINESS
(Will be given byLEOS)
B C D
Fig A18: INITIAL READINESS FOR ELECTRO-OPTIC SENSORS (EOS)TYPE-S
OPTICAL MODULESREADINESS
(Will be given by LEOS)
E
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO-OPTIC SENSORS (EOS) TYPE-S Page 63 of 74
Fig A19: PCB READINESS FOR ELECTRO-OPTIC SENSORS (EOS) TYPE-S
PCB READINESS
A
YES
NO
Collect PCB Spool files andMechanical Drawings from LEOS
Issue Work order for PCB fabricationfrom LEOS approved Sources
Fabrication of PCB by LEOS approvedsources through Vendor
Submit the fabricated PCB with all thereports to LEOS for clearance for flightuse
Do necessary Rework orFabricate new PCB
PCB’s are ready for flight use
A1
PCBcleared
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO-OPTIC SENSORS (EOS) TYPE-S Page 64 of 74
CONSUMABLES READINESS
B
Fig A20: CONSUMABLES READINESS FOR ELECTRO-OPTIC SENSORS(EOS) TYPE-S
Collect list of all consumablerequired and their quantity from
LEOS
Issue of Work order for procurementfrom LEOS approved Sources by
Vendor
Receipt of consumables and theirinspection by Vendor
Submit the received consumables withall the reports to LEOS for clearancefor flight use
Return and procure thecorrect consumables
Consumables are ready for flightuse
B1
Consumablescleared
YES
NO
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO-OPTIC SENSORS (EOS) TYPE-S Page 65 of 74
C1
C
Fig A21: MECHANICAL PARTSREADINESS FOR ELECTRO-OPTICSENSORS (EOS) TYPE-S
Collect approved drawings from LEOS
Submit Received Materials and reportsto LEOS for clearance for fabrication
Parts matching by vendor
Anodizing of all aluminum parts asper anodizing drawings
Helicoil fixing / matching
Thermal treatment as per drawings
MECHANICAL PARTS REDY FORASSEMBLY
Issue of Work order for procurement ofmaterials from LEOS approved
Sources by Vendor
Materialscleared
Fabricate the Mechanical parts throughLEOS approved Sources
Partscleared
Submit fabricated parts and inspectionreports to LEOS for clearance for thermal
treatments fabrication
Reprocure thematerial
Refabricate theparts or doreworks
YES
YES
NO
NO
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 66 of 74
Collect Components from LEOS
Inspect the components as percomponents list
If not correct or get the necessaryclarifications from LEOS
Return the componentsand collect new
components
Components are ready for flight use
D1
Componentscleared
YES
NO
COMPONENTS READINESS
D
Fig A22: COMPONENT READINESS FOR ELECTRO-OPTIC SENSORS(EOS) TYPE-S
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 67 of 74
OPTICAL MODULE READINESS
E
Fig A23: OPTICAL MODULE READINESS FOR ELECTRO-OPTICSENSORS (EOS) TYPE-S
Collect Optical Module from LEOS
Inspect the module
If any observation, get the necessaryclarifications from LEOS
Return the opticalmodule and collect new
optical module
Optics module ready for flight use
E1
Opticalmodule cleared
YES
NO
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 68 of 74
Fig A24: OVERALL ASSEMBLY, TEST SEQUENCE FOR ELECTRO-OPTICSENSORS (EOS) TYPE-S
PCB WIRING and Readiness for Testing(Refer Assembly Document for Complete Details)
Integrated Package Level Testing
Package Assembly
Package Level Test after Assembly andAlignment in front of Simulators
Stabilization Tests(thermovac and Vibration) andalignment in front of simulators after each test.
Card-1 Testing
Card-2 Testing
Card Testing
Acceptance Level Vibration andThermovac tests and alignment in front of
special simulators after each activity.
Final Ambient Performance Checks
Pre-Certification and handing over toLEOS
A1 B1 C1 D1
Integration of Optical Modules and testingin front of special SimulatorsE1
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 69 of 74
APPENDIX-BTypical list of consumables used for Electro-Optic Sensors(EOS) Type-S
CONSUMABLE FOR PCB WIRINGSl.No Item Description Known Sources Approx Quantity
Required1 Electronic Grade Isopropyl Alcohol
As per LEOS specificationEMEREK Brand, SAP Specialties, Scientificand allied productions
15 Ltrs/package
2 Conformal coating Material(PartA,Part B, S 8)
a.Cytec Industries Inc, 1405 Buffalo Street,Olean,NY- 14760b.Transwave Electronics
1 Kit/6Months
3 Dow Coming RTV3145 Gray Colouronly
Dow Corning India (P)Ltd, MumbaiTentacle aerologistix pvt ltd, BangaloreSysco Tech Systems (India) Pvt Ltd
1 tube /2packages
4 Adhesive Tape like Polymide,Kapton, Copper PTFE Etc.
Intek Tape(P) ltd, Bangalore3M,USA Inde enterprises, Chandigarh
1 reel
5 Electrical Grade Copper Sheets Sri.Anugraha Enterprises, BangaloreShanti Metals, Bangalore
6. Polyolefin Tubing 3M India Ltd; Bangalore 1 mtrs/package7. Panduit Terminals Liberty International India Ahmedabad
Advance Tech services New Delhi8. Ultrapure Solder wire As per F.S
QQ-S-571F SN63B.T.Solders(P)Ltd:Bangalore-94AAIM Inc,Canada HIE2S4Multicore Solders Ltd;HPw 4RQ-UK
50 gms/package
9. Polymide Wires & Cables Spec 55 Sanghvi Aerospace(P)Ltd,AhmedabadTyco Electronics,CA94025-USA
10 meters
10. Insulation Bushes for Diode &Transistors
Nanni Engineering Works,Bangalore-54
11. Solder Bar As per QQ-S-571F SN63 Advance Tech services Bangalore 2.5Kg/ 6 meters
12.Harnessing materials like cableties/Bushes
Inde Enterprises, ChandigarhElectrical terminal service USA
20 Nos/package
13 Self Adhesive polyester Filmlabels
Brady corporation Bangalore 1 Reel/10 Pkgs
14 Liquid FluxType R&RMA B.T.Solders(P) ltd; MysoreSumitron exports(P) ltd; New Delhi
5 Litres/6 Months
15 ConapCE1155 (Part A, Part B,CS8)
Tentacles aerologistix(P) LTD;BangaloreLiberty International 15852, USA
1 Kit /6 Months
16 Solder Terminals Sumitron Exports Bangalore17 Lacing Thread Sumitron Exports Bangalore
Tag international INC, USA1 reel/6 packages
18 Distilled Water19 Tantalum sheet Titanium Tantalum Products Chennai
United Titanium Inc,0h10-44691-USA300 x 230 mm-1Sheet
20 Chotherm Tentacles aerologistix(P) LTD;Bangalore, Syschotech
300 x 230 for 10Pkgs. 2 Sheets/10packages
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Sl.NoItem Description Known Sources Approx QuantityRequired
21 PCBs fabricationapproved Vendors
1. M/s ELTEK Ltd (Rigid and Flex-Rigid PCB’s)Petach-Tikva 4910101, IsraelTel: 972-3-9395050Fax:972-3-9309581
2. M/s ASCENT Circuits Pvt.Ltd (RigidPCB Only)Plot No111, Sipcot IndustrialComplexPhase-1,Hosur-635126,Tamil NaduPh:91-4344400108/400124Fax:91-4344000128
3. M/s Micropack Ltd, Bangalore (RigidPCB Only)Plot No 16, Jigani Industrial Area,Anekal TalukBangalore-562106
As given inAppendix A
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 71 of 74
CONSUMABLE REQUIRED FOR MECHANICAL ACTITIVTIES
Sl.No Item Description Known Sources Quantity Required
22 DC 93500 Dow Corning (Asia)M/S TranswaveElectronics,Secunderabad,M/S Avimarine, Bengaluru
1 kit/6 months
23 Selflock Helicoils Armstrong Fasterning Systems,UK 50 Numbers withdifferent sizes perpackage
24 Aero tight Locking Nuts Apex stainless steel fastenerslimited unitUK Precision stainless fasteners UK
25 Non Magnetic SS 316 cheese head& CSK Screws, Washers as perDIN/ISO
Avdel India Ltd, BangaloreLPS Bossard(P)Ltd,New Delhi
26 100% Non Magnetic SS316 specialwashers &Spacers
Nanni Engineering Works, Bangalore
27 Ecobond 285 Henkel Loctite (formerly Emerson& Cumming)M/S Transwave Electronics,Secunderabad,M/S Avimarine, Bengaluru
1 Kit/5 packages
28 Ecobond 286 Henkel Loctite (formerly Emerson& Cumming)M/S Transwave Electronics,Secunderabad,M/S Avimarine, Bengaluru
1 Kit/2 packages
29 RTV11 M/S. Momentive PerformanceMaterials India Pvt Ltd, BengaluruM/S. Swetadri Associates,Bengaluru
1 Kit/5 packages
30 Cube Bacon in two parts(LCA-41,BA-5)
Bacon Industries, USAM/S Transwave Electronics,Secunderabad,M/S Avimarine, Bengaluru
1 Kit/10 packages
31 SS Shims Total 450 Nos withdifferent thickness,fixed diameter as 8 x 4mm
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
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Sl.No Item Description Known Sources Quantity Required
33 PUC BLACK CONDUCTIVE PAINT,Z306-AEROGLAZE
a. POLYURETHANE COATINGGallon Packb. PRIMER FOR Z306-9924A-0.5Gallon Packc. PRIMER FOR Z306-9924B-0.5Gallon Packd. THINNER FOR Z306-9958-Gallon PackMake: LORD CORPORATION
M/S. UMAC AEROSPACE Pte Ltd.,391B, ORCHARD ROAD,#23-01, NGEE ANN CITY,TOWER-B,SINGAPORE-238874Indian Agent:M/S. UMAC Avionics Pvt. Ltd.,142, 18th A MAIN, HAL 2nd stage,Indira Nagar,Bengaluru-560008
1 gallon Pack for 45Electro-OpticSensors (EOS)Type-S
34 Mechanical parts fabricationapproved vendors
1.Government Tool and Training Center(GTTC), Rajajinagar, Bengaluru,2.DUCOM Aerospace, Peenya,Bengaluru3.Smart Technologies, PeenyaBengaluru,4.Delta Technologies, Peenya, Bengaluru5.Pushpak Industries, Bengaluru(Anodization and Blackanodizing/painting only)6.SRE Enterprises,Bengaluru7.Southern Electronics,Bengaluru8.Shoma Automation, Bengaluru9.Multiteck Systems,Bengaluru
As given inAppendix A
32
SCREWS
Avdel India Ltd, BangaloreLPS Bossard(P)Ltd,New Delhi
QUANTITY
1 M3 X 10L ALLEN HEAD, WITHSPRING AND PLAIN WASHER 300
2 M4 X 10L ALLEN HEAD, WITHSPRING AND PLAIN WASHER 200
3 M2 X 5L ALLEN HEAD, WITHSPRING AND PLAIN WASHER 400
4 M3 X 8L ALLEN HEAD, WITHSPRING AND PLAIN WASHER 200
5 M3 X 8L ALLEN HEAD WITHLOCKNUT 50
6 M3 X 12L ALLEN HEAD, WITHSPRING AND PLAIN WASHER 400
7 M4 X 8L ALLEN HEAD, WITHSPRING AND PLAIN WASHER 200
8 M2 X 6L ALLEN HEAD, WITHSPRING AND PLAIN WASHER 200
9 M2 X 8L ALLEN HEAD, WITHSPRING AND PLAIN WASHER 800
Note: List is only representative and not exhaustive
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ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 73 of 74
APPENDIX C
TYPICAL LIST OF EQUIPMENET FOR CARD/PACKAGE FABRICATION &
ASSEMBLY
WIRING EQUIPMENTS.No Equipment
PROVIDED BY LEOS1 Soldering Stations(Weller,ERSA)2 soldering bits of different sizes3 Hot air blower4 PCB mounting stands5 Turret swaging equipment6 Stands for holding blower7 Lead forming equipment8 Baking Oven9 Ultrasonic cleaning
10 Vapour degreaser11 Nitrogen purging storage12 Vinyl tables with ESD mats15 Laminar Flow tables16 Magnifiers (6X,8X,40X)17 Trays and beakers for mixing,cleaning18 ESD brushes19 Tools for conformal coating20 Tools for potting,DAM and fill21 ESD wristraps22 ESD coats ,caps,slippers
TO BE BROUGHT BY VENDOR23 Weighing Balance 0.01gms to 500gms24 Weighing Balance 1gms to 5kg25 Cutter26 Tweezer27 Thermal Wire stripper28 Manual wire stripper29 Crimping tool30 Crimping insert removal tool31 Noseblair
MECHANICAL EQUIPMENTSl.No Equipment
PROVIDED BY LEOS1 Comperssor air supply2 Grinding machine3 Torque wrench4 Drill bits5 Drilling Machine6 Micro height7 Micrometer
TO BE BROUGHT BY VENDOR6 Screw drivers7 Allen Keys Set8 M2,M2.5,M3 Allen and CSK screw bits9 Air Blow Brush
10 Scissors11 4.5mm Femal nut drive bit12 4.0 mm male nut drive bit13 Flush cutter14 Penvac15 Mixing and Potting Acessories16 Teflon Twezer17 Glass rods18 Finger cots19 Files20 Cutting Pliers21 Hammer22 Mallet Hammer23 Helicoil insert tools and accessories24 Helicoil tape set25 Files set26 Vernier claipers27 Feeler gauge28 Steel Rule29 Twezer
LABORATORY FOR ELECTRO OPTIC SYSTEMS ISRO
ELECTRO OPTIC SENSORS (EOS) TYPE-S Page 74 of 74
APPENDIX-DTYPICAL LIST OF TEST EQUIPMENT USED FO R ELECTRO-OPTIC
SENSORS (EOS) TYPE-S PROVIDED BY LEOS
The following table gives the list of general purpose equipment required to test electronic hardware.This, along with the set of specific equipment’s for specific hardware shall be required to completethe total testing activities.
Serial No Test Equipment Remarks
1 Power Supplies Will be
provided by
LEOS
2 Digital Multimeters
3 Oscilloscopes
4 Function Generator
5 Decade Resistance Box
6 On-line Monitors
7 Clip on meter
8 Current Probe Amplifier
9 LCR Meter
10 Simulators for Electro-Optic Sensors
11 Card test jigs
12 Test consoles