reverse costing analysis
DESCRIPTION
Reverse Costing analysis. 9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr. Nokia 2330 Camera Module Toshiba VGA CIS WLP Anteryon WL- Optic. October 2011 - Version 1 - PowerPoint PPT PresentationTRANSCRIPT
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 – Toshiba CIS – Anteryon WL-Optic 1
9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - FrancePhone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr
October 2011 - Version 1Written by: Sylvain HALLEREAU
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 – Toshiba CIS – Anteryon WL-Optic 2
Table of ContentsGlossary
1. Overview / Introduction……….……………….…........…4– Executive Summary– Reverse Costing Methodology
2. Companies Profile……………..……………….……....….6– CMOS Image Sensors – Volume Shipments– Toshiba Profil– Anteryon Profil
3. Nokia 2330 Teardown………………………….……....…12
4. Physical Analysis………………………...……….............16– Synthesis of the Physical Analysis– Physical Analysis Methodology– Camera Module Views & Dimensions– Camera Module Disassembly– CIS Views & Dimensions– CIS Markings – CIS Bonding– CIS Microlenses– CIS Pixels– CIS Technology node– CIS Back view– Camera Module Cross-section– Package Cross-section– Optical Module Cross-section– CIS Packaging Cross-section– CIS Cross-section– Physical Data Summary
5. Manufacturing Process Flow…….…………………..….64– Global Overview– CIS Process Flow – CIS Wafer-level packaging Process Flow– Description of the CIS Wafer Fabrication Unit– WL-Optic Process Flow– Description of the WL-Optic Wafer Fabrication Unit– Final Assembly Process Flow
6. Cost Analysis………………………….………………..…..79– Synthesis of the Cost Analysis– Main Steps of Economic Analysis– Yields Explanation– Yields Hypotheses– CIS Front-End : Hypotheses – CIS FEOL + BEOL Cost– CIS Front-End Cost– CIS Back-End 0 : 1st Probe Test & Optical Test – CIS WLP Cost– CIS WLP Cost per Process Steps– CIS WLP : Equipment Cost per Family– CIS WLP : Material Cost per Family– CIS Die Cost – WL-Optic : Hypotheses – WL-Optic Front-End Cost– WL-Optic Cost per Process Steps – WL-Optic : Equipment Cost per Family– WL-Optic : Material Cost per Family– WL-Optic : Test, dicing and assembly– WL-Optic Price– Back-End : Final Packaging & Test – Camera Module Cost (CIS + WLO + Packaging)
7. Estimated Price Analysis….………………….……..…..110– Definition of Prices– Manufacturer Financial Ratios– Camera Module estimated Manufacturer Price
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 – Toshiba CIS – Anteryon WL-Optic 3
Physical Analysis Methodology• Package is analyzed and measured.
– X-ray pictures are used to identify the package construction and the redistribution.• One cross-section is realized to get overall package data : dimensions, main characteristics.• An analysis of the technologies and of the materials used is performed.
The schematic diagram below is constructed from observations made during this study and presented in the next slides.
Glass carrier
Cap in glass fiber filled plastic
Spacerwafer
Polymer Convex lens layer #3
Glue
Bronze exterior part Glassspacer
Glass lense
Silicone-epoxy glue
CIS photo-diodes
Redistribution layer + bumps
Polymer lense layer #2
IR filter layer
Lens plate glass wafer
Polymer lense layer #1
Chrome AP layer
Glue
TSV
SAMPLE
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 – Toshiba CIS – Anteryon WL-Optic 4
Camera Module Disassembly
SAMPLE
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 – Toshiba CIS – Anteryon WL-Optic 5
CIS Microlenses
SAMPLE
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 – Toshiba CIS – Anteryon WL-Optic 6
Camera module cross-section – SEM view
Camera Module Cross-Section
SAMPLE
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 – Toshiba CIS – Anteryon WL-Optic 7
CIS Packaging Cross-Section
SAMPLE
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 – Toshiba CIS – Anteryon WL-Optic 8
CIS Process Flow
SAMPLE
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 – Toshiba CIS – Anteryon WL-Optic 9
CIS FEOL+BEOL Cost
SAMPLE
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia 2330 – Toshiba CIS – Anteryon WL-Optic 10
Spacer Wafer Cost per process steps
SAMPLE