COMPLETE TEARDOWN WITH:

• Detailed photos

• Precise measurements

• Complete bills-of-material for the modules

• Comparison between suppliers

• Comparison between OEMs

• Comparison with 2017 smartphones

RF Front-End Module Comparison 2018

Title: RF Front-End Modules Comparison 2018

Pages: 600

Date: April 2017

Format: PDF & Excel file

Price: Full report: EUR 6,490

Extensive overview of 40 RF Front-End modules and components found in 10 flagship products, including the Apple Watch Series 3, iPhone 8 and X, Samsung Galaxy S8,

Huawei P10, Asus Zenfone 4 Pro, Sony XZs and Xiaomi Mi6

fifth generation (5G) wireless communication protocols. High-end OEMs are seeking new waysto integrate more capabilities into one device, which creates space on printed circuit boardsfor 5G components in the future.

At the same time, isolation techniques for all front-end communication devices are gettingbetter, in a market with high-quality competitors. Now is the perfect time to track the field’sdevelopments, and to see what’s coming. System Plus has therefore opened up Front-EndModules in ten flagship products. We provide information on every player and compareintegration technologies between the OEMs, module suppliers and against last year’s models.

We have conducted this comparative technology study to provide insights and technology datafor RF Front-End Modules in smartphones and a new smartwatch. The report studies over 40Front-End Modules and several other components found in ten flagship products, the AppleWatch Series 3, Apple iPhone 8 Plus, Apple iPhone X, US and European versions, Samsung GalaxyS8+, US and European versions, Huawei P10, Asus Zenfone 5 Pro, Sony XZs and Xiaomi Mi6.

With teardowns of a large variety of smartphones and one smartwatch, we have extracted themain RF Modules and physically analyzed them. We have studied component sizes andtechnologies to provide a large panel of OEM technical and economic choices and an overview ofthe market. Skyworks is now a major player along with Broadcom/Avago, but we alsoencountered and analyzed devices from several other players, like Qorvo, Murata, andEpcos/TDK.

The report includes a description of each component and statistical analyses for most front-endmodules. It also tries to explain OEM and supplier choices. Wifi and Bluetooth Modules analysisare not covered in this report.

2018 is a new year for RF Front-End Modulesuppliers, and a turning point for somesmartphone-making original equipmentmanufacturers (OEMs). In 2017, we saw animportant choice in adopting PowerAmplifier Module integrated Duplexers(PAMiDs) that distinguished high-end andmid-range smartphones. Today, thedistinction between these categories isbecoming wider as companies work towards

Structural, Process & Comparison Report

Reverse Costing®

TABLE OF CONTENTS

Overview/Introduction

Company Profile

Smartphones Teardown

Physical Analysis - Apple Watch Series 3

• Front-End Modules

Packages view and

dimensions

Packages opening

Active die views and

dimensions

• Power amplifier

• SPxT switch

• RFIC

Active/passive die views

and dimensions

• Antenna matching IC

Passive die views and

dimensions

• SAW filters

• BAW filters

• IPDs

• SMD components

Component summary

Area and share

comparison

Physical Analysis - Apple iPhone 8 Plus,

Physical Analysis - Apple iPhone X

Physical Analysis - Samsung Galaxy S8+

Physical Analysis - Huawei P10

Physical Analysis - Asus Zenfone 5 Pro

Physical Analysis - Sony XZs

Physical Analysis - Xiaomi Mi6

Comparison Analysis

• Apple vs. Samsung vs.

Huawei vs. Asus vs. Sony vs.

Xiaomi

• Integration Comparison

• 2018 vs. 2017 RFFE Module

Author (Lab):VéroniqueLe Troadec

AUTHORS:

at System Plus Consulting. He has adeep knowledge in chemical andphysical analyses. He previouslyworked in microelectronics R&D forCEA/LETI in Grenoble and forSTMicroelectronics in Crolles.

NicolasRadufe (Lab)

Nicolas is in chargeof physical analysis

Dr. StéphaneElisabeth

S t é p h a n e h a sjoined System Plus

Consulting's team in 2016. He has adeep knowledge of Materialscharacterizations and Electronicssystems. He holds an EngineeringDegree in Electronics and NumericalTechnology, and a PhD in Materialsfor Micro-electronics.

Broadcom AFEM-8072 – Mid

and High Band LTE RF Front-

End Module (FEM)

Advanced RF SiPs for Cell Phones: Reverse Costing

Overview

RF Front End Modules and Components for Cellphones2017 – Yole Développement

The 1st mid/high band LTE RF FEM inthe Apple iPhone X integrates thelatest generation of FBAR technologywith advanced and innovativepackaging.

Physical analyses and costestimation of radio-frequencySystems-in-Packages from SkyworksSolutions, Murata, TDK-Epcos, Qorvoand Broadcom/Avago.

A dynamic market with highresponsivity to technical innovation,the RF front end industry is set togrow at 14% CAGR to reach $22.7Bin 2022.

Pages: 160Date: March 2018Full report: EUR 3,490*

Pages: 140Date: November 2017Full report: EUR 4,990*

Pages: 220+Date: March 2017Full report: EUR 3,490*

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