rf front-end module comparison 2020 volume 1 - …...smartphone teardowns apple iphone 11 pro,...
TRANSCRIPT
Each year System Plus opens hundreds ofFront-End Modules (FEMs) andcomponents to provide an overview of theRadio Frequency (RF) FEM market inselected flagship smartphones. Gatheringthe information into one report offers anopportunity to keep track of the evolutionof this technology market.
This year, System Plus Consulting proposesdifferent volumes on technical and costcomparison of Smartphones’ RFFEM.Every report will focus on a specificsubject, that can be a player’s evolution, aspecific technology or a comparison offlagships devices.
This first volume provides insights intotechnology and cost data for FEMs andseveral components found in threesmartphones: Apple iPhone 11 Pro,Samsung Galaxy Note10+ and OnePlus 7Pro 5G. It features disruptive choices likedouble side Ball Grid Array (BGA)packaging for High Volume Manufacturing(HVM) from suppliers like Broadcom.Incredible High Performance (IHP) SurfaceAcoustic Wave (SAW) filter adoption isrevealed in the Apple iPhone series. Also,it reveals new competitors in the HVMBulk Acoustic Wave (BAW) filter market,like Skyworks.
With teardowns of the smartphones, themain RF modules and components have
been extracted and physically analyzed,from the output of the transceiver to theantenna. Packaging, sizes and technologiesare studied to provide a large panel oftechnical and economical choices and anoverview of the market.
Moreover, the report includes anoverview of other flagship smartphonesreleased by the end of 2019 and providesa statistical analysis for most of front-endmodules. It also tries to explain thesmartphone makers’ choices and suppliertendencies. Wifi and Bluetooth moduleanalysis are not included in this report.
COMPLETE TEARDOWN WITH
• Detailed Photos
• Precise Measurements
• Module Opening
• Die Measurements
• Complete Bills-of-Materials for the Modules
• Cost comparisons
• Comparison Between OEMs
• Detailed technical and cost analysis of 70 components
• Physical comparisons with the modules included in RFFEM comparison 2019
Technical and cost overview of the latest Radio Frequency Front-End moduletechnologies, with deep analysis of the Apple iPhone 11 Pro, Samsung GalaxyNote 10+ and OnePlus 7 Pro 5G.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: RF Front-End Module Comparison 2020 Volume 1
Pages: 266
Date: January 2020
Format: PDF & Excel file
Price: EUR 6,490
RF Front-End Module Comparison 2020 –Volume 1
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
Company Profile
Smartphone Teardowns
Apple iPhone 11 Pro, Samsung Galaxy Note 10 Plus European Version, OnePlus 7 Pro 5G Physical & Cost Analysis
• Front-End Modules
Packages view and dimensions
Packages opening
Active die views and dimensions
o Power amplifier
o SPxT switch
o LNA
o RFIC
Passive die views and vimensions
o SAW filters
o BAW filters
o IPDs
o SMD components
Component summary
Area and distribution number comparison
AUTHORS
Comparison Analysis
• Apple vs. Samsung vs. OnePlus
• Supported Bands
• Integration Comparison including Area per Supplier, Area per Function and Filters
• Material Comparison including Substrate and Silicon Consumption
• 2019 vs. 2020 Comparison: Evolution
• Cost Comparison per Supplier and per Function
RF FRONT-END MODULE COMPARISON 2020 VOLUME 1
RELATED REPORTS
Dr. Stéphane Elisabeth has joinedSystem Plus Consulting's team in2016. He has a deep knowledge ofMaterials characterizations andElectronics systems. He holds anEngineering Degree in Electronicsand Numerical Technology, and aPhD in Materials forMicroelectronics.
Nicolas Radufe is in charge ofphysical analysis at System PlusConsulting. He has a deepknowledge in chemical and physicalanalyses. He previously worked inmicroelectronics R&D for CEA/LETIin Grenoble and forSTMicroelectronics in Crolles.
Guillaume Chevalier has joinedSystem Plus Consulting in early 2018to perform physical analyses. Heholds a two-year university degreein technology of physicalmeasurements and instru-mentation technics.
Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052A study from modem to antenna of the very first compact-form 5G millimeter-wave chipset for handset applications.September 2019 - EUR 3,990*
Qorvo QM76018 RFFEM in the Apple iPhone XrFirst mid/high-band front-end module from Qorvo in an Apple phone with advanced packaging.October 2019 - EUR 3,990*
Murata Incredible High Performance (IHP) SAW FilterThe first thin-film SAW filter for 2.4 GHz Wi-Fi smartphone front-ends.October 2019 - EUR 3,990*
COSTING TOOLS
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Process-BasedCosting Tools
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WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
IC Price+
MEMS CoSim+
MEMS Price+
Power CoSim+
Power Price+
LED CoSim+
3D PackageCoSim+
DisplayPrice+
PCBPrice+
SYSCost+
Our analysis is performed with our costing tools IC Price+, MEMS CoSim+ and 3D Package CoSim+.
System Plus Consulting offers powerful costing tools to evaluate any process or device, the production cost
and selling price, from single chip to complex structures. All these tools are on sale under corporate
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CONTACTS
ABOUT SYSTEM PLUS CONSULTING
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Cost simulation tool to evaluate the cost of anyMEMS process or device.
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