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In 2019 RF Front-End Module suppliershave brought through new com-munication technology. This follows thedisruptive choices made in 2018 by thehigh-end smartphone original equipmentmanufacturers (OEMs). Some chose theDiversity Switch (RxDM), others pickedmixed Mid-Band/High Band PowerAmplifier integrated Duplexers (MB/HBPAMiDs). Today, the choices arebecoming even more diverse, due to theupcoming fifth generation (5G) wirelesstechnology. High-end smartphone OEMsare seeking new ways to integrate moreinto one device, along with betterisolation techniques for all the front-endcommunication devices, in a market withhigh-quality competitors. To keep track ofthe industry’s evolution and see what’scoming, this is the perfect time to look theplayers by comparing the integrationtechnologies between the smartphonebrands, the module suppliers and lastyear’s technologies.
This comparative technology study hasbeen conducted to provide insight intotechnology data for Radio-Frequency (RF)Front-End Modules and components insmartphones. The report includes thestudy of Front-End Modules andcomponents found in eight flagship smart-phones: the Apple iPhone Xs/Xs Max,Apple iPhone Xr, Samsung Galaxy S9 PlusX US and European version, SamsungGalaxy S10 Plus European Version,Huawei Mate 20 Pro, Huawei P30 Pro,Xiaomi Mi8 Explorer Edition, and theOppo Find X.
With teardowns of a large variety ofsmartphones, the main RF Modules andcomponents, from the output of thetransceiver to the antenna, have beenextracted and physically analyzed. Wehave studied packaging, sizes andtechnologies to provide a large panel ofthe smartphone producers’ technical andeconomical choices and an overview ofthe market. In terms of design wins inthese smartphones, Qorvo is now a majorplayer, along with Skyworks andBroadcom/Avago. Several other playerslike Murata and Qualcomm are alsoinvolved and have been analyzed.
The report includes a description of eachcomponent and statistical analyses formost front-end modules. It also tries toexplain the smartphone-making OEMschoices and supplier preferences. Wi-Fiand Bluetooth Module analyses are notcovered in this report.
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Complete bills-of-materials of the modules
• Comparison between suppliers
• Comparison between OEMs
• Comparison with 2017 and 2018 smartphones
Extensive overview of 100 RF Front-End modules and components foundin eight leading flagship smartphones from Apple, Samsung, Huawei,Xiaomi, and Oppo.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: RF FEM Technical Comparison 2019
Pages: 431
Date: August 2019
Format: PDF & Excel file
Price: EUR 6,490
RF Front-End Module Technical Comparison 2019
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - MEMORY - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
Company Profile
Smartphone Teardowns
Physical Analysis :
‐ Apple iPhone Xs/Xs Max and Xr
‐ Samsung Galaxy S9 Plus X US and European version
‐ Samsung Galaxy S10 Plus European Version
‐ Huawei Mate 20 Pro and P30 Pro
‐ Xiaomi Mi8 Explorer Edition
‐ Oppo Find X
• Front-End Modules
Packages view and dimensions
Package opening
Active dies view and dimensions
o Power amplifier
o SPxT switch
o LNA
o RFIC
Passive dies view and dimensions
o SAW filters
o BAW filters
o IPDs
o SMD components
Component summaries
Area and distribution comparison
Comparison Analysis
• Apple vs. Samsung vs. Huawei vs. Oppo vs. Xiaomi
• Integration Comparison
• Material Comparison
• 2019 vs. 2018 vs. 2017 RFFE Module and Smartphones: Apple, Samsung, Huawei, Xiaomi
RF FRONT-END MODULE TECHNICAL COMPARISON 2019
RELATED REPORTS
Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/XrSeriesSecond generation of mid/high band Front-End module with advanced and innovative packaging.February 2019 - EUR 3,990*
Qualcomm 60GHz WiGig/WiFi802.11ad Chipset World’s First Smartphone EditionEarly glimpse of very compact form millimeter-wave chipset commercially available for handset applications.July 2018 - EUR 3,490*
Advanced RF System-in-Package for Cellphones 2019 –by YoleDéveloppement5G is pushing innovation for RF front-end SiP.March 2019 - EUR 6,490*
AUTHORS
Dr. Stéphane Elisabeth has joinedSystem Plus Consulting's team in 2016.He has a deep knowledge of Materialscharacterizations and Electronicssystems. He holds an EngineeringDegree in Electronics and NumericalTechnology, and a PhD in Materials forMicroelectronics.
Nicolas Radufe is in charge of physicalanalysis at System Plus Consulting. Hehas a deep knowledge in chemical andphysical analyses. He previouslyworked in microelectronics R&D forCEA/LETI in Grenoble and forSTMicroelectronics in Crolles.
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5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 - Market and Technology
Report by Yole Développement
The battle for 5G still rages: integration in-module or with discrete parts?
Bundle offer possible with the RF Front-End Module Technical Comparison 2019, contact us for more
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