rhp-technology - indico€¦ · workplan /timeline outlook/future applications of metal diamond...
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ERICHNEUBAUER
RHP-Technology
Inves&ga&onofnewmethodsforthemanufacturingofCopper-DiamondCompositeswithtailoredthermo-physicalproper&es
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Background: RHP & Metal Diamond Composites
Motivation for using Blown Powder Processes
Objectives & Challenges
Workplan /Timeline
Outlook/Future applications of metal diamond composites mady by blown
powder processes
Contents
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ABOUT RHP
RHP-Technology is located @ CAMPUS Seibersdorf
Activities started in 1996 RHP-Technology founded 2010 Privately owned 40 employees (~15 researchers)
RHP-Technology
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Company History
1996201020132016
think-addi)ve.comBlownpowder,wirefeed&STL
HOTPRESSING(1996)
SPS/FAST(2009)
RSP(2012)
XXL3DPRINTING(2014/15)
POWDERINJECTIONMOLDING(2013)
FilamentPrinPng(2017)
Spin-Off(2018)
FeedstockPrinPng(2018)
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AGENDA
PROCESSING TECHNOLOGIES
RAPID SINTER PRESSING
NEW MATERIALS
POWDER INJECTION MOULDING
RAPID SINTER PRESSING ADDITIVE MANUFACTURING
HOT PRESSING
SPS/FAST SINTERING
SINTERING / SINTER HIP
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PRODUCTS
PIM PARTS & DEVELOPMENT
AEROSPACE & SPACE PARTS
PERFORMANCE COOLING INNOVATIVE CERAMICS
TIGER METAL PRODUCTS SPUTTERTARGETS
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MAIN ACTIVITIES
Advanced Materials Multi-Materials, Composites Space and Aerospace Thermal management
Sputtering Targets Development and Manufacturing customized composition
New Processes Powder Technology, Rapid Hot Pressing, Powder Injection Moulding (Ceramics/Metals) Multi-Material-Manufacturing (3M) Additive Manufacturing
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METAL-DIAMONDCOMPOSITES
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Metal-Diamond Composites with tailored properties
Silver-Diamond Composites Ag-Diamond
Al/Cu-Diamond
Stateoftheartmaterials
Cu-/Al - Diamond Composites
ElectronicPackaging
HighPowerModule(SSPA)
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Metal-Diamond Composites with tailored properties
RHP was involved in the previous EUCARD I/II project led by CERN as well in the ongoing ARIES project Activities are linked to the development of different grades of copper- diamond which have been tested for the application as a collimator. For the collimator material the properties which are needed are a basically a high thermal conductivity, a low coefficient of thermal expansion and excellent electrical conductivity. Additional issue is the shaping/machining of the components to meet the requirements
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Manufacturing Process
DC (dHP)
Graphite Punch
Powder
Graphite Electrode
Graphite tool
Hydraulic pressure
Vacu
um c
ham
ber
diamonds nm-coaPng/interfacedesign
mixing
Metalpowder(Al/Ag/Cu)
hotpressing
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Copper-diamond composites: impact of diamond size
0
100
200
300
400
500
600
FACTOR 10 in size
Ther
mal
Cond
uctiv
ity [W
/mK]
Diamond diameter [µm]
Cu-50 vol.% diamondTradeoff:§ HighestthermalproperPescanbe
obtainedwithlargediamonds=>butpoorsurfacequality
§ HighestsurfacequalitybutlowerthermalproperPesareobtainedwithsmalldiamondsize
§ Sandwichorgradientstructuresallowabebersurfacefinish
=>Claddinglayerisrequired
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PROOFOFCONCEPT
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Manufacturing method which does not require tooling Large sizes possible (actually limit of hot pressing at RHP is a length of 300 mm) Possibility to build/shape 3D structures Direct deposition on „substrates“ /carriers possible High building rate (several kg/hour) Possibility for Gradient and multilayers
New concept for manufacturing: Blown powder methods
Die Kerne wurden fertig gefräst und vermessen.
5
DIE KERNE
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Additive Manufacturing using Plasma Metal Deposition
4MSystem
• MulP-MaterialBuild-up• Buildingpladormtoday1.5x1.8m• Shieldinggas&closedprotecPonwith
argongaspossible
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Additive Manufacturing using Plasma Metal Deposition
4MSystem
• MulP-MaterialBuild-up• Buildingpladormtoday1.5x1.8m• Shieldinggas&closedprotecPonwith
argongaspossible
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Objective Nr 1: Demonstration of copper-diamond composite manufacturing with a content of up to 50 volume percent of diamonds with a particle size of > 100 micron by using blown powder methods Blown powder methods allows manufacturing of large structures including 3D shapes (near net shape)
Goal is to manufacture parts with size of 200mm x 40 mm x 25 mm for demonstration
Objective
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Objective Nr 2: Demonstration of high thermal Conductive/Low Coefficient of Thermal Expansion in composites made from a blown powder process. Proper Design of the interface/ improving the wetting
Goal is to demonstrate the suitability of the process to obtain a thermal conductivity of > 400 W/mK and a coefficient of thermal expansion of < 8 ppm/K in a copper-composite, at least on a test coupon level.
Objectives
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WORKPLAN
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Task 1.1 Feedstock selection and Feedstock preparation (RHP) 3 different types of feedstock concepts are used 2 different diamond size/3 different volume content Especially the used of completely encapsulated diamond particles
Task 1.2 Screening of Plasma Transferred Arc Technology (RHP)
Parameter variation during the deposition process Investigation of single & multiseams
Task 1.3 Screening of Cold gas Spraying Testing of different feedstocks Additional thermal treatment required
WP 1: Screening of Blown Powder Technologies (Month 1 – Month 8)
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MS 1.1 (M3): Feedstocks prepared MS 1.2 (M8): Selection of most promising method/feedstock
D1.1 (M8): Summary/Report on experimental results achieved by blown powder methods
Possible risks/minimization of risks: 3 different types of feedstock concepts are used Different volume contents of diamonds are used. Investigation of two different blown powder methods
one of them is based on a liquid phase processing (PTA) one is linked to a solid state processing (cold gas spraying)
Milestones/Deliverables & Risk
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Task 2.1: Preparation of test structure from selected process
Preparation of a test structure (e.g. with size of approx. 200 mm x 40 mm x 25 mm) made from the most promising method selected from WP 1
MS 2.1 (M10): Test structure finalized D 2.1 (M10): Report on Test part manufacturing
Possible risk and minimisation of risks:
Density issues on the test part or irregular surface might appear when the metal diamond composite is deposited => „hot shaping“ Warpage might be an issue => symmetric building of structures
WP 2: Preparation of a test structure from selected process (M9 - M10)
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Task 3.1 Feedstock characterisation Analysis of the feedstocks /flowability/distribution etc
Task 3.2 Test coupon characterisation
Preparation of test coupons /cutting/machining and testing of thermophysical properties (partner: GSI)
Task 3.3 Material Investigation and characterisation Microstructure analysis/fracture analysis to identify porosities, inhomogenities
Task 3.4: Lessons learned Exploitation/follow up activities
WP 3: Characterisation, Analysis and Assessment (M2 – M12)
κ [m×/s]
5 10 15 20 25 30 35 40
5
10
15
20
25
30
0.95
1
1.05
1.1
1.15
1.2
1.25
1.3x 10-4
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MS 3.1 (M8) Results from Test coupons available
MS 3.2 (M12): Results from characterisation of demonstrator
D3.1 (M12): Summary of characterisation and lessons learned
Possible risk and minimisation of risks: Extraction of samples might be an issue; Two different type of processes will be applied (wire cutting and water jet)
WP 3: Characterisation, Analysis and Assessment (M2 – M12)
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Task 4.1 Project Management Take care on administrative issues Meeting with project partners Technical and Financial Reporting
MS 4.1 (M1): Kick-off MS 4.2 (M6): Progress Meeting /Telco MS 4.3 (M12): Final Meeting
D4.1 (M6): Progress Report D4.2 (M12): Final Report
WP 4: Management
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Components used at CERN: Collimators/Cooling Plates used at CERN (e.g.LHC)
Electronic Packaging Power electronics, Semiconductor industry Cooling systems for high power lasers and laser diodes (e.g. Trumpf, Jenoptik,...)
Industrial applications High thermal conductive materials applied in heavy machinery for removing of heat in high temperature extrusion processes (application of ASMAG) Cooling Plates/Backing plates for thin film deposition (new concept) Grinding wheels/general wear resistant applications (diamond loading between 10-30 vol%)
OUTLOOK: Applications of Metal Diamond Composites
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THANKYOUFORYOURATTENTION
Forschungs-u.TechnologiezentrumGebäudeCA2444Seibersdorf,AUSTRIA
ErichNeubauer