Roadmap to the next 2015 run

F. MarchettoGigaTracKer Working Group meeting

Dec. 9th 2014

a) Introductory meeting on Nov. 27, 2014b) At that meeting several critical items have been pointed out that will be

rediscussed todayc) In the following slides a broader view is represented and the previous items

dealt on Nov. 27th are includedd) The goal is to prepare 3+3 full stations

Cooling plant: Test on the chiller:a) Switch on the chiller with some GTK installed and vacuumb) Try to operate between -25 and -8 C (approximately)c) Pulse the pixelsd) Check that the working chip on the GTK don’t breakdown

also from the mechanical point of view

January:A. Saputi, M. Noy, and one DAQ person

Cooling plant: other works

Replace the resistors (to warm up the liquid) to be able to operate between -8 C and ambient temperature?

Cooling plateOptional items:a) Development to get to 8 g/sec and 10-13 barb) More refined simulator of the heat exchange

c) Order to LETI

A. MapelliG. Romagnoli, ?

c) Interface between cooling plate and detector (3M tape): to be investigated

A. MapelliJ. Noel

d) cooling station is missing in building 14 —> plan is to deliver one by end of 2014, but installation with available man power problematic

After the last meeting, progresses have been done

Sensorsa) We have 9 n-in-p (from FBK) at IZMb) Ordered other 30 sensors (p-in-n) to CiS: expected delivery

middle-end of Januaryc) Do we need an independent electrical characterization of the

test structures?d) Do we need to measure independently the bowing of the

sensor?

??

Flanges

We need at least 6 flangesDesign fixed (?)

J. Noel

Bump-bonding (IZM)

• Delivered assemblies: 6 full-assemblies (two for each of 450, 250, and 100 mm) 15 (?)single-chip assemblies ( five for each of 450, 250, and 100 mm ?)

• As part of the signed contract, IZM should deliver others: 6 full-assemblies thinned to 100 mm 15 single-chip assemblies thinned to 100 mm

R. Arcidiacono

Test of the n-in-p on single-chip

To do this it is required that IZM processes one n-in-p

• IZM should add one process: BCB to protect chips from high voltage discharge.

GTK carrier

• Three batches from Eltos1) First batch failed for problem due to the metallization (used a process for FR4 instead of

for Necro 4000)2) Second batch failed due to an offset (~ 300 mm) in the pool position: however one

could be used with strong limitation.3) Third batch: out of ten starting cards only two were without faults.

Wrong thickness of the pool: 1.150 mm instead of 0.850 mm ->> 0.850 mm achievable from Eltos process (?)

• One batch from Somacis: Some pads were found in short and recovered by Michel

… however…

Characterization of the GTK-carrier is necessary

setup for qualification AND production/tuning in future is needed - reference setup(not to be confused with qualification setup)

M. Noy ,M. Morel

Redesign some parts of the card?

cooling station is missing in building 14 —> plan is to deliver one by end of 2014,but installation with available man power problematic

GTK carrier

For the full characterization of the GTK carrier it is necessary a cooling station in bldg 14.

Chip characterization

• Probe card to be checked

• Order for the PCB to be placed

M. Noy, M. Michel

M. Perrin-Terrin

• Probe station ready in manual mode• Probing of the wafers

M. Perrin-Terrin, B. Velghe

Probe card for the assemblies

A similar probe card could be used to verify the assembly before gluing it to the cooling plate

M. Perrin-Terrin, B. Velghe

ASIC Wafer procurement

• IBM ended the foundry activity

• How many wafer do we need ? 1 wafer = 60 chips

• How many wafer are we left with? (10?)

• How many wafer are still at MOSIS?

• Can we ordered wafer to the company which bought IBM?

A. Kluge

Wire-bonding

• Resistive protection on the edges applied already from Eltos/Somacis• Depth of the pool less than 0.850 mm

M. Morel

Are these two implementations enough for a 100% good wire-bonding ?Or is necessary a further discussion with Ian/Florentine ?

Calibration of the pixels

Around May with theCooling station at bldg 14 M. Noy

• Interesting to measure the temperature effect on the calibration constants

• Interesting to measure the threshold in terms of fC on the calibration constants

DAQ

•Installation of the remaining cards

• Replacing of the daughter cards

• Firmware to synchronize the hit extraction to the trigger. Offset to be determined

A. Cotta, E. Gamberini

Necessary both DAQ modes:

• 0-bias R/O mode

• L0 synchronized R/O mode

E. Gamberini, A. Gianoli

Interface of Run Control with the DAQ

Necessary a more precise specification of the parameters to be uploaded

G. Mila

Shareable information and data log

• Cooling plant: pressures and temperatures for the three station are logged by shifters. DCS should also register them continuously.

• Mechanical construction log: Alessandro M.

• Measurements on the bump-bonded assemblies (full and single) by IZM or by the collaboration: Roberta A.

• ECN3 and CR logbook: Flavio M and Mathieu P-T

• Calibration logbook : Matthew N.

Meeting schedule

Proposal:Every two weeks at a fixed day (Thursday?) at 14:00