rohs pcb finishes - lead free pros cons
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Immersion SilverPros ConsGood Wettability Poor Shelf-Life:
*Must be vacuumed packed for shipping*Must be vacuumed packed for storage*Must not handle Surface Areas
Good CoplanarityGood Reflow CyclesGood Process timesLow Cost Fair Process WindowGood Process Control Poor AdhesionGood Electrical Testability Difficult to Re-Work
Organic Solderability Preservative - OSPPros ConsGood Coplanarity Poor Shelf-Life:
*Degrades with High Temperature *Must not handle Surface Areas
Good Surface OxidationRe-WorkableVery Low Cost Reflow CyclesGood Process Window Flux Sensitivity Good Process Control Poor Wettability
Very Poor Electrical TestabilityPoor Adhesion
Electroless Nickel Immersion Gold - ENIGPros ConsGood Wettability High CostGood Coplanarity Complex ProcessGood Reflow Cycles Not Re-WorkableGood Surface Oxidation Ni/Sn brittle Solder Joints
Good Shelf-Life Field Failure Good Adhesion Fair Process WindowWire Bonding Fair Process ControlKeypadsGood Electrical Testability
Hard GoldPros ConsGood Wettability High CostGood Coplanarity Not Re-WorkableGood Reflow CyclesGood Surface OxidationGood Shelf-LifeGood Process WindowGood Process ControlGood AdhesionGood Electrical Testability
White TinPros ConsGood Wettability Long Process TimeGood Coplanarity Fair Process WindowGood Reflow Cycles Possible Tin WhiskersGood Surface Oxidation Problems if Tin Thickness is LowLow CostGood Process ControlGood AdhesionGood Electrical Testability
Lead-Free Hot Air Solder LevelingPros ConsExcellent Wettability Process ControlMuch Improved Coplanarity over Sn/Pb Heat CycleExcellent Reflow CyclesExcellent Surface OxidationVery Low CostRe-WorkableGood Process WindowGood AdhesionExcellent Solder JointsExcellent Shelf-LifeGood Electrical Testability