tion of oxalic acid ion and hy- drofluoric acid ion; and a second step in which the film coat is re- moved by contacting with a sec- ond aqueous solution of a mixture of nitric acid and hydrofluoric acid.

COMPOSITE PLATING APPARATUS U.S. Patent 6,183,610. Feb. 6, 2001 Y. Kataoka et al., assignors to Nihon Parkerizing Co. Ltd., Tokyo

An apparatus for composite plat- ing the inner surface of a cylindri- cal body,

SPUI"I'ERING CATHODE U.S. Patent 6,183,612. Feb. 6, 2001 R. Adam et al., assignors to Leybold Systems GmbH, Hanau, Germany

A sputtering cathode with a flat plate-shaped target formed from at least one part comprising a tub- shaped yoke having a center ridge and a tub rim with end faces and being spaced apart from and be- hind a target.

SPUTIrEH TARGET/BACKING PLATE ASSEMBLY U.S. Patent 6,183,613. Feb. 6, 2001

P.S. Gilman et al., assignors to Praxair S.T. Technology Inc., Danbury, Conn.

A sputter target assembly com- prising a target member; a back- ing member; and a block member.

ROTATING SPUTTER MAGNETRON ASSEMBLY U.S. Patent 6,183,614. Feb. 6, 2001 J. Fu, assignor to Applied Materials Inc., Santa Clara, Calif.

A magnetron assembly position- able at a backside of a sputtering target and rotatable about a cen- ter position of the target.

ELECTROCOAT BATH STABILIZATION U.S. Patent 6,183,616. Feb. 6, 2001 H. Sakamoto et al., assignors to Nippon Paint Co. Ltd., Osaka, Japan

A method of stabilization of elec- trolyte bath in electrocoating for obtaining electrodeposition coat by immersing a substrate in the electrolyte bath filled with a cat- ionic electrocoating composition containing a basic resin and an

amine compound and carrying out electrocoating.

TIN PLATING PROCESS U.S. Patent 6,183,617. Feb. 6, 2001 D. Guhl and F. Honselmann, assignors to Th Goldschmidt AG, Essen, Germany

A self-regulating, acidic electro- lyte for tin plating aluminum al- loys.

SULFONIC ACID ELECTROPLATING BATHS U.S. Patent 6,183,619. Feb. 6, 2001 H.D. Gillman et al., assignors to Technic Inc., Cranston, R.I., and Special Chemical Systems Inc., Royersford, Pa.

A method of improving the plat- ing performance of sulfonic acid based electroplating baths com- prising replacing at least a por- tion of the alkyl sulfonic acid elec- trolyte with a salt of an alkanol sulfonic acid or of a mixture of an alkyl sulfonic acid and an alkanol sulfonic acid, wherein the replace- ment salt is selected from the group consisting of alkali metal, alkaline earth metal, and ammo- nium or substituted ammonium salts.

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ADDITIVE FOR ELECTROREFINING AND ELECTROWINNING U.S. Patent 6,183,622. Feb. 6, 2001 R. Janik, assignor to Enthone-OMI Inc., Warren, Mich.

A method for improving the duc- tility of copper produced by the electrowinning or electrorefining of copper from a copper electrolyte bath comprising adding an addi- tion agent consisting essentially of a bath-soluble adduct of a ter- t iary alkyl amine.

ABRASIVE SHEET U.S. Patent 6,183,677. Feb. 6, 2001 A. Usui and Y. Yoshida, assignors to Kovax Corp., Tokyo

A method of manufactur ing an abrasive sheet comprising form-

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